WO2008028841A1 - Electronic device with integrated-circuit module and antenna that are linked by capacitive electrical connections - Google Patents

Electronic device with integrated-circuit module and antenna that are linked by capacitive electrical connections Download PDF

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Publication number
WO2008028841A1
WO2008028841A1 PCT/EP2007/058919 EP2007058919W WO2008028841A1 WO 2008028841 A1 WO2008028841 A1 WO 2008028841A1 EP 2007058919 W EP2007058919 W EP 2007058919W WO 2008028841 A1 WO2008028841 A1 WO 2008028841A1
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WO
WIPO (PCT)
Prior art keywords
capacitive electrical
electrical connection
capacitor plates
module
integrated circuit
Prior art date
Application number
PCT/EP2007/058919
Other languages
French (fr)
Inventor
Yves Eray
Jacques Venambre
Original Assignee
Oberthur Technologies
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Publication date
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Publication of WO2008028841A1 publication Critical patent/WO2008028841A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive

Definitions

  • the invention relates to electronic devices comprising an integrated circuit module and an antenna for the integrated circuit module to establish contactless communication with external electronic equipment. It concerns in particular, but not exclusively, portable electronic devices with deformable flat bodies, with a thickness of less than one millimeter, such as "dual interface" smart cards because they have two communication interfaces: an interface using electrical contacts and an interface contactless using an internal magnetic loop antenna, smart card type simple contactless communication interface, contactless smart passports, etc. It also relates to electronic keys provided with contactless communication means.
  • the problem posed by these electronic devices is that of the reliability of the electrical connections between the antenna and the integrated circuit module.
  • These electrical connections are usually made by welding using metal alloy pastes (tin-lead, indium-cadmium-lead or indium-tin most often) or by gluing using conductive glues.
  • the shear forces that they inevitably undergo during their lifetime due to mechanical stresses caused in particular by bending the body of the electronic device are at the origin of rupture of the welds or bonding resulting in irreversible or intermittent cutting of the electrical contacts they provide.
  • the present invention aims to solve the aforementioned problems to improve the reliability of these devices while limiting as much as possible, the cost of production.
  • an electronic device having a body having an integrated circuit module and an antenna which enables the integrated circuit module to establish contactless communication with external electronic equipment and which is connected to the integrated circuit module by capacitive electrical connections with, opposite, two capacitor plates, one carried by the body and the other by the integrated circuit module.
  • This device is remarkable in that its body has spacing stops on which the integrated circuit module is supported to delimit the spacing of the capacitor plates capacitive electrical connections.
  • the spacing abutments delimit a spacing between the capacitor plates of a capacitive electrical connection of the order of 30 .mu.m to 60 .mu.m.
  • the spacing stops are constituted by shoulders arranged at the periphery of the cavity. cavity.
  • the residual space between the capacitor plates facing a capacitive electrical connection is filled by an insulating adhesive.
  • the residual space between the capacitor plates facing a capacitive electrical connection is filled by an electrically insulating adhesive mixed with dielectric particles.
  • the residual space between the capacitor plates facing a capacitive electrical connection is filled by an electrically insulating adhesive mixed with particles of alumina or glass.
  • one of the capacitor plates is coated with an electrically nonconductive, polymerizable ink layer, mixed with dielectric particles, and deposited by screen printing.
  • the capacitor armature connected to the integrated circuit module is coated with a layer of electrically non-conductive ink, polymerizable, mixed with dielectric particles and deposited by screen printing.
  • the capacitor armature connected to the antenna is buried under a dielectric plate forming part of the body of the device.
  • the capacitor plates of capacitive electrical connections are located substantially over the entire periphery of the cavity and the module.
  • the substance or substances used between the capacitor plates of a capacitive electrical connection are dielectric with a permittivity greater than or equal to 2.
  • the substance or substances used between the capacitor plates of a capacitive electrical connection are dielectric with a permittivity greater than or equal to 4.
  • one of the capacitor plates of a capacitive electrical connection is smaller than the other to allow a constant capacitance to be maintained despite errors in the positioning of the module in the body of the device.
  • one of the capacitor plates of a capacitive electrical connection is smaller than the other, of the order of 500 .mu.m per side, to allow to keep a constant capacitance despite errors of positioning of the module in the body of the capacitor.
  • the device is a contactless smart card.
  • the device is a dual interface smart card.
  • the device is a contactless passport.
  • the device is an electronic key antenna.
  • FIG. 1 is a plan view showing, in transparency, an example of an arrangement of an integrated circuit module and of a loop antenna within a contactless smart card, and
  • FIGS. 2, 3 and 4 are partial cross-sectional views of a chip card showing various embodiments according to the invention of capacitive electrical connections between the integrated circuit module and the loop antenna of a card. contactless chip.
  • a smart card with a contactless communication interface comprises a flat, flexible, plastic body 1 in the form of a bank card, enclosing in a cavity 3, an integrated circuit module 20 and, in its thickness, an inductive antenna intended for time to exchange information and receive the energy necessary for the operation of the module 2 by electromagnetic coupling with external reading equipment.
  • the antenna is for example tuned to a frequency of approximately 13.56 Mhz, in accordance with ISO 14443.
  • Its inductive part is formed of conductive turns 10, for example photo-etched copper, carried by both sides of a film. insulation 1 1 commonly called inlay, sandwiched between two sheets of PVC, PET or other polymers to achieve hot rolling card body 1.
  • the conductive turns of the antenna are terminated by conductive pads 12, 13 carried on the same side of the insulating film 11 by means of an auxiliary bridging 14A, 14B, and positioned in the housing cavity 3 of the module 2.
  • the module 2 comprises a support substrate commonly called a sticker supporting, on its face facing the bottom of the cavity, the integrated circuit or circuits 20, conductive antenna connection pads 22, 23 coming opposite those 12, 13 of the antenna, interconnecting conductors and, optionally, microcomponents 21 such as capacitors providing polarization and antenna tuning functions.
