WO2008026652A1

WO2008026652A1 - Micromovement device and method of producing the same

Info

Publication number: WO2008026652A1
Application number: PCT/JP2007/066796
Authority: WO
Inventors: Hirokazu Tsuji; Rai Itoh; Susumu Ryuzaki
Original assignee: Tokyo Denki University
Priority date: 2006-08-31
Filing date: 2007-08-29
Publication date: 2008-03-06
Also published as: JP2008057470A; JP4753815B2

Abstract

A micromovement device having a curve member (2) constructed from at least a first elastic layer and a second elastic layer, and also having a light source (3) for irradiating the curve member with laser light. The curve member (2) is placed on a placement surface with the recessed surface of the curve member upward. The micromovement device can move without relying on impact force generated by a heat deformation element, and drive energy can be supplied to the micromovement device without contact.

Description

Specification

Micro-movement device and manufacturing method thereof

Technical field

TECHNICAL FIELD [0001] The present invention relates to a micro-movement device that operates using heat generated by light irradiation and a method for manufacturing the same.

Background art

[0002] There is known a micro-movement device using an impact force accompanying thermal deformation of a thermal deformation element! (Patent Document 1). The micro-movement device described in this document includes a moving body that is placed on a predetermined sliding surface, a thermal deformation element that is attached to an end face of the moving body and that expands and contracts by thermal deformation, It consists of an inertial mass attached and spaced from the sliding surface. When the heat-deformable element is heated, the heat-deformable element is rapidly deformed, and the impact force accompanying the deformation acts on the moving body. Since the movable body is slidable with respect to the sliding surface, it can be moved by an impact force. Here, since the thermal deformation element can be heated by laser light or microwaves, there is an advantage that the driving energy of the moving body can be supplied in a non-contact manner.

Patent Document 1: Japanese Patent Laid-Open No. 6-17747

Disclosure of the invention

[0003] However, the above-described micro movement device has the following disadvantages. That is, in order to use the impact force generated by the deformation of the thermally deformable element, it is necessary to make the shape of the moving body itself special when attempting to move the moving body efficiently. In addition, since it is necessary to rapidly deform when heat is applied, a special material must be selected as the thermal deformation element. Furthermore, it is necessary to optimize the weight balance between the moving body and the inertial body, which is limited in terms of downsizing and simplification of the structure.

[0004] An object of the present invention is to provide a micro-movement device that can be displaced without depending on an impact force generated by a thermal deformation element and can supply driving energy in a non-contact manner.

[0005] The first aspect of the present invention comprises at least a first elastic layer and a second elastic layer. Provided is a micro-movement device that includes a curved member that faces and a light source that irradiates light to the curved member, and the curved member is placed with the concave surface facing the placement surface.

[0006] Here, it is preferable that the bending member has a plurality of branch portions whose tip portions are in contact with the placement surface. Each branch portion is provided on the bending member, and includes a first elastic layer and a second elastic layer. In this way, the bending member is stably placed on the placement surface.

[0007] The first elastic layer is preferably a photoresist, and the second elastic layer is preferably a metal. More preferably, the metal is aluminum. Further, it is more preferable that the photoresist has a hardness of 0.02 to 5 GPa and a Young's modulus of 0.7 to 170 GPa.

[0008] Preferably, the light source includes a laser diode. In this case, the bending member can be easily irradiated with laser light. The light source preferably further includes a modulator that modulates the intensity of light applied to the bending member. In this case, the force S is used to easily generate vibration of the bending member.

[0009] A second aspect of the present invention provides the following method for manufacturing a micro-movement device in which a first layer and a second layer are laminated. In the method, a photoresist layer is formed on the surface of the substrate, the photoresist layer is patterned to form a first layer, a metal layer covering the surface of the substrate and the first layer is formed, and the metal layer is patterned. A second layer is formed on the first layer. According to this method, it is possible to reliably manufacture the bending member of the micro movement device.

[0010] Here, the first layer is preferably heated. Then, the first layer can have a predetermined hardness and Young's modulus.

[0011] A third aspect of the present invention provides a micro-movement device comprising a cantilever composed of the following first elastic layer and the following second elastic layer, and a light source for irradiating the cantilever with light. Here, the first elastic layer is made of a photoresist having a hardness of 0.02 to 5 GPa and a Young's modulus of 0.7 to 170 GPa, and the second elastic layer is made of aluminum.

