WO2008109576A3 - Systems and methods for efficient slurry application for chemical mechanical polishing - Google Patents

Systems and methods for efficient slurry application for chemical mechanical polishing Download PDF

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Publication number
WO2008109576A3
WO2008109576A3 PCT/US2008/055742 US2008055742W WO2008109576A3 WO 2008109576 A3 WO2008109576 A3 WO 2008109576A3 US 2008055742 W US2008055742 W US 2008055742W WO 2008109576 A3 WO2008109576 A3 WO 2008109576A3
Authority
WO
WIPO (PCT)
Prior art keywords
slurry
chemical mechanical
mechanical polishing
systems
methods
Prior art date
Application number
PCT/US2008/055742
Other languages
French (fr)
Other versions
WO2008109576A2 (en
Inventor
Stanley Monroe Smith
Christopher Lyle Borst
Original Assignee
Texas Instruments Inc
Stanley Monroe Smith
Christopher Lyle Borst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc, Stanley Monroe Smith, Christopher Lyle Borst filed Critical Texas Instruments Inc
Publication of WO2008109576A2 publication Critical patent/WO2008109576A2/en
Publication of WO2008109576A3 publication Critical patent/WO2008109576A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

An embodiment relates generally to a chemical mechanical polishing apparatus (100). The apparatus includes a platen (105) adapted to receive a wafer to be chemical- mechanically polished and a polishing pad configured to polish the wafer. The apparatus also includes a slurry feed line (115) configured to provide slurry to the polishing pad (130) and at least one slurry dispensing outlet (125) coupled to the slurry feed line and configured to dispense slurry as a mist of small droplets ranging from submicron to about 500 microns.
PCT/US2008/055742 2007-03-07 2008-03-04 Systems and methods for efficient slurry application for chemical mechanical polishing WO2008109576A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/683,142 US20080220698A1 (en) 2007-03-07 2007-03-07 Systems and methods for efficient slurry application for chemical mechanical polishing
US11/683,142 2007-03-07

Publications (2)

Publication Number Publication Date
WO2008109576A2 WO2008109576A2 (en) 2008-09-12
WO2008109576A3 true WO2008109576A3 (en) 2008-12-24

Family

ID=39739062

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/055742 WO2008109576A2 (en) 2007-03-07 2008-03-04 Systems and methods for efficient slurry application for chemical mechanical polishing

Country Status (2)

Country Link
US (1) US20080220698A1 (en)
WO (1) WO2008109576A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6243255B2 (en) * 2014-02-25 2017-12-06 光洋機械工業株式会社 Surface grinding method for workpieces
CN108604549B (en) * 2016-02-08 2023-09-12 应用材料公司 System, apparatus and method for chemical polishing

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6251001B1 (en) * 1999-05-10 2001-06-26 Applied Materials, Inc. Substrate polishing with reduced contamination
US20060014478A1 (en) * 2004-07-15 2006-01-19 Mcclatchie Simon Apparatus and method for distributing a polishing fluid

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198103A (en) * 1987-06-08 1993-03-30 Carbon Fuels Corporation Method for increasing liquid yields from short residence time hydropyrolysis processes
US5158843A (en) * 1990-07-02 1992-10-27 Batson David C Small particle thin electrochemical electrode and method
US5895550A (en) * 1996-12-16 1999-04-20 Micron Technology, Inc. Ultrasonic processing of chemical mechanical polishing slurries
US6024829A (en) * 1998-05-21 2000-02-15 Lucent Technologies Inc. Method of reducing agglomerate particles in a polishing slurry
US6429131B2 (en) * 1999-03-18 2002-08-06 Infineon Technologies Ag CMP uniformity
US6589872B1 (en) * 1999-05-03 2003-07-08 Taiwan Semiconductor Manufacturing Company Use of low-high slurry flow to eliminate copper line damages
US6053801A (en) * 1999-05-10 2000-04-25 Applied Materials, Inc. Substrate polishing with reduced contamination
US6468134B1 (en) * 2000-06-30 2002-10-22 Lam Research Corporation Method and apparatus for slurry distribution
US6705925B1 (en) * 2000-10-20 2004-03-16 Lightwave Microsystems Apparatus and method to dice integrated circuits from a wafer using a pressurized jet
US6780305B2 (en) * 2001-02-20 2004-08-24 Fuji Photo Film Co., Ltd. Method for producing support for planographic printing plate, support for planographic printing plate, and planographic printing plate precursor
US6652366B2 (en) * 2001-05-16 2003-11-25 Speedfam-Ipec Corporation Dynamic slurry distribution control for CMP
US6641462B2 (en) * 2001-06-27 2003-11-04 Speedfam-Ipec Corporation Method and apparatus for distributing fluid to a polishing surface during chemical mechanical polishing
US6599175B2 (en) * 2001-08-06 2003-07-29 Speedfam-Ipeca Corporation Apparatus for distributing a fluid through a polishing pad
US6648734B2 (en) * 2001-08-30 2003-11-18 Agere Systems Inc. Polishing head for pressurized delivery of slurry

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6251001B1 (en) * 1999-05-10 2001-06-26 Applied Materials, Inc. Substrate polishing with reduced contamination
US20060014478A1 (en) * 2004-07-15 2006-01-19 Mcclatchie Simon Apparatus and method for distributing a polishing fluid

Also Published As

Publication number Publication date
US20080220698A1 (en) 2008-09-11
WO2008109576A2 (en) 2008-09-12

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