WO2008087400A1 - Laminate - Google Patents

Laminate Download PDF

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Publication number
WO2008087400A1
WO2008087400A1 PCT/GB2008/000135 GB2008000135W WO2008087400A1 WO 2008087400 A1 WO2008087400 A1 WO 2008087400A1 GB 2008000135 W GB2008000135 W GB 2008000135W WO 2008087400 A1 WO2008087400 A1 WO 2008087400A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
melt flow
flow index
thermoplastic polymer
laminate
Prior art date
Application number
PCT/GB2008/000135
Other languages
French (fr)
Inventor
David Barlow
Original Assignee
Lab091 Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lab091 Limited filed Critical Lab091 Limited
Priority to AT08701813T priority Critical patent/ATE547240T1/en
Priority to EP20080701813 priority patent/EP2112971B1/en
Priority to US12/523,496 priority patent/US8501305B2/en
Publication of WO2008087400A1 publication Critical patent/WO2008087400A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/31—Heat sealable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/04—Polyethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/10—Polypropylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24843—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] with heat sealable or heat releasable adhesive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249994—Composite having a component wherein a constituent is liquid or is contained within preformed walls [e.g., impregnant-filled, previously void containing component, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component

Definitions

  • the invention relates to a laminate particularly suitable for the printing of an ink pattern, such as a conductive ink electrode in a microfluidic device, and a method for printing such an ink pattern.
  • This method can also be used to bond two films together.
  • Each film is provided with an outer heat seal polymer layer.
  • the two outer layers of heat seal polymer are arranged to face each other and may be bonded together, upon application of the suitable temperature and pressure.
  • This technology is commonly employed in the packaging industry, where flexible and rigid polymers are used, for example for packaging food, healthcare products and other products.
  • the ink is not applied to the heat seal layer, but another layer of the co-extruded laminate, such as, for example, a layer which is not in contact with the heat seal layer or a layer which can subsequently be adhesive laminated to the heat seal layer.
  • another layer of the co-extruded laminate such as, for example, a layer which is not in contact with the heat seal layer or a layer which can subsequently be adhesive laminated to the heat seal layer.
  • Microfluidic devices used in many fields such as pharmaceuticals, biotechnology, the life sciences, defense, public health, and agriculture, are miniaturized systems controlling the flow of minute amounts of liquids or gases, to carry out lab-on-a-chip assays. These devices include a number of three-dimensional networks of channels and components, and thus require a high level of accuracy and precision during manufacture.
  • microfluidic devices may comprise one or more semi-encapsulated electrodes, formed by application of ink between two heal seal layers.
  • ink distorts, spreads and cracks, when the heat seal polymer flows, thereby breaking the circuit of the electrodes.
  • heat seal polymer does not flow, it has been shown to be insufficient bonding between the heat seal layers.
  • alternative heat seal materials were investigated, which led to the same issues.
  • a laminate comprising a first thermoplastic polymer layer with a first melt flow index, adjacent a thermoplastic polymer second layer with a second melt flow index, the first and second layer comprising the same thermoplastic polymer, characterised in that the first melt flow index is lower than the second melt flow index.
  • the first layer is bonded to the second layer.
  • the thermoplastic polymer in the first and second layer is preferably polyethylene.
  • the first layer comprises ink, which preferably forms a pattern on the surface of the first layer adjacent the second layer.
  • the ink is conductive and preferably forms an electrode.
  • a microfluidic device comprising a laminate as described above.
  • a method for incorporating an ink pattern in a laminate comprising the steps of a. providing a first thermoplastic polymer layer with a first melt flow index; b. applying the ink pattern onto a surface of the first layer; c. bonding said surface with a second thermoplastic polymer second layer with a second melt flow index; the first and second layer comprising the same thermoplastic polymer and wherein the first melt flow index is lower than the second melt flow index.
  • the surface of the first layer is bonded to the second layer by application of heat, preferably the sealing temperature. Pressure may also be applied for better adhesion of the heat seal layers.
  • the ink applied onto a surface of the first layer is conductive and preferably forms an electrode.