[0012] According to the present invention, it is possible to provide a micro-movement device that can move without depending on the impact force generated by the thermal deformation element and that can supply drive energy in a non-contact manner and a method for manufacturing the same.

Brief Description of Drawings

[0013] FIG. 1 is a schematic diagram of one embodiment of a micro-movement device of the present invention. 2 is a (a) perspective view, (b) a top view, and (c) a side view showing a bending member of the micro-movement device in FIG. 1.

3 is a view showing a manufacturing method (first half) of the bending member of FIG. 2.

4 is a diagram showing a method (second half) for manufacturing the bending member of FIG. 2. FIG.

FIG. 5 is a diagram showing a stainless steel single layer cantilever before (a) light irradiation and (b) after light irradiation.

FIG. 6 is a diagram showing an aluminum single layer cantilever (a) before light irradiation and (b) after light irradiation.

FIG. 7 is a view showing a cantilever having an aluminum layer and a photoresist layer according to the present invention (a) before light irradiation and (b) after light irradiation.

FIG. 8 is a schematic view of a measuring apparatus used in the experiments shown in FIGS.

FIG. 9 is a diagram showing the relationship between the tip end portion displacement of the cantilever shown in FIG. 7 and the laser beam output.

FIG. 10 is a diagram showing the relationship between the tip end displacement of the cantilever shown in FIG. 7 and the laser beam irradiation frequency.

FIG. 11 is a diagram showing a state of movement of the bending member.

FIG. 12 shows (a) a perspective view, (b) a top view, and (c) a side view showing a modified example of the bending member.

FIG. 13 shows another modified example of the bending member, (a) a perspective view, (b) a top view, and (c) a side view.

FIG. 14 shows still another modified example of the bending member; (a) perspective view, (b) top view, (c) side view. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an embodiment of a mobile device of the present invention will be described with reference to the accompanying drawings. The accompanying drawings merely depict an overview of embodiments that are not reduced or enlarged according to a scale ratio. In addition, the accompanying drawings are not intended to illustrate specific parameters or structural details of the embodiments. These can be arbitrarily determined by those skilled in the art through the information presented here. In the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted.

[0015] Referring to FIG. 1, the moving device 1 irradiates the bending member 2 and the luminous flux L to the bending member 2. The light source 3

As shown in FIGS. 2 (a) to (c), the bending member 2 includes a main portion 2a that bends, and branch portions 2b and 2c that are provided on the side of the main portion 2a and bend in the same manner as the main portion 2a. And have. The bending member 2 has a cross shape in plan view (FIG. 2 (b)). The bending member 2 is placed with the concave surface facing the base 4. Both ends of the main part 2a and the tips of the branch parts 2b and 2c are slidably in contact with the upper surface 4a of the base 4 (FIG. 2 (c)).

The main part 2a and the branch parts 2b, 2c are configured by laminating a first elastic layer 20 and a second elastic layer 21. The first elastic layer 20 is located on the convex surface side, and the second elastic layer 21 is located on the concave surface side. Further, these layers 20 and 21 are made of an elastic material and have different thermal expansion coefficients. Specifically, the first elastic layer 20 is made of glass (SiO 2), plastic

2

Or a resin or the like. It is preferable that the second elastic layer 21 is made of a metal such as stainless steel (steel nanotube) (A1). In the present embodiment, the first conductive layer 20 is made of a photoresist. Further, since the fine processing is easy, the second insulating layer 21 is made of aluminum. In particular, the photoresist layer has a hardness of about 3.4 GPa and a Young's modulus of about 8 lGPa.

[0017] The dimensions of the bending member 2 in the present embodiment are such that the length of the main part 2a is about 3 to 4 mm, and the width is about 0.8 to 1.2 mm. The thickness of the first elastic layer 20 (photoresist) is about 0.1 to 2 mm, and the thickness of the second elastic layer 21 (aluminum) is about 0 ·! To 10 m. The length from the tip of one branch part 2b to the tip of the other branch part 2c is substantially the same as the length of the main part 2a. The widths of the branch portions 2b and 2c are substantially the same as the width of the main portion 2a.

[0018] The base 4 is held so that the bending member 2 placed on the upper surface 4a does not move by its own weight. The upper surface 4a is a flat surface on which the bending member 2 can slide. Specifically, the base 4 is preferably a mirror-polished silicon wafer.

