WO2008000551A2 - Cooling member - Google Patents

Cooling member Download PDF

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Publication number
WO2008000551A2
WO2008000551A2 PCT/EP2007/054881 EP2007054881W WO2008000551A2 WO 2008000551 A2 WO2008000551 A2 WO 2008000551A2 EP 2007054881 W EP2007054881 W EP 2007054881W WO 2008000551 A2 WO2008000551 A2 WO 2008000551A2
Authority
WO
WIPO (PCT)
Prior art keywords
heat
recess
medium
conducting medium
heat sink
Prior art date
Application number
PCT/EP2007/054881
Other languages
German (de)
French (fr)
Other versions
WO2008000551A3 (en
Inventor
Ian Trevor Williams
Original Assignee
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Publication of WO2008000551A2 publication Critical patent/WO2008000551A2/en
Publication of WO2008000551A3 publication Critical patent/WO2008000551A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • the invention relates to a heat sink for heat dissipation of an electronic assembly.
  • the invention is therefore an object of the invention to provide a heat sink for the dissipation of heat from an electronic assembly, which is efficient, mechanically advantageous executable and inexpensive to implement.
  • the invention is characterized by a heat sink for dissipating heat from an electrical unit, with a thermally conductive base body having a recess, and a heat-conducting medium arranged in the recess, which is connected to the base body in FIG thermally conductive contact is, wherein the heat-conducting medium is formed and arranged so that the electronic assembly protrudes when properly coupled to the heat sink at least partially into the recess and is in heat-conducting contact with the heat-conducting medium.
  • the heat-conducting medium has viscoelastic material.
  • a deformation of a viscoelastic material is zeitab ⁇ pendent. After a discharge, the visco-elastic elongation returns after a certain time to the part of the plastic strain. This means that a viscoelastic material relaxes only incompletely after removal of the external force. The remaining energy is dissipated in the form of flow processes. This makes it possible that the electronic assembly can reach a large contact surface with the heat-conducting medium, since the electronic assembly can dive into the heat-conducting medium and thus reach a large area for the heat transfer from the electronic assembly to the viscoelastic material of the heat ⁇ conductive medium is.
  • the heat-conducting medium has spontaneously elastic material.
  • the deformation of spontaneously elastic materials is time-independent and has an immediate effect on the change of a force acting on the spontaneous elastic material. out of sight. It can be achieved so that the electronic assembly achieved by the spontaneous elastic behavior of the heat-conducting medium secure contact with the heat-conducting medium, since the heat-conducting medium can be pressed against the electronic assembly.
  • the recess is formed as a depression in the base body, that is, the base body is only weakened in the region of the recess, but there may be carried out without a breakthrough.
  • the recess can be provided with a heat-conducting medium made of a material that should not come into contact with the environment. This is especially true if the material of the thermally conductive Medi ⁇ ums in a wider sense could cause contamination of the environment.
  • the heat conductive ⁇ Me dium can be shielded tightly against the environment. This means that even a pasty thermally conductive medium, without causing pollution of the environment, can be arranged in the recess. Since the base body is only weakened in the region of the recess, but has no breakthrough, allows the formation of the recess as Vertie ⁇ tion of the body further high stability of the body.
  • the invention is characterized by a circuit carrier arrangement with a heat sink and at least one electronic component.
  • the circuit carrier arrangement has a carrier plate, which is mechanically coupled to the heat sink and on which the electronic nische component is arranged. It is thus possible to save space to arrange the elekt ⁇ tronic component on the circuit carrier arrangement and directly by means of the heat sink to cow ⁇ len.
  • the single FIGURE is a sectional view of a Heidelbergungsträ ⁇ geranix.
  • the sectional view shown in the figure illustrates the structure of a circuit carrier assembly 10th
  • a circuit carrier 12 is mounted on a base body 14 formed of a thermally conductive material, which is preferably a part of a housing.
  • the circuit carrier 12 has a carrier plate 20 on which on a first component side 22 electronic components 26 are arranged ⁇ .