  • the invention relates to a laminate comprising a first thermoplastic polymer layer with a first melt flow index, adjacent a thermoplastic polymer second layer with a second melt flow index, the first and second layer comprising the same thermoplastic polymer, characterised in that the first melt flow index is lower than the second melt flow index.
  • the laminate comprises an efficient heat seal layer and is particularly suitable for incorporation of an ink pattern therein, without distortion, cracking or breaking of the ink pattern.
  • the invention further relates to microfluidic devices comprising such a laminate and to a method of printing an ink pattern using such a laminate.
  • Figure 1 is a schematic view of a laminate according to the invention.
  • Figure 2 is a schematic view of the laminate of Figure 1 , in which the first and the second thermoplastic layer are bonded together;
  • Figure 3 is a schematic view of a second laminate according to the invention
  • Figure 4 is a schematic view of the laminate of Figure 3, wherein the first thermoplastic polymer and the second thermoplastic polymer layer are bonded;
  • Figure 5 is a schematic view of a co-extruded film comprising the first thermoplastic polymer layer
  • Figure 6 is a schematic view of the co-extruded film of Figure 5, further comprising an ink pattern
  • Figure 7 is a schematic view of a co-extruded film comprising the second thermoplastic polymer layer.
  • the laminate comprises a first and a second co-extruded film 1, 2, each comprising one or more co-extruded layers 5, 6.
  • the first co-extruded film 1 further comprises a thermoplastic polymer or heat seal layer 3, with a first melt flow index and the second co- extruded film 2 further comprises a thermoplastic polymer or heat seal layer 4, with a second melt flow index.
  • the first and the second thermoplastic polymer layer 3, 4 may be bonded together by application of heat and preferably pressure.
  • both heat seal layers 3, 4 comprise the same material.
  • both heat seal layers 3, 4 consist essentially of the same thermoplastic polymer.
  • the preferred thermoplastic polymer for the heat seal layers 3, 4 is polyethylene, however, other thermoplastic polymers, such as polyolefm and polypropylene may be used.
  • thermoplastic material In order to reduce the flow of the thermoplastic material, polymers with lower melt flow index may be selected. However, sufficient seal cannot be achieved when one merely use a heat seal material of low melt flow index [PLEASE PROVIDE, IF AVAILABLE, THE LOWEST MELT FLOW INDEX WHICH CAN BE USED] and a second heat seal material of higher melt flow is necessary.
  • the Melt Flow Index is a measure of the flow of the melt of a thermoplastic polymer and corresponds to the amount (in grams) of polymer which can be forced through an orifice of specific diameter in 10 minutes, when subjected to a specific pressure at a specific temperature. Thus, the lower the melt flow index, the less flow is obtained upon heating and the less flexible the material. Methods for measuring the melt flow index of a material are given, for example in ASTM D1238 and ISO Rl 133.
  • Figures 3 and 4 are schematic view of a further laminate according to the invention, in which the first co-extruded film 1 comprises one or more co-extruded layers 5, a heat seal layer 3 and an ink pattern 7, applied onto the surface of the heat seal layer 3, which may bond to heat seal layer 4 of film 2.
  • thermoplastic polymer layer 4 with the higher melt flow index, contributes to the flow required for the heat seal layers 3, 4 to bond, while thermoplastic polymer layer 3, with the lower melt flow index, has enough tackiness to accept the adhesion, but not enough to cause ink distortion.
  • an acceptable bond strength is obtained, without distortion of the ink pattern.
  • the laminate as shown on Figure 3 may be obtained by providing a first film 1 comprising a thermoplastic polymeric layer 3 and one or more other layers 5, which may be co-extruded to form a co-extruded film 1 illustrated by Figure 5.
  • Figure 6 shows a schematic view of a co-extruded film 1 , in which an ink pattern 7 has been applied onto the outer surface of the heat seal layer 3.
  • the ink pattern 7 may form a specific decorative design.
  • the ink may be a conductive ink, applied onto the heat seal surface to form an electrode circuit.
  • Figure 7 shows a second film 2 comprising a thermoplastic polymeric layer 4 and one or more other layers 6, which may be co-extruded to form a co-extruded film 2.
  • the heat seal layer 4 comprises, or preferably consists essentially, of the same polymer as heat seal layer 3 and the melt flow index of heat seal layer 3 is lower than that of heat seal layer 4.
  • heat seal layers 3 and 4 of the first and the second co-extruded films 1, 2 are placed against each other, and upon application of heat, the polymer of heat seal layer 3 starts flowing and heat seal layer 4 achieves sufficient tackiness to accept the adhesion to heat seal layer 3.
  • the temperature to be applied, or sealing temperature, for a given material is known in the art and is specific to a given material, regardless of its melt flow index. As heat seal layer 4 has a lower melt flow index, the ink pattern does not distort, crack or break.

