WO2008087918A1 - Dispositif électroluminescent semi-conducteur - Google Patents

Dispositif électroluminescent semi-conducteur Download PDF

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Publication number
WO2008087918A1
WO2008087918A1 PCT/JP2008/050306 JP2008050306W WO2008087918A1 WO 2008087918 A1 WO2008087918 A1 WO 2008087918A1 JP 2008050306 W JP2008050306 W JP 2008050306W WO 2008087918 A1 WO2008087918 A1 WO 2008087918A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor light
light
light emitting
emitting device
emitting elements
Prior art date
Application number
PCT/JP2008/050306
Other languages
English (en)
Japanese (ja)
Inventor
Seiichi Tokunaga
Kunio Takeuchi
Original Assignee
Sanyo Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008004024A external-priority patent/JP5334088B2/ja
Application filed by Sanyo Electric Co., Ltd. filed Critical Sanyo Electric Co., Ltd.
Priority to US12/441,247 priority Critical patent/US8384101B2/en
Publication of WO2008087918A1 publication Critical patent/WO2008087918A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)

Abstract

L'invention concerne des dispositifs électroluminescents semi-conducteurs (10, 30, 40) dans lesquels la directivité de l'intensité et la teinte de couleur de la lumière de sortie est faible et la sortie de lumière ne diminue pas aisément. Les dispositifs électroluminescents semi-conducteurs comprennent des éléments électroluminescents semi-conducteurs (1, 31), et des parties de diffusion de lumière en film mince (8, 8a, 38, 41) disposées sur le côté direction de sortie de lumière des éléments électroluminescents semi-conducteurs.
PCT/JP2008/050306 2007-01-15 2008-01-14 Dispositif électroluminescent semi-conducteur WO2008087918A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/441,247 US8384101B2 (en) 2007-01-15 2008-01-14 Semiconductor light-emitting device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007005323 2007-01-15
JP2007-005323 2007-01-15
JP2008004024A JP5334088B2 (ja) 2007-01-15 2008-01-11 半導体発光装置
JP2008-004024 2008-02-22

Publications (1)

Publication Number Publication Date
WO2008087918A1 true WO2008087918A1 (fr) 2008-07-24

Family

ID=39635922

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050306 WO2008087918A1 (fr) 2007-01-15 2008-01-14 Dispositif électroluminescent semi-conducteur

Country Status (1)

Country Link
WO (1) WO2008087918A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005191219A (ja) * 2003-12-25 2005-07-14 Sanken Electric Co Ltd 半導体発光素子およびその製造方法
JP2005332951A (ja) * 2004-05-19 2005-12-02 Toyoda Gosei Co Ltd 発光装置
JP2006032726A (ja) * 2004-07-16 2006-02-02 Kyocera Corp 発光装置
JP2006190710A (ja) * 2004-12-28 2006-07-20 Mitsubishi Cable Ind Ltd 窒化物半導体発光素子およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005191219A (ja) * 2003-12-25 2005-07-14 Sanken Electric Co Ltd 半導体発光素子およびその製造方法
JP2005332951A (ja) * 2004-05-19 2005-12-02 Toyoda Gosei Co Ltd 発光装置
JP2006032726A (ja) * 2004-07-16 2006-02-02 Kyocera Corp 発光装置
JP2006190710A (ja) * 2004-12-28 2006-07-20 Mitsubishi Cable Ind Ltd 窒化物半導体発光素子およびその製造方法

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