WO2008062036A2 - Montage sur carte d'un transducteur de microphone - Google Patents

Montage sur carte d'un transducteur de microphone Download PDF

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Publication number
WO2008062036A2
WO2008062036A2 PCT/EP2007/062688 EP2007062688W WO2008062036A2 WO 2008062036 A2 WO2008062036 A2 WO 2008062036A2 EP 2007062688 W EP2007062688 W EP 2007062688W WO 2008062036 A2 WO2008062036 A2 WO 2008062036A2
Authority
WO
WIPO (PCT)
Prior art keywords
microphone
circuit board
communication device
printed circuit
portable communication
Prior art date
Application number
PCT/EP2007/062688
Other languages
English (en)
Other versions
WO2008062036A3 (fr
Inventor
Pirmin Herman Otto Rombach
Jörg Rehder
Original Assignee
Pulse Mems Aps.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pulse Mems Aps. filed Critical Pulse Mems Aps.
Priority to US12/516,120 priority Critical patent/US8295528B2/en
Priority to DE112007002856T priority patent/DE112007002856T5/de
Publication of WO2008062036A2 publication Critical patent/WO2008062036A2/fr
Publication of WO2008062036A3 publication Critical patent/WO2008062036A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/023—Screens for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Definitions

  • the present invention relates to a mobile terminal assembly comprising a mobile terminal printed circuit board having an aperture formed therein.
  • the aperture extends between first and second substantially opposing surfaces of the mobile terminal printed circuit board and a microphone is positioned at least partly inside the aperture.
  • US 2006/0157841 and US 2006/0116180 disclose respective MEMS microphone mounting concepts to attach surface mountable MEMS microphone packages to printed circuit boards disposed inside a housing or casing of an electronic device.
  • a sound aperture is formed in a surface mountable carrier of the MEMS microphone package and another sound aperture extends through the printed circuit board of the communication device.
  • a sound passage is formed through the respective sound apertures of the MEMS microphone carrier and the printed circuit board of the communication device to acoustically couple a transducer element disposed inside the MEMS microphone package to the exterior of the electronic device.
  • a microphone is positioned at least partly within an aperture formed in a printed circuit board of a portable communication device such as a mobile terminal, mobile phone, headset or hearing prostheses.
  • a portable communication device such as a mobile terminal, mobile phone, headset or hearing prostheses.
  • an implementation of the present invention relates to a portable communication device assembly comprising: a housing comprising a housing portion having first opening for receiving sound; a first printed circuit board positioned adjacent to the housing portion and comprising a second opening or cavity positioned adjacent to the first opening; and a microphone for receiving sound, the microphone being positioned at least partly in the second opening or cavity.
  • the second opening or cavity extends through the first printed circuit board from a first surface to a second opposing surface thereof.
  • the portable communication device assembly may further comprise a carrier element supporting or holding the microphone and attached to the first printed circuit board. This carrier element may be attached to or at a surface portion of the first PCB facing away from the surface part of the portable communication device housing having the opening for example by gluing, bonding or soldering.
  • the portable communication device 1 preferably comprises an acoustical seal provided between the first printed circuit board and the carrier element for acoustically sealing the second opening or cavity at the first side of the first printed circuit board.
  • the portable communication device assembly or communication device assembly further comprises an electromagnetic shield provided between the first printed circuit board and the carrier element for electromagnetically shielding the microphone from the surroundings of the first printed circuit board and the carrier element.
  • the first PCB provides an EMC sealing, at least by the EMC sealing provided by the conductors thereof.
  • the carrier element may comprise an electromagnetic shield either by using an electrically conductive plane (or conductors positioned in that plane) electrical conductors positioned at circumferential edge portions thereof and at an angle to the plane of the carrier element.
  • This plane of the carrier element would normally be parallel to a plane of the first PCB.
  • the carrier element may be adapted to block or attenuate electromagnetic fields entering the carrier element both at a major surface thereof as well as via edges thereof.