Landscapes

  • Laminated Bodies (AREA)

Abstract

The present invention relates to laminate comprising a first thermoplastic polymer layer with a first melt flow index, adjacent a thermoplastic polymer second layer with a second melt flow index, the first and second layer comprising the same thermoplastic polymer, characterised in that the first melt flow index is lower than the second melt flow index. The invention also relates to a microfluidic device comprising the laminate and a method for incorporating an ink pattern in the laminate.

Description

LAMINATE
The invention relates to a laminate particularly suitable for the printing of an ink pattern, such as a conductive ink electrode in a microfluidic device, and a method for printing such an ink pattern.
The incorporation of heat seals in polymeric laminates is well-known and is traditionally carried out by incorporating a layer of polymer, which will be used as heat seal during subsequent manufacture, into a co-extruded laminate. Upon application of a suitable temperature, the layer of polymer will become tacky and form a seal whilst the other layers of the co-extruded laminate remain unaffected.
This method can also be used to bond two films together. Each film is provided with an outer heat seal polymer layer. The two outer layers of heat seal polymer are arranged to face each other and may be bonded together, upon application of the suitable temperature and pressure. This technology is commonly employed in the packaging industry, where flexible and rigid polymers are used, for example for packaging food, healthcare products and other products.
Where an ink design or print is to be incorporated in the laminate, the ink is not applied to the heat seal layer, but another layer of the co-extruded laminate, such as, for example, a layer which is not in contact with the heat seal layer or a layer which can subsequently be adhesive laminated to the heat seal layer. Indeed, as the heat seal polymer needs to melt and flow to some extent for the bonding to be successful, and any ink pattern applied on the heat seal layer would be distorted by this flow. The distortion caused by this flow is disadvantageous where the ink pattern has a decorative purpose, but even more so where the ink pattern serves a functional purpose, which is the case for example in microfluidic devices.
Microfluidic devices, used in many fields such as pharmaceuticals, biotechnology, the life sciences, defense, public health, and agriculture, are miniaturized systems controlling the flow of minute amounts of liquids or gases, to carry out lab-on-a-chip assays. These devices include a number of three-dimensional networks of channels and components, and thus require a high level of accuracy and precision during manufacture.
These microfluidic devices may comprise one or more semi-encapsulated electrodes, formed by application of ink between two heal seal layers. However, it has been shown that, in such devices, the ink distorts, spreads and cracks, when the heat seal polymer flows, thereby breaking the circuit of the electrodes. And where the heat seal polymer does not flow, it has been shown to be insufficient bonding between the heat seal layers. Several alternative heat seal materials were investigated, which led to the same issues.
It is an object of the invention to mitigate problems such as those described above.
According to a first aspect of the invention, there is provided a laminate comprising a first thermoplastic polymer layer with a first melt flow index, adjacent a thermoplastic polymer second layer with a second melt flow index, the first and second layer comprising the same thermoplastic polymer, characterised in that the first melt flow index is lower than the second melt flow index.
According to an embodiment of the invention, the first layer is bonded to the second layer. The thermoplastic polymer in the first and second layer is preferably polyethylene.
According to another embodiment of the invention, the first layer comprises ink, which preferably forms a pattern on the surface of the first layer adjacent the second layer.
According to a further embodiment of the invention, the ink is conductive and preferably forms an electrode.
According to a second aspect of the invention, there is provided a microfluidic device comprising a laminate as described above. According to a third aspect of the invention, there is provided a method for incorporating an ink pattern in a laminate comprising the steps of a. providing a first thermoplastic polymer layer with a first melt flow index; b. applying the ink pattern onto a surface of the first layer; c. bonding said surface with a second thermoplastic polymer second layer with a second melt flow index; the first and second layer comprising the same thermoplastic polymer and wherein the first melt flow index is lower than the second melt flow index.
According to an embodiment of the invention, the surface of the first layer is bonded to the second layer by application of heat, preferably the sealing temperature. Pressure may also be applied for better adhesion of the heat seal layers.
According to a further embodiment of the invention, the ink applied onto a surface of the first layer is conductive and preferably forms an electrode.
