WO2008026893A1 - A method of antistatic deposition on components of mobile phone - Google Patents

A method of antistatic deposition on components of mobile phone Download PDF

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Publication number
WO2008026893A1
WO2008026893A1 PCT/KR2007/004197 KR2007004197W WO2008026893A1 WO 2008026893 A1 WO2008026893 A1 WO 2008026893A1 KR 2007004197 W KR2007004197 W KR 2007004197W WO 2008026893 A1 WO2008026893 A1 WO 2008026893A1
Authority
WO
WIPO (PCT)
Prior art keywords
tin
wireless terminal
terminal component
aluminum
alloy
Prior art date
Application number
PCT/KR2007/004197
Other languages
French (fr)
Inventor
Byung Hoon Ryou
Won Mo Sung
Jun Lee
Original Assignee
E.M.W. Antenna Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by E.M.W. Antenna Co., Ltd. filed Critical E.M.W. Antenna Co., Ltd.
Priority to CN2007800309352A priority Critical patent/CN101506945B/en
Priority to JP2009525507A priority patent/JP2010501727A/en
Priority to US12/440,018 priority patent/US20100039745A1/en
Priority to EP07793777A priority patent/EP2057667A4/en
Publication of WO2008026893A1 publication Critical patent/WO2008026893A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products
    • B29L2009/005—Layered products coated
    • B29L2009/008—Layered products coated metalized, galvanized
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3431—Telephones, Earphones
    • B29L2031/3437—Cellular phones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3493—Moulded interconnect devices, i.e. moulded articles provided with integrated circuit traces

