WO2008009475A3 - Solder flux - Google Patents

Solder flux Download PDF

Info

Publication number
WO2008009475A3
WO2008009475A3 PCT/EP2007/006489 EP2007006489W WO2008009475A3 WO 2008009475 A3 WO2008009475 A3 WO 2008009475A3 EP 2007006489 W EP2007006489 W EP 2007006489W WO 2008009475 A3 WO2008009475 A3 WO 2008009475A3
Authority
WO
WIPO (PCT)
Prior art keywords
soldering
derivatives
solder flux
composition
component
Prior art date
Application number
PCT/EP2007/006489
Other languages
French (fr)
Other versions
WO2008009475A2 (en
Inventor
Frank Timothy Lawrence
Original Assignee
Henkel Loctite Adhesives Ltd
Frank Timothy Lawrence
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from IE2006/0535A external-priority patent/IE85263B1/en
Application filed by Henkel Loctite Adhesives Ltd, Frank Timothy Lawrence filed Critical Henkel Loctite Adhesives Ltd
Publication of WO2008009475A2 publication Critical patent/WO2008009475A2/en
Publication of WO2008009475A3 publication Critical patent/WO2008009475A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A soldering flux composition comprising: a carrier vehicle comprising a solvent; an activator component for activating a metal surface for soldering; a component selected from one or more compounds within the structural formula I, wherein each R is independently selected from C1-C15 alkyl, C6-C15 aryl, C2-C15 alkenyl; C2-C15 alkynyl; C1-C15 alkoxy, or derivatives thereof for example halogenated derivatives thereof. Quadrol is one suitable compound. The composition of the invention provides good through hole fill such as in wave flow soldering processes.
PCT/EP2007/006489 2006-07-20 2007-07-20 Solder flux WO2008009475A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IE2006/0535A IE85263B1 (en) 2006-07-20 Solder flux
IE2006/0535 2006-07-20

Publications (2)

Publication Number Publication Date
WO2008009475A2 WO2008009475A2 (en) 2008-01-24
WO2008009475A3 true WO2008009475A3 (en) 2008-06-12

Family

ID=38957128

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/006489 WO2008009475A2 (en) 2006-07-20 2007-07-20 Solder flux

Country Status (1)

Country Link
WO (1) WO2008009475A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102281988A (en) * 2009-01-27 2011-12-14 荒川化学工业株式会社 Flux composition for lead-free solder, lead-free solder composition, and resin flux cored solder

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009013210A1 (en) 2007-07-23 2009-01-29 Henkel Limited Solder flux
JP6826061B2 (en) * 2018-02-09 2021-02-03 株式会社タムラ製作所 Method for manufacturing solder composition and electronic board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4478650A (en) * 1983-10-19 1984-10-23 At&T Technologies, Inc. Water soluble flux
US5403467A (en) * 1992-01-29 1995-04-04 Bayer Ag Process for through-hole plating of two-layer circuit boards and multilayers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4478650A (en) * 1983-10-19 1984-10-23 At&T Technologies, Inc. Water soluble flux
US5403467A (en) * 1992-01-29 1995-04-04 Bayer Ag Process for through-hole plating of two-layer circuit boards and multilayers

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ANONYMOUS: "Immersible Solder Wave System. November 1977.", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 20, no. 6, 1 November 1977 (1977-11-01), New York, US, pages 2156 - 2157, XP002470270 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102281988A (en) * 2009-01-27 2011-12-14 荒川化学工业株式会社 Flux composition for lead-free solder, lead-free solder composition, and resin flux cored solder

Also Published As

Publication number Publication date
WO2008009475A2 (en) 2008-01-24
IE20060535A1 (en) 2008-02-06

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