The invention relates to a laminate comprising a first thermoplastic polymer layer with a first melt flow index, adjacent a thermoplastic polymer second layer with a second melt flow index, the first and second layer comprising the same thermoplastic polymer, characterised in that the first melt flow index is lower than the second melt flow index. The laminate comprises an efficient heat seal layer and is particularly suitable for incorporation of an ink pattern therein, without distortion, cracking or breaking of the ink pattern. The invention further relates to microfluidic devices comprising such a laminate and to a method of printing an ink pattern using such a laminate.
The invention will further be described by way of examples and with reference to the accompanying drawings, in which:
Figure 1 is a schematic view of a laminate according to the invention;
Figure 2 is a schematic view of the laminate of Figure 1 , in which the first and the second thermoplastic layer are bonded together;
Figure 3 is a schematic view of a second laminate according to the invention; Figure 4 is a schematic view of the laminate of Figure 3, wherein the first thermoplastic polymer and the second thermoplastic polymer layer are bonded;
Figure 5 is a schematic view of a co-extruded film comprising the first thermoplastic polymer layer;
Figure 6 is a schematic view of the co-extruded film of Figure 5, further comprising an ink pattern; and
Figure 7 is a schematic view of a co-extruded film comprising the second thermoplastic polymer layer.
Referring to Figures 1 and 2 there is illustrated a laminate according to the invention. The laminate comprises a first and a second co-extruded film 1, 2, each comprising one or more co-extruded layers 5, 6. The first co-extruded film 1 further comprises a thermoplastic polymer or heat seal layer 3, with a first melt flow index and the second co- extruded film 2 further comprises a thermoplastic polymer or heat seal layer 4, with a second melt flow index. As illustrated by Figure 2, the first and the second thermoplastic polymer layer 3, 4 may be bonded together by application of heat and preferably pressure.
It is essential for efficient bonding to be obtained that both heat seal layers 3, 4 comprise the same material. Most preferably, both heat seal layers 3, 4 consist essentially of the same thermoplastic polymer. The preferred thermoplastic polymer for the heat seal layers 3, 4 is polyethylene, however, other thermoplastic polymers, such as polyolefm and polypropylene may be used.
In order to reduce the flow of the thermoplastic material, polymers with lower melt flow index may be selected. However, sufficient seal cannot be achieved when one merely use a heat seal material of low melt flow index [PLEASE PROVIDE, IF AVAILABLE, THE LOWEST MELT FLOW INDEX WHICH CAN BE USED] and a second heat seal material of higher melt flow is necessary.
The Melt Flow Index (MFI) is a measure of the flow of the melt of a thermoplastic polymer and corresponds to the amount (in grams) of polymer which can be forced through an orifice of specific diameter in 10 minutes, when subjected to a specific pressure at a specific temperature. Thus, the lower the melt flow index, the less flow is obtained upon heating and the less flexible the material. Methods for measuring the melt flow index of a material are given, for example in ASTM D1238 and ISO Rl 133.
Figures 3 and 4 are schematic view of a further laminate according to the invention, in which the first co-extruded film 1 comprises one or more co-extruded layers 5, a heat seal layer 3 and an ink pattern 7, applied onto the surface of the heat seal layer 3, which may bond to heat seal layer 4 of film 2. Upon application of heat, thermoplastic polymer layer 4, with the higher melt flow index, contributes to the flow required for the heat seal layers 3, 4 to bond, while thermoplastic polymer layer 3, with the lower melt flow index, has enough tackiness to accept the adhesion, but not enough to cause ink distortion. Thus, an acceptable bond strength is obtained, without distortion of the ink pattern.
The laminate as shown on Figure 3 may be obtained by providing a first film 1 comprising a thermoplastic polymeric layer 3 and one or more other layers 5, which may be co-extruded to form a co-extruded film 1 illustrated by Figure 5. Figure 6 shows a schematic view of a co-extruded film 1 , in which an ink pattern 7 has been applied onto the outer surface of the heat seal layer 3. The ink pattern 7 may form a specific decorative design. Alternatively, the ink may be a conductive ink, applied onto the heat seal surface to form an electrode circuit.
Figure 7 shows a second film 2 comprising a thermoplastic polymeric layer 4 and one or more other layers 6, which may be co-extruded to form a co-extruded film 2. The heat seal layer 4 comprises, or preferably consists essentially, of the same polymer as heat seal layer 3 and the melt flow index of heat seal layer 3 is lower than that of heat seal layer 4.
Finally, the heat seal layers 3 and 4 of the first and the second co-extruded films 1, 2 are placed against each other, and upon application of heat, the polymer of heat seal layer 3 starts flowing and heat seal layer 4 achieves sufficient tackiness to accept the adhesion to heat seal layer 3. The temperature to be applied, or sealing temperature, for a given material is known in the art and is specific to a given material, regardless of its melt flow index. As heat seal layer 4 has a lower melt flow index, the ink pattern does not distort, crack or break.