In this embodiment, the light source 3 includes a laser diode that emits laser light having a wavelength of 685 nm. Further, the laser beam irradiation position on the bending member 2 is not particularly limited, and may be on the main part 2a or on the branch parts 2b and 2c. The irradiation position may be on the convex surface or the concave surface. However, if the irradiation position is biased to one of the tips rather than the top of the bending member 2, there will be a difference in the amount of deformation at both ends. Becomes more prominent.

Note that the light source 3 can turn ON / OFF the voltage applied to the laser diode at a predetermined frequency (for example, 30 Hz to 140 Hz) (duty control can be performed). Thereby, the irradiation light to the bending member 2 is also turned ON / OFF at the frequency. In the present embodiment, the above frequency control is realized by using a function generator (not shown). However, the applied voltage may be turned on / off with a switch, or a variable voltage device may be used. Further, a chopper may be provided in the optical path of the laser beam L (light beam L).

[0021] The operation of the mobile device 1 having the above-described configuration and the effects and advantages of the mobile device 1 will be described.

In the moving device 1, the bending member 2 is placed so that the concave surface side (aluminum layer side) faces the upper surface 4a of the base 4, and is in contact with the upper surface 4a at least at two contact portions. Here, when the laser beam L from the light source 3 is irradiated onto the bending member 2, heat is generated by absorption of the light. The bending member 2 is deformed by this heat and the difference in thermal expansion coefficient between the first elastic layer 20 and the second elastic layer 21. As a result, the distance between at least two contact portions in contact with the upper surface 4a changes. When the irradiation with the laser beam L is interrupted and the temperature decreases, the bending member 2 returns to the original shape by the inertial force of the layers 20 and 21. As a result, the distance between the contact portions also returns. Here, when the irradiation of the laser beam L is turned ON / OFF at a predetermined cycle, the distance between the contact portions of the bending member 2 vibrates so as to be widened / narrowed at that cycle. Since the bending member 2 is simply placed on the base 4, it can move on the base 4 by this vibration. Therefore, the bending member 2 can function as a moving body that moves in response to the supply of driving energy in a non-contact manner without using the impact force associated with the thermal deformation of the thermal deformation member.

In addition, since the first elastic layer 20 is made of a photoresist layer and the second elastic layer 21 is made of aluminum, the difference in thermal expansion coefficient between the two is large. Therefore, since the amount of deformation caused by the irradiation with the laser beam L can be increased, the force S for improving the moving amount and moving speed of the bending member 2 can be achieved. In particular, the photoresist layer has a hardness of about 3.4 GPa and a Young's modulus of about 81 GPa, and is suitable as the first elastic layer 20 of the bending member 2.

Furthermore, when such a material is used, the bending member 2 can be easily and reliably bent by the difference in internal residual stress between the first elastic layer 20 and the second elastic layer 21. [0024] Furthermore, since not only the tip of the main part 2a but also the tips of the branch parts 2b and 2c are in contact with the upper surface 4a, the bending member 2 is stably placed on the base 4.

Next, a method for producing the bending member 2 will be described with reference to FIGS. 3 (a) to (d) and FIGS. 4 (a) to (c).

[0026] (1) Photoresist layer forming step

First, a silicon (Si) substrate 31 is prepared, and a photoresist layer 32 to be the first elastic layer 20 is formed on the surface (FIG. 3 (a)). The size of the silicon substrate 31 is not limited as long as the silicon substrate 31 is larger than the curved member 2 to be produced by using a commercially available mirror-polished wafer.

The photoresist used can be either a positive photoresist or a negative photoresist. Specifically, TSMR-8900 manufactured by Tokyo Ohka Kogyo Co., Ltd. can be used as a photoresist. In particular, from the viewpoint of workability in the lift-off process described later, it is preferable to use a photoresist that can be easily removed with an organic solvent. The thickness of the photoresist layer 32 is preferably about 0.01 to 3111.

Next, the photoresist layer 32 is exposed and developed using a photomask having a pattern (cross shape) corresponding to the shape of the curved member 2 to be produced, thereby forming a patterned photoresist layer 32a (FIG. 3). (b)).

[0027] ( ² ) Formation process of aluminum film

Next, an aluminum film 33 to be the second elastic layer 21 is formed on the photoresist layer 32a and the silicon substrate 31 exposed by removing the photoresist layer 32 (FIG. 3 (c)). Various physical 'chemical vapor deposition methods can be adopted for the film formation. However, the sputtering method (particularly, the magnetron sputtering method) is preferable because it has good film thickness controllability and the effects of alteration of the photoresist layer 32 (described later). Specific film forming conditions are exemplified by sputtering gas: argon (Ar), sputtering power: 500 W, gas pressure: 3.0 Pa, sputtering time: 7 to 10 hours. The film thickness of the aluminum film is about 2 to 3 m.