  • the electronic ⁇ rule components 26, 28 are electrically and mechanically fixedly coupled in a known manner by means of soldering or gluing to the carrier plate twentieth
  • the circuit carrier assembly 10 further comprises a heat sink 30, which comprises the base body 14, which in turn has a recess 18 in which a heat-conducting medium 16 is arranged.
  • the heat-conducting medium 16 is connected to the Base body 14 of the heat sink 30 in heat-conducting contact, so that a heat flow from the heat-conducting medium 16 to the base body 14 may be made.
  • the electronic components 28 on the second component side 24 are in heat-conducting contact with the heat-conducting medium 16. It is thus possible to deliver heat accumulating in the electronic components 28 to the heat-conducting medium 16 and from there to the base body 14 of the heat sink 30. From the main body 14, the heat can then be discharged directly or preferably via not shown heat sink fingers to the environment.
  • the heat-conducting medium 16 is preferably made of a viscoelastic material or has a viscoelastic material
  • the electronic components 28 of the second component side 24, as shown here can dip into the heat-conducting medium 16.
  • a particularly large area of contact between the electronic components 28 of the second component side 24 and the thermally conductive medium 16 may be formed, and thus a particularly good heat transfer from the electronic components 28 of the second component side 24 to the thermally conductive medium 16 reaches ⁇ the.
  • the recess 18 in the base body 14 is formed here as a recess. This is particularly advantageous if that would ⁇ me technicallyde medium 16 consisting of a visco-elastic material. This is then placed in the heat sink 30, without it coming into contact with the environment and this could contaminate it. In addition, can be dispensed with a breakthrough in the base body 14, which allows a high stability of the base body 14.
  • the arrangement of the electronic components 28 on the second component side 24 in the recess 18 no additional space for the electronic components 28 is required. It can be as a high packing density of electronic construction share ⁇ 26, reached 28 on the circuit substrate 12, while still a good heat dissipation from the electronic components 28 are achieved. In addition, the outer dimensions of the circuit carrier assembly 10 can be maintained unchanged.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Disclosed is a cooling member (30) for dissipating heat from an electronic subassembly (12, 28). Said cooling member (30) comprises a heat-conducting base (14) that is provided with a recess (18), and a heat-conducting medium (16) which is disposed in the recess (18) and is in heat-conducting contact with the base (14). The heat-conducting medium (16) is configured and arranged such that the electronic subassembly (12, 28) protrudes at least in part into the recess (18) and is in heat-conducting contact with the heat-conducting medium (16) when the electronic subassembly (12, 28) is properly coupled to the cooling member (30).

Description

Beschreibungdescription
Kühlkörperheatsink
Die Erfindung betrifft einen Kühlkörper zur Wärmeableitung von einer elektronischen Baueinheit.The invention relates to a heat sink for heat dissipation of an electronic assembly.
Bei elektronischen Baueinheiten, wie beispielsweise Schaltungsträgern oder Leiterplatten, besteht immer häufiger die Anforderung eine dichte Packung elektronischer Bauteile auf der elektronischen Baueinheit zu realisieren, um so Platz einsparen zu können. Durch die dichtere Packung der elektronischen Bauelemente kann es jedoch auch zu einer immer größeren Wärmedichte auf der elektronischen Baueinheit kommen. Um die elektronische Baueinheit und die darauf angeordneten e- lektronischen Bauelemente vor einer thermischen Überlastung zu schützen, muss die Wärmeenergie effizient abgeführt wer¬ den .In electronic components, such as circuit boards or printed circuit boards, there is an increasing requirement to realize a dense packing of electronic components on the electronic assembly, so as to be able to save space. Due to the denser packing of the electronic components, however, it can also lead to an ever greater heat density on the electronic assembly. To protect the electronic component and disposed thereon e- lektronischen components against thermal overload, the heat energy must be dissipated efficiently ¬ to.
Der Erfindung liegt demzufolge die Aufgabe zugrunde, einen Kühlkörper zur Ableitung von Wärme von einer elektronischen Baueinheit zu schaffen, die effizient, mechanisch vorteilhaft ausführbar und kostengünstig realisierbar ist.The invention is therefore an object of the invention to provide a heat sink for the dissipation of heat from an electronic assembly, which is efficient, mechanically advantageous executable and inexpensive to implement.
