WO2008133515A3 - Fabrication of planar electronic circuit devices - Google Patents

Fabrication of planar electronic circuit devices

Info

Publication number
WO2008133515A3
WO2008133515A3 PCT/NL2008/050255 NL2008050255W WO2008133515A3 WO 2008133515 A3 WO2008133515 A3 WO 2008133515A3 NL 2008050255 W NL2008050255 W NL 2008050255W WO 2008133515 A3 WO2008133515 A3 WO 2008133515A3
Authority
WO
Grant status
Application
Patent type
Prior art keywords
material
layer
electronic
conducting
circuit
Prior art date
Application number
PCT/NL2008/050255
Other languages
French (fr)
Other versions
WO2008133515A2 (en )
Inventor
Tobias Balla
Alec Reader
Aerle Nicolaas Aldegonda Jan Maria Van
Original Assignee
Tobias Balla
Polymer Vision Ltd
Alec Reader
Aerle Nicolaas Aldegonda Jan Maria Van
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/0021Formation of conductors
    • H01L51/0022Formation of conductors using printing techniques, e.g. ink jet printing
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2251/00Indexing scheme relating to organic semiconductor devices covered by group H01L51/00
    • H01L2251/10Processes specially adapted for the manufacture or treatment of organic semiconductor devices
    • H01L2251/105Patterning of a layer by embossing, e.g. to form trenches in an insulating layer
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/28Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
    • H01L27/32Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
    • H01L27/3241Matrix-type displays
    • H01L27/3244Active matrix displays
    • H01L27/3276Wiring lines
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/0021Formation of conductors
    • H01L51/0023Patterning of conductive layers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/05Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential- jump barrier or surface barrier multistep processes for their manufacture
    • H01L51/0504Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential- jump barrier or surface barrier multistep processes for their manufacture the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or swiched, e.g. three-terminal devices
    • H01L51/0508Field-effect devices, e.g. TFTs
    • H01L51/0512Field-effect devices, e.g. TFTs insulated gate field effect transistors
    • H01L51/0516Field-effect devices, e.g. TFTs insulated gate field effect transistors characterised by the gate dielectric
    • H01L51/052Field-effect devices, e.g. TFTs insulated gate field effect transistors characterised by the gate dielectric the gate dielectric comprising only organic materials
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5203Electrodes

Abstract

A method is provided of fabricating a multilayer planar electronic circuit device on a substrate comprising the steps providing a patterned layer of a first conducting material, depositing a layer of a first insulating material and providing a patterned layer of a second conducting material. The method enables the fabrication of complex electronic circuit devices by depositing core material layers and forming the required conducting structures using an imprinting technique. High tolerances are possible at fast processing speed, while keeping processing material costs low.
PCT/NL2008/050255 2007-04-25 2008-04-25 Fabrication of planar electronic circuit devices WO2008133515A3 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB0708032A GB0708032D0 (en) 2007-04-25 2007-04-25 Fabrication of planar electronic circuit devices
GB0708032.8 2007-04-25

Publications (2)

Publication Number Publication Date
WO2008133515A2 true WO2008133515A2 (en) 2008-11-06
WO2008133515A3 true true WO2008133515A3 (en) 2009-01-15

Family

ID=38170682

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2008/050255 WO2008133515A3 (en) 2007-04-25 2008-04-25 Fabrication of planar electronic circuit devices

Country Status (2)

Country Link
GB (1) GB0708032D0 (en)
WO (1) WO2008133515A3 (en)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0966182A1 (en) * 1998-06-17 1999-12-22 Lg Electronics Inc. Method of fabricating organic electroluminescent display panel
US20030060038A1 (en) * 1999-12-21 2003-03-27 Plastic Logic Limited Forming interconnects
US20030223138A1 (en) * 2002-04-24 2003-12-04 Yoshikazu Akiyama Thin film apparatus, a manufacturing method of the thin film apparatus, an active matrix substrate, a manufacturing method of the active matrix substrate, and an electro-optical apparatus having the active matrix substrate
US20040013982A1 (en) * 1999-09-14 2004-01-22 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
WO2004111729A1 (en) * 2003-06-19 2004-12-23 Avantone Oy A method and an apparatus for manufacturing an electronic thin-film component and an electronic thin-film component
EP1541524A2 (en) * 2003-12-11 2005-06-15 Xerox Corporation Nanoparticle deposition process
US6930818B1 (en) * 2000-03-03 2005-08-16 Sipix Imaging, Inc. Electrophoretic display and novel process for its manufacture
WO2006064859A1 (en) * 2004-12-14 2006-06-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US20060160276A1 (en) * 2002-12-14 2006-07-20 Brown Thomas M Electronic devices
US20060208266A1 (en) * 2005-03-16 2006-09-21 Seiko Epson Corporation Method for manufacturing an organic semiconductor device, as well as organic semiconductor device, electronic device, and electronic apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1271669A3 (en) * 1994-09-06 2005-01-26 Philips Electronics N.V. Electroluminescent device comprising a transparent structured electrode layer made from a conductive polymer
US20020031602A1 (en) * 2000-06-20 2002-03-14 Chi Zhang Thermal treatment of solution-processed organic electroactive layer in organic electronic device
US7098060B2 (en) * 2002-09-06 2006-08-29 E.I. Du Pont De Nemours And Company Methods for producing full-color organic electroluminescent devices

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0966182A1 (en) * 1998-06-17 1999-12-22 Lg Electronics Inc. Method of fabricating organic electroluminescent display panel
US20040013982A1 (en) * 1999-09-14 2004-01-22 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
US20030060038A1 (en) * 1999-12-21 2003-03-27 Plastic Logic Limited Forming interconnects
US6930818B1 (en) * 2000-03-03 2005-08-16 Sipix Imaging, Inc. Electrophoretic display and novel process for its manufacture
US20030223138A1 (en) * 2002-04-24 2003-12-04 Yoshikazu Akiyama Thin film apparatus, a manufacturing method of the thin film apparatus, an active matrix substrate, a manufacturing method of the active matrix substrate, and an electro-optical apparatus having the active matrix substrate
US20060160276A1 (en) * 2002-12-14 2006-07-20 Brown Thomas M Electronic devices
WO2004111729A1 (en) * 2003-06-19 2004-12-23 Avantone Oy A method and an apparatus for manufacturing an electronic thin-film component and an electronic thin-film component
EP1541524A2 (en) * 2003-12-11 2005-06-15 Xerox Corporation Nanoparticle deposition process
WO2006064859A1 (en) * 2004-12-14 2006-06-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US20060208266A1 (en) * 2005-03-16 2006-09-21 Seiko Epson Corporation Method for manufacturing an organic semiconductor device, as well as organic semiconductor device, electronic device, and electronic apparatus

Also Published As

Publication number Publication date Type
GB2448730A (en) 2008-10-29 application
GB0708032D0 (en) 2007-06-06 grant
WO2008133515A2 (en) 2008-11-06 application

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