(3) Patterning process

A photoresist film 34 is applied and baked on the aluminum film 33 (FIG. 3 (d)). Thereafter, exposure and development are performed using the photomask described above to form a mask layer 34a (FIG. 4 (a)). Thereafter, this mask layer 34a is used to cover the aluminum film 33 with the mask layer 34a. Etch away the large part. As a result, an aluminum layer 33a is formed (FIG. 4 (b)).

[0028] (4) Lift-off process

Finally, using an organic solvent (acetone), the mask layer 34a is removed and the photoresist layer 32a is lifted off from the silicon substrate 31 (FIG. 4 (c)). At this time, the photoresist layer 32a (20) remains on the aluminum layer 33a (21). This is because the photoresist layer 32a has deteriorated due to the influence of plasma generated during the sputter deposition of the aluminum film 33a (21).

[0029] After the photoresist layer 32a (20) was heated (heat-treated) under the sputter deposition conditions of the aluminum film 33a (21), a nanoindentation test was performed. As a result, the hardness of the photoresist layer 32a (20) changed from 1. OGPa before heat treatment to 3.4 GPa after heat treatment. The Young's modulus of the photoresist layer 32a (20) changed from 33 GPa before heat treatment to 81 GPa after heat treatment. The first elastic layer 20 suitable for the bending member 2 is realized by changing the quality of the photoresist layer 32a (20).

[0030] Through the above steps, the bending member 2 in which the first elastic layer 20 and the second elastic layer 21 are laminated is formed. The bending member 2 is bent due to a difference in residual stress between two films having different Young's moduli. The bending member 2 in the present embodiment needs to be bent because it moves using the change in the amount of bending due to ON / OFF of laser light irradiation. Here, in order to realize a curved shape, a two-layer structure of a first elastic layer 20 and a second elastic layer 21 is used. In other words, according to the method described above, the force S can be achieved by realizing the curved shape without any special process by laminating two layers.

[0031] Next, the results of experiments conducted to confirm the effect of the mobile device 1 will be described. This experiment was conducted in order to examine how much the bending amount is. For this purpose, considering the simplicity of measurement, a micro-cantilever consisting of two layers, an aluminum layer and a photoresist layer, was fabricated in place of the bending member 2, and its displacement was evaluated. The photoresist layer in this micro'cantilever had a hardness of about 3.4 GPa and a Young's modulus of 81 GPa, like the curved member 2 described above.

In addition, for comparison, a micro 'cantilever composed of an aluminum single layer, and The displacement of a micro-cantilever composed of a single layer of stainless steel (sus) was also investigated. These micro-cantilevers were produced by appropriately changing the manufacturing method of the bending member 2 described above. The sizes of the above three types of micro cantilevers are as follows.

[0032] · Two-layer cantilever: length 3 · 06mm X width 700 111 X thickness 1 · μ ηι ^

'Aluminum single layer cantilever: length 5.22 mm x width 700 m x thickness 2.7 m, • Stainless steel' single layer cantilever: length 4.86 mm x width 700 m x thickness 10 μm.

[0033] FIGS. 5 to 7 show changes in the shape of the above-described micro cantilever before and after continuous laser beam irradiation. (A) in each figure shows the shape before continuous laser light irradiation, and (b) in each figure shows the shape after continuous laser light irradiation.

[0034] Note that the measurement apparatus shown in FIG. 8 was used for this observation. Specifically, the micro cantilever MC was placed under the objective lens of the stereomicroscope 10, and the laser light L was applied to the micro cantilever MC. The laser light L was applied to the back surface of the micro-cantilever MC from the laser diode 12 driven through the function generator 11. Then, an image of the micro cantilever MC is picked up by the CCD camera 13 installed in the stereomicroscope 10, and electronic data of this image is input to the personal computer 14. The image is displayed on the display 15 and printed by a predetermined printer (not shown).

[0035] As shown in FIGS. 5 (a) and 5 (b), the cantilever made of a stainless steel / single-layer force is deformed so that the upward warping is increased by laser light irradiation, but the tip displacement amount is Just 13 μm.

