WO2008102431A1 - Process for producing photosensitive resin, photosensitive resin obtained by the process, and photosensitive resin composition - Google Patents

Process for producing photosensitive resin, photosensitive resin obtained by the process, and photosensitive resin composition Download PDF

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Publication number
WO2008102431A1
WO2008102431A1 PCT/JP2007/053030 JP2007053030W WO2008102431A1 WO 2008102431 A1 WO2008102431 A1 WO 2008102431A1 JP 2007053030 W JP2007053030 W JP 2007053030W WO 2008102431 A1 WO2008102431 A1 WO 2008102431A1
Authority
WO
WIPO (PCT)
Prior art keywords
photosensitive resin
resin
reacting
compound
reaction product
Prior art date
Application number
PCT/JP2007/053030
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroshi Uei
Masayuki Kobayashi
Original Assignee
Showa Highpolymer Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Highpolymer Co., Ltd. filed Critical Showa Highpolymer Co., Ltd.
Priority to PCT/JP2007/053030 priority Critical patent/WO2008102431A1/en
Priority to CN2007800514380A priority patent/CN101611068B/en
Priority to JP2009500028A priority patent/JP5356211B2/en
Priority to KR1020097019518A priority patent/KR101387796B1/en
Publication of WO2008102431A1 publication Critical patent/WO2008102431A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image

Abstract

A process for producing a photosensitive resin which is capable of exposure to ultraviolet and development with a dilute aqueous alkali solution, has high sensitivity, is satisfactory in thermal stability and development control tolerance, and is suitable for use as a solder resist ink giving a coating film having excellent performances; a photoresist resin obtained by the production process; and a composition containing the photosensitive resin. The process for photosensitive resin production comprises reacting a novolak type polyfunctional epoxy resin with an unsaturated monobasic acid and a saturated monobasic acid having a primary alcoholic hydroxy group in the presence of an organic compound of trivalent phosphorus and a specific metal salt catalyst to obtain a resin (reaction product I), reacting the resin with a polybasic acid anhydride, and reacting the resultant resin (reaction product II) with a compound having a radical-polymerizable unsaturated group and an epoxy group and a water-soluble monoepoxy compound.
PCT/JP2007/053030 2007-02-20 2007-02-20 Process for producing photosensitive resin, photosensitive resin obtained by the process, and photosensitive resin composition WO2008102431A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2007/053030 WO2008102431A1 (en) 2007-02-20 2007-02-20 Process for producing photosensitive resin, photosensitive resin obtained by the process, and photosensitive resin composition
CN2007800514380A CN101611068B (en) 2007-02-20 2007-02-20 Process for producing photosensitive resin, photosensitive resin obtained by the process, and photosensitive resin composition
JP2009500028A JP5356211B2 (en) 2007-02-20 2007-02-20 Photosensitive resin manufacturing method, photosensitive resin and photosensitive resin composition obtained from the manufacturing method
KR1020097019518A KR101387796B1 (en) 2007-02-20 2007-02-20 Process for producing photosensitive resin, photosensitive resin obtained by the process, and photosensitive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/053030 WO2008102431A1 (en) 2007-02-20 2007-02-20 Process for producing photosensitive resin, photosensitive resin obtained by the process, and photosensitive resin composition

Publications (1)

Publication Number Publication Date
WO2008102431A1 true WO2008102431A1 (en) 2008-08-28

Family

ID=39709716

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/053030 WO2008102431A1 (en) 2007-02-20 2007-02-20 Process for producing photosensitive resin, photosensitive resin obtained by the process, and photosensitive resin composition

Country Status (4)

Country Link
JP (1) JP5356211B2 (en)
KR (1) KR101387796B1 (en)
CN (1) CN101611068B (en)
WO (1) WO2008102431A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010189464A (en) * 2009-02-16 2010-09-02 Showa Highpolymer Co Ltd Photosensitive resin composition, and method for manufacturing photosensitive resin for use in the same
WO2020044678A1 (en) * 2018-08-30 2020-03-05 昭和電工株式会社 Photosensitive resin composition for forming black column spacers, black column spacer and image display device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105669892B (en) * 2016-03-17 2019-07-26 上海昭和高分子有限公司 A kind of solvent type copolymer resins and combinations thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000321765A (en) * 1999-05-13 2000-11-24 Showa Highpolymer Co Ltd Photosensitive resin composition
JP2001264977A (en) * 2000-03-21 2001-09-28 Showa Highpolymer Co Ltd Photosensitive resin composition
JP2003057821A (en) * 2001-08-13 2003-02-28 Showa Highpolymer Co Ltd Photosensitive resin and photosensitive resin composition
JP2005041958A (en) * 2003-07-25 2005-02-17 Showa Highpolymer Co Ltd Manufacturing process of photosensitive resin

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6727042B2 (en) * 2000-01-17 2004-04-27 Showa Highpolymer Co., Ltd. Photosensitive resin composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000321765A (en) * 1999-05-13 2000-11-24 Showa Highpolymer Co Ltd Photosensitive resin composition
JP2001264977A (en) * 2000-03-21 2001-09-28 Showa Highpolymer Co Ltd Photosensitive resin composition
JP2003057821A (en) * 2001-08-13 2003-02-28 Showa Highpolymer Co Ltd Photosensitive resin and photosensitive resin composition
JP2005041958A (en) * 2003-07-25 2005-02-17 Showa Highpolymer Co Ltd Manufacturing process of photosensitive resin

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010189464A (en) * 2009-02-16 2010-09-02 Showa Highpolymer Co Ltd Photosensitive resin composition, and method for manufacturing photosensitive resin for use in the same
WO2020044678A1 (en) * 2018-08-30 2020-03-05 昭和電工株式会社 Photosensitive resin composition for forming black column spacers, black column spacer and image display device

Also Published As

Publication number Publication date
CN101611068B (en) 2012-07-04
KR20100014472A (en) 2010-02-10
CN101611068A (en) 2009-12-23
JP5356211B2 (en) 2013-12-04
JPWO2008102431A1 (en) 2010-05-27
KR101387796B1 (en) 2014-04-21

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