Diese Aufgabe wird gelöst durch die Merkmale des unabhängigen Patentanspruchs. Vorteilhafte Ausgestaltungen der Erfindung sind in den Unteransprüchen gekennzeichnet.This object is solved by the features of the independent claim. Advantageous embodiments of the invention are characterized in the subclaims.
Die Erfindung zeichnet sich gemäß eines ersten Aspekts aus durch einen Kühlkörper zur Wärmeableitung von einer elektrischen Baueinheit, mit einem wärmeleitenden Grundkörper, der eine Ausnehmung aufweist, und einem in der Ausnehmung angeordneten wärmeleitenden Medium, das mit dem Grundkörper in wärmeleitenden Kontakt steht, wobei das wärmeleitende Medium so ausgebildet und angeordnet ist, dass die elektronische Baueinheit bei bestimmungsgemäßer Kopplung mit dem Kühlkörper zumindest teilweise in die Ausnehmung hineinragt und mit dem wärmeleitenden Medium in wärmeleitenden Kontakt ist.According to a first aspect, the invention is characterized by a heat sink for dissipating heat from an electrical unit, with a thermally conductive base body having a recess, and a heat-conducting medium arranged in the recess, which is connected to the base body in FIG thermally conductive contact is, wherein the heat-conducting medium is formed and arranged so that the electronic assembly protrudes when properly coupled to the heat sink at least partially into the recess and is in heat-conducting contact with the heat-conducting medium.
Dies ist besonders vorteilhaft, da durch die wenigstens teil¬ weise Anordnung der elektronischen Baueinheit in der Ausnehmung eine raumsparende Anordnung der elektronischen Baueinheit ermöglicht ist und diese durch die thermische Kopplung mit dem wärmeleitenden Medium direkt gekühlt werden kann.This is particularly advantageous because a space-saving arrangement of the electronic assembly is made possible by the at least partially ¬ arrangement of the electronic assembly in the recess and this can be cooled directly by the thermal coupling with the heat-conducting medium.
In einer besonders bevorzugten Ausführungsform der Erfindung weist das wärmeleitende Medium viskoelastisches Material auf. Eine Verformung eines viskoelastischen Materials ist zeitab¬ hängig. Nach einer Entlastung stellt sich die viskoeleasti- sche Dehnung nach einer bestimmten Zeit auf den Teil der plastischen Dehnung zurück. Dies bedeutet, dass ein viskoelastisches Material nach Entfernen der externen Kraft nur unvollständig relaxiert. Die verbleibende Energie wird in Form von Fließvorgängen abgebaut. Damit ist ermöglicht, dass die elektronische Baueinheit eine große Kontaktfläche mit dem wärmeleitenden Medium erreichen kann, da die elektronische Baueinheit in das wärmeleitende Medium eintauchen kann und so eine große Fläche für den Wärmeübergang von der elektronischen Baueinheit auf das viskoelestische Material des wärme¬ leitenden Mediums erreichbar ist.In a particularly preferred embodiment of the invention, the heat-conducting medium has viscoelastic material. A deformation of a viscoelastic material is zeitab ¬ pendent. After a discharge, the visco-elastic elongation returns after a certain time to the part of the plastic strain. This means that a viscoelastic material relaxes only incompletely after removal of the external force. The remaining energy is dissipated in the form of flow processes. This makes it possible that the electronic assembly can reach a large contact surface with the heat-conducting medium, since the electronic assembly can dive into the heat-conducting medium and thus reach a large area for the heat transfer from the electronic assembly to the viscoelastic material of the heat ¬ conductive medium is.