  • Non-limiting examples of the first PCB and the carrier element are: a standard PCB, a ceramic substrate, a semiconductor substrate (typically Silicon-based), LTCC (Low Temperature Co-fired Ceramic) and HTCC (High Temperature Co-fired Ceramic).
  • the PCB and the carrier element each comprise an electrically nonconducting base material and support micron- size features.
  • the carrier element is a second printed circuit board comprising a number of electrically conducting paths; the microphone is electrically connected to one or more of the conducting paths; and one or more of the conducting paths are electrically connected to conductive parts of the first printed circuit board.
  • the microphone may simply be fixed or attached to the carrier element and the second carrier element may be fixed to the first PCB via this electrically conducting connection (typically soldering).
  • This electrically conducting connection may e.g. be wire-bonding or flip chip mounting.
  • These electrically conducting connections may be provided at the same side of the carrier element which may then be connected to a side of the first PCB facing away from the surface portion of the housing.
  • the above shielding may be provided between the carrier element and the first PCB also by e.g. a ring (preferably forming a closed curve) of solder surrounding (in a projection on to a plane of the first PCB) the electrical connections of the microphone and the carrier element and the connections between the carrier element and the first PCB.
  • the above-mentioned optional electrical shielding around the edge portions of the carrier element may advantageously comprise a number of standard vias extending along the edge portions, and the electrical shielding in the plane of the carrier element may be provided by conducting paths thereof in one or more path layers thereof as is known in standard PCBs.
  • additional electronic components may be connected to the conducting paths of the carrier element.
  • these components may be positioned inside the electrically shielded area.
  • Such components may be amplifiers such as low-noise microphone preamplifiers, decoupling or voltage supply capacitors, voltage multipliers, voltage regulators, or the like.
  • the microphone comprises a first and a second part engaging each other, such as in a detachable manner, where: the first part comprises a diaphragm and comprising an inner surface defining a cavity, the diaphragm forming at least part of the inner surface; the second part defines a cavity having an opening facing the diaphragm.
  • the first and second parts may be provided or manufactured separately from each other, and may be assembled at any desired point in time or may even subsequently be detached again.
  • the first and second parts engage in a manner so that an acoustic sealing is provided there between.
  • a sealing member may be used if desired.
  • the second part may be formed by at least a part of the second cavity in the first PCB.
  • the first part may then be positioned outside the second cavity or at least partly within the second cavity with the diaphragm facing the second cavity or a "deeper part" of the second cavity (a part further into the cavity than the first part).
  • the second part of the microphone may then be formed by a cavity in a second element which is attached to the first printed circuit board. Then, the first part of the microphone may be attached to the second element or the first PCB.
  • any type of microphone may be used in the present invention, such as a condenser or electret microphone transducer. Due to the preferred soldering operation in connecting the microphone to the first PCB or the carrier element, it is advantageous that the microphone comprises a MEMS transducer element, which is a transducer element wholly or at least partly fabricated by application of Micro Mechanical System Technology, or a temperature resistant ASIC in that this facilitates such soldering.
  • the microphone may form part of a Chip-Scale-Packaged (CSP) MEMS microphone assembly, and it may advantageously comprise an electronic circuit die electrically coupled to the microphone to amplify or buffer electrical signals generated by the microphone in response to receipt of sound.
  • CSP Chip-Scale-Packaged
  • the microphone comprises a MEMS transducer with a diaphragm to back plate distance of 1-20 ⁇ m or more preferably 1-10 ⁇ m, such as 1-5 ⁇ m.
  • the MEMS transducer may have an extension, in the plane of the diaphragm, of less than 4.0 mm x 4.0 mm such as 3.5 mm x 3.5 mm or even more preferably less than 3.0 mm x 3.0 mm.
  • the MEMS microphone transducer may comprise a semiconductor material such as Silicon or Gallium Arsenide in combination with conductive and/or isolating materials such as silicon nitride, poly crystalline silicon, silicon oxide and glass.