In addition, as shown in Figs. 6 (a) and 6 (b), the tip displacement of the aluminum single layer cantilever before and after laser light irradiation was about 33 Hm. Compared with a stainless steel cantilever with a single layer, the amount of displacement is greatly increased.

[0036] On the other hand, in a micro cantilever composed of an aluminum layer and a photoresist layer, the tip displacement was found to be about 640 m, as shown in FIGS. 7 (a) and (b). . This is the effect of laminating an aluminum layer and a photoresist layer. This is thought to be because the dyst layer was altered by heating (during the sputtering process of Amminium), resulting in the hardness and Young's modulus described above.

Next, the relationship between the laser light intensity of a micro cantilever composed of an aluminum layer and a photoresist layer and the amount of displacement will be described. As shown in Fig. 9, the amount of tip displacement of the cantilever is approximately proportional to the laser light output in the range from about 1.5 to 13 mW. This result suggests that the deformation amount of the bending member 2 of the moving device 1 can be controlled by the intensity of the irradiated laser beam, and further the moving speed can be controlled.

[0037] Next, the relationship between the laser light irradiation frequency of the micro-cantilever composed of an aluminum layer and a photoresist layer and the amount of displacement will be described. As shown in Fig. 10, the tip displacement amount (amplitude) of the force cantilever can be controlled by the laser beam irradiation frequency (irradiation period). In particular, a displacement peak is observed near the frequency of 100 Hz. This phenomenon can be attributed to a resonance phenomenon that occurs when the cantilever has a natural frequency of about 100 Hz and coincides with the laser beam irradiation frequency and the natural frequency.

[0038] When the irradiation frequency exceeds about 120 Hz, the amount of displacement decreases. This phenomenon is presumed to be because the radiation of heat is not sufficiently performed as the non-irradiation time is shortened, and the original shape cannot be restored.

Based on the above experimental results, a specific example of the operation of the mobile device 1 according to the present embodiment will be described.

FIGS. L l (a) to (e) are diagrams showing changes in the position of the bending member 2 irradiated with laser light (wavelength 685 nm * output 6 · 7 mW) at an irradiation frequency of 25 Hz. The white ellipse in the figure represents the laser light irradiation point.

[0040] Fig. 11 (a) shows the curved member 2 immediately after the start of laser beam irradiation, Fig. 11 (b) shows the curved member 2 10 seconds after the start of irradiation, and Figs. 11 (c) and 11 (d) show 20 seconds after the start of irradiation. Is shown. As shown in the figure, the bending member 2 moves downward in the figure by laser light irradiation! Comparing FIG. 11 (a) and FIG. 11 (c), the bending member 2 moves about 0.5 mm in about 20 seconds after the laser beam irradiation. Such movement amount and movement speed that can be recognized with the naked eye have not been realized in the past. From this fact, the effect of the present invention can be understood. Moreover, it is 6.7 m with a visible light laser beam with a wavelength of 685 nm. Since such a movement amount and movement speed can be obtained in spite of the output of w, it can be said that the effect is remarkable. Furthermore, if the natural frequency of the bending member 2 and the irradiation frequency of the irradiation laser light are matched, the deformation amount of the bending member 2 can be increased. Speed can be realized.

[0041] FIG. 11 (d) is the same as FIG. 11 (c). Comparing FIG. 11 (a), FIG. 11 (c) and FIG. 11 (d), it can be seen that the bending member 2 rotates counterclockwise in the figure. This result shows that the moving direction of the bending member 2 can be controlled in a non-contact manner by adjusting the laser light irradiation point in the moving device according to the present invention. This is also a great effect achieved by the present invention.

Yes

[0042] Although one embodiment of the mobile device of the present invention has been described above, the present invention is not limited to the above-described embodiment, and various modifications can be made.

For example, in the above embodiment, the cross-shaped curved member 2 having two branch portions 2b and 2c is illustrated. However, as shown in FIGS. 12 (a) to 12 (c), the bending member 2 is composed of only the portion corresponding to the main part 2a of the above embodiment, and may have a rectangular shape in plan view. ! /, (Figure 12 (b)). Alternatively, the bending member 2 may have an arrowhead shape in plan view as shown in FIGS. 13 (a) to (c) (FIG. 13 (b)). Alternatively, it may have a Y shape or a star shape in plan view.