In einer weiteren besonders bevorzugten Ausführungsform der Erfindung weist das wärmeleitende Medium spontanelastisches Material auf. Die Verformung spontanelastischer Materialien ist zeitunabhängig und wirkt sich nach der Veränderung einer auf das spontanelastische Material einwirkenden Kraft unmit- telbar aus. Es kann so erreicht werden, dass die elektronische Baueinheit durch das spontanelastische Verhalten des wärmeleitenden Mediums einen sicheren Kontakt mit dem wärmeleitenden Medium erreicht, da das wärmeleitende Medium gegen die elektronische Baueinheit gedrückt werden kann.In a further particularly preferred embodiment of the invention, the heat-conducting medium has spontaneously elastic material. The deformation of spontaneously elastic materials is time-independent and has an immediate effect on the change of a force acting on the spontaneous elastic material. out of sight. It can be achieved so that the electronic assembly achieved by the spontaneous elastic behavior of the heat-conducting medium secure contact with the heat-conducting medium, since the heat-conducting medium can be pressed against the electronic assembly.
In einer weiteren besonders bevorzugten Ausführungsform der Erfindung ist die Ausnehmung als Vertiefung im Grundkörper ausgebildet, das heißt, dass der Grundkörper im Bereich der Ausnehmung lediglich geschwächt ist, dort jedoch ohne einen Durchbruch ausgeführt sein kann. Durch die Ausbildung der Ausnehmung als Vertiefung kann die Ausnehmung mit einem wärmeleitenden Medium aus einem Material versehen werden, das nicht in Kontakt mit der Umgebung gelangen soll. Dies gilt insbesondere dann, wenn das Material des wärmeleitenden Medi¬ ums in einem weiteren Sinne eine Kontaminierung der Umgebung bewirken könnte. In der Vertiefung ist das wärmeleitende Me¬ dium dicht gegenüber der Umgebung abschirmbar. Das bedeutet, dass auch ein pastöses wärmeleitendes Medium, ohne dass es zu einer Verschmutzung der Umgebung kommt, in der Ausnehmung angeordnet sein kann. Da der Grundkörper im Bereich der Ausnehmung lediglich geschwächt ist, aber keinen Durchbruch aufweist, ermöglicht die Ausbildung der Ausnehmung als Vertie¬ fung des Grundkörpers weiterhin eine hohe Stabilität des Grundkörpers .In a further particularly preferred embodiment of the invention, the recess is formed as a depression in the base body, that is, the base body is only weakened in the region of the recess, but there may be carried out without a breakthrough. By forming the recess as a recess, the recess can be provided with a heat-conducting medium made of a material that should not come into contact with the environment. This is especially true if the material of the thermally conductive Medi ¬ ums in a wider sense could cause contamination of the environment. In the recess, the heat conductive ¬ Me dium can be shielded tightly against the environment. This means that even a pasty thermally conductive medium, without causing pollution of the environment, can be arranged in the recess. Since the base body is only weakened in the region of the recess, but has no breakthrough, allows the formation of the recess as Vertie ¬ tion of the body further high stability of the body.
Gemäß eines zweiten Aspekts zeichnet sich die Erfindung aus durch eine Schaltungsträgeranordnung mit einem Kühlkörper und mindesten einem elektronischen Bauteil.According to a second aspect, the invention is characterized by a circuit carrier arrangement with a heat sink and at least one electronic component.
In einer bevorzugten Ausführungsform der Erfindung weist die Schaltungsträgeranordnung eine Trägerplatte auf, die mit dem Kühlkörper mechanisch gekoppelt ist und auf der das elektro- nische Bauteil angeordnet ist. Es ist so möglich, das elekt¬ ronische Bauteil auf der Schaltungsträgeranordnung platzsparend anzuordnen und es direkt mittels des Kühlkörpers zu küh¬ len .In a preferred embodiment of the invention, the circuit carrier arrangement has a carrier plate, which is mechanically coupled to the heat sink and on which the electronic nische component is arranged. It is thus possible to save space to arrange the elekt ¬ tronic component on the circuit carrier arrangement and directly by means of the heat sink to cow ¬ len.
Vorteilhafte Ausgestaltungen der Erfindung sind nachfolgend anhand der schematischen Zeichnung näher erläutert.Advantageous embodiments of the invention are explained in more detail below with reference to the schematic drawing.
Es zeigt:It shows:
Die einzige Figur eine Schnittansicht einer Schaltungsträ¬ geranordnung.The single FIGURE is a sectional view of a Schaltungsträ ¬ geranordnung.
