WO2008117444A1 - Method for aligning exposure position for lithography processing - Google Patents

Method for aligning exposure position for lithography processing Download PDF

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Publication number
WO2008117444A1
WO2008117444A1 PCT/JP2007/056409 JP2007056409W WO2008117444A1 WO 2008117444 A1 WO2008117444 A1 WO 2008117444A1 JP 2007056409 W JP2007056409 W JP 2007056409W WO 2008117444 A1 WO2008117444 A1 WO 2008117444A1
Authority
WO
WIPO (PCT)
Prior art keywords
exposure position
lots
lithography
positional shift
amount
Prior art date
Application number
PCT/JP2007/056409
Other languages
French (fr)
Japanese (ja)
Inventor
Mutsumi Fujita
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2007/056409 priority Critical patent/WO2008117444A1/en
Publication of WO2008117444A1 publication Critical patent/WO2008117444A1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment

Abstract

A method for aligning the exposure position for lithography processing, in which an effective feedback method can be determined with regard to adjustment of the exposure position, based on the achievement of lithography processing performed in the past. A simulation step for calculating a virtual offset set value for each virtual lot and an amount of estimated positional shift of a lithography pattern, based on an actual offset set value and an actual amount of positional shift, by assuming that the offset set values of exposure processing for each of lots are determined in sequence by feeding back the offset set value of exposure position in preceding i lots and an amount of positional shift of a lithography pattern after lithography processing, and a step for calculating the deviation of the estimated amount of positional shift between respective virtual lots are performed a plurality of times while varying the value of i. Thus, the optimal number i of feedback lots where the deviation becomes minimum out of a plurality of i is obtained.
PCT/JP2007/056409 2007-03-27 2007-03-27 Method for aligning exposure position for lithography processing WO2008117444A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/056409 WO2008117444A1 (en) 2007-03-27 2007-03-27 Method for aligning exposure position for lithography processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/056409 WO2008117444A1 (en) 2007-03-27 2007-03-27 Method for aligning exposure position for lithography processing

Publications (1)

Publication Number Publication Date
WO2008117444A1 true WO2008117444A1 (en) 2008-10-02

Family

ID=39788187

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/056409 WO2008117444A1 (en) 2007-03-27 2007-03-27 Method for aligning exposure position for lithography processing

Country Status (1)

Country Link
WO (1) WO2008117444A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009283600A (en) * 2008-05-21 2009-12-03 Nec Electronics Corp Exposure aligning method, exposure aligning program, and exposure device
JP2014529909A (en) * 2011-09-01 2014-11-13 ケーエルエー−テンカー コーポレイション Method and system for detection and correction of problematic advanced process control parameters
JP2018501508A (en) * 2014-12-02 2018-01-18 エーエスエムエル ネザーランズ ビー．ブイ． Lithographic method and apparatus
CN111316170A (en) * 2017-11-01 2020-06-19 Asml控股股份有限公司 Lithographic cluster, lithographic apparatus and device manufacturing method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11186132A (en) * 1997-12-19 1999-07-09 Sony Corp Method for feedback of semiconductor device manufacturing process
JP2000049068A (en) * 1998-07-28 2000-02-18 Sony Corp Method for determining exposure conditions and device for determining the exposure conditions in semiconductor manufacture process
JP2003124110A (en) * 2001-07-03 2003-04-25 Samsung Electronics Co Ltd Method of controlling processing device
JP2005235899A (en) * 2004-02-18 2005-09-02 Matsushita Electric Ind Co Ltd Feedback method of semiconductor manufacturing step
JP2006013178A (en) * 2004-06-28 2006-01-12 Toshiba Corp Method and system for exposure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11186132A (en) * 1997-12-19 1999-07-09 Sony Corp Method for feedback of semiconductor device manufacturing process
JP2000049068A (en) * 1998-07-28 2000-02-18 Sony Corp Method for determining exposure conditions and device for determining the exposure conditions in semiconductor manufacture process
JP2003124110A (en) * 2001-07-03 2003-04-25 Samsung Electronics Co Ltd Method of controlling processing device
JP2005235899A (en) * 2004-02-18 2005-09-02 Matsushita Electric Ind Co Ltd Feedback method of semiconductor manufacturing step
JP2006013178A (en) * 2004-06-28 2006-01-12 Toshiba Corp Method and system for exposure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009283600A (en) * 2008-05-21 2009-12-03 Nec Electronics Corp Exposure aligning method, exposure aligning program, and exposure device
JP2014529909A (en) * 2011-09-01 2014-11-13 ケーエルエー−テンカー コーポレイション Method and system for detection and correction of problematic advanced process control parameters
JP2018501508A (en) * 2014-12-02 2018-01-18 エーエスエムエル ネザーランズ ビー．ブイ． Lithographic method and apparatus
CN111316170A (en) * 2017-11-01 2020-06-19 Asml控股股份有限公司 Lithographic cluster, lithographic apparatus and device manufacturing method

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