Claims

1. A laminate comprising a first thermoplastic polymer layer with a first melt flow index, adjacent a thermoplastic polymer second layer with a second melt flow index, the first and second layer comprising the same thermoplastic polymer, characterised in that the first melt flow index is lower than the second melt flow index.
2. The laminate according to claim 1, wherein the first layer is bonded to the second layer.
3. The laminate according to claim 1 or 2, wherein the thermoplastic polymer is polyethylene.
4. The laminate according to any preceding claim, wherein the first layer comprises ink.
5. The laminate according to claim 4, wherein the ink forms a pattern on the surface of the first layer adjacent the second layer.
6. The laminate according to claim 4 or 5, wherein the ink is conductive.
7. The laminate according to claim 6, wherein the ink forms an electrode.
8. The laminate substantially as described herein with reference to the accompanying drawings.
9. A microfluidic device comprising a laminate according to any one of claims 1 to 8.
10. A method for incorporating an ink pattern in a laminate comprising the steps of d. providing a first thermoplastic polymer layer with a first melt flow index; e. applying the ink pattern onto a surface of the first layer; f. bonding said surface with a second thermoplastic polymer second layer with a second melt flow index; the first and second layer comprising the same thermoplastic polymer and wherein the first melt flow index is lower than the second melt flow index.
11. The method according to claim 10, wherein the surface of the first layer is bonded to the second layer by application of heat.
12. The method according to claim 11, wherein the heat applied is the sealing temperature of the thermoplastic polymer.
13. The method according to one of claims 10 to 12, wherein the bonding step is carried out under pressure.
14. The method according to any one of claims 10 to 13, wherein the ink is conductive.
15. The method according to claim 14, wherein the ink pattern forms an electrode.
16. The method as substantially as described herein with reference to the accompanying drawings.
PCT/GB2008/000135 2007-01-16 2008-01-16 Laminate WO2008087400A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AT08701813T ATE547240T1 (en) 2007-01-16 2008-01-16 LAMINATE
EP20080701813 EP2112971B1 (en) 2007-01-16 2008-01-16 Laminate
US12/523,496 US8501305B2 (en) 2007-01-16 2008-01-16 Laminate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0700824A GB2445739A (en) 2007-01-16 2007-01-16 Polymeric laminates containing heat seals
GB0700824.6 2007-01-16

Publications (1)

Publication Number Publication Date
WO2008087400A1 true WO2008087400A1 (en) 2008-07-24

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PCT/GB2008/000135 WO2008087400A1 (en) 2007-01-16 2008-01-16 Laminate

Country Status (5)

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US (1) US8501305B2 (en)
EP (1) EP2112971B1 (en)
AT (1) ATE547240T1 (en)
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WO (1) WO2008087400A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2641271A1 (en) 2006-02-03 2008-03-13 Microchip Biotechnologies, Inc. Microfluidic devices
EP2606154B1 (en) 2010-08-20 2019-09-25 Integenx Inc. Integrated analysis system
US10865440B2 (en) 2011-10-21 2020-12-15 IntegenX, Inc. Sample preparation, processing and analysis systems
US20150136604A1 (en) 2011-10-21 2015-05-21 Integenx Inc. Sample preparation, processing and analysis systems
WO2015073999A1 (en) 2013-11-18 2015-05-21 Integenx Inc. Cartridges and instruments for sample analysis
US9601909B2 (en) 2014-04-03 2017-03-21 Yazaki North America, Inc. Protective enclosure for a wire harness
US10208332B2 (en) 2014-05-21 2019-02-19 Integenx Inc. Fluidic cartridge with valve mechanism
CN113092563B (en) 2014-10-22 2024-06-07 尹特根埃克斯有限公司 Systems and methods for sample preparation, processing, and analysis
US10233491B2 (en) 2015-06-19 2019-03-19 IntegenX, Inc. Valved cartridge and system
EP3452404A4 (en) * 2016-05-06 2019-12-25 The Board of Trustees of the Leland Stanford Junior University Elastomeric focusing valves