Die in der Figur dargestellte Schnittansicht veranschaulicht den Aufbau einer Schaltungsträgeranordnung 10.The sectional view shown in the figure illustrates the structure of a circuit carrier assembly 10th
Ein Schaltungsträger 12 ist auf einem aus einem wärmeleitenden Material gebildeten Grundkörper 14 montiert, der vorzugsweise ein Teil eines Gehäuses ist.A circuit carrier 12 is mounted on a base body 14 formed of a thermally conductive material, which is preferably a part of a housing.
Der Schaltungsträger 12 hat eine Trägerplatte 20, auf der auf einer ersten Bauteilseite 22 elektronische Bauteile 26 ange¬ ordnet sind. Auf einer zweiten Bauteilseite 24, die der ers¬ ten Bauteilseite 22 gegenüberliegend angeordnet ist, sind weitere elektronische Bauteile 28 angeordnet. Die elektroni¬ schen Bauteile 26, 28 sind in bekannter Weise mittels Löten oder Kleben elektrisch und mechanisch fest mit der Trägerplatte 20 gekoppelt.The circuit carrier 12 has a carrier plate 20 on which on a first component side 22 electronic components 26 are arranged ¬ . On a second component side 24, which is arranged opposite the ers ¬ th component side 22, further electronic components 28 are arranged. The electronic ¬ rule components 26, 28 are electrically and mechanically fixedly coupled in a known manner by means of soldering or gluing to the carrier plate twentieth
Die Schaltungsträgeranordnung 10 weist weiter einen Kühlkörper 30 auf, welcher den Grundkörper 14 umfasst, der wiederum eine Ausnehmung 18 aufweist, in der ein wärmeleitendes Medium 16 angeordnet ist. Das wärmeleitende Medium 16 steht mit dem Grundkörper 14 des Kühlkörpers 30 in wärmeleitendem Kontakt, so dass ein Wärmestrom vom wärmeleitenden Medium 16 zum Grundkörper 14 bestehen kann. Die elektronischen Bauteile 28 auf der zweiten Bauteilseite 24 sind in wärmeleitendem Kontakt mit dem wärmeleitenden Medium 16. Es ist so möglich, in den elektronischen Bauteilen 28 anfallende Wärme an das wärmeleitende Medium 16 und von diesem weiter auf den Grundkörper 14 des Kühlkörpers 30 abzugeben. Vom Grundkörper 14 kann die Wärme dann direkt oder vorzugsweise über nicht weiter dargestellte Kühlkörperfinger an die Umgebung abgegeben werden .The circuit carrier assembly 10 further comprises a heat sink 30, which comprises the base body 14, which in turn has a recess 18 in which a heat-conducting medium 16 is arranged. The heat-conducting medium 16 is connected to the Base body 14 of the heat sink 30 in heat-conducting contact, so that a heat flow from the heat-conducting medium 16 to the base body 14 may be made. The electronic components 28 on the second component side 24 are in heat-conducting contact with the heat-conducting medium 16. It is thus possible to deliver heat accumulating in the electronic components 28 to the heat-conducting medium 16 and from there to the base body 14 of the heat sink 30. From the main body 14, the heat can then be discharged directly or preferably via not shown heat sink fingers to the environment.
Wenn das wärmeleitende Medium 16 vorzugsweise aus einem viskoelastischen Material besteht oder ein viskoelastisches Material aufweist, so können die elektronischen Bauteile 28 der zweiten Bauteilseite 24, wie hier dargestellt, in das wärmeleitende Medium 16 eintauchen. In diesem Fall kann eine besonders große Kontaktfläche zwischen den elektronischen Bauteilen 28 der zweiten Bauteilseite 24 und dem wärmeleitenden Medium 16 ausgebildet sein und damit ein besonders guter Wärmeübergang von den elektronischen Bauteilen 28 der zweiten Bauteilseite 24 auf das wärmeleitende Medium 16 erreicht wer¬ den .If the heat-conducting medium 16 is preferably made of a viscoelastic material or has a viscoelastic material, the electronic components 28 of the second component side 24, as shown here, can dip into the heat-conducting medium 16. In this case, a particularly large area of contact between the electronic components 28 of the second component side 24 and the thermally conductive medium 16 may be formed, and thus a particularly good heat transfer from the electronic components 28 of the second component side 24 to the thermally conductive medium 16 reaches ¬ the.