Alternatively, the bending member 2 may be placed so that only a part thereof is curved and the concave surface side of the curved portion faces the placement surface. For example, as shown in FIGS. 14 (a) to (c), the bending member 2 may have an S-shape when viewed from the side (FIG. 14 (c)). Alternatively, the bending member 2 may have a W shape in a side view, and the concave surface may be placed downward. Furthermore, a projection may be provided on the convex surface as long as the curved shape is not impaired without inhibiting light irradiation. When the minute moving body (curved member) acts on another member, the protrusion can function as an action point or an operating point on the other member.

[0044] The curved shape is not particularly limited as long as a portion excluding at least two contact portions with the placement surface is separated from the placement surface. Further, the bending member can take various bending states depending on the placement location.

[0045] Further, the bending member has a configuration in which the first elastic layer and the second elastic layer are laminated as described above. It is not limited. The bending member may be configured by laminating three or more layers. Specifically, the bending member may be composed of three layers: an aluminum layer, a photoresist layer, and a carbon layer. Further, the first elastic layer and the second elastic layer may have different shapes. For example, the first elastic layer may cover a part of the second elastic layer. Alternatively, a plurality of first elastic layers may be scattered on the second elastic layer! /!

In the above embodiment, the light source 3 is a laser diode that emits laser light having a wavelength of 685 nm. However, the type of the light source is not particularly limited as long as it can irradiate the curved member with light. Further, the wavelength of the irradiation light is not limited to 685 nm, and may be any wavelength within the visible range (about 400 nm to about 700 nm). Further, the wavelength of the irradiation light may be an infrared wavelength.

[0047] The light source may be composed of a red light emitting diode and a condensing lens that condenses the light from the diode and irradiates the curved member. At this time, in order to modulate the intensity of the light beam applied to the bending member at a predetermined frequency, it is preferable to provide a tipper between the lens and the bending member.

The above-described method for manufacturing a curved member is an example of applying a semiconductor manufacturing process such as sputtering or photolithography, and various modifications can be made.

[0048] For example, a heating step of intentionally heating and altering the photoresist layer of the first elastic layer may be provided separately. This is suitable when vacuum deposition is employed instead of sputtering of the aluminum film.

[0049] Further, before forming the photoresist layer (32) on the silicon substrate (31), an SiO layer is formed on the substrate.

2 and a photoresist layer may be formed on the SiO layer. And aluminum film (3

2

After patterning by etching in 3), the mask (photoresist) layer (34a) is removed by ashing, and the SiO layer is removed using buffered hydrofluoric acid. In this way,

2

The thickness of the photoresist layer (32a, 20) of the first elastic layer can be reliably and easily controlled.

Industrial applicability

The present invention can be used in various fields as a core technology of a so-called photothermally driven self-propelled micromachine. Specifically, it can be applied to measuring instruments, medical equipment, and machine tools. It can be used, especially in the instrument field.

Claims

The scope of the claims

[1] a curved member having at least a concave surface composed of at least a first elastic layer and a second elastic layer;

A light source for irradiating the bending member with light,

A micro-movement device in which the bending member is placed with the concave surface facing the placement surface.

[2] The bending member has a plurality of branch portions whose tip portions are in contact with the mounting surface, and each of the branch portions is provided in the bending member, and the first elastic layer and the 2. The micro-movement device according to claim 1, comprising a second elastic layer.

3. The micro movement device according to claim 2, wherein the first elastic layer is a photoresist and the second elastic layer is a metal.

4. The micro movement device according to claim 3, wherein the metal is aluminum.

[5] The micro-movement device according to claim 4, wherein the photoresist force has a hardness of 0.02 to 5 GPa and a Young's modulus of 0.7 to 170 GPa.

6. The micro movement device according to claim 5, wherein the light source includes a laser diode.

7. The micro-movement device according to claim 6, wherein the light source further includes a modulator that modulates intensity of light applied to the bending member.

[8] A method for manufacturing a micro-movement device in which a first layer and a second layer are laminated,

Form a photoresist layer on the surface of the substrate,

Patterning the photoresist layer to form the first layer;

Forming a metal layer covering the surface of the substrate and the first layer;

The metal layer is patterned to form the second layer on the first layer.

[9] The method for manufacturing a micro movable body according to [8], wherein the first layer is heated.

[10] a cantilever composed of a first elastic layer and a second elastic layer;

A light source for irradiating the cantilever with light,

The first elastic layer is made of a photoresist having a hardness of 0.02 to 5 GPa and a Young's modulus of 170 GPa;

The micro movement device in which the second elastic layer is made of aluminum.