WO2008091393A3 - Group iv nanoparticles and films thereof - Google Patents
Group iv nanoparticles and films thereof Download PDFInfo
- Publication number
- WO2008091393A3 WO2008091393A3 PCT/US2007/076549 US2007076549W WO2008091393A3 WO 2008091393 A3 WO2008091393 A3 WO 2008091393A3 US 2007076549 W US2007076549 W US 2007076549W WO 2008091393 A3 WO2008091393 A3 WO 2008091393A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- nanoparticles
- group
- films
- atoms
- manoparticle
- Prior art date
Links
- 239000002105 nanoparticle Substances 0.000 title abstract 5
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/0545—Dispersions or suspensions of nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/12—Making metallic powder or suspensions thereof using physical processes starting from gaseous material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/05—Preparation or purification of carbon not covered by groups C01B32/15, C01B32/20, C01B32/25, C01B32/30
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
- C01B33/029—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition of monosilane
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/223—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase
- H01L21/2236—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase from or into a plasma phase
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/0673—Nanowires or nanotubes oriented parallel to a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/068—Nanowires or nanotubes comprising a junction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
Abstract
A set of nanoparticles is disclosed. Each nanoparticle of the set of nanoparticles is comprised of a set of Group IV atoms arranged in a substantially spherical configuration. Each manoparticle of the set of nanoparticles further having a sphericity of between about 1.0 and about 2.0; a diameter of between about 4 nm and about 100 nm; and a sintering temperature less than a melting temperature of the set of Group IV atoms.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07872740A EP2097195A2 (en) | 2006-12-21 | 2007-08-22 | Group iv nanoparticles and films thereof |
CN2007800514770A CN101657283B (en) | 2006-12-21 | 2007-08-22 | Group IV nanoparticles and films thereof |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US87632806P | 2006-12-21 | 2006-12-21 | |
US60/876,328 | 2006-12-21 | ||
US90176807P | 2007-02-16 | 2007-02-16 | |
US60/901,768 | 2007-02-16 | ||
US11/775,509 US20090014423A1 (en) | 2007-07-10 | 2007-07-10 | Concentric flow-through plasma reactor and methods therefor |
US11/775,509 | 2007-07-10 | ||
US11/842,466 | 2007-08-21 | ||
US11/842,466 US7718707B2 (en) | 2006-12-21 | 2007-08-21 | Method for preparing nanoparticle thin films |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2008091393A2 WO2008091393A2 (en) | 2008-07-31 |
WO2008091393A3 true WO2008091393A3 (en) | 2008-10-02 |
WO2008091393B1 WO2008091393B1 (en) | 2008-12-11 |
Family
ID=39577481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/076549 WO2008091393A2 (en) | 2006-12-21 | 2007-08-22 | Group iv nanoparticles and films thereof |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2097195A2 (en) |
CN (1) | CN101657283B (en) |
WO (1) | WO2008091393A2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8435477B2 (en) | 1997-07-21 | 2013-05-07 | Nanogram Corporation | Dispersions of submicron doped silicon particles |
US8623951B2 (en) | 2001-08-03 | 2014-01-07 | Nanogram Corporation | Silicon nanoparticle dispersions |
US9006720B2 (en) | 2010-06-29 | 2015-04-14 | Nanogram Corporation | Silicon/germanium nanoparticles and inks having low metal contamination |
US9175174B2 (en) | 2000-10-17 | 2015-11-03 | Nanogram Corporation | Dispersions of submicron doped silicon particles |
US9199435B2 (en) | 2001-01-26 | 2015-12-01 | Nanogram Corporation | Dispersions of silicon nanoparticles |
US9475695B2 (en) | 2013-05-24 | 2016-10-25 | Nanogram Corporation | Printable inks with silicon/germanium based nanoparticles with high viscosity alcohol solvents |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8632702B2 (en) | 2007-01-03 | 2014-01-21 | Nanogram Corporation | Silicon/germanium particle inks, doped particles, printing and processes for semiconductor applications |
US8163587B2 (en) * | 2009-07-02 | 2012-04-24 | Innovalight, Inc. | Methods of using a silicon nanoparticle fluid to control in situ a set of dopant diffusion profiles |
GB201109319D0 (en) * | 2011-06-03 | 2011-07-20 | Intrinsiq Materials Ltd Uk | Fine particles |