  • the microphone may comprise solely conductive materials such as aluminium, copper etc., optionally in combination with isolating materials like glass and/or silicon oxide.
  • a second aspect of the invention relates to a microphone assembly for use in the portable communication device according to the first aspect, the assembly comprising:
  • an electro acoustic transducer adapted to output an electrical signal
  • a processing circuit adapted to process the electrical signal from the transducer
  • a carrier element having a first and a second sides, the transducer and processing circuit being fixed to the same side of the carrier element.
  • the carrier element has a hole in the side thereof, and wherein the transducer element is positioned so as to cover the hole.
  • the transducer may use be of a type using the hole as one of the front or back chambers thereof.
  • the transducer may comprise a diaphragm, one side of which is acoustically connected to the hole.
  • This transducer may comprise a housing having an opening into the hole, or the pertaining side of the diaphragm may be fully exposed to the hole.
  • the carrier element has, on the side thereof and encircling the transducer and the circuit, a sealing element adapted to seal against a printed circuit to which it is connected when mounted in the communication device.
  • This sealing element may be an acoustic sealing element, such as a resilient element contacting the carrier element and the PCB when the present assembly is mounted vis-a-vis the PCB.
  • the sealing element may be adapted to protect the transducer and circuit from external electrical fields (EMC shielding), whereby it may be formed by a conducting sealing surrounding the transducer and circuit and contacting (preferably along the periphery thereof) (or being adapted to support a conducting material contacting) both the carrier element and the PCB.
  • the carrier element may comprise, therein in a plane, which may be parallel to or not perpendicular to a plane of the surface, one or more electrical conductors adapted to shield the circuit from external electromagnetic fields.
  • the carrier element further comprises electrical conductors connecting the transducer and the circuit.
  • the transducer and the circuit may be fixed to the carrier element via electrical connections (such as via solder bumps), which carry signals from the transducer to the circuit via the electrical conductors of the carrier element.
  • the carrier element may then be a PCB.
  • the present invention relates to a portable communication device comprising a portable communication device assembly according to the first aspect of the present invention.
  • the portable communication device may be a mobile terminal, cellular phone, a hearing prostheses, headset or any combination thereof.
  • FIGS. Ia and b show cross-sectional and perspective views, respectively, of mobile terminal assembly according to a first embodiment of the present invention.
  • FIG. 2a and b show cross-sectional and perspective views, respectively, of a MEMS microphone assembly according to a second embodiment of the present invention.
  • FIG. 3a and b show cross-sectional and perspective views, respectively, of mobile terminal assembly according to a third embodiment of the present invention.
  • FIG. 4 a and b illustrate the embodiment in more detail.
  • a mobile terminal assembly comprises a mobile terminal printed circuit board 5 disposed inside a casing or housing 10 of a mobile terminal (not shown).
  • a Chip-Scale-Packaged (CSP) MEMS microphone 8 is mounted onto and electrically coupled to a first surface of an intermediate carrier 1 that preferably comprises a printed circuit board.
  • CSP Chip-Scale-Packaged
  • the CSP packaged MEMS microphone assembly 8 comprises a semiconductor or ceramic substrate 12 that holds a MEMS transducer element 13 in form of a MEMS condenser transducer.
  • the semiconductor substrate 12 may advantageously comprise an indentation or cut-out 14 aligned with and positioned beneath a diaphragm/back plate assembly of the MEMS transducer element 13.
  • the indentation 14 functions as a back chamber for the MEMS transducer element 13.
  • the MEMS transducer element 13 is adjacently positioned to an electronic circuit die 16 that preferably comprises a low-noise preamplifier, and optionally and A/D converter and/or a voltage regulator and a voltage multiplier, electrically coupled to the MEMS transducer element 13 through interconnections supplied on the semiconductor substrate 12, or alternatively, directly between respective bonding pads on the MEMS transducer element and the electronic circuit die 16.
  • an electronic circuit die 16 that preferably comprises a low-noise preamplifier, and optionally and A/D converter and/or a voltage regulator and a voltage multiplier, electrically coupled to the MEMS transducer element 13 through interconnections supplied on the semiconductor substrate 12, or alternatively, directly between respective bonding pads on the MEMS transducer element and the electronic circuit die 16.
