WO2008033484A3 - Connection for flex circuit and rigid circuit board - Google Patents
Connection for flex circuit and rigid circuit board Download PDFInfo
- Publication number
- WO2008033484A3 WO2008033484A3 PCT/US2007/019969 US2007019969W WO2008033484A3 WO 2008033484 A3 WO2008033484 A3 WO 2008033484A3 US 2007019969 W US2007019969 W US 2007019969W WO 2008033484 A3 WO2008033484 A3 WO 2008033484A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- rigid
- conductive pads
- flex
- flex circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/027—Soldered or welded connections comprising means for positioning or holding the parts to be soldered or welded
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10666—Plated through-hole for surface mounting on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1178—Means for venting or for letting gases escape
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Conductive pads of a flex circuit may be electrically connected to conductive pads of a rigid circuit board. The conductive pads of the flex circuit may be sized, configured and alignable to the conductive pads of the rigid circuit board. A spacer with a plurality of apertures may be sized, configured and aligned to the conductive pads of the flex circuit and the rigid circuit board Solder paste may be disposed between respective conductive pads of the flex circuit and the rigid circuit board within the apertures of the spacer. When the flex circuit, rigid circuit board and the spacer are assembled, the solder paste is displaced through relief vents formed through the conductive pads of the flex circuit, rigid circuit board or both the flex circuit or rigid circuit board.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US84481606P | 2006-09-14 | 2006-09-14 | |
US60/844,816 | 2006-09-14 | ||
US11/562,905 US7448923B2 (en) | 2006-09-14 | 2006-11-22 | Connection for flex circuit and rigid circuit board |
US11/562,905 | 2006-11-22 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2008033484A2 WO2008033484A2 (en) | 2008-03-20 |
WO2008033484A3 true WO2008033484A3 (en) | 2008-07-10 |
WO2008033484B1 WO2008033484B1 (en) | 2008-08-21 |
Family
ID=39184364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/019969 WO2008033484A2 (en) | 2006-09-14 | 2007-09-14 | Connection for flex circuit and rigid circuit board |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2008033484A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014192476A (en) * | 2013-03-28 | 2014-10-06 | Fujitsu Ltd | Printed circuit board solder packaging method and solder packaging structure |
US9723725B2 (en) * | 2013-05-29 | 2017-08-01 | Finisar Corporation | Rigid-flexible circuit interconnects |
US9740839B2 (en) | 2014-08-13 | 2017-08-22 | Google Technology Holdings LLC | Computing device chording authentication and control |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3541225A (en) * | 1968-12-20 | 1970-11-17 | Gen Electric | Electrical conductor with improved solder characteristics |
US4394712A (en) * | 1981-03-18 | 1983-07-19 | General Electric Company | Alignment-enhancing feed-through conductors for stackable silicon-on-sapphire wafers |
US5132879A (en) * | 1990-10-01 | 1992-07-21 | Hewlett-Packard Company | Secondary board for mounting of components having differing bonding requirements |
US5570504A (en) * | 1991-12-31 | 1996-11-05 | Tessera, Inc. | Multi-Layer circuit construction method and structure |
US5617300A (en) * | 1993-08-23 | 1997-04-01 | Nagano Japan Radio Co., Ltd. | Connecting method of printed substrate and apparatus |
US5688584A (en) * | 1988-06-10 | 1997-11-18 | Sheldahl, Inc. | Multilayer electronic circuit having a conductive adhesive |
US5896276A (en) * | 1994-08-31 | 1999-04-20 | Nec Corporation | Electronic assembly package including connecting member between first and second substrates |
-
2007
- 2007-09-14 WO PCT/US2007/019969 patent/WO2008033484A2/en active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3541225A (en) * | 1968-12-20 | 1970-11-17 | Gen Electric | Electrical conductor with improved solder characteristics |
US4394712A (en) * | 1981-03-18 | 1983-07-19 | General Electric Company | Alignment-enhancing feed-through conductors for stackable silicon-on-sapphire wafers |
US5688584A (en) * | 1988-06-10 | 1997-11-18 | Sheldahl, Inc. | Multilayer electronic circuit having a conductive adhesive |
US5132879A (en) * | 1990-10-01 | 1992-07-21 | Hewlett-Packard Company | Secondary board for mounting of components having differing bonding requirements |
US5570504A (en) * | 1991-12-31 | 1996-11-05 | Tessera, Inc. | Multi-Layer circuit construction method and structure |
US5617300A (en) * | 1993-08-23 | 1997-04-01 | Nagano Japan Radio Co., Ltd. | Connecting method of printed substrate and apparatus |
US5896276A (en) * | 1994-08-31 | 1999-04-20 | Nec Corporation | Electronic assembly package including connecting member between first and second substrates |
Also Published As
Publication number | Publication date |
---|---|
WO2008033484A2 (en) | 2008-03-20 |
WO2008033484B1 (en) | 2008-08-21 |
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