WO2008016421A3 - Mixed-use memory array with different data states and method for use therewith - Google Patents
Mixed-use memory array with different data states and method for use therewith Download PDFInfo
- Publication number
- WO2008016421A3 WO2008016421A3 PCT/US2007/013772 US2007013772W WO2008016421A3 WO 2008016421 A3 WO2008016421 A3 WO 2008016421A3 US 2007013772 W US2007013772 W US 2007013772W WO 2008016421 A3 WO2008016421 A3 WO 2008016421A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- data states
- memory array
- mixed
- different data
- states
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
- G11C17/165—Memory cells which are electrically programmed to cause a change in resistance, e.g. to permit multiple resistance steps to be programmed rather than conduct to or from non-conduct change of fuses and antifuses
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5692—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency read-only digital stores using storage elements with more than two stable states
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/76—Masking faults in memories by using spares or by reconfiguring using address translation or modifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2211/00—Indexing scheme relating to digital stores characterized by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C2211/56—Indexing scheme relating to G11C11/56 and sub-groups for features not covered by these groups
- G11C2211/564—Miscellaneous aspects
- G11C2211/5641—Multilevel memory having cells with different number of storage levels
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2211/00—Indexing scheme relating to digital stores characterized by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C2211/56—Indexing scheme relating to G11C11/56 and sub-groups for features not covered by these groups
- G11C2211/564—Miscellaneous aspects
- G11C2211/5646—Multilevel memory with flag bits, e.g. for showing that a "first page" of a word line is programmed but not a "second page"
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/72—Array wherein the access device being a diode
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
Abstract
A mixed-use memory array with different data states and a method for use therewith are disclosed. In one preferred embodiment, a memory array is provided comprising a plurality of memory cells, each memory cell comprising a memory element comprising a switchable resistance material configurable to one of at least three resistivity states. A first set of memory cells uses X resistivity states to represent X respective data states, and a second set of memory cells uses Y resistivity states to represent Y respective data states, wherein X≠Y.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/497,021 US7486537B2 (en) | 2006-07-31 | 2006-07-31 | Method for using a mixed-use memory array with different data states |
US11/497,021 | 2006-07-31 | ||
US11/496,870 US20080025069A1 (en) | 2006-07-31 | 2006-07-31 | Mixed-use memory array with different data states |
US11/496,870 | 2006-07-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008016421A2 WO2008016421A2 (en) | 2008-02-07 |
WO2008016421A3 true WO2008016421A3 (en) | 2008-05-02 |
Family
ID=38997615
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/013772 WO2008016421A2 (en) | 2006-07-31 | 2007-06-12 | Mixed-use memory array with different data states and method for use therewith |
Country Status (2)
Country | Link |
---|---|
TW (1) | TWI483262B (en) |
WO (1) | WO2008016421A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4719910B2 (en) * | 2008-11-26 | 2011-07-06 | 国立大学法人東北大学 | Manufacturing method of semiconductor device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0788113A1 (en) * | 1996-01-31 | 1997-08-06 | STMicroelectronics S.r.l. | Multilevel memory circuits and corresponding reading and writing methods |
US6483734B1 (en) * | 2001-11-26 | 2002-11-19 | Hewlett Packard Company | Memory device having memory cells capable of four states |
DE102004029939A1 (en) * | 2004-06-21 | 2006-01-12 | Infineon Technologies Ag | Memory cell component with non-volatile memory (NVM) cells with cells distributed in memory sections so configured that cells of a memory section |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6034882A (en) * | 1998-11-16 | 2000-03-07 | Matrix Semiconductor, Inc. | Vertically stacked field programmable nonvolatile memory and method of fabrication |
US6420215B1 (en) * | 2000-04-28 | 2002-07-16 | Matrix Semiconductor, Inc. | Three-dimensional memory array and method of fabrication |
US6768661B2 (en) * | 2002-06-27 | 2004-07-27 | Matrix Semiconductor, Inc. | Multiple-mode memory and method for forming same |
-
2007
- 2007-06-12 WO PCT/US2007/013772 patent/WO2008016421A2/en active Application Filing
- 2007-06-27 TW TW096123303A patent/TWI483262B/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0788113A1 (en) * | 1996-01-31 | 1997-08-06 | STMicroelectronics S.r.l. | Multilevel memory circuits and corresponding reading and writing methods |
US6483734B1 (en) * | 2001-11-26 | 2002-11-19 | Hewlett Packard Company | Memory device having memory cells capable of four states |
DE102004029939A1 (en) * | 2004-06-21 | 2006-01-12 | Infineon Technologies Ag | Memory cell component with non-volatile memory (NVM) cells with cells distributed in memory sections so configured that cells of a memory section |
Non-Patent Citations (1)
Title |
---|
LE K Y ET AL: "Evaluation of SiO2 Antifuse in a 3D-OTP Memory", IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, vol. 4, no. 3, September 2004 (2004-09-01), pages 416 - 421, XP011123442, ISSN: 1530-4388 * |
Also Published As
Publication number | Publication date |
---|---|
TW200818204A (en) | 2008-04-16 |
TWI483262B (en) | 2015-05-01 |
WO2008016421A2 (en) | 2008-02-07 |
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