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4049147A (en) * 1974-01-14 1977-09-20 National Distillers And Chemical Corporation Plastic skin envelopes for glass bottles and the like
US4247591A (en) * 1978-03-27 1981-01-27 Signode Corporation Fusible composite binding strap
US4472471A (en) * 1982-01-27 1984-09-18 United Technical Products Inc. Chair mat
US5658647A (en) * 1995-06-07 1997-08-19 Avery Dennison Corporation Garment labeling system, equipment and method and elastomeric label for use therewith
US5665469A (en) * 1994-12-07 1997-09-09 Wolff Walsrode Aktiengesellschaft Multilayer oriented heat-sealable polypropylene film
US6123798A (en) * 1998-05-06 2000-09-26 Caliper Technologies Corp. Methods of fabricating polymeric structures incorporating microscale fluidic elements

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4065263A (en) 1976-04-02 1977-12-27 Woodbridge Iii Richard G Analytical test strip apparatus
US5284570A (en) 1991-06-26 1994-02-08 Ppg Industries, Inc. Fluid sample analyte collector and calibration assembly
US5288463A (en) 1992-10-23 1994-02-22 Eastman Kodak Company Positive flow control in an unvented container
WO1994026414A1 (en) 1993-05-17 1994-11-24 Syntex (U.S.A.) Inc. Reaction container for specific binding assays and method for its use
US5658413A (en) 1994-10-19 1997-08-19 Hewlett-Packard Company Miniaturized planar columns in novel support media for liquid phase analysis
US5500071A (en) 1994-10-19 1996-03-19 Hewlett-Packard Company Miniaturized planar columns in novel support media for liquid phase analysis
US5525405A (en) 1994-12-14 1996-06-11 E. I. Du Pont De Nemours And Company Adhesiveless aromatic polyimide laminate
US20010055812A1 (en) 1995-12-05 2001-12-27 Alec Mian Devices and method for using centripetal acceleration to drive fluid movement in a microfluidics system with on-board informatics
US5685469A (en) * 1996-04-04 1997-11-11 Advanced Accessory Systems L.L.C. Swing-down carriers with top actuators
US5863801A (en) 1996-06-14 1999-01-26 Sarnoff Corporation Automated nucleic acid isolation
US6054100A (en) 1996-11-18 2000-04-25 Robbins Scientific Corporation Apparatus for multi-well microscale synthesis
US5932799A (en) 1997-07-21 1999-08-03 Ysi Incorporated Microfluidic analyzer module
US6375871B1 (en) 1998-06-18 2002-04-23 3M Innovative Properties Company Methods of manufacturing microfluidic articles
US6207031B1 (en) * 1997-09-15 2001-03-27 Whitehead Institute For Biomedical Research Methods and apparatus for processing a sample of biomolecular analyte using a microfabricated device
CA2301557A1 (en) 1997-09-19 1999-04-01 Aclara Biosciences, Inc. Apparatus and method for transferring liquids
CA2306126A1 (en) 1997-10-15 1999-04-22 Aclara Biosciences, Inc. Laminate microstructure device and method for making same
US6632653B1 (en) 1997-12-08 2003-10-14 Thomas W. Astle Continuous polymerase chain reaction apparatus with multiple temperature stations
US6251343B1 (en) 1998-02-24 2001-06-26 Caliper Technologies Corp. Microfluidic devices and systems incorporating cover layers
US6106783A (en) 1998-06-30 2000-08-22 Microliter Analytical Supplies, Inc. Microplate assembly and closure
US6787111B2 (en) * 1998-07-02 2004-09-07 Amersham Biosciences (Sv) Corp. Apparatus and method for filling and cleaning channels and inlet ports in microchips used for biological analysis
US7155344B1 (en) 1998-07-27 2006-12-26 Caliper Life Sciences, Inc. Distributed database for analytical instruments
US6103199A (en) 1998-09-15 2000-08-15 Aclara Biosciences, Inc. Capillary electroflow apparatus and method