Definitions

  • the present invention relates to an antistatic deposition method of a wireless terminal component such as a display protective widow, a navigation key, a side key, a case or the like. More particularly, the present invention relates to an antistatic deposition method of a wireless terminal component, which comprises depositing tin (Sn) or a tin-aluminum (Sn-Al) alloy on a molded material for a wireless terminal component.
  • a wireless terminal component such as a display protective widow, a navigation key, a side key, a case or the like. More particularly, the present invention relates to an antistatic deposition method of a wireless terminal component, which comprises depositing tin (Sn) or a tin-aluminum (Sn-Al) alloy on a molded material for a wireless terminal component.
  • the present invention relates to an antistatic deposition method of a wireless terminal component, which comprises: depositing tin (Sn) or a tin-aluminum (Sn-Al) alloy on a molded material for a wireless terminal component; and depositing one or more materials selected from the group consisting of Si, SiO , Ti, TiO , Al O and a mixture thereof on the deposited tin (Sn) layer or the deposited tin-aluminum (Sn-Al) alloy layer.
  • the present invention relates to a wireless terminal component (particularly, display protective windows) on which a tin (Sn) or tin- aluminum (Sn-Al) alloy layer is deposited, or the tin (Sn) or tin-aluminum (Sn-Al) alloy layer and a layer made of one or more materials selected from the group consisting of Si, SiO , Ti, TiO , Al O and a mixture thereof are sequentially deposited.
  • a wireless terminal component particularly, display protective windows
  • a tin (Sn) or tin- aluminum (Sn-Al) alloy layer is deposited, or the tin (Sn) or tin-aluminum (Sn-Al) alloy layer and a layer made of one or more materials selected from the group consisting of Si, SiO , Ti, TiO , Al O and a mixture thereof are sequentially deposited.
  • a metal such as nickel (Ni), chrome (Cr) or the like is deposited on a wireless terminal component so as to create a mirror effect.
  • a metal having electrical conductivity generates static electricity to thereby adversely affect the performance of the inner circuits of the wireless terminal.
  • a wireless terminal component plated with nickel (Ni), chrome (Cr) or the like entails a problem in that it reduces the radiation performance of radio waves. Disclosure of Invention
  • an object of the present invention has been made to overcome the above-mentioned problems occurring in the prior art, and it is an object of the present invention to provide an antistatic deposition method of a wireless terminal component, which can maintain an mirror effect and the performance of radio frequencies, can prevent peel-off of a tin (Sn) or tin-aluminum (Sn-Al) alloy deposited on a molded material for a wireless terminal component, and can improve scratch resistance and impact resistance of the wireless terminal component.
  • Sn tin
  • Sn-Al tin-aluminum
  • Another object of the present invention is to provide an antistatic deposition method of a wireless terminal component, which can easily form patterns on even a wireless terminal component made of a material which is not allowed to be plated or deposited, can increase a degree of freedom of design, and can manufacture the wireless terminal component in a three-dimensional shape with a diversified upscale design and color.
  • the present invention provides an antistatic deposition method of a wireless terminal component such as a display protective widow, a navigation key, a side key, a case or the like, and other information communication equipment components. More particularly, the present invention provides an antistatic deposition method of a wireless terminal component, which comprises depositing tin (Sn) or tin-aluminum (Sn-Al) alloy on a molded material for a wireless terminal component.
  • the present invention employs tin (Sn) or tin-aluminum (Sn-Al) alloy with a very low electrical conductivity in its deposition on a molded material for a wireless terminal component to thereby prevent a deterioration in the performance of the inner circuits of the wireless terminal due to generation of static electricity while maintaining a mirror effect.
  • a molded material for the wireless terminal component, on which tin (Sn) or tin-aluminum (Sn-Al) alloy is deposited is preferably a molded material for a wireless terminal component, which is molded by a dual-injection molding process using an acrylonitrile butadiene styrene (ABS) resin which is allowed to be plated and a polycarbonate (PC) resin which is not allowed to be plated or is difficult to plate.
  • ABS acrylonitrile butadiene styrene
  • PC polycarbonate
  • an antistatic deposition method of a wireless terminal component according to the present invention has an advantageous effect in that it overcome the problems of the prior art, and in that it can maintain an mirror effect and the performance of radio frequencies, can prevent peel-off of a tin (Sn) or tin- aluminum (Sn-Al) alloy deposited on a molded material for a wireless terminal component, and can improve scratch resistance and impact resistance of the wireless terminal component.
  • a transcription inmold method or an insert in-mold method according to the present invention has an advantageous effect in that it can easily form patterns on even a wireless terminal component made of a material which is not allowed to be plated, can increase a degree of freedom of design, and can manufacture the wireless terminal component in a three-dimensional shape with a diversified upscale design and color.
