WO2008114728A1 - Magnetic pressure sensor - Google Patents

Magnetic pressure sensor Download PDF

Info

Publication number
WO2008114728A1
WO2008114728A1 PCT/JP2008/054753 JP2008054753W WO2008114728A1 WO 2008114728 A1 WO2008114728 A1 WO 2008114728A1 JP 2008054753 W JP2008054753 W JP 2008054753W WO 2008114728 A1 WO2008114728 A1 WO 2008114728A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
major surface
pressure sensor
magnetic pressure
shield layer
Prior art date
Application number
PCT/JP2008/054753
Other languages
French (fr)
Japanese (ja)
Inventor
Tetsuya Fukuda
Kiyoshi Sato
Hiroyuki Morioka
Shigeaki Yamauchi
Hisanobu Ohkawa
Original Assignee
Alps Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co., Ltd. filed Critical Alps Electric Co., Ltd.
Priority to JP2009505199A priority Critical patent/JP4866957B2/en
Publication of WO2008114728A1 publication Critical patent/WO2008114728A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/14—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means involving the displacement of magnets, e.g. electromagnets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Measuring Fluid Pressure (AREA)
  • Hall/Mr Elements (AREA)

Abstract

Disclosed is a magnetic pressure sensor (1) comprising a glass substrate (11) having a major surface, a first shield layer (12) formed within a recess which is provided in the major surface, a GMR element (17) formed on the first shield layer (12) through an insulting layer (13), and a silicon substrate (20) bonded onto the insulting layer (13) with a gold-tin eutectic alloy (18) and having a diaphragm (20a) which comprises a hard magnetic layer (21) on one major surface so that the hard magnetic layer faces the GMR element, while having a second shield layer (22) on the other major surface.
PCT/JP2008/054753 2007-03-14 2008-03-14 Magnetic pressure sensor WO2008114728A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009505199A JP4866957B2 (en) 2007-03-14 2008-03-14 Magnetic pressure sensor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-064460 2007-03-14
JP2007064460 2007-03-14

Publications (1)

Publication Number Publication Date
WO2008114728A1 true WO2008114728A1 (en) 2008-09-25

Family

ID=39765836

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054753 WO2008114728A1 (en) 2007-03-14 2008-03-14 Magnetic pressure sensor

Country Status (2)

Country Link
JP (1) JP4866957B2 (en)
WO (1) WO2008114728A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016148687A (en) * 2016-05-27 2016-08-18 株式会社東芝 Element package and electric circuit
US10070230B2 (en) 2012-11-20 2018-09-04 Kabushiki Kaisha Toshiba Microphone package

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10775197B2 (en) 2018-03-14 2020-09-15 Kabushiki Kaisha Toshiba Sensor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05340831A (en) * 1992-02-26 1993-12-24 Nippondenso Co Ltd Pressure sensor
US5637905A (en) * 1996-02-01 1997-06-10 New Jersey Institute Of Technology High temperature, pressure and displacement microsensor
JPH10170377A (en) * 1996-12-11 1998-06-26 Toyota Motor Corp Pressure detecting device
US6507187B1 (en) * 1999-08-24 2003-01-14 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ultra-sensitive magnetoresistive displacement sensing device
JP2005221418A (en) * 2004-02-06 2005-08-18 Tdk Corp Pressure sensor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05340831A (en) * 1992-02-26 1993-12-24 Nippondenso Co Ltd Pressure sensor
US5637905A (en) * 1996-02-01 1997-06-10 New Jersey Institute Of Technology High temperature, pressure and displacement microsensor
JPH10170377A (en) * 1996-12-11 1998-06-26 Toyota Motor Corp Pressure detecting device
US6507187B1 (en) * 1999-08-24 2003-01-14 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ultra-sensitive magnetoresistive displacement sensing device
JP2005221418A (en) * 2004-02-06 2005-08-18 Tdk Corp Pressure sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10070230B2 (en) 2012-11-20 2018-09-04 Kabushiki Kaisha Toshiba Microphone package
JP2016148687A (en) * 2016-05-27 2016-08-18 株式会社東芝 Element package and electric circuit

Also Published As

Publication number Publication date
JPWO2008114728A1 (en) 2010-07-01
JP4866957B2 (en) 2012-02-01

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