A method for packaging integrated sensors
Technical Field
The present invention relates to a method for manufacturing a sensor device comprising a substrate with an integrated sensing structure, in particular using molding techniques .
Background Art
The integration of sensors on a substrate, e.g. a semiconductor substrate, provides a series of ad- vantages, such as small size and the possibility to apply advanced manufacturing techniques as used in semiconductor technology. In addition, when using a semiconductor substrate, it is possible to integrate further functionality on the substrate, such as amplifiers, D/A- converters, calibration circuitry, etc.
Many of the sensors devices of this type, such as gas sensors, flow sensors, humidity sensors or optical sensors, need to be in contact with their surroundings, which makes it impossible to use conventional semiconductor packaging for housing the devices. Rather, specialized packaging techniques are required, such as they are e.g. described in US 6 750 522 or US 6 729 181. These packaging techniques tend, however, to be expensive . Another family of packaging techniques for light detectors and pressure gauges is described in WO 02/078077, WO 03/028086 and EP 1 246 235, where the housing is cast in a mold having an inwardly projecting section. The inwardly projecting section maintains an access opening to the sensing structure of the sensor device while casting the housing. When using these techniques, care must be taken in order to prevent the inwardly pro-
jecting section from damaging the sensor's sensing structure .
Disclosure of the Invention
Hence, it is a general object of the invention to provide an economical packaging technique for sensor devices . This object is achieved by the method of claim 1. Accordingly, a sacrifical buffer structure is formed on a surface of the substrate. The buffer structure covers and/or surrounds the sensor's sensing structure and extends away from the surface, i.e. it projects away from the substrate. For casting the housing, a mold is provided. The mold defines an mold cavity to receive a hardening material. At least part of that mold cavity is lined by a deformable layer. The substrate is placed in the mold, and the parts are arranged such that the de- formable layer abuts against the buffer structure. Then the hardening material is introduced into the mold and hardened for forming the housing. During this procedure, the deformable layer seals at least part of the surface of the sacrifical buffer structure, preventing the mould from covering it. When the material has hardened (at least in part) the mold (or at least part thereof) is removed, thereby making at least part of the sacrifical buffer structure accessible through a window. Finally, at least part of the sacrifical buffer structure is removed through the window, thereby forming an access opening extending from the outside of the housing to the sensing structure .
This procedure relies on a synergetic combination of the sacrifical buffer structure and the deform- able layer. One the one hand, the deformable layer ensures that at least part of the buffer structure is not covered by housing material and remains accessible
through said window, thereby making it possible to remove the buffer structure after forming the housing. On the other hand, the buffer structure mechanically protects the sensing structure but allows to make the same com- pletely accessible by removal of the buffer structure.
Neither the buffer structure alone, nor the deforrαable layer alone could achieve such an effect. If the buffer structure were directly abutting against the (hard) mold, no perfect seal could be achieved and hous- ing material could seep into small gaps between buffer structure and mold. If the deformable layer were abutting against the sensing structure, it might damage the same.
The invention is particularly suited for substance sensors, where the removable buffer structure pro- vides protection for the mechanically sensitive sensing structure during the casting process, but it can e.g. also be used for flow sensors, in particular for flow sensors using a heat source and one or more temperature sensors arranged on a thin membrane extending over a re- cess or opening in a substrate.
Brief Description of the Drawings
The invention will be better understood and objects other than those set forth above will become apparent when consideration is given to the following detailed description thereof. Such description makes reference to the annexed drawings, wherein: Fig. 1 shows a semiconductor substrate with integrated sensor,
Fig. 2 shows the device of Fig. 1 after the addition of the buffer structure,
Fig. 3 shows the device of Fig. 2 after placement on a lead frame,
Fig. 4 shows the device of Fig. 3 after transfer molding,
Fig. 5 shows a sectional view through the mold,
Fig. 6 shows a sectional view during casting,
Fig. 7 shows a sectional after removing the mold sections,
Fig. 8 shows a sectional view of the final sensor device,
Fig. 9 shows the second embodiment of the device during the casting of the housing, Fig. 10 shows the second embodiment of the device after removal of the mold sections, and
Fig. 11 shows the second embodiment of the device after removal of the buffer structure.