  • FIG. 1 is a cross-sectional view illustrating a state where a tin (Sn) layer or a tin- aluminum (Sn-Al) alloy layer is deposited on a molded material for a wireless terminal component; and
  • FIG. 2 is a cross-sectional view illustrating a state where a tin (Sn) or tin-aluminum
  • (Sn-Al) alloy layer and a layer made of one or more materials selected from the group consisting of Si, SiO , Ti, TiO , Al O and a mixture thereof is sequentially deposited on a molded material for a wireless terminal component.
  • an antistatic deposition method of a wireless terminal component such as a display protective widow, a navigation key, a side key, a case or the like, and other information communication equipment components. More particularly, according to the embodiment of the present invention, there is provided an antistatic deposition method of a wireless terminal component, which comprises depositing tin (Sn) or a tin- aluminum (Sn-Al) alloy on a molded material for a wireless terminal component.
  • tin (Sn) or a tin-aluminum (Sn-Al) alloy with a very low electrical conductivity is employed in its deposition on a molded material for a wireless terminal component to thereby prevent a deterioration in the performance of the inner circuits of the wireless terminal due to generation of static electricity while maintaining a mirror effect.
  • a molded material for the wireless terminal component, on which tin (Sn) or a tin- aluminum (Sn-Al) alloy is deposited is preferably a molded material for a wireless terminal component, which is molded by, but not limited to, a dual-injection molding process using an acrylonitrile butadiene styrene (ABS) resin which is allowed to be plated and a polycarbonate (PC) resin which is not allowed to be plated or is difficult to plate.
  • ABS acrylonitrile butadiene styrene
  • PC polycarbonate
  • an antistatic deposition method of a wireless terminal component which comprises: depositing tin (Sn) or a tin-aluminum (Sn-Al) alloy on a molded material for a wireless terminal component; and depositing one or more materials selected from the group consisting of Si, SiO , Ti, TiO , Al O and a mixture thereof on the deposited tin (Sn) layer or the deposited tin-aluminum (Sn-Al) alloy layer.
  • the layer made of one or more materials selected from the group consisting of Si, SiO , Ti, TiO , Al O and a mixture thereof is deposited on the tin (Sn) layer or the tin-aluminum (Sn-Al) alloy layer, thereby preventing peel-off of the tin (Sn) or tin-aluminum (Sn-Al) alloy deposited on a molded material for a wireless terminal component and increasing hardness of the deposited surface to improve scratch resistance and impact resistance of the wireless terminal component.
  • a weight ratio of tin to aluminum of the tin-aluminum (Sn-Al) alloy used in the antistatic deposition method of a wireless terminal component is 85% by weight: 15% by weight to 95% by weight: 5% by weight, preferably 90% by weight: 10% by weight.
  • the tin-aluminum (Sn-Al) alloy may be electrically plated.
  • the electrically plated tin-aluminum (Sn-Al) alloy forms a solid solution and exhibits physical properties of relatively low melting point, excellent electrical and thermal conductivity and excellent flexibility.
  • a layer made of one or more materials selected from the group consisting of Si, SiO , Ti, TiO , Al O and a mixture thereof deposited on the tin(Sn) layer or the tin-aluminum (Sn-Al) alloy layer is preferably about 0.5-20 D in thickness.
  • a wireless terminal component on which a tin (Sn) or tin-aluminum (Sn-Al) alloy layer is deposited, or the tin (Sn) or tin-aluminum (Sn-Al) alloy layer and a layer made of one or more materials selected from the group consisting of Si, SiO , Ti, TiO , Al O and a mixture thereof are sequentially deposited.
  • a display protective window which has a tin (Sn) or tin- aluminum (Sn-Al) alloy layer deposited on a rear surface thereof, or has the tin (Sn) or tin-aluminum (Sn-Al) alloy layer and a layer made of one or more materials selected from the group consisting of Si, SiO , Ti, TiO , Al O and a mixture thereof are sequentially deposited on a rear surface thereof.
  • (Sn-Al) alloy is deposited, exhibits an excellent mirror effect as well as no deterioration in the performance of the inner circuits of the wireless terminal due to generation of static electricity.
  • a transcription inmold method or an insert inmold method of the wireless terminal component which employs a polyethylene terephthalate (PET) film, etc., plated with tin (Sn) or a tin-aluminum (Sn-Al) alloy.
  • PET polyethylene terephthalate
  • Sn tin
  • Sn-Al tin-aluminum
  • the transcription inmold method refers to a technique in which a film printed with a predetermined pattern is put into a mold to perform injection so that a pattern is transcribed on a molded material.
  • the insert inmold method refers to a technique in which a film printed with a predetermined pattern is put into a mold to perform injection so that the film is formed integrally with a molded material to thereby form the pattern on the molded material.
  • the deposited polyethylene terephthalate (PET) film is used to perform the transcription inmold method or the insert inmold method on the molded material for a wireless terminal component.
  • the use of the polyethylene terephthalate (PET) film can prevent a deformation of the molded material for the wireless terminal component or deposited layers, and can manufacture a product with diverse colors.

