WO2008134603A3 - Layered structure for corrosion resistant interconnect contacts - Google Patents

Layered structure for corrosion resistant interconnect contacts Download PDF

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Publication number
WO2008134603A3
WO2008134603A3 PCT/US2008/061706 US2008061706W WO2008134603A3 WO 2008134603 A3 WO2008134603 A3 WO 2008134603A3 US 2008061706 W US2008061706 W US 2008061706W WO 2008134603 A3 WO2008134603 A3 WO 2008134603A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductive layer
layered structure
corrosion resistant
interconnect contacts
resistant interconnect
Prior art date
Application number
PCT/US2008/061706
Other languages
French (fr)
Other versions
WO2008134603A2 (en
Inventor
David A Ruben
Original Assignee
Medtronic Inc
David A Ruben
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Medtronic Inc, David A Ruben filed Critical Medtronic Inc
Priority to EP08746988A priority Critical patent/EP2142083A2/en
Publication of WO2008134603A2 publication Critical patent/WO2008134603A2/en
Publication of WO2008134603A3 publication Critical patent/WO2008134603A3/en

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
    • A61B5/021—Measuring pressure in heart or blood vessels
    • A61B5/0215—Measuring pressure in heart or blood vessels by means inserted into the body
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/02—Details of sensors specially adapted for in-vivo measurements
    • A61B2562/028—Microscale sensors, e.g. electromechanical sensors [MEMS]

Abstract

The present invention is directed to an interconnect for an implantable medical device. The interconnect includes a first conductive layer, a second conductive layer introduced over the first conductive layer, and a third conductive layer introduced over the second conductive layer. One of the first conductive layer, the second conductive layer, and the third conductive layer comprises titanium-niobium (Ti-Nb).
PCT/US2008/061706 2007-04-27 2008-04-28 Layered structure for corrosion resistant interconnect contacts WO2008134603A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP08746988A EP2142083A2 (en) 2007-04-27 2008-04-28 Layered structure for corrosion resistant interconnect contacts

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/741,583 2007-04-27
US11/741,583 US8461681B2 (en) 2007-04-27 2007-04-27 Layered structure for corrosion resistant interconnect contacts

Publications (2)

Publication Number Publication Date
WO2008134603A2 WO2008134603A2 (en) 2008-11-06
WO2008134603A3 true WO2008134603A3 (en) 2008-12-31

Family

ID=39540514

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/061706 WO2008134603A2 (en) 2007-04-27 2008-04-28 Layered structure for corrosion resistant interconnect contacts

Country Status (3)

Country Link
US (1) US8461681B2 (en)
EP (1) EP2142083A2 (en)
WO (1) WO2008134603A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9616223B2 (en) * 2005-12-30 2017-04-11 Medtronic, Inc. Media-exposed interconnects for transducers
US20140117559A1 (en) * 2012-03-30 2014-05-01 Paul A. Zimmerman Process and material for preventing deleterious expansion of high aspect ratio copper filled through silicon vias (tsvs)
US9968794B2 (en) 2014-12-24 2018-05-15 Medtronic, Inc. Implantable medical device system including feedthrough assembly and method of forming same
US9865533B2 (en) 2014-12-24 2018-01-09 Medtronic, Inc. Feedthrough assemblies
US10136535B2 (en) 2014-12-24 2018-11-20 Medtronic, Inc. Hermetically-sealed packages including feedthrough assemblies
JP6589277B2 (en) 2015-01-14 2019-10-16 富士電機株式会社 HIGH VOLTAGE PASSIVE DEVICE AND METHOD FOR MANUFACTURING HIGH VOLTAGE PASSIVE DEVICE
US10098589B2 (en) 2015-12-21 2018-10-16 Medtronic, Inc. Sealed package and method of forming same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003041096A1 (en) * 2001-11-03 2003-05-15 H.C. Starck Inc. Thin film capacitor using conductive polymers
WO2006104432A1 (en) * 2005-03-31 2006-10-05 St. Jude Medical Ab Porous niobium oxide as electrode material and manufacturing process

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5324326A (en) * 1991-11-25 1994-06-28 Telectronics Pacing Systems, Inc. Pressure sensing pacing lead
JPH065129A (en) * 1992-06-19 1994-01-14 Furukawa Electric Co Ltd:The Nbti alloy superconductive wire
US5513793A (en) * 1994-10-07 1996-05-07 Advanced Bionics Corporation Brazeless ceramic-to-metal bond for use in implantable devices
US5489552A (en) * 1994-12-30 1996-02-06 At&T Corp. Multiple layer tungsten deposition process
JP2006033748A (en) 2004-07-21 2006-02-02 Matsushita Electric Ind Co Ltd Thin film bulk acoustic resonator
KR20070086749A (en) 2004-11-30 2007-08-27 더 리전트 오브 더 유니버시티 오브 캘리포니아 Braze system with matched coefficients of thermal expansion
TWI249470B (en) * 2005-03-09 2006-02-21 Univ Nat Central Structure and method of thermal stress compensation
US20070060969A1 (en) * 2005-09-15 2007-03-15 Burdon Jeremy W Implantable co-fired electrical feedthroughs
AU2006311850B2 (en) * 2005-11-02 2011-06-16 Second Sight Medical Products, Inc. Implantable microelectronic device and method of manufacture

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003041096A1 (en) * 2001-11-03 2003-05-15 H.C. Starck Inc. Thin film capacitor using conductive polymers
WO2006104432A1 (en) * 2005-03-31 2006-10-05 St. Jude Medical Ab Porous niobium oxide as electrode material and manufacturing process

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
ARSHAK ET AL: "Development of oxide thick film capacitors for a real time pressure monitoring system", MATERIALS SCIENCE AND ENGINEERING C, ELSEVIER SCIENCE S.A, CH, vol. 27, no. 5-8, 17 July 2006 (2006-07-17), pages 1406 - 1410, XP022190518, ISSN: 0928-4931 *
DOUGLASS ET AL: "The thermal expansion of niobium pentoxide and its effect on the spalling of niobium oxidation films", JOURNAL OF THE LESS-COMMON METALS, ELSEVIER-SEQUOIA S.A. LAUSANNE, CH, vol. 5, no. 2, 1 April 1963 (1963-04-01), pages 151 - 157, XP022818492, ISSN: 0022-5088, [retrieved on 19630401] *
See also references of EP2142083A2 *
SRIKANTH V ET AL: "Thermal expansion anisotropy, microcracking and acoustic emission of Nb2O5 ceramics", CERAMICS INTERNATIONAL, ELSEVIER, AMSTERDAM, NL, vol. 18, no. 4, 1 January 1992 (1992-01-01), pages 251 - 261, XP022784795, ISSN: 0272-8842, [retrieved on 19920101] *

Also Published As

Publication number Publication date
EP2142083A2 (en) 2010-01-13
US8461681B2 (en) 2013-06-11
WO2008134603A2 (en) 2008-11-06
US20080265423A1 (en) 2008-10-30

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