  • the entire CSP MEMS microphone assembly 8 is located within an aperture 11 formed in mobile terminal printed circuit board 5 and that extends between opposing upper and lower surfaces of the printed circuit board 5.
  • Sound or acoustical signals from the exterior environment propagate through the sound inlet 20 in the casing 10 of the mobile terminal to a diaphragm of the MEMS condenser transducer 13.
  • a compressible gasket 15 is arranged on a first or upper surface of the mobile terminal printed circuit board 5 and surrounds the aperture 11 formed therein. The compressible gasket 15 is disposed in-between the casing 10 of the mobile terminal and the mobile terminal printed circuit board 5 to abut these and to surround the sound inlet 20 and the aperture 11. Thereby, the sound path to the CSP packaged MEMS microphone 8 is acoustically sealed from the interior of the mobile terminal.
  • the CSP packaged MEMS microphone assembly 8 and the first surface of an intermediate carrier 1 comprises aligned respective sets of electrically conductive bumps or terminals 8' to allow compact flip-chip mounting of the CSP packaged MEMS microphone 8 on the intermediate carrier 1 having corresponding terminals 19' and the die 16 as well, using terminals 16'.
  • other interconnection mechanisms are possible such as wire bonding etc.
  • the first surface 6 of an intermediate carrier 1 additionally comprises a second set of electrically conductive bumps 3 that can be soldered to mating electrical terminals 3' placed on the second or lower side of the mobile terminal printed circuit board 5 to establish electrical and mechanical contact between the printed circuit board 5 and the intermediate carrier 1.
  • the printed circuit board 5 typically comprises electronic components of the mobile terminal and circuits for receipt and processing of microphone signals generated by the CSP packaged MEMS microphone assembly 8.
  • the first surface 6 of the intermediate carrier 1 additionally comprises a peripherally extending solder ring 2 that is operative to acoustically seal the CSP packaged MEMS microphone 8 from the interior space of the mobile terminal situated below the printed circuit board 5.
  • the solder ring 2 may advantageously be soldered onto a corresponding electrical trace 2' patterned on the lower side of the mobile terminal printed circuit board 5.
  • the combination of the mutually interconnected CSP packaged MEMS microphone assembly 8 and the intermediate carrier 1 may be viewed as a MEMS microphone assembly or package/component that is reflow solderable to the printed circuit board 5 residing in the mobile terminal.
  • solder ring 2 may additionally function to EMC shield the CSP packaged MEMS microphone 8 for example by connecting the solder ring 2 to a suitable electrical potential such as a DC supply potential or ground potential.
  • the shielding effect of the carrier 1 may be increased by using electrically conducting paths thereof (not illustrated), such as paths provided in an inner layer thereof or provided on a side opposite to that having the bumps 3, and vias may be provided through the carrier 1 at peripheral parts thereof (at or under the ring 2) in order to also provide an EMC shielding of electromagnetic fields entering through the carrier 1 from the back side or the edges thereof.
  • Naturally additional electronic elements such as amplifiers or decoupling capacitors, may be provided on the carrier 1 and within the ring 2, in order to take advantage of electrical connection to e.g. the microphone 8 while being within the shielded area.
  • the carrier 1 is as small as possible while providing the an area sufficient for the microphone 8, the ring 2 to seal around the aperture 11 and for holding any desired additional electronic components.
  • An area of 4x4 mm or 4x3 mm is obtainable.
  • FIG. 2a and b a second embodiment of the invention is illustrated wherein the CSP MEMS microphone assembly 8 of the first embodiment has been replaced with a simplified MEMS microphone assembly 17 wherein the MEMS transducer element 13 is directly attached and electrically coupled to the intermediate carrier 1 or carrier.
  • the carrier 1 is mounted to a mobile terminal printed circuit board 5 in a manner similar to the first embodiment so as to position the MEMS transducer element 13 at least partly inside the aperture 11 that extends through opposing upper and lower surfaces of the mobile terminal printed circuit board 5.
  • the microphone 8 is now provided as two separate parts of which one is a back cavity provided in the carrier 1.
  • the other part 13 of the microphone 8 also comprises a cavity (or parts defining a cavity) and the diaphragm of the microphone 8.
