WO2008024388A3 - Substrate container with outboard kinematic coupling structure - Google Patents

Substrate container with outboard kinematic coupling structure Download PDF

Info

Publication number
WO2008024388A3
WO2008024388A3 PCT/US2007/018550 US2007018550W WO2008024388A3 WO 2008024388 A3 WO2008024388 A3 WO 2008024388A3 US 2007018550 W US2007018550 W US 2007018550W WO 2008024388 A3 WO2008024388 A3 WO 2008024388A3
Authority
WO
WIPO (PCT)
Prior art keywords
kinematic coupling
container
coupling grooves
periphery
outboard
Prior art date
Application number
PCT/US2007/018550
Other languages
French (fr)
Other versions
WO2008024388A2 (en
Inventor
Matthew A Fuller
John Burns
Original Assignee
Entegris Inc
Matthew A Fuller
John Burns
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc, Matthew A Fuller, John Burns filed Critical Entegris Inc
Publication of WO2008024388A2 publication Critical patent/WO2008024388A2/en
Publication of WO2008024388A3 publication Critical patent/WO2008024388A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped

Abstract

A substrate container having a set of kinematic coupling grooves defined in the periphery of a horizontally extending skirt portion around the periphery of the container portion. This set of kinematic coupling grooves, being located outside the periphery of the container portion, enables the container to be positioned relatively closer to the Horizontal Datum Plane of wafer processing equipment. This can provide vertical space conservation along with greater stability than provided by the conventional location of kinematic coupling grooves. The container may also include a set of conventionally located kinematic coupling grooves.
PCT/US2007/018550 2006-08-22 2007-08-22 Substrate container with outboard kinematic coupling structure WO2008024388A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US83939706P 2006-08-22 2006-08-22
US60/839,397 2006-08-22

Publications (2)

Publication Number Publication Date
WO2008024388A2 WO2008024388A2 (en) 2008-02-28
WO2008024388A3 true WO2008024388A3 (en) 2008-10-30

Family

ID=39107380

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/018550 WO2008024388A2 (en) 2006-08-22 2007-08-22 Substrate container with outboard kinematic coupling structure

Country Status (2)

Country Link
TW (1) TW200835637A (en)
WO (1) WO2008024388A2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060061979A1 (en) * 2004-09-04 2006-03-23 Applied Materials, Inc. Substrate carrier having reduced height

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060061979A1 (en) * 2004-09-04 2006-03-23 Applied Materials, Inc. Substrate carrier having reduced height

Also Published As

Publication number Publication date
WO2008024388A2 (en) 2008-02-28
TW200835637A (en) 2008-09-01

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