WO2008088306A3 - Dispositifs de thermoénergie et leurs procédés de fabrication - Google Patents
Dispositifs de thermoénergie et leurs procédés de fabrication Download PDFInfo
- Publication number
- WO2008088306A3 WO2008088306A3 PCT/US2006/048749 US2006048749W WO2008088306A3 WO 2008088306 A3 WO2008088306 A3 WO 2008088306A3 US 2006048749 W US2006048749 W US 2006048749W WO 2008088306 A3 WO2008088306 A3 WO 2008088306A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- devices
- methods
- thermoenergy
- manufacturing same
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
- H10N19/101—Multiple thermocouples connected in a cascade arrangement
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
La présente invention concerne des dispositifs thermoélectriques ou thermodiodiques et des procédés de fabrication de tels dispositifs.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2006/048749 WO2008088306A2 (fr) | 2006-12-20 | 2006-12-20 | Dispositifs de thermoénergie et leurs procédés de fabrication |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2006/048749 WO2008088306A2 (fr) | 2006-12-20 | 2006-12-20 | Dispositifs de thermoénergie et leurs procédés de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008088306A2 WO2008088306A2 (fr) | 2008-07-24 |
WO2008088306A3 true WO2008088306A3 (fr) | 2009-04-09 |
Family
ID=39636490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/048749 WO2008088306A2 (fr) | 2006-12-20 | 2006-12-20 | Dispositifs de thermoénergie et leurs procédés de fabrication |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2008088306A2 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11435766B2 (en) | 2018-09-07 | 2022-09-06 | Maxwell Labs Inc | Fine-grain dynamic solid-state cooling system |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4855810A (en) * | 1987-06-02 | 1989-08-08 | Gelb Allan S | Thermoelectric heat pump |
US6396191B1 (en) * | 1999-03-11 | 2002-05-28 | Eneco, Inc. | Thermal diode for energy conversion |
US20020085601A1 (en) * | 2000-12-29 | 2002-07-04 | Arima Optoelectronics Corporation | Light emitting diode with light conversion using scattering optical media |
US6446441B1 (en) * | 2001-08-28 | 2002-09-10 | William G. Dean | Magnetic refrigerator |
US6492585B1 (en) * | 2000-03-27 | 2002-12-10 | Marlow Industries, Inc. | Thermoelectric device assembly and method for fabrication of same |
US6948322B1 (en) * | 2001-09-10 | 2005-09-27 | Percy Giblin | Solid state heat pump appliance with carbon foam heat sink |
US20050227382A1 (en) * | 2004-04-02 | 2005-10-13 | Hui Angela T | In-situ surface treatment for memory cell formation |
US20050242425A1 (en) * | 2004-04-30 | 2005-11-03 | Leal George R | Semiconductor device with a protected active die region and method therefor |
-
2006
- 2006-12-20 WO PCT/US2006/048749 patent/WO2008088306A2/fr active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4855810A (en) * | 1987-06-02 | 1989-08-08 | Gelb Allan S | Thermoelectric heat pump |
US6396191B1 (en) * | 1999-03-11 | 2002-05-28 | Eneco, Inc. | Thermal diode for energy conversion |
US6492585B1 (en) * | 2000-03-27 | 2002-12-10 | Marlow Industries, Inc. | Thermoelectric device assembly and method for fabrication of same |
US20020085601A1 (en) * | 2000-12-29 | 2002-07-04 | Arima Optoelectronics Corporation | Light emitting diode with light conversion using scattering optical media |
US6446441B1 (en) * | 2001-08-28 | 2002-09-10 | William G. Dean | Magnetic refrigerator |
US6948322B1 (en) * | 2001-09-10 | 2005-09-27 | Percy Giblin | Solid state heat pump appliance with carbon foam heat sink |
US20050227382A1 (en) * | 2004-04-02 | 2005-10-13 | Hui Angela T | In-situ surface treatment for memory cell formation |
US20050242425A1 (en) * | 2004-04-30 | 2005-11-03 | Leal George R | Semiconductor device with a protected active die region and method therefor |
Also Published As
Publication number | Publication date |
---|---|
WO2008088306A2 (fr) | 2008-07-24 |
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