  • the MEMS microphone of the present embodiment lacks the semiconductor substrate 12 residing within the CSP MEMS microphone assembly of FIG. 1. Advantages of the present embodiment are its lower parts count and cost. Furthermore, the present MEMS microphone may have lower overall height. A MEMS microphone may have a height of only 400 ⁇ m, and a standard PCB has a thickness of 900 ⁇ m. However, if the PCB is a flex print, the height of the MEMS microphone may be deciding for the overall height of the assembly.
  • an electronic circuit die 16 as described above in relation to FIG. Ia and b, may be placed adjacently to the MEMS transducer element 13 and electrically coupled thereto.
  • the MEMS transducer element 13 and the electronic circuit die 16 may be integrated on a common semiconductor substrate.
  • a lower surface of the MEMS transducer element 13 and the first or upper surface 6 of the intermediate carrier 1 may advantageously comprise respective sets of aligned electrically conductive bumps or terminals to allow compact flip-chip mounting of the MEMS transducer element 13 on the intermediate carrier 1.
  • the electronic circuit die 16 may also be connected to the intermediate carrier 1 in a similar manner. However, other interconnection mechanisms between the intermediate carrier 1 and electronic circuit die 16 and/or the MEMS transducer element 13 are naturally possible such as wire bonding etc.
  • the intermediate carrier 1 preferably comprises, or is formed in, a conventional piece of printed circuit board.
  • the intermediate carrier 1 may advantageously comprise an indentation or cutout 14 aligned with and positioned beneath a diaphragm/back plate assembly of the MEMS transducer element 13.
  • the indentation 14 may be formed in the intermediate carrier 1 by laser cutting, punching or drilling and functions as a back chamber for the MEMS transducer element 13.
  • the first surface of an intermediate carrier 1 additionally comprises a second set of electrically conductive bumps 3 that are solderable to mating electrical terminals placed on the second or lower side of a mobile terminal printed circuit board 5 as illustrated in FIG. Ia and b. Electrical and mechanical contact is thereby established between the printed circuit board 5 and the intermediate carrier 1.
  • the printed circuit board 5 typically comprises electronic components of the mobile terminal and circuits for receipt and processing of microphone signals generated by the MEMS transducer element 13.
  • the first surface of an intermediate carrier 1 additionally comprises a peripherally extending solder ring 2 that is operative to acoustically seal the MEMS transducer element 13 from the interior space of the mobile terminal situated below the printed circuit board 5.
  • the solder ring 2 may advantageously also function to EMC shield the MEMS transducer element 13 for example by connecting the solder ring 2 to a suitable electrical potential such as ground potential.
  • An alternative to the second embodiment is one, wherein the indentation 14 is instead provided in the PCB 5, whereby the part 13 is simply provided above or also within the indentation in the PCB 5. This further reduces the height of the assembly.
  • Fig. 3a and 3b illustrate a third embodiment, in which the microphone 8 is positioned within the indentation 11 of the PCB 5, which does now not extend all the way through the PCB 5 for forming a through-going aperture.
  • the PCB 5 may have soldering pads 28 arranged at a bottom or lower surface 29 of the aperture or indentation 11.
  • the PCB 5 may be a multilayer PCB, where the surface 29 is a surface of an internal layer of the PCB 5.
  • additional electronic components may be provided in the indentation 11, such as on the layer 29, by providing additional bumps/pads 28 for attachment of such components.
  • a lower layer or the lower surface of the PCB 5 may be used therefore as may vias provided around the exposed surface 29 in the same manner as is described in relation to FIG. 1.
  • the microphone assembly comprising the microphone 8, the circuit 16 as well as the substrate 12, in this embodiment having the hole 14 for use by the microphone 8, is illustrated attached to and separated from the PCB 5. It is seen that the PCB and substrate 12 have mating contacts or terminals 3 and 3' for carrying signals there between as well as mating encircling, conducting paths 2 and 2' for providing an electromagnetic sealing of the circuit 16 from the surroundings.
  • the overall height of the microphone 8 and circuit 16 is sufficiently low for them to not extend beyond the upper surface of the PCB 5 in order for them to be protected from shear forces exerted between the PCB 5 and the casing 10, which may come about when handling or dropping the telephone. Such forces are taken up by the gasket 15 with no damage to the other elements.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Telephone Set Structure (AREA)