Modes for Carrying Out the Invention
Figure 1 shows a device comprising a semiconductor substrate 1. A sensing structure 2, evaluation circuitry 3 and contact pads 4 are integrated on a top surface Ia of semiconductor substrate 1. Alternatively, substrate 1 can be a simple carrier for sensing structure 2 without active circuitry, and it may also be of a non- semiconductor material. The device of Fig. 1 may e.g. be a flow sensor, such as it is described in reference to Fig. 5 of US 6 729 181, in which case reference number 2 generally designates the membrane carrying the heater and temperature sensors. It may also be a sensor for detecting sub- stances, in particular humidity, such as it is described in US 6 690 569, in which case reference number 2 generally designates the measuring layer of the device, or it may be some other type of gas detector or, more generally, substance detector for detecting a substance in a fluid. The sensor may e.g. also be a light sensor, in which case reference number 2 generally designates the light sensitive area of the device, or it may be a pres-
sure sensor, in which case reference number 2 generally designates a pressure sensitive area.
In the following, the steps for packaging the device of Fig. 1 in a housing are described. In a first step, as shown in Fig. 2, a sacri- fical buffer structure 6 is attached to surface Ia adjacent to the sensing structure 2. In the embodiment of Fig. 2, buffer structure 6 is a layer covering sensing structure 2. Buffer structure 6 can e.g. be glued oro bonded to substrate 1. Advantageously, it is manufactured by applying a buffer layer directly onto surface Ia of substrate 1 and structuring the same using photoli- tographic or screen printing methods .
Now, as shown in Fig. 3, substrate 1 iss placed on a lead frame 7. Lead frames are known to the person skilled in the art. Generally they are metal structures that carry the substrate during packaging and that form the contact pins or pads of the final device. Bond wires 8 are used to connect the contact pads 4 too lead frame 7 in conventional manner.
In a next step, as shown in Fig. 4, a housing 10 is formed, advantageously by transfer molding or another molding technique. For this purpose, the device of Fig. 3 is placed in a mold and a flowable material, such5 as a heated thermoplastic, is injected into the mold and then hardened. Finally the mold is removed. This technology is widely used for semiconductor packaging.
The final device is provided with an access opening 12 in housing 10 for connecting sensing structureo 2 to the environment, as will be further described below.
Fig. 5 shows an embodiment of a suitable mold for casting housing 10. It comprises an upper mold section 30 and a lower mold section 31, e.g. made of metal, which, for clarity, are shown at a slight distance from5 each other. Between them, mold sections 30 and 31 form an mold cavity 32. In the embodiment of Fig. 5, upper mold section 30 comprises a stamp-like, inward extending sec-
tion 33 extending into mold cavity 32 and having a flat end surface 34. Inward extending section 33 is advantageously mounted to upper mold section 30. It may be an integral part of upper mold section 30 or it may be a separate part placed into an opening or recess of upper mold section 30.
A deformable layer 35, i.e. a layer of material that is substantially more deformable than the material the mold sections 30, 31 are made from, is lining e.g. all of surface 34. Advantageously, and for reasons that will become apparent below, deformable layer 35 is made of an elastically deformable material that is heat resistant up to the temperatures used during the molding process . Advantageously, it should also be more easily deformable than the material of sacrificial buffer structure 6. It can e.g. be made of Teflon. Its thickness should generally exceed 10 μm and is typically in the range of 50 to 100 μm.
In Fig. 5, deformable layer 35 has the same size as the top of buffer structure 6. It must be noted, though, that deformable layer 35 may also cover a larger area or a smaller area than the top area of buffer structure 6.