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  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Metallurgy (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

The present invention provides an antistatic deposition method of a wireless terminal component, which comprises depositing tin (Sn) or a tin-aluminum (Sn-Al) alloy on a molded material for a wireless terminal component. Also, the present invention discloses an antistatic deposition method of a wireless terminal component, which comprises: depositing tin (Sn) or a tin-aluminum (Sn-Al) alloy on a molded material for a wireless terminal component; and depositing one or more materials selected from the group consisting of Si, SiO, Ti, TiO, Al O and a mixture thereof on the deposited tin (Sn) layer or the deposited tin-aluminum (Sn-Al) alloy layer. The antistatic deposition method of a wireless terminal component according to the present invention has advantageous effects in that it overcomes the problems of the prior art that generation of static electricity adversely affects the performance of the inner circuits of the wireless terminal in case where a metal such as nickel (Ni), chrome (Cr) or the like is deposited on a wireless terminal component so as to create a mirror effect, and in that it can maintain an mirror effect and the performance of radio frequencies, can prevent peel-off of a tin (Sn) or tin- aluminum (Sn-Al) alloy deposited on a molded material for a wireless terminal component, and can improve scratch resistance and impact resistance of the wireless terminal component.

Description

Description
A METHOD OF ANTISTATIC DEPOSITION ON COMPONENTS OF MOBILE PHONE
Technical Field
[1] The present invention relates to an antistatic deposition method of a wireless terminal component such as a display protective widow, a navigation key, a side key, a case or the like. More particularly, the present invention relates to an antistatic deposition method of a wireless terminal component, which comprises depositing tin (Sn) or a tin-aluminum (Sn-Al) alloy on a molded material for a wireless terminal component. Also, the present invention relates to an antistatic deposition method of a wireless terminal component, which comprises: depositing tin (Sn) or a tin-aluminum (Sn-Al) alloy on a molded material for a wireless terminal component; and depositing one or more materials selected from the group consisting of Si, SiO , Ti, TiO , Al O and a mixture thereof on the deposited tin (Sn) layer or the deposited tin-aluminum (Sn-Al) alloy layer. In addition, the present invention relates to a wireless terminal component (particularly, display protective windows) on which a tin (Sn) or tin- aluminum (Sn-Al) alloy layer is deposited, or the tin (Sn) or tin-aluminum (Sn-Al) alloy layer and a layer made of one or more materials selected from the group consisting of Si, SiO , Ti, TiO , Al O and a mixture thereof are sequentially deposited. Background Art
[2] Conventionally, a metal such as nickel (Ni), chrome (Cr) or the like is deposited on a wireless terminal component so as to create a mirror effect. In this case, a metal having electrical conductivity generates static electricity to thereby adversely affect the performance of the inner circuits of the wireless terminal. Especially, in case of using high frequencies, such a problem occurs more remarkably. In addition, a wireless terminal component plated with nickel (Ni), chrome (Cr) or the like entails a problem in that it reduces the radiation performance of radio waves. Disclosure of Invention
Technical Problem
[3] Accordingly, an object of the present invention has been made to overcome the above-mentioned problems occurring in the prior art, and it is an object of the present invention to provide an antistatic deposition method of a wireless terminal component, which can maintain an mirror effect and the performance of radio frequencies, can prevent peel-off of a tin (Sn) or tin-aluminum (Sn-Al) alloy deposited on a molded material for a wireless terminal component, and can improve scratch resistance and impact resistance of the wireless terminal component. [4] Another object of the present invention is to provide an antistatic deposition method of a wireless terminal component, which can easily form patterns on even a wireless terminal component made of a material which is not allowed to be plated or deposited, can increase a degree of freedom of design, and can manufacture the wireless terminal component in a three-dimensional shape with a diversified upscale design and color. Technical Solution
[5] To accomplish the above object, the present invention provides an antistatic deposition method of a wireless terminal component such as a display protective widow, a navigation key, a side key, a case or the like, and other information communication equipment components. More particularly, the present invention provides an antistatic deposition method of a wireless terminal component, which comprises depositing tin (Sn) or tin-aluminum (Sn-Al) alloy on a molded material for a wireless terminal component. The present invention employs tin (Sn) or tin-aluminum (Sn-Al) alloy with a very low electrical conductivity in its deposition on a molded material for a wireless terminal component to thereby prevent a deterioration in the performance of the inner circuits of the wireless terminal due to generation of static electricity while maintaining a mirror effect. A molded material for the wireless terminal component, on which tin (Sn) or tin-aluminum (Sn-Al) alloy is deposited, is preferably a molded material for a wireless terminal component, which is molded by a dual-injection molding process using an acrylonitrile butadiene styrene (ABS) resin which is allowed to be plated and a polycarbonate (PC) resin which is not allowed to be plated or is difficult to plate.
Advantageous Effects
[6] As described above, an antistatic deposition method of a wireless terminal component according to the present invention has an advantageous effect in that it overcome the problems of the prior art, and in that it can maintain an mirror effect and the performance of radio frequencies, can prevent peel-off of a tin (Sn) or tin- aluminum (Sn-Al) alloy deposited on a molded material for a wireless terminal component, and can improve scratch resistance and impact resistance of the wireless terminal component.
[7] A transcription inmold method or an insert in-mold method according to the present invention has an advantageous effect in that it can easily form patterns on even a wireless terminal component made of a material which is not allowed to be plated, can increase a degree of freedom of design, and can manufacture the wireless terminal component in a three-dimensional shape with a diversified upscale design and color. Brief Description of the Drawings
[8] FIG. 1 is a cross-sectional view illustrating a state where a tin (Sn) layer or a tin- aluminum (Sn-Al) alloy layer is deposited on a molded material for a wireless terminal component; and
