WO2008133594A3 - Cooling device for electronic components - Google Patents
Cooling device for electronic components Download PDFInfo
- Publication number
- WO2008133594A3 WO2008133594A3 PCT/SG2008/000137 SG2008000137W WO2008133594A3 WO 2008133594 A3 WO2008133594 A3 WO 2008133594A3 SG 2008000137 W SG2008000137 W SG 2008000137W WO 2008133594 A3 WO2008133594 A3 WO 2008133594A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooling device
- electronic components
- section
- condenser
- evaporator
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A cooling device (10) including a chamber having an evaporator section (34) and a condenser section, the condenser section extending from a periphery of the evaporator section (34).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/597,774 US20100132924A1 (en) | 2007-04-27 | 2008-04-24 | Cooling device for electronic components |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US91441007P | 2007-04-27 | 2007-04-27 | |
US60/914,410 | 2007-04-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008133594A2 WO2008133594A2 (en) | 2008-11-06 |
WO2008133594A3 true WO2008133594A3 (en) | 2009-06-04 |
Family
ID=39926220
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SG2008/000137 WO2008133594A2 (en) | 2007-04-27 | 2008-04-24 | Cooling device for electronic components |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100132924A1 (en) |
WO (1) | WO2008133594A2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120017614A1 (en) * | 2010-07-21 | 2012-01-26 | Edward Vincent Clancy | Apparatus and Method of Using Nanofluids to Improve Energy Efficiency of Vapor Compression Systems |
US9051502B2 (en) | 2011-01-31 | 2015-06-09 | Liquidcool Solutions, Inc. | Nanofluids for use in cooling electronics |
WO2016148065A1 (en) * | 2015-03-13 | 2016-09-22 | 大沢健治 | Heat transfer device for cooling |
EP3168969B1 (en) * | 2015-11-16 | 2018-01-24 | Siemens Aktiengesellschaft | Cage rotor |
US20190170057A1 (en) * | 2017-12-06 | 2019-06-06 | GM Global Technology Operations LLC | Charge air cooler (cac) having a condensate dispersion device and a method of dispersing condensate from a cac |
CN108595735A (en) * | 2018-02-02 | 2018-09-28 | 哈尔滨汽轮机厂辅机工程有限公司 | A kind of evaluation method of the condenser numerical simulation based on Star-CD |
CN114485228B (en) * | 2022-01-25 | 2023-04-07 | 浙江大学 | Hollow polygonal prism-shaped heat exchanger |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6588498B1 (en) * | 2002-07-18 | 2003-07-08 | Delphi Technologies, Inc. | Thermosiphon for electronics cooling with high performance boiling and condensing surfaces |
US20050139345A1 (en) * | 2003-12-31 | 2005-06-30 | Himanshu Pokharna | Apparatus for using fluid laden with nanoparticles for application in electronic cooling |
JP2005228809A (en) * | 2004-02-10 | 2005-08-25 | Hitachi Cable Ltd | Cpu cooler |
US20060120044A1 (en) * | 2004-12-04 | 2006-06-08 | Foxconn Technology Co., Ltd | Heat dissipating apparatus |
JP2006177582A (en) * | 2004-12-21 | 2006-07-06 | Denso Corp | Boiling cooler device |
Family Cites Families (46)
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US3613778A (en) * | 1969-03-03 | 1971-10-19 | Northrop Corp | Flat plate heat pipe with structural wicks |
CH498488A (en) * | 1969-04-30 | 1970-10-31 | Bbc Brown Boveri & Cie | Cooling device, in particular for semiconductor elements and electron tubes |
US3779310A (en) * | 1971-04-05 | 1973-12-18 | G Russell | High efficiency heat transit system |
JPS599832B2 (en) * | 1978-03-20 | 1984-03-05 | 日立造船株式会社 | fermenter |
US4523636A (en) * | 1982-09-20 | 1985-06-18 | Stirling Thermal Motors, Inc. | Heat pipe |
US4632179A (en) * | 1982-09-20 | 1986-12-30 | Stirling Thermal Motors, Inc. | Heat pipe |
US4884628A (en) * | 1988-10-19 | 1989-12-05 | En Jian Chen | Heat pipe employing hydrogen oxidation means |
US5253702A (en) * | 1992-01-14 | 1993-10-19 | Sun Microsystems, Inc. | Integral heat pipe, heat exchanger, and clamping plate |
JPH098190A (en) * | 1995-06-22 | 1997-01-10 | Calsonic Corp | Cooling device for electronic component |
GB2317222B (en) * | 1996-09-04 | 1998-11-25 | Babcock & Wilcox Co | Heat pipe heat exchangers for subsea pipelines |
US6419009B1 (en) * | 1997-08-11 | 2002-07-16 | Christian Thomas Gregory | Radial flow heat exchanger |
US6227287B1 (en) * | 1998-05-25 | 2001-05-08 | Denso Corporation | Cooling apparatus by boiling and cooling refrigerant |
US6432320B1 (en) * | 1998-11-02 | 2002-08-13 | Patrick Bonsignore | Refrigerant and heat transfer fluid additive |
US20010050164A1 (en) * | 1999-08-18 | 2001-12-13 | Agilent Technologies, Inc. | Cooling apparatus for electronic devices |
US6397941B1 (en) * | 1999-12-01 | 2002-06-04 | Cool Options, Inc. | Net-shape molded heat exchanger |
