WO2008060244A3 - Net block assembly - Google Patents

Net block assembly Download PDF

Info

Publication number
WO2008060244A3
WO2008060244A3 PCT/SG2007/000373 SG2007000373W WO2008060244A3 WO 2008060244 A3 WO2008060244 A3 WO 2008060244A3 SG 2007000373 W SG2007000373 W SG 2007000373W WO 2008060244 A3 WO2008060244 A3 WO 2008060244A3
Authority
WO
WIPO (PCT)
Prior art keywords
elements
net block
block assembly
row
odd number
Prior art date
Application number
PCT/SG2007/000373
Other languages
French (fr)
Other versions
WO2008060244A8 (en
WO2008060244A2 (en
Inventor
Nee Seng Ling
Soo Loo Ang
Chong Chen Lim
Seung Ho Baek
Jong Jae Jung
Yun Suk Shin
Original Assignee
Rokko Systems Pte Ltd
Nee Seng Ling
Soo Loo Ang
Chong Chen Lim
Seung Ho Baek
Jong Jae Jung
Yun Suk Shin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rokko Systems Pte Ltd, Nee Seng Ling, Soo Loo Ang, Chong Chen Lim, Seung Ho Baek, Jong Jae Jung, Yun Suk Shin filed Critical Rokko Systems Pte Ltd
Publication of WO2008060244A2 publication Critical patent/WO2008060244A2/en
Publication of WO2008060244A3 publication Critical patent/WO2008060244A3/en
Publication of WO2008060244A8 publication Critical patent/WO2008060244A8/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices

Abstract

The present invention relates to a net block assembly in a system for positioning singulated integrated circuits, having a net block surface partially covered by a two dimensional array of first (12) and second elements (14), each first element (12) having an aperture provided with vacuum adapted to receive an integrated circuit and each second element (14) projecting from the surface said net block assembly including a plurality of rows of first (12) and second element (14) arranged in a chequer pattern, wherein the number of elements in the row is an odd number and a buffer row (16) in the array having two first elements (12) arranged adjacent to each other, wherein the number of elements in the buffer row (16) is an odd number.
PCT/SG2007/000373 2006-11-14 2007-11-05 Net block assembly WO2008060244A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200607890-1 2006-11-14
SG200607890-1A SG143079A1 (en) 2006-11-14 2006-11-14 Net block assembly

Publications (3)

Publication Number Publication Date
WO2008060244A2 WO2008060244A2 (en) 2008-05-22
WO2008060244A3 true WO2008060244A3 (en) 2008-07-10
WO2008060244A8 WO2008060244A8 (en) 2008-08-28

Family

ID=39402127

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG2007/000373 WO2008060244A2 (en) 2006-11-14 2007-11-05 Net block assembly

Country Status (3)

Country Link
SG (1) SG143079A1 (en)
TW (1) TWI407527B (en)
WO (1) WO2008060244A2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006022597A2 (en) * 2004-08-23 2006-03-02 Rokko Systems Pte Ltd Supply mechanism for the chuck of an integrated circuit dicing device
WO2006115466A1 (en) * 2005-04-28 2006-11-02 Rokko Systems Pte Ltd Improved net block assembly

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001196328A (en) * 2000-01-12 2001-07-19 Disco Abrasive Syst Ltd Method of splitting csp substrate
SG118084A1 (en) * 2001-08-24 2006-01-27 Micron Technology Inc Method and apparatus for cutting semiconductor wafers
KR100445457B1 (en) * 2002-02-25 2004-08-21 삼성전자주식회사 Apparatus and method for inspecting wafer backside

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006022597A2 (en) * 2004-08-23 2006-03-02 Rokko Systems Pte Ltd Supply mechanism for the chuck of an integrated circuit dicing device
WO2006115466A1 (en) * 2005-04-28 2006-11-02 Rokko Systems Pte Ltd Improved net block assembly

Also Published As

Publication number Publication date
WO2008060244A8 (en) 2008-08-28
TW200834797A (en) 2008-08-16
TWI407527B (en) 2013-09-01
WO2008060244A2 (en) 2008-05-22
SG143079A1 (en) 2008-06-27

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