  • the substrate of the module 2 usually has, on its opposite side to the bottom of the cavity, a set of electrical contacts accessible from outside the card 1 and arranged in accordance with ISO781 6 -2, also making possible a connection by contacts with a reading device.
  • connections between the conductive connection pads of the antenna elements housed in the thickness of the body 1 of the card and the conductive antenna connection pads of the module 2 are capacitive connections in order to avoid the reliability issues due to conductive connection failures due to unavoidable mechanical flexions experienced by the chip card during its life.
  • the value of the capacity that influences the properties of the antenna is directly related:
  • the separation distance is the most poorly controlled criterion during the collage assembly of the module 2 in the body 1 of the smart card because of the inaccuracy of the final thickness of the adhesive layer.
  • the body 1 of the smart card is provided with end stops. spacing on which the substrate of the module 2 comes directly to rest once inserted into the cavity 3. As shown in Figures 2 to 4, these spacing stops may consist of a shoulder located along the inner edges of the cavity 3.
  • FIG. 2 shows in cross-section, a first example of capacitive electrical connection structure with spacing stop, between an integrated circuit module in place in the cavity serving as a housing and an antenna element housed in the thickness of microchip.
  • This section is a partial cross section of a contactless smart card, made at the edge of the cavity 3 housing the module 2, where the conductive areas 12 and 22 are to be connected capacitively.
  • FIG. 2 shows in cross-section, a first example of capacitive electrical connection structure with spacing stop, between an integrated circuit module in place in the cavity serving as a housing and an antenna element housed in the thickness of microchip.
  • the edge profile of the cavity 3 has two intermediate steps, the first 30, the most buried, revealing the surface of the conductive pad 12 used in the capacitive electrical connection and the second 31, the closest to the edge of the cavity 3, constituting a shoulder or spacing abutment 32, on which the substrate 25 of the module 2 comes to bear in order to delimit the deep eur of driving of the module 2 in the cavity 3 and therefore the spacing of the conductive pads 12 and 22 constituting the capacitor plates of the capacitive electrical connection.
  • the step 31 determining the spacing between the conductive pads 12, 22 advantageously has a height of 45 ⁇ m +/- 10 ⁇ m.
  • the surface of the periphery of the substrate 25 of the module 2 is sized to accommodate the conductive pad surfaces necessary to obtain the desired capacitance for each capacitive electrical connection. These occupy advantageously, most of the periphery of the substrate 25.
  • the conductive pads 12, 22 constituting the capacitor plates of a capacitive electrical connection are not distinguishable from their connecting tabs, the conductive pads 12, 22 are of slightly different dimensions, one being smaller than the other, for example 500 ⁇ m per side, to allow to keep a constant capacity despite positioning errors of the module 2 in the cavity 3 of the body 1 of the smart card.
  • the plastic material of the layer 15 in which the step 31 constituting the spacer stop 32 is cut is chosen so as to have a hardness sufficient to maintain the thickness of the abutment during the lamination operation leading to obtaining of the map body. It may itself be formed of a stack of several layers, the step 31 being cut in a layer having the appropriate properties of hardness.
  • the volume delimited by the surfaces facing the conductive areas 12, 22 forming the capacitor plates of the capacitive electrical connection is filled with an electrically insulating adhesive 40, for example of the "Hot MeIt" type, which can be activated at temperatures of order of 1 10 ° C to 150 ° C.
  • the electrically insulating glue 40 may be mixed with dielectric particles of alumina or glass. It preferably has a permittivity greater than or equal to two and advantageously greater than or equal to four.
  • FIG. 3 illustrates an alternative structure for a capacitive electrical connection differentiating from that of FIG. 3 by the presence of a dielectric interlayer 41 consisting of a non-conductive ink mixed with dielectric particles of alumina or glass and deposited by screen printing on the conductive pad 12 carried by the substrate 25 of the module 2.
  • a dielectric interlayer 41 consisting of a non-conductive ink mixed with dielectric particles of alumina or glass and deposited by screen printing on the conductive pad 12 carried by the substrate 25 of the module 2.
  • Another variant not illustrated is to deposit by screen printing a dielectric interlayer on the conductive pad 12 carried by the body 1 of the card.
  • FIG. 4 illustrates yet another variant of a structure for a capacitive electrical connection differentiating from that of FIG. 3 in that the conductive pad 12 carried by the body 1 of the card is buried under a dielectric plate 17 forming an integral part of the body 1 of the smart card.
  • the spacer stops are not necessarily placed along the edges of the cavity serving as a housing for the integrated circuit module.
  • the capacitive electrical connection structures that have just been described apply to contactless and dual interface smart cards as well as contactless passports and contactless electronic keys, particularly those having the dimensions and / or the appearance of a USB type key (acronym for "Universal Sériai Bus"), and more generally any portable electronic device with a contactless communication interface having a body capable of undergoing bending, in which an antenna and a module are embedded. integrated circuit.

Abstract

The invention relates to electronic devices enclosing an integrated-circuit module and an antenna that are linked by capacitive electrical connections, mainly, those having a deformable flat body, of small thickness like contactless chip cards, contactless chip passports, etc. It consists in furnishing the body (1) of the devices, with spacing abutments (32) on which the module (2) with integrated circuit (20) bears directly so as to accurately delimit the separation of the capacitor plates (12, 22) of the capacitive electrical connections and to thus make it possible to obtain stable, industrially reproducible values of capacitance.