Fig. 6 shows the device during casting (with lead frame 7 not shown for better clarity) . As can be seen, upper mold section 30 is positioned such that the deformable layer 35 of inward extending section 33 abuts against buffer structure 6 and is pressed against the same with a force sufficient to deform layer 35 such that it matches the surface of buffer structure 6 and prevents housing material from entering between layer 35 and buffer structure 6.
Once the mold sections 30, 31 are placed around substrate 1, a hardening material is introduced into mold cavity 32 through suitable openings (not shown) and is hardened by cooling and/or setting.
After hardening the material, mold sections 30, 31 with inward extending section 33 are removed to form a device as shown in Fig. 7. As can be seen, the space occupied by inward extending section 33 now forms window 37, which makes buffer structure 6 accessible from the outside.
In a next step, sacrificial buffer structure 6 is removed, partially or completely, advantageously by etching, melting, evaporating, dissolving or chemically decomposing. The removal process should, however, be such that it does not greatly affect housing 10, sensing structure 2 or substrate 1. Suitable examples of materials and processes are given below.
Buffer structure 6 is removed in such a man- ner that at least part or all of sensing structure 2 is exposed to the environment, as e.g. shown in Fig. 8.
The details of the method for removing buffer structure 6 depend on the material used for manufacturing the same. For example: A) Buffer structure 6 is made of a material with a melting or evaporation temperature lower than the melting point of housing 10. For this purpose, housing 10 is cast using a polymer precursor or a partially polymerized material, which is then cured such that it with- stands a higher temperature than the one required for melting or evaporating buffer structure 6. Once that housing 10 has been cured and the mold sections 30, 31 have been removed, the device is subjected to a temperature sufficient for evaporating or melting buffer struc- ture 6 at least partially. A suitable material for housing 10 is e.g. Xydar by Solvay Advanced Polymers, LCC, Georgia, USA, which can be cast as a resin at low temperatures. An advantageous material to be used for forming buffer structure 6 is the Unity Sacrificial Polymer by Promerus LCC, Cleveland, USA.
B) Buffer structure 6 is made of a material that can be solved or chemically decomposed after forming
access opening 12. For example, buffer structure 6 can be made of a salt or a water soluble polymer, such as a polyvinyl alcohol, that can be dissolved by water introduced through access opening 12. For providing sufficient protection for sensing structure 2, buffer structure 6 advantageously extends over surface Ia by a height H of at least 10 μm, in particular between 10 μm and 100 μm, preferably between 25 μm and 50 μm. o A second embodiment of the invention is now described with reference to Figs. 9 - 11.
In contrast to the first embodiment, and as can be seen from Fig. 9, buffer structure 6 of this embodiment extends all the way to the top side of housings 10 and is flush therewith. To achieve this, upper mold section 30 has a substantially flat inner surface 30a, having an area larger than the top area of buffer structure 6 and lined with deformable layer 35. During the molding process, flat inner surface 30a is pressedo against buffer structure 6, thereby preventing housing material from covering the buffer structure.
After removing the mold sections 30, 31 and prior to removing buffer structure 6, buffer structure 6 extends from sensing structure 2 up to the flat, upper5 surface 38 of housing 10 and is flush therewith in window 37.
After removing buffer structure 6 by the means described above, the resulting device looks as shown in Fig. 11 with access opening 12 extending from0 window 37 in upper surface 38 down to sensing structure 2.
The present invention is especially advantageous when being used in combination with a sensing structure 2 mounted at least partially on a thin mem-5 brane, such as shown in Fig. 5 of US 6 729 181, which is incorporated by reference herein. The buffer structure 6
of the present application allows to protect the membrane from being damaged in the molding process.
In the embodiments shown so far, deformable layer 35 was formed by a small piece of deformable mate- rial mounted on the inside of one of the mould sections 30, 31. However, deformable layer 35 may also cover all of the surfaces of mold cavity 32. In another embodiment, deformable layer 35 can be formed by a foil extending through one or more mold cavities 32 of the mold. While there are shown and described presently preferred embodiments of the invention, it is to be distinctly understood that the invention is not limited thereto but may be otherwise variously embodied and practiced within the scope of the following claims .