[9] FIG. 2 is a cross-sectional view illustrating a state where a tin (Sn) or tin-aluminum
(Sn-Al) alloy layer and a layer made of one or more materials selected from the group consisting of Si, SiO , Ti, TiO , Al O and a mixture thereof is sequentially deposited on a molded material for a wireless terminal component. Best Mode for Carrying Out the Invention
[10] Reference will now be made in detail to a preferred embodiment of the present invention with reference to the attached drawings.
[11] According to one embodiment of the present invention, there is provided an antistatic deposition method of a wireless terminal component such as a display protective widow, a navigation key, a side key, a case or the like, and other information communication equipment components. More particularly, according to the embodiment of the present invention, there is provided an antistatic deposition method of a wireless terminal component, which comprises depositing tin (Sn) or a tin- aluminum (Sn-Al) alloy on a molded material for a wireless terminal component. In the embodiment of the present invention, tin (Sn) or a tin-aluminum (Sn-Al) alloy with a very low electrical conductivity is employed in its deposition on a molded material for a wireless terminal component to thereby prevent a deterioration in the performance of the inner circuits of the wireless terminal due to generation of static electricity while maintaining a mirror effect.
[12] A molded material for the wireless terminal component, on which tin (Sn) or a tin- aluminum (Sn-Al) alloy is deposited, is preferably a molded material for a wireless terminal component, which is molded by, but not limited to, a dual-injection molding process using an acrylonitrile butadiene styrene (ABS) resin which is allowed to be plated and a polycarbonate (PC) resin which is not allowed to be plated or is difficult to plate.
[13] According to another embodiment of the present invention, there is provided an antistatic deposition method of a wireless terminal component, which comprises: depositing tin (Sn) or a tin-aluminum (Sn-Al) alloy on a molded material for a wireless terminal component; and depositing one or more materials selected from the group consisting of Si, SiO , Ti, TiO , Al O and a mixture thereof on the deposited tin (Sn) layer or the deposited tin-aluminum (Sn-Al) alloy layer. The layer made of one or more materials selected from the group consisting of Si, SiO , Ti, TiO , Al O and a mixture thereof is deposited on the tin (Sn) layer or the tin-aluminum (Sn-Al) alloy layer, thereby preventing peel-off of the tin (Sn) or tin-aluminum (Sn-Al) alloy deposited on a molded material for a wireless terminal component and increasing hardness of the deposited surface to improve scratch resistance and impact resistance of the wireless terminal component.
[14] A weight ratio of tin to aluminum of the tin-aluminum (Sn-Al) alloy used in the antistatic deposition method of a wireless terminal component is 85% by weight: 15% by weight to 95% by weight: 5% by weight, preferably 90% by weight: 10% by weight. The tin-aluminum (Sn-Al) alloy may be electrically plated. In this case, the electrically plated tin-aluminum (Sn-Al) alloy forms a solid solution and exhibits physical properties of relatively low melting point, excellent electrical and thermal conductivity and excellent flexibility.
[15] In the antistatic deposition method of a wireless terminal component according to the embodiment of the present invention, a layer made of one or more materials selected from the group consisting of Si, SiO , Ti, TiO , Al O and a mixture thereof deposited on the tin(Sn) layer or the tin-aluminum (Sn-Al) alloy layer is preferably about 0.5-20 D in thickness.
[16] According to another embodiment of the present invention, there is also provided a wireless terminal component on which a tin (Sn) or tin-aluminum (Sn-Al) alloy layer is deposited, or the tin (Sn) or tin-aluminum (Sn-Al) alloy layer and a layer made of one or more materials selected from the group consisting of Si, SiO , Ti, TiO , Al O and a mixture thereof are sequentially deposited. Particularly, in the inventive embodiment, there is also provided a display protective window which has a tin (Sn) or tin- aluminum (Sn-Al) alloy layer deposited on a rear surface thereof, or has the tin (Sn) or tin-aluminum (Sn-Al) alloy layer and a layer made of one or more materials selected from the group consisting of Si, SiO , Ti, TiO , Al O and a mixture thereof are sequentially deposited on a rear surface thereof.
[17] The wireless terminal component, on which the tin (Sn) or the tin-aluminum
(Sn-Al) alloy is deposited, exhibits an excellent mirror effect as well as no deterioration in the performance of the inner circuits of the wireless terminal due to generation of static electricity.
[18] Moreover, there is provided a transcription inmold method or an insert inmold method of the wireless terminal component according to another embodiment of the present invention which employs a polyethylene terephthalate (PET) film, etc., plated with tin (Sn) or a tin-aluminum (Sn-Al) alloy.
[19] The transcription inmold method refers to a technique in which a film printed with a predetermined pattern is put into a mold to perform injection so that a pattern is transcribed on a molded material. The insert inmold method refers to a technique in which a film printed with a predetermined pattern is put into a mold to perform injection so that the film is formed integrally with a molded material to thereby form the pattern on the molded material. [20] According to this embodiment, after tin (Sn) or a tin-aluminum (Sn-Al) alloy has been deposited on a polyethylene terephthalate (PET) film, etc., without directly depositing tin (Sn) or a tin-aluminum (Sn-Al) alloy on a molded material for a wireless terminal component, the deposited polyethylene terephthalate (PET) film is used to perform the transcription inmold method or the insert inmold method on the molded material for a wireless terminal component. Thus, it is possible to easily form patterns on even a wireless terminal component made of a material which is not allowed to be plated or deposited and increase a degree of freedom of design. Further, the use of the polyethylene terephthalate (PET) film can prevent a deformation of the molded material for the wireless terminal component or deposited layers, and can manufacture a product with diverse colors.
[21] While the invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is merely exemplary and not limited to the disclosed embodiments. Therefore, a person skilled in the art can perform various changes and modifications based on a principle of the present invention, which falls in the scope of the present invention. The scope of the present invention should be defined by the claims and their equivalents, but not the embodiments as described above.