JP3594900B2 (en) * | 2000-12-19 | 2004-12-02 | 株式会社日立製作所 | Display integrated computer |
JP4512296B2 (en) * | 2001-08-22 | 2010-07-28 | 株式会社日立製作所 | Liquid cooling system for portable information processing equipment |
US6538888B1 (en) * | 2001-09-28 | 2003-03-25 | Intel Corporation | Radial base heatsink |
US6736192B2 (en) * | 2002-03-08 | 2004-05-18 | Ting-Fei Wang | CPU cooler |
TW588823U (en) * | 2002-05-13 | 2004-05-21 | Shuttle Inc | CPU heat dissipation apparatus having heat conduction pipe |
TW537437U (en) * | 2002-06-28 | 2003-06-11 | Shuttle Inc | CPU heat dissipating fastener |
US6712130B2 (en) * | 2002-07-01 | 2004-03-30 | Global Win Technology Co., Ltd. | CPU cooling structure |
JP2004125381A (en) * | 2002-08-02 | 2004-04-22 | Mitsubishi Alum Co Ltd | Heat pipe unit and heat pipe cooler |
US20060060333A1 (en) * | 2002-11-05 | 2006-03-23 | Lalit Chordia | Methods and apparatuses for electronics cooling |
US6892800B2 (en) * | 2002-12-31 | 2005-05-17 | International Business Machines Corporation | Omnidirectional fan-heatsinks |
KR100505554B1 (en) * | 2003-01-24 | 2005-08-03 | 아이큐리랩 홀딩스 리미티드 | Cooling device of hybrid-type |
US6798659B2 (en) * | 2003-02-21 | 2004-09-28 | Wilson Chen | CPU cooling structure |
JP4140495B2 (en) * | 2003-09-25 | 2008-08-27 | 株式会社日立製作所 | Cooling module |
US6958912B2 (en) * | 2003-11-18 | 2005-10-25 | Intel Corporation | Enhanced heat exchanger |
US20060175045A1 (en) * | 2004-03-19 | 2006-08-10 | Yin-Hung Chen | Heat dissipation device |
US7273091B2 (en) * | 2004-04-20 | 2007-09-25 | International Business Machines Corporation | Cooling apparatus for heat generating devices |
CN100338767C (en) * | 2004-05-26 | 2007-09-19 | 鸿富锦精密工业(深圳)有限公司 | Heat pipe radiating unit and manufacturing method thereof |
US20060032616A1 (en) * | 2004-08-11 | 2006-02-16 | Giga-Byte Technology Co., Ltd. | Compound heat-dissipating device |
TWM261983U (en) * | 2004-08-23 | 2005-04-11 | Inventec Corp | Tubular radiator |
US7128135B2 (en) * | 2004-11-12 | 2006-10-31 | International Business Machines Corporation | Cooling device using multiple fans and heat sinks |
US20060196640A1 (en) * | 2004-12-01 | 2006-09-07 | Convergence Technologies Limited | Vapor chamber with boiling-enhanced multi-wick structure |
TWI271501B (en) * | 2005-01-14 | 2007-01-21 | Foxconn Tech Co Ltd | Heat pipe and method of manufacturing it |
US7926553B2 (en) * | 2005-03-07 | 2011-04-19 | Asetek A/S | Cooling system for electronic devices, in particular, computers |
WO2006109929A1 (en) * | 2005-04-11 | 2006-10-19 | Zalman Tech Co., Ltd. | Apparatus for cooling computer parts and method of manufacturing the same |
TWM282235U (en) * | 2005-06-24 | 2005-12-01 | Golden Sun News Tech Co Ltd | Improved structure of a heat dissipating device using heat pipes |
US7262965B2 (en) * | 2005-10-28 | 2007-08-28 | Shuttle Inc. | Thermal structure for electric devices |
CN100498185C (en) * | 2006-04-21 | 2009-06-10 | 富准精密工业(深圳)有限公司 | Heat pipe |
US7369410B2 (en) * | 2006-05-03 | 2008-05-06 | International Business Machines Corporation | Apparatuses for dissipating heat from semiconductor devices |
US7974096B2 (en) * | 2006-08-17 | 2011-07-05 | Ati Technologies Ulc | Three-dimensional thermal spreading in an air-cooled thermal device |
CN101212884B (en) * | 2006-12-27 | 2011-06-08 | 富准精密工业(深圳)有限公司 | Heat radiator |
US20090242170A1 (en) * | 2008-03-28 | 2009-10-01 | Raytheon Company | Cooling Fins for a Heat Pipe |
-
2008
- 2008-04-24 US US12/597,774 patent/US20100132924A1/en not_active Abandoned
- 2008-04-24 WO PCT/SG2008/000137 patent/WO2008133594A2/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6588498B1 (en) * | 2002-07-18 | 2003-07-08 | Delphi Technologies, Inc. | Thermosiphon for electronics cooling with high performance boiling and condensing surfaces |
US20050139345A1 (en) * | 2003-12-31 | 2005-06-30 | Himanshu Pokharna | Apparatus for using fluid laden with nanoparticles for application in electronic cooling |
JP2005228809A (en) * | 2004-02-10 | 2005-08-25 | Hitachi Cable Ltd | Cpu cooler |
US20060120044A1 (en) * | 2004-12-04 | 2006-06-08 | Foxconn Technology Co., Ltd | Heat dissipating apparatus |
JP2006177582A (en) * | 2004-12-21 | 2006-07-06 | Denso Corp | Boiling cooler device |
Non-Patent Citations (1)
Title |
---|
"Applied Thermal Engineering. Journal Article.", 1 April 2005, ELSEVIER, ISSN: 1359-4311, article YU.F. MAYDANIK: "Loop heat pipes.", pages: 635 - 657, XP004668703, DOI: doi:10.1016/j.applthermaleng.2004.07.010 * |
Also Published As
Publication number | Publication date |
---|---|
WO2008133594A2 (en) | 2008-11-06 |
US20100132924A1 (en) | 2010-06-03 |
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