US10225919B2 (en) | 2011-06-30 | 2019-03-05 | Aes Global Holdings, Pte. Ltd | Projected plasma source |
US11939477B2 (en) | 2014-01-30 | 2024-03-26 | Monolith Materials, Inc. | High temperature heat integration method of making carbon black |
US10370539B2 (en) | 2014-01-30 | 2019-08-06 | Monolith Materials, Inc. | System for high temperature chemical processing |
RU2016135213A (en) | 2014-01-31 | 2018-03-05 | Монолит Матириалз, Инк. | PLASMA BURNER DESIGN |
CA3032246C (en) | 2015-07-29 | 2023-12-12 | Monolith Materials, Inc. | Dc plasma torch electrical power design method and apparatus |
MX2018013161A (en) | 2016-04-29 | 2019-06-24 | Monolith Mat Inc | Torch stinger method and apparatus. |
EP3592810A4 (en) | 2017-03-08 | 2021-01-27 | Monolith Materials, Inc. | Systems and methods of making carbon particles with thermal transfer gas |
CA3060576A1 (en) | 2017-04-20 | 2018-10-25 | Monolith Materials, Inc. | Carbon particles with low sulfur, ash and grit impurities |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5576248A (en) * | 1994-03-24 | 1996-11-19 | Starfire Electronic Development & Marketing, Ltd. | Group IV semiconductor thin films formed at low temperature using nanocrystal precursors |
US20060051505A1 (en) * | 2004-06-18 | 2006-03-09 | Uwe Kortshagen | Process and apparatus for forming nanoparticles using radiofrequency plasmas |
WO2006096201A2 (en) * | 2004-07-28 | 2006-09-14 | Evergreen Solar, Inc. | Method for preparing group iv nanocrystals with chemically accessible surfaces |
WO2008039757A2 (en) * | 2006-09-28 | 2008-04-03 | Innovalight, Inc. | Semiconductor devices and methods from group iv nanoparticle materials |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1465461A (en) * | 2002-06-21 | 2004-01-07 | 江苏华强纳米科技有限公司 | Method for preparing finely surface protected nano metal powder |
-
2007
- 2007-08-22 WO PCT/US2007/076549 patent/WO2008091393A2/en active Application Filing
- 2007-08-22 EP EP07872740A patent/EP2097195A2/en not_active Withdrawn
- 2007-08-22 CN CN2007800514770A patent/CN101657283B/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5576248A (en) * | 1994-03-24 | 1996-11-19 | Starfire Electronic Development & Marketing, Ltd. | Group IV semiconductor thin films formed at low temperature using nanocrystal precursors |
US20060051505A1 (en) * | 2004-06-18 | 2006-03-09 | Uwe Kortshagen | Process and apparatus for forming nanoparticles using radiofrequency plasmas |
WO2006096201A2 (en) * | 2004-07-28 | 2006-09-14 | Evergreen Solar, Inc. | Method for preparing group iv nanocrystals with chemically accessible surfaces |
WO2008039757A2 (en) * | 2006-09-28 | 2008-04-03 | Innovalight, Inc. | Semiconductor devices and methods from group iv nanoparticle materials |
Non-Patent Citations (4)
Title |
---|
A. N. GOLDSTEIN: "The melting of silicon nanocrystals: Submicron thin-film structures derived from nanocrystal precursors", APPLIED PHYSICS A, vol. 62, 1996, Springer, pages 33 - 37, XP002488050 * |
D. V. MELNIKOV ET. AL.: "Quantum Confinement in Phosphorus-Doped Silicon Nanocrystals", PHYSICAL REVIEW LETTERA, vol. 92, 2004, APS, pages 046802-1 - 046802-4, XP002488048 * |
T. IFUKU ET. AL.: "Fabrication of Nanocrystalline Silicon with Small Spread of Particle Size by Pulsed Gas Plasma", JAPANESE JOURNAL OF APPLIED PHYSICS, vol. 36, 1997, pages 4031 - 4034, XP002488047 * |
Y. H. TANG ET. AL.: "Microstructure and field-emission characteristics of boron-doped Si nanoparticle chains.", APPLIED PHYSICS LETTERS, vol. 79, 2001, AIP, pages 1673 - 1675, XP002488049 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8435477B2 (en) | 1997-07-21 | 2013-05-07 | Nanogram Corporation | Dispersions of submicron doped silicon particles |
US9175174B2 (en) | 2000-10-17 | 2015-11-03 | Nanogram Corporation | Dispersions of submicron doped silicon particles |
US9199435B2 (en) | 2001-01-26 | 2015-12-01 | Nanogram Corporation | Dispersions of silicon nanoparticles |
US8623951B2 (en) | 2001-08-03 | 2014-01-07 | Nanogram Corporation | Silicon nanoparticle dispersions |
US9006720B2 (en) | 2010-06-29 | 2015-04-14 | Nanogram Corporation | Silicon/germanium nanoparticles and inks having low metal contamination |
US9475695B2 (en) | 2013-05-24 | 2016-10-25 | Nanogram Corporation | Printable inks with silicon/germanium based nanoparticles with high viscosity alcohol solvents |
Also Published As
Publication number | Publication date |
---|---|
CN101657283B (en) | 2013-01-23 |
EP2097195A2 (en) | 2009-09-09 |
WO2008091393B1 (en) | 2008-12-11 |
CN101657283A (en) | 2010-02-24 |
WO2008091393A2 (en) | 2008-07-31 |
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