Description

DISPOSITIF ELECTRONIQUE A MODULE A CIRCUIT INTEGRE ET ANTENNE RACCORDES PAR DES CONNEXIONS ELECTRIQUES ELECTRONIC DEVICE WITH INTEGRATED CIRCUIT MODULE AND ANTENNA CONNECTED BY ELECTRICAL CONNECTIONS
CAPACITIVESCAPACITIVE
L'invention est relative aux dispositifs électroniques renfermant un module à circuit intégré et une antenne permettant au module à circuit intégré d'établir une communication sans contact avec un équipement électronique externe. Elle concerne notamment, mais non exclusivement, les dispositifs électroniques portables à corps plat déformables, d'une épaisseur inférieure au millimètre comme les cartes à puce dites "dual interface" car comportant deux interfaces de communication : une interface utilisant des contacts électriques et une interface sans contact utilisant une antenne boucle magnétique interne, les cartes à puce de type simple interface de communication sans contact, les passeports à puce sans contact, etc.. Elle concerne également, les clefs électroniques pourvues de moyens de communication sans contact.The invention relates to electronic devices comprising an integrated circuit module and an antenna for the integrated circuit module to establish contactless communication with external electronic equipment. It concerns in particular, but not exclusively, portable electronic devices with deformable flat bodies, with a thickness of less than one millimeter, such as "dual interface" smart cards because they have two communication interfaces: an interface using electrical contacts and an interface contactless using an internal magnetic loop antenna, smart card type simple contactless communication interface, contactless smart passports, etc. It also relates to electronic keys provided with contactless communication means.
Le problème posé par ces dispositifs électroniques est celui de la fiabilité des connexions électriques entre l'antenne et le module à circuit intégré. Ces connexions électriques sont habituellement réalisées par soudure à l'aide de pâtes en alliages métalliques (étain-plomb, indium- cadmium-plomb ou indium-étain le plus souvent) ou par collage à l'aide de colles conductrices. Les efforts de cisaillement qu'elles subissent inévitablement au cours de leur vie du fait de tensions mécaniques provoquées notamment par des flexions du corps du dispositif électronique sont à l'origine de rupture des soudures ou du collage entraînant une coupure irréversible ou intermittente des contacts électriques qu'elles assurent.The problem posed by these electronic devices is that of the reliability of the electrical connections between the antenna and the integrated circuit module. These electrical connections are usually made by welding using metal alloy pastes (tin-lead, indium-cadmium-lead or indium-tin most often) or by gluing using conductive glues. The shear forces that they inevitably undergo during their lifetime due to mechanical stresses caused in particular by bending the body of the electronic device are at the origin of rupture of the welds or bonding resulting in irreversible or intermittent cutting of the electrical contacts they provide.
Pour résoudre ce problème de fiabilité des connexions électriques entre l'antenne et le module à circuit intégré d'une carte à puce dual interface, il a été proposé notamment, dans la demande de brevet japonais JP 2004295772, d'utiliser, entre l'antenne et le module à circuit intégré, des connexions électriques capacitives plutôt que conductrices car celles-ci restent opérationnelles en cas de rupture de leur liaison pourvu que les plages conductrices en regard restent en place, ce qui est le cas tant que la carte à puce n'est pas mise en morceaux. Ces connexions électriques capacitives dont une armature est portée par le corps de la carte à puce et l'autre par le module à circuit intégré sont obtenues, comme décrit dans la demande de brevet japonais précitée JP 2004295772, par un dépôt supplémentaire d'un film isolant de polyimide sur les plages conductrices de contact du module à circuit intégré avant l'insertion du module à circuit intégré dans une cavité du corps de la carte et le collage des plages conductrices de contact du module à circuit intégré à celles de l'antenne par l'habituelle colle conductrice. Ce dépôt supplémentaire d'un film isolant de polyimide sur les plages conductrices de contact d'antenne du module à circuit intégré ajoute une étape à la fabrication d'une carte à puce sans contact qui nécessite de prévoir une machine capable de déposer un tel film isolant et qui renchérit les coûts de production. Comme les connexions électriques capacitives influent sur les propriétés électromagnétiques de l'antenne et de son couplage au module à circuit intégré, leur réalisation pose en outre le problème de l'obtention de valeurs stables de capacité, reproductibles industriellement et donc de la maîtrise de la distance de séparation des plages de conductrices en regard formant les armatures des connexions.To solve this problem of reliability of the electrical connections between the antenna and the integrated circuit module of a dual interface smart card, it has been proposed in particular, in the Japanese patent application JP 2004295772, to use, between the antenna and the integrated circuit module, capacitive electrical connections rather than conductive because they remain operational in case of breakage of their connection provided that the conductive areas opposite remain in place, which is the case as long as the smart card is not put in pieces. These capacitive electrical connections of which one armature is carried by the body of the smart card and the other by the integrated circuit module are obtained, as described in the aforementioned Japanese patent application JP 2004295772, by an additional deposit of a film. polyimide insulation on the conductive contact pads of the integrated circuit module prior to insertion of the integrated circuit module into a cavity of the card body and bonding of the conductive contact pads of the integrated circuit module to those of the antenna by the usual conductive glue. This additional deposition of a polyimide insulating film on the conductive antenna contact pads of the integrated circuit module adds a step to the manufacture of a contactless smart card which requires the provision of a machine capable of depositing such a film. insulation and which increases the cost of production. As the capacitive electrical connections affect the electromagnetic properties of the antenna and its coupling to the integrated circuit module, their implementation also poses the problem of obtaining stable values of capacity, reproducible industrially and therefore the control of the separation distance of the conductive areas opposite forming the reinforcement connections.
La présente invention a pour but de résoudre les problèmes précités en vue d'améliorer la fiabilité de ces dispositifs tout en en limitant autant qu'il est possible, le coût de production.The present invention aims to solve the aforementioned problems to improve the reliability of these devices while limiting as much as possible, the cost of production.
Elle a pour objet un dispositif électronique pourvu d'un corps comportant un module à circuit intégré et une antenne qui permet au module à circuit intégré d'établir une communication sans contact avec un équipement électronique externe et qui est raccordée au module à circuit intégré par des connexions électriques capacitives avec, en regard, deux armatures de condensateur, l'une portée par le corps et l'autre par le module à circuit intégré. Ce dispositif est remarquable en ce que son corps présente des butées d'espacement sur lesquelles le module à circuit intégré prend appui pour délimiter l'écartement des armatures de condensateur des connexions électriques capacitives. Avantageusement, les butées d'espacement délimitent un écartement entre les armatures de condensateur d'une connexion électrique capacitive de l'ordre de 30μm à 60μm.It relates to an electronic device having a body having an integrated circuit module and an antenna which enables the integrated circuit module to establish contactless communication with external electronic equipment and which is connected to the integrated circuit module by capacitive electrical connections with, opposite, two capacitor plates, one carried by the body and the other by the integrated circuit module. This device is remarkable in that its body has spacing stops on which the integrated circuit module is supported to delimit the spacing of the capacitor plates capacitive electrical connections. Advantageously, the spacing abutments delimit a spacing between the capacitor plates of a capacitive electrical connection of the order of 30 .mu.m to 60 .mu.m.
Avantageusement, lorsque le module à circuit intégré est disposé dans une cavité du corps, avec les armatures de condensateur de ses connexions électriques capacitives sensiblement parallèles au fond de la cavité, les butées d'espacement sont constituées par des épaulements ménagés à la périphérie de la cavité.Advantageously, when the integrated-circuit module is disposed in a cavity of the body, with the capacitor plates of its capacitive electrical connections substantially parallel to the bottom of the cavity, the spacing stops are constituted by shoulders arranged at the periphery of the cavity. cavity.
Avantageusement, l'espace résiduel entre les armatures de condensateur en regard d'une connexion électrique capacitive est rempli par un adhésif isolant.Advantageously, the residual space between the capacitor plates facing a capacitive electrical connection is filled by an insulating adhesive.
Avantageusement, l'espace résiduel entre les armatures de condensateur en regard d'une connexion électrique capacitive est rempli par un adhésif électriquement isolant mélangé à des particules diélectriques. Avantageusement, l'espace résiduel entre les armatures de condensateur en regard d'une connexion électrique capacitive est rempli par un adhésif électriquement isolant mélangé à des particules d'alumine ou de verre.Advantageously, the residual space between the capacitor plates facing a capacitive electrical connection is filled by an electrically insulating adhesive mixed with dielectric particles. Advantageously, the residual space between the capacitor plates facing a capacitive electrical connection is filled by an electrically insulating adhesive mixed with particles of alumina or glass.
Avantageusement, dans une connexion électrique capacitive, l'une des armatures de condensateur est revêtue d'une couche d'encre électriquement non-conductrice, polymérisable, mélangée à des particules diélectriques, et déposée par sérigraphie.Advantageously, in a capacitive electrical connection, one of the capacitor plates is coated with an electrically nonconductive, polymerizable ink layer, mixed with dielectric particles, and deposited by screen printing.
Avantageusement, dans une connexion électrique capacitive, l'armature de condensateur reliée au module à circuit intégré est revêtue d'une couche d'encre électriquement non-conductrice, polymérisable, mélangée à des particules diélectriques et déposée par sérigraphie.Advantageously, in a capacitive electrical connection, the capacitor armature connected to the integrated circuit module is coated with a layer of electrically non-conductive ink, polymerizable, mixed with dielectric particles and deposited by screen printing.
Avantageusement, dans une connexion électrique capacitive, l'armature de condensateur reliée à l'antenne est enterrée sous une lame de diélectrique faisant partie du corps du dispositif. Avantageusement, lorsque le module à circuit intégré est disposé dans une cavité du corps du dispositif, les armatures de condensateur des connexions électriques capacitives sont situées sensiblement sur toute la périphérie de la cavité et du module. Avantageusement, la ou les substances utilisées entre les armatures de condensateur d'une connexion électrique capacitive sont diélectriques avec une permittivité supérieure ou égale à 2.Advantageously, in a capacitive electrical connection, the capacitor armature connected to the antenna is buried under a dielectric plate forming part of the body of the device. Advantageously, when the integrated circuit module is disposed in a cavity of the body of the device, the capacitor plates of capacitive electrical connections are located substantially over the entire periphery of the cavity and the module. Advantageously, the substance or substances used between the capacitor plates of a capacitive electrical connection are dielectric with a permittivity greater than or equal to 2.
Avantageusement, la ou les substances utilisées entre les armatures de condensateur d'une connexion électrique capacitive sont diélectriques avec une permittivité supérieure ou égale à 4.Advantageously, the substance or substances used between the capacitor plates of a capacitive electrical connection are dielectric with a permittivity greater than or equal to 4.
Avantageusement, l'une des armatures de condensateur d'une connexion électrique capacitive est plus petite que l'autre pour permettre de garder une capacité constante malgré des erreurs de positionnement du module dans le corps du dispositif.Advantageously, one of the capacitor plates of a capacitive electrical connection is smaller than the other to allow a constant capacitance to be maintained despite errors in the positioning of the module in the body of the device.
Avantageusement, l'une des armatures de condensateur d'une connexion électrique capacitive est plus petite que l'autre, de l'ordre de 500μm par côté, pour permettre de garder une capacité constante malgré des erreurs de positionnement du module dans le corps du dispositif. Avantageusement, le dispositif est une carte à puce sans contact.Advantageously, one of the capacitor plates of a capacitive electrical connection is smaller than the other, of the order of 500 .mu.m per side, to allow to keep a constant capacitance despite errors of positioning of the module in the body of the capacitor. device. Advantageously, the device is a contactless smart card.
Avantageusement, le dispositif est une carte à puce dual interface.Advantageously, the device is a dual interface smart card.
Avantageusement, le dispositif est un passeport sans contact.Advantageously, the device is a contactless passport.
Avantageusement, le dispositif est une clef électronique à antenne.Advantageously, the device is an electronic key antenna.
D'autres caractéristiques et avantages de l'invention ressortiront de la description de modes de réalisation de l'invention donnés à titre d'exemple. Cette description sera faite en regard du dessin dans lequel :Other features and advantages of the invention will emerge from the description of embodiments of the invention given by way of example. This description will be made with reference to the drawing in which:
- une figure 1 est une vue de dessus montrant en transparence, un exemple de disposition d'un module à circuit intégré et d'une antenne boucle au sein d'une carte à puce sans contact, etFIG. 1 is a plan view showing, in transparency, an example of an arrangement of an integrated circuit module and of a loop antenna within a contactless smart card, and
- des figures 2, 3 et 4 sont des vues partielles en coupe transversales, d'une carte à puce montrant différentes réalisations conformes à l'invention, de connexions électriques capacitives entre le module à circuit intégré et l'antenne boucle d'une carte à puce sans contact.FIGS. 2, 3 and 4 are partial cross-sectional views of a chip card showing various embodiments according to the invention of capacitive electrical connections between the integrated circuit module and the loop antenna of a card. contactless chip.
Comme montré à la figure 1 , une carte à puce à interface de communication sans contact comporte un corps 1 plat, flexible, en plastique au format d'une carte bancaire, renfermant dans une cavité 3, un module 2 à circuit intégré 20 et, dans son épaisseur, une antenne inductive destinée à la fois à échanger des informations et recevoir l'énergie nécessaire au fonctionnement du module 2 par couplage électromagnétique avec un équipement de lecture extérieur.As shown in FIG. 1, a smart card with a contactless communication interface comprises a flat, flexible, plastic body 1 in the form of a bank card, enclosing in a cavity 3, an integrated circuit module 20 and, in its thickness, an inductive antenna intended for time to exchange information and receive the energy necessary for the operation of the module 2 by electromagnetic coupling with external reading equipment.
L'antenne est par exemple accordée sur une fréquence d'environ 13,56 Mhz, conformément à la norme ISO 14443. Sa partie inductive est formée de spires conductrices 10, par exemple en cuivre photogravé, portées par les deux côtés d'un film isolant 1 1 appelé couramment inlay, placé en sandwich entre deux feuilles de polymères PVC, PET ou autres pour réaliser par laminage à chaud le corps 1 de carte. Les spires conductrices de l'antenne se terminent par des plages conductrices 12, 13 reportées sur un même côté du film isolant 1 1 grâce à un pontage auxiliaire 14A, 14B, 15 et positionnées dans la cavité 3 de logement du module 2.The antenna is for example tuned to a frequency of approximately 13.56 Mhz, in accordance with ISO 14443. Its inductive part is formed of conductive turns 10, for example photo-etched copper, carried by both sides of a film. insulation 1 1 commonly called inlay, sandwiched between two sheets of PVC, PET or other polymers to achieve hot rolling card body 1. The conductive turns of the antenna are terminated by conductive pads 12, 13 carried on the same side of the insulating film 11 by means of an auxiliary bridging 14A, 14B, and positioned in the housing cavity 3 of the module 2.
Le module 2 comporte un substrat support couramment appelé vignette supportant, sur sa face tournée vers le fond de la cavité, le ou les circuits intégrés 20, des plages conductrices de raccordement d'antenne 22, 23 venant en regard de celles 12, 13 de l'antenne, des conducteurs d'interconnexion et, éventuellement, des microcomposants 21 tels que des condensateurs assurant des fonctions de polarisation et d'accord d'antenne. Bien que non représenté dans un but de simplification, le substrat du module 2 présente habituellement, sur sa face opposée au fond de la cavité, un jeu de contacts électriques accessibles de l'extérieur de la carte 1 et disposés conformément à la norme ISO781 6-2, rendant également possible un raccordement par contacts avec un équipement de lecture. Comme indiqué précédemment, les connexions entre les plages conductrices de raccordement des éléments de l'antenne logés dans l'épaisseur du corps 1 de la carte et les plages conductrices de raccordement d'antenne du module 2 sont des connexions capacitives afin d'éviter les problèmes de fiabilité dus aux ruptures des connexions conductrice lors des flexions mécaniques inévitables subies par la carte à puce au cours de sa durée d'utilisation. Pour ces connexions, la valeur de la capacité qui influe sur les propriétés de l'antenne, est directement liée :The module 2 comprises a support substrate commonly called a sticker supporting, on its face facing the bottom of the cavity, the integrated circuit or circuits 20, conductive antenna connection pads 22, 23 coming opposite those 12, 13 of the antenna, interconnecting conductors and, optionally, microcomponents 21 such as capacitors providing polarization and antenna tuning functions. Although not shown for purposes of simplification, the substrate of the module 2 usually has, on its opposite side to the bottom of the cavity, a set of electrical contacts accessible from outside the card 1 and arranged in accordance with ISO781 6 -2, also making possible a connection by contacts with a reading device. As indicated above, the connections between the conductive connection pads of the antenna elements housed in the thickness of the body 1 of the card and the conductive antenna connection pads of the module 2 are capacitive connections in order to avoid the reliability issues due to conductive connection failures due to unavoidable mechanical flexions experienced by the chip card during its life. For these connections, the value of the capacity that influences the properties of the antenna is directly related:
- à la surface en regard des plages conductrices qui constituent les armatures du condensateur, - à la distance séparant ces plages conductrices en regard, et - à la permittivité du milieu isolant de séparation. La distance de séparation est le critère le plus mal maîtrisé lors du montage par collage du module 2 dans le corps 1 de la carte à puce du fait de l'imprécision de l'épaisseur finale de la couche de colle. Pour mieux maîtriser la distance d'écartement des armatures de condensateur des connexions électriques capacitives entre les éléments d'antenne logés dans le corps 1 de la carte à puce et le module 2, le corps 1 de la carte à puce est pourvu de butées d'espacement sur lesquelles le substrat du module 2 vient directement reposer une fois inséré dans la cavité 3. Comme montré sur les figures 2 à 4, ces butées d'espacement peuvent être constituées d'un épaulement situé le long des bords intérieurs de la cavité 3.at the surface opposite the conductive areas which constitute the capacitor plates, at the distance separating these conductive areas from each other, and to the permittivity of the separating insulating medium. The separation distance is the most poorly controlled criterion during the collage assembly of the module 2 in the body 1 of the smart card because of the inaccuracy of the final thickness of the adhesive layer. In order to better control the spacing distance of the capacitor plates from the capacitive electrical connections between the antenna elements housed in the body 1 of the smart card and the module 2, the body 1 of the smart card is provided with end stops. spacing on which the substrate of the module 2 comes directly to rest once inserted into the cavity 3. As shown in Figures 2 to 4, these spacing stops may consist of a shoulder located along the inner edges of the cavity 3.
La figure 2 montre en coupe transversale, un premier exemple de structure de connexion électrique capacitive avec butée d'espacement, entre un module à circuit intégré en place dans la cavité lui servant de logement et un élément d'antenne logé dans l'épaisseur de la carte à puce. Cette coupe est une coupe transversale partielle d'une carte à puce sans contact, faite au niveau du bord de la cavité 3 logeant le module 2, où se situent les plages conductrices 12 et 22 à raccorder de manière capacitive. On distingue dans la partie gauche de cette figure 2, la structure lamellaire du corps 1 de la carte à puce avec le film isolant 1 1 ou inlay supportant la plage conductrice 12 et des éléments d'antenne interconnectés, pris en sandwich entre deux couches de plastique 15, 1 6 servant à la fois de protection et de support d'impression et, dans la partie supérieure droite, un morceau du substrat 25 du module 2 à circuit intégré 20 supportant une plage conductrice 22 pour raccordement d'antenne, raccordée par un fil conducteur de connexion 26 à un circuit intégré 20. Le profil du bord de la cavité 3 présente deux gradins intermédiaires, le premier 30, le plus enfoui, laissant apparaître la surface de la plage conductrice 12 utilisée dans la connexion électrique capacitive et le deuxième 31 , le plus proche du bord de la cavité 3, constituant un épaulement ou butée d'espacement 32, sur lequel le substrat 25 du module 2 vient prendre appui afin de délimiter la profondeur d'enfoncement du module 2 dans la cavité 3 et donc l'écartement des plages conductrices 12 et 22 constituant les armatures de condensateur de la connexion électrique capacitive. Le gradin 31 déterminant l'écartement entre les plages conductrices 12, 22 présente avantageusement une hauteur de 45 μm +/- 10μm.FIG. 2 shows in cross-section, a first example of capacitive electrical connection structure with spacing stop, between an integrated circuit module in place in the cavity serving as a housing and an antenna element housed in the thickness of microchip. This section is a partial cross section of a contactless smart card, made at the edge of the cavity 3 housing the module 2, where the conductive areas 12 and 22 are to be connected capacitively. In the left-hand part of this FIG. 2, the lamellar structure of the body 1 of the smart card with the insulating film 11 or inlay supporting the conductive pad 12 and interconnected antenna elements sandwiched between two layers of 15, 16 for both protection and printing medium and, in the upper right part, a piece of the substrate 25 of the integrated circuit module 20 supporting a conductive pad 22 for antenna connection, connected by a connecting conductor 26 to an integrated circuit 20. The edge profile of the cavity 3 has two intermediate steps, the first 30, the most buried, revealing the surface of the conductive pad 12 used in the capacitive electrical connection and the second 31, the closest to the edge of the cavity 3, constituting a shoulder or spacing abutment 32, on which the substrate 25 of the module 2 comes to bear in order to delimit the deep eur of driving of the module 2 in the cavity 3 and therefore the spacing of the conductive pads 12 and 22 constituting the capacitor plates of the capacitive electrical connection. The step 31 determining the spacing between the conductive pads 12, 22 advantageously has a height of 45 μm +/- 10 μm.
La surface de la périphérie du substrat 25 du module 2 est dimensionnée pour pouvoir loger les surfaces de plages conductrices nécessaires à l'obtention de la capacité désirée pour chaque connexion électrique capacitive. Celles-ci occupent avantageusement, la majeure partie de la périphérie du substrat 25.The surface of the periphery of the substrate 25 of the module 2 is sized to accommodate the conductive pad surfaces necessary to obtain the desired capacitance for each capacitive electrical connection. These occupy advantageously, most of the periphery of the substrate 25.
Bien que cela n'apparaissent pas dans les figures où les plages conductrices 12, 22 constituant les armatures de condensateur d'une connexion électrique capacitive ne se distinguent pas de leurs pattes de connexion, les plages conductrices 12, 22 sont de dimensions légèrement différentes, l'une étant plus petite que l'autre, par exemple de 500μm par côté, pour permettre de garder une capacité constante malgré des erreurs de positionnement du module 2 dans la cavité 3 du corps 1 de la carte à puce.Although this does not appear in the figures where the conductive pads 12, 22 constituting the capacitor plates of a capacitive electrical connection are not distinguishable from their connecting tabs, the conductive pads 12, 22 are of slightly different dimensions, one being smaller than the other, for example 500μm per side, to allow to keep a constant capacity despite positioning errors of the module 2 in the cavity 3 of the body 1 of the smart card.
Le matériau plastique de la couche 15 dans laquelle est taillé le gradin 31 constituant la butée d'espacement 32 est choisi de manière à présenter une dureté suffisante pour conserver l'épaisseur de la butée lors de l'opération de lamination conduisant à l'obtention du corps de carte. Il peut être lui-même formé d'un empilement de plusieurs couches, le gradin 31 étant taillée dans une couche présentant les propriétés de dureté adéquates.The plastic material of the layer 15 in which the step 31 constituting the spacer stop 32 is cut is chosen so as to have a hardness sufficient to maintain the thickness of the abutment during the lamination operation leading to obtaining of the map body. It may itself be formed of a stack of several layers, the step 31 being cut in a layer having the appropriate properties of hardness.
Le volume délimité par les surfaces en vis à vis des plages conductrices 12, 22 formant les armatures de condensateur de la connexion électrique capacitive est rempli d'une colle électriquement isolante 40 par exemple de type "Hot MeIt" activable à des températures de l'ordre de 1 10°C à 150°C. Pour augmenter la permittivité de la connexion électrique capacitive, la colle électriquement isolante 40 peut être mélangée à des particules diélectriques d'alumine ou de verre. Elle a de préférence une permittivité supérieure ou égale à deux et avantageusement, supérieure ou égale à quatre.The volume delimited by the surfaces facing the conductive areas 12, 22 forming the capacitor plates of the capacitive electrical connection is filled with an electrically insulating adhesive 40, for example of the "Hot MeIt" type, which can be activated at temperatures of order of 1 10 ° C to 150 ° C. To increase the permittivity of the capacitive electrical connection, the electrically insulating glue 40 may be mixed with dielectric particles of alumina or glass. It preferably has a permittivity greater than or equal to two and advantageously greater than or equal to four.
La figure 3 illustre une variante de structure pour une connexion électrique capacitive se différenciant de celle de la figure 3 par la présence d'une couche intercalaire diélectrique 41 constituée d'une encre non- conductrice mélangée à des particules diélectriques d'alumine ou de verre et déposée par sérigraphie sur la plage conductrice 12 portée par le substrat 25 du module 2.FIG. 3 illustrates an alternative structure for a capacitive electrical connection differentiating from that of FIG. 3 by the presence of a dielectric interlayer 41 consisting of a non-conductive ink mixed with dielectric particles of alumina or glass and deposited by screen printing on the conductive pad 12 carried by the substrate 25 of the module 2.
Une autre variante non illustrée consiste à déposer par sérigraphie une couche intercalaire diélectrique sur la plage conductrice 12 portée par le corps 1 de la carte.Another variant not illustrated is to deposit by screen printing a dielectric interlayer on the conductive pad 12 carried by the body 1 of the card.
La figure 4 illustre encore une autre variante de structure pour une connexion électrique capacitive se différenciant de celle de la figure 3 par le fait que la plage conductrice 12 portée par le corps 1 de la carte est enterrée sous une lame diélectrique 17 faisant partie intégrante du corps 1 de la carte à puce.FIG. 4 illustrates yet another variant of a structure for a capacitive electrical connection differentiating from that of FIG. 3 in that the conductive pad 12 carried by the body 1 of the card is buried under a dielectric plate 17 forming an integral part of the body 1 of the smart card.
Les butées d'espacement ne sont pas nécessairement placées le long des bords de la cavité servant de logement au module à circuit intégré.The spacer stops are not necessarily placed along the edges of the cavity serving as a housing for the integrated circuit module.
Elles peuvent être situées à l'intérieur même de la cavité, à proximité des connexions électriques capacitives, en regard de surfaces d'appui libérées pour elles sur le substrat du module à circuit intégréThey can be located inside the cavity, near the capacitive electrical connections, facing bearing surfaces released for them on the substrate of the integrated circuit module
Les structures de connexion électriques capacitives qui viennent d'être décrites s'appliquent aux cartes à puce sans contact et dual interface ainsi qu'aux passeports sans contact et aux clef électroniques sans contact, notamment celles ayant les dimensions et/ou l'apparence d'une clef de type USB (acronyme anglo-saxon pour" Universal Sériai Bus), et plus généralement à tout dispositif électronique portable à interface de communication sans contact ayant un corps susceptible de subir des flexions, dans lequel est noyée une antenne et un module à circuit intégré. The capacitive electrical connection structures that have just been described apply to contactless and dual interface smart cards as well as contactless passports and contactless electronic keys, particularly those having the dimensions and / or the appearance of a USB type key (acronym for "Universal Sériai Bus"), and more generally any portable electronic device with a contactless communication interface having a body capable of undergoing bending, in which an antenna and a module are embedded. integrated circuit.

Claims

REVENDICATIONS
1. Dispositif électronique pourvu d'un corps (1 ) comportant un module (2) à circuit intégré (20) et une antenne (10) qui permet au module (2) à circuit intégré (20) d'établir une communication sans contact avec un équipement électronique externe et qui est raccordée au module (2) à circuit intégré (20) par des connexions électriques capacitives avec, en regard, deux armatures (12, 22) de condensateur, l'une (12) portée par le corps (1 ) et l'autre (22) par le module (2) à circuit intégré (20), caractérisé en ce que son corps (1 ) présente des butées d'espacement (32) qui sont constituées par des épaulements ménagés à la périphérie de la cavité et sur lesquels le module (2) à circuit intégré (20) prend directement appui pour délimiter l'écartement des armatures (12, 22) de condensateur des connexions électriques capacitives.An electronic device having a body (1) having an integrated circuit module (2) (20) and an antenna (10) which enables the integrated circuit module (2) to establish a contactless communication with external electronic equipment and which is connected to the integrated circuit module (2) by capacitive electrical connections with, opposite, two capacitor plates (12, 22), one (12) carried by the body (1) and the other (22) by the module (2) integrated circuit (20), characterized in that its body (1) has spacing stops (32) which are constituted by shoulders provided at the periphery of the cavity and on which the module (2) integrated circuit (20) bears directly to delimit the spacing of the capacitor plates (12, 22) capacitive electrical connections.
2. Dispositif selon la revendication 1 , caractérisé en ce que les butées d'espacement (32) délimitent un écartement entre les armatures (12,2. Device according to claim 1, characterized in that the spacing stops (32) delimit a spacing between the reinforcements (12,
22) de condensateur d'une connexion électrique capacitive de l'ordre de 30μm à 60μm.22) capacitor of a capacitive electrical connection of the order of 30μm to 60μm.
3. Dispositif selon la revendication 1 , caractérisé en ce que l'espace résiduel entre les armatures (12, 22) de condensateur en regard d'une connexion électrique capacitive est rempli par un adhésif isolant (40).3. Device according to claim 1, characterized in that the residual space between the capacitor plates (12, 22) facing a capacitive electrical connection is filled by an insulating adhesive (40).
4. Dispositif selon la revendication 3, caractérisé en ce que l'espace résiduel entre les armatures (12, 22) de condensateur en regard d'une connexion électrique capacitive est rempli par un adhésif isolant (40) mélangé à des particules diélectriques.4. Device according to claim 3, characterized in that the residual space between the capacitor plates (12, 22) opposite a capacitive electrical connection is filled by an insulating adhesive (40) mixed with dielectric particles.
5. Dispositif selon la revendication 4, caractérisé en ce que l'espace résiduel entre les armatures (12, 22) de condensateur en regard d'une connexion électrique capacitive est rempli par un adhésif isolant (40) mélangé à des particules d'alumine ou de verre.5. Device according to claim 4, characterized in that the residual space between the capacitor plates (12, 22) facing a capacitive electrical connection is filled by an insulating adhesive (40) mixed with alumina particles. or glass.
6. Dispositif selon la revendication 1 , caractérisé en ce que, dans une connexion électrique capacitive, l'une (12 ou 22) des armatures de condensateur est revêtue d'une couche (41 ) d'encre non-conductrice polymérisable, mélangée à des particules diélectriques, et déposée par sérigraphie.6. Device according to claim 1, characterized in that, in a capacitive electrical connection, one (12 or 22) of the reinforcements of capacitor is coated with a layer (41) of polymerizable non-conductive ink, mixed with dielectric particles, and deposited by screen printing.
7. Dispositif selon la revendication 6, caractérisé en ce que, dans une connexion électrique capacitive, l'armature (22) de condensateur reliée au module (2) à circuit intégré (20) est revêtue d'une couche (41 ) d'encre non-conductrice polymérisable, mélangée à des particules diélectriques, et déposée par sérigraphie.7. Device according to claim 6, characterized in that, in a capacitive electrical connection, the capacitor armature (22) connected to the integrated circuit module (2) (20) is coated with a layer (41) of polymerizable non-conductive ink, mixed with dielectric particles, and deposited by screen printing.
8. Dispositif selon la revendication 1 , caractérisé en ce que, dans une connexion électrique capacitive, l'armature (12) de condensateur reliée à l'antenne (10) est enterrée sous une lame de diélectrique (17) faisant partie du corps (1 ).8. Device according to claim 1, characterized in that, in a capacitive electrical connection, the capacitor armature (12) connected to the antenna (10) is buried under a dielectric plate (17) forming part of the body ( 1).
9. Dispositif selon la revendication 1 , caractérisé en ce que les armatures (12, 22 ; 13, 23) de condensateur des connexions électriques capacitives sont situées sensiblement sur toute la périphérie de la cavité (3) et du module (2).9. Device according to claim 1, characterized in that the capacitor plates (12, 22; 13, 23) capacitive electrical connections are located substantially over the entire periphery of the cavity (3) and the module (2).
10. Dispositif selon la revendication 1 , caractérisé en ce que le volume séparant les armatures (12, 22) de condensateur d'une connexion électrique capacitive est rempli d'un diélectrique ayant une permittivité supérieure ou égale à 2.10. Device according to claim 1, characterized in that the volume separating the capacitor plates (12, 22) of a capacitive electrical connection is filled with a dielectric having a permittivity greater than or equal to 2.
1 1. Dispositif selon la revendication 1 , caractérisé en ce que le volume séparant les armatures (12, 22) de condensateur d'une connexion électrique capacitive est rempli d'un diélectrique ayant une permittivité supérieure ou égale à 4.1 1. Device according to claim 1, characterized in that the volume separating the capacitor plates (12, 22) of a capacitive electrical connection is filled with a dielectric having a permittivity greater than or equal to 4.
12. Dispositif selon la revendication 1 , caractérisé en ce que l'une des armatures (12 ou 22) de condensateur d'une connexion électrique capacitive est plus petite que l'autre pour permettre de garder une capacité constante malgré des erreurs de positionnement du module dans le corps du dispositif. 12. Device according to claim 1, characterized in that one of the capacitor plates (12 or 22) of a capacitive electrical connection is smaller than the other to allow a constant capacitance to be maintained despite errors in the positioning of the capacitor. module in the body of the device.
13. Dispositif selon la revendication 12 caractérisé en ce que l'une des armatures (12 ou 22) de condensateur d'une connexion électrique capacitive est plus petite que l'autre, de l'ordre de 500μm par côté, pour permettre de garder une capacité constante malgré des erreurs de positionnement du module dans le corps du dispositif.13. Device according to claim 12 characterized in that one of the capacitor plates (12 or 22) of a capacitive electrical connection is smaller than the other, of the order of 500μm per side, to allow to keep a constant capacity despite module positioning errors in the body of the device.
14. Dispositif selon la revendication 1 , caractérisé en ce qu'il est une carte à puce sans contact.14. Device according to claim 1, characterized in that it is a contactless smart card.
15. Dispositif selon la revendication 1 , caractérisé en ce qu'il est une carte à puce dual interface. 15. Device according to claim 1, characterized in that it is a dual interface smart card.
PCT/EP2007/058919 2006-09-05 2007-08-28 Electronic device with integrated-circuit module and antenna that are linked by capacitive electrical connections WO2008028841A1 (en)

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FR0607756A FR2905494B1 (en) 2006-09-05 2006-09-05 ELECTRONIC DEVICE WITH INTEGRATED CIRCUIT MODULE AND ANTENNA CONNECTED BY CAPACITIVE ELECTRICAL CONNECTIONS

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