Abstract

L'invention concerne un ensemble de dispositif de communication portable comprenant un boîtier et une carte de circuit imprimé disposée dans celui-ci. Un microphone est disposé au moins partiellement à l'intérieur d'une ouverture dans la carte de circuit imprimé, laquelle ouverture est placée de manière adjacente à une entrée de son du boîtier. Le microphone peut être fixé à un élément de support également fixé à la carte de circuit imprimé, et des composants électroniques supplémentaires peuvent être fixés à l'élément de support. Une protection acoustique et/ou électromagnétique peut être prévue.
PCT/EP2007/062688 2006-11-23 2007-11-22 Montage sur carte d'un transducteur de microphone WO2008062036A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/516,120 US8295528B2 (en) 2006-11-23 2007-11-22 Board mounting of microphone transducer
DE112007002856T DE112007002856T5 (de) 2006-11-23 2007-11-22 Platinenmontage eines Mikrophonwandlers

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DKPA200601546 2006-11-23
DKPA200601546 2006-11-23
US90394007P 2007-02-28 2007-02-28
US60/903,940 2007-02-28

Publications (2)

Publication Number Publication Date
WO2008062036A2 true WO2008062036A2 (fr) 2008-05-29
WO2008062036A3 WO2008062036A3 (fr) 2008-10-23

Family

ID=39430096

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/062688 WO2008062036A2 (fr) 2006-11-23 2007-11-22 Montage sur carte d'un transducteur de microphone

Country Status (2)

Country Link
DE (1) DE112007002856T5 (fr)
WO (1) WO2008062036A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8406437B2 (en) 2008-02-22 2013-03-26 Epcos Pte Ltd Miniature microphone assembly with solder sealing ring

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6018584A (en) * 1996-11-06 2000-01-25 Motorola, Inc. Electronic component assembly for an electronic device and method of assembling the same
US6178249B1 (en) * 1998-06-18 2001-01-23 Nokia Mobile Phones Limited Attachment of a micromechanical microphone
JP2002300684A (ja) * 2001-03-30 2002-10-11 Nec Corp マイクロホンの取付構造
JP2003087898A (ja) * 2001-09-14 2003-03-20 Nec Corp コンデンサマイクロホン
US20040184632A1 (en) * 2003-02-28 2004-09-23 Minervini Anthony D. Acoustic transducer module

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7439616B2 (en) 2000-11-28 2008-10-21 Knowles Electronics, Llc Miniature silicon condenser microphone
US7382048B2 (en) 2003-02-28 2008-06-03 Knowles Electronics, Llc Acoustic transducer module
US20040267621A1 (en) 2003-06-27 2004-12-30 Schuller Robert J. Food product scale-based incentive system
DE602005010129D1 (de) 2004-01-12 2008-11-20 Sonion As Verstärkerschaltung für kapazitive Umformer
EP1739933B1 (fr) 2005-06-28 2008-01-09 Research In Motion Limited Dispositif de communication avec écran pour le microphone
KR100644730B1 (ko) 2005-08-20 2006-11-10 주식회사 비에스이 실리콘 콘덴서 마이크로폰

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6018584A (en) * 1996-11-06 2000-01-25 Motorola, Inc. Electronic component assembly for an electronic device and method of assembling the same
US6178249B1 (en) * 1998-06-18 2001-01-23 Nokia Mobile Phones Limited Attachment of a micromechanical microphone
JP2002300684A (ja) * 2001-03-30 2002-10-11 Nec Corp マイクロホンの取付構造
JP2003087898A (ja) * 2001-09-14 2003-03-20 Nec Corp コンデンサマイクロホン
US20040184632A1 (en) * 2003-02-28 2004-09-23 Minervini Anthony D. Acoustic transducer module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8406437B2 (en) 2008-02-22 2013-03-26 Epcos Pte Ltd Miniature microphone assembly with solder sealing ring

Also Published As

Publication number Publication date
WO2008062036A3 (fr) 2008-10-23
DE112007002856T5 (de) 2009-10-29

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