Ist das wärmeleitende Medium 16 aus einem spontanelastischem Material aufgebaut, so kann dadurch ein besonders sicherer Kontakt der elektronischen Bauteile 28 mit dem wärmeleitenden Medium 16 erreicht werden, da die elastischen Kräfte im Mate¬ rial des wärmeleitenden Mediums 16 ein Andrücken des wärmeleitenden Mediums 16 an die elektronischen Bauteile 28 ermög¬ licht. Es kann so eine besonders sichere Wärmeübertragung von den elektronischen Bauteilen 28 auf das wärmeleitende Medium 16 erreicht werden. Die Ausnehmung 18 im Grundkörper 14 ist hier als Vertiefung ausgebildet. Dies ist insbesondere vorteilhaft, wenn das wär¬ meleitende Medium 16 aus viskoelastischem Material besteht. Dieses ist dann im Kühlkörper 30 angeordnet, ohne dass es mit der Umgebung in Kontakt kommen und diese damit kontaminieren könnte. Darüber hinaus kann so auf einen Durchbruch im Grundkörper 14 verzichtet werden, was eine hohe Stabilität des Grundkörpers 14 ermöglicht.Is the heat-conducting medium 16 composed of a spontanelastischem material so characterized a particularly secure contact of the electronic components 28 to the heat-conducting medium can be achieved 16, since the elastic forces in Mate ¬ rial of the thermally conductive medium 16, a pressing of the thermally conductive medium 16 to the electronic components 28 made ¬ light. It is thus possible to achieve a particularly reliable transfer of heat from the electronic components 28 to the heat-conducting medium 16. The recess 18 in the base body 14 is formed here as a recess. This is particularly advantageous if that would ¬ meleitende medium 16 consisting of a visco-elastic material. This is then placed in the heat sink 30, without it coming into contact with the environment and this could contaminate it. In addition, can be dispensed with a breakthrough in the base body 14, which allows a high stability of the base body 14.
Durch die Anordnung der elektronischen Bauteile 28 auf der zweiten Bauteilseite 24 in der Ausnehmung 18 wird kein zusätzlicher Raum für die elektronischen Bauteile 28 benötigt. Es kann so eine hohe Packungsdichte von elektronischen Bau¬ teilen 26, 28 auf dem Schaltungsträger 12 erreicht werden, und dabei dennoch eine gute Wärmeabfuhr von den elektronischen Bauteilen 28 erreicht werden. Darüber hinaus können die äußeren Abmessungen der Schaltungsträgeranordnung 10 unverändert beibehalten werden. The arrangement of the electronic components 28 on the second component side 24 in the recess 18 no additional space for the electronic components 28 is required. It can be as a high packing density of electronic construction share ¬ 26, reached 28 on the circuit substrate 12, while still a good heat dissipation from the electronic components 28 are achieved. In addition, the outer dimensions of the circuit carrier assembly 10 can be maintained unchanged.

Claims

Patentansprüche claims
1. Kühlkörper (30) zur Wärmeableitung von einer elektronische Baueinheit (12,28), mit1. heat sink (30) for heat dissipation of an electronic assembly (12,28), with
- einem wärmeleitenden Grundkörper (14), der eine Ausnehmung (18) aufweist, und- A thermally conductive base body (14) having a recess (18), and
- einem in der Ausnehmung (18) angeordneten wärmeleitenden Medium (16), das mit dem Grundkörper (14) in wärmeleitendem Kontakt steht, wobei das wärmeleitende Medium (16) so ausgebildet und ange¬ ordnet ist, dass die elektronische Baueinheit (12,28) bei be¬ stimmungsgemäßer Kopplung mit dem Kühlkörper (30) mindestens teilweise in die Ausnehmung