JP4427834B2 (en) * 1999-04-30 2010-03-10 凸版印刷株式会社 Multilayer film for standing pouch
ATE215673T1 (en) * 1999-06-28 2002-04-15 California Inst Of Techn ELASTOMERIC MICROPUMP AND MICROVALVE SYSTEMS
WO2001007892A1 (en) 1999-07-27 2001-02-01 Esperion Therapeutics, Inc. Method and device for measurement of cholesterol efflux
AU7698500A (en) 1999-10-14 2001-04-23 Ce Resources Pte Ltd Microfluidic structures and methods of fabrication
CA2387064A1 (en) 1999-10-22 2001-05-03 Torlief Ove Bjornson Sealing for microfluidic devices
US6569674B1 (en) 1999-12-15 2003-05-27 Amersham Biosciences Ab Method and apparatus for performing biological reactions on a substrate surface
US6361958B1 (en) 1999-11-12 2002-03-26 Motorola, Inc. Biochannel assay for hybridization with biomaterial
US20030017467A1 (en) 2000-02-18 2003-01-23 Aclara Biosciences, Inc. Multiple-site sample-handling apparatus and method
US6627159B1 (en) 2000-06-28 2003-09-30 3M Innovative Properties Company Centrifugal filling of sample processing devices
EP1311390A1 (en) * 2000-07-18 2003-05-21 Showa Denko Plastic Products Co. Ltd. Layered film and packaging product thereof
US20020172622A1 (en) 2001-04-03 2002-11-21 Weigl Bernhard H. Microfluidic device for concentrating particles in a concentrating solution
US6843262B2 (en) 2001-04-25 2005-01-18 President And Fellows Of Harvard College Fluidic switches and methods for controlling flow in fluidic systems
JP2003011297A (en) * 2001-06-28 2003-01-15 Japan Polychem Corp Packaging polypropylene oriented film
US6863878B2 (en) 2001-07-05 2005-03-08 Robert E. Klepper Method and apparatus for producing synthesis gas from carbonaceous materials
GB0128350D0 (en) 2001-11-27 2002-01-16 Lab901 Ltd Non-rigid apparatus for microfluidic applications
EP1336475A1 (en) * 2002-02-15 2003-08-20 Amcor Flexibles Transpac Gas tight multilayered peelable polypropylene film
US7241420B2 (en) 2002-08-05 2007-07-10 Palo Alto Research Center Incorporated Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal
US7431888B2 (en) * 2002-09-20 2008-10-07 The Regents Of The University Of California Photoinitiated grafting of porous polymer monoliths and thermoplastic polymers for microfluidic devices
US7718421B2 (en) 2003-02-05 2010-05-18 Iquum, Inc. Sample processing
DE10307227A1 (en) 2003-02-14 2004-08-26 Cytocentrics Ccs Gmbh Introducing fluid into microfluidic structures for e.g. analysis or synthesis, locates elastic material above access opening and penetrates it using hollow needle
GB0502556D0 (en) 2005-02-08 2005-03-16 Lab901 Ltd Analysis instrument
GB2445738A (en) 2007-01-16 2008-07-23 Lab901 Ltd Microfluidic device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4049147A (en) * 1974-01-14 1977-09-20 National Distillers And Chemical Corporation Plastic skin envelopes for glass bottles and the like
US4247591A (en) * 1978-03-27 1981-01-27 Signode Corporation Fusible composite binding strap
US4472471A (en) * 1982-01-27 1984-09-18 United Technical Products Inc. Chair mat
US5665469A (en) * 1994-12-07 1997-09-09 Wolff Walsrode Aktiengesellschaft Multilayer oriented heat-sealable polypropylene film
US5658647A (en) * 1995-06-07 1997-08-19 Avery Dennison Corporation Garment labeling system, equipment and method and elastomeric label for use therewith
US6123798A (en) * 1998-05-06 2000-09-26 Caliper Technologies Corp. Methods of fabricating polymeric structures incorporating microscale fluidic elements

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GB2445739A (en) 2008-07-23
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US20100068477A1 (en) 2010-03-18
GB0700824D0 (en) 2007-02-21

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