Claims

Claims
[1] An antistatic deposition method of a wireless terminal component, comprising depositing tin (Sn) on a molded material for a wireless terminal component. [2] An antistatic deposition method of a wireless terminal component, comprising depositing a tin-aluminum (Sn-Al) alloy on a molded material for a wireless terminal component [3] The antistatic deposition method as defined in claim 1 or 2, further comprising depositing one or more materials selected from the group consisting of Si, SiO ,
Ti, TiO , Al O and a mixture thereof. [4] The antistatic deposition method as defined in claim 1 or 2, wherein the wireless terminal component is a display protective widow, a navigation key, a side key, or a case. [5] The antistatic deposition method as defined in claim 1 or 2, wherein the molded material for the wireless terminal component is molded by a dual-injection molding process using an acrylonitrile butadiene styrene (ABS) resin which is allowed to be plated and a polycarbonate (PC) resin which is not allowed to be plated or is difficult to plate. [6] The antistatic deposition method as defined in claim 2, wherein a weight ratio of tin to aluminum of the tin-aluminum (Sn-Al) alloy is 85% by weight: 15% by weight to 95% by weight: 5% by weight. [7] The antistatic deposition method as defined in claim 6, wherein a weight ratio of tin to aluminum of the tin-aluminum (Sn-Al) alloy is 90% by weight: 10% by weight. [8] A transcription inmold or insert inmold method of a wireless terminal component, employing a film on which tin (Sn) or a tin-aluminum (Sn-Al) alloy is deposited. [9] A wireless terminal component deposited with a tin (Sn) or tin-aluminum
(Sn-Al) alloy. [10] The wireless terminal component as defined in claim 9, wherein a layer made of one or more materials selected from the group consisting of Si, SiO , Ti, TiO , Al
O and a mixture thereof is deposited on the tin (Sn) or tin-aluminum (Sn-Al) alloy.
PCT/KR2007/004197 2006-09-01 2007-08-31 A method of antistatic deposition on components of mobile phone WO2008026893A1 (en)

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CN2007800309352A CN101506945B (en) 2006-09-01 2007-08-31 A method of antistatic deposition on components of mobile phone
JP2009525507A JP2010501727A (en) 2006-09-01 2007-08-31 Electrostatic deposition method for mobile phone parts
US12/440,018 US20100039745A1 (en) 2006-09-01 2007-08-31 Method of antistatic deposition on components of mobile phone
EP07793777A EP2057667A4 (en) 2006-09-01 2007-08-31 A method of antistatic deposition on components of mobile phone

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KR1020060083994A KR100797627B1 (en) 2006-09-01 2006-09-01 A method of antistatic deposition on components of mobile phone
KR10-2006-0083994 2006-09-01

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KR101761942B1 (en) * 2012-08-27 2017-07-26 삼성전기주식회사 Electrostatic discharge protection device and method for manufacturing the same
KR20140128057A (en) * 2013-04-26 2014-11-05 삼성전기주식회사 Thin film type chip device and method for manufacturing the same
KR20210074910A (en) * 2019-12-12 2021-06-22 삼성전자주식회사 Electronic device having metal housing for decreasing vibration by leakage current and method for manufacturing the metal housing

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KR100797627B1 (en) 2008-01-24
US20100039745A1 (en) 2010-02-18
CN101506945B (en) 2012-06-20
CN101506945A (en) 2009-08-12
EP2057667A4 (en) 2013-03-20
EP2057667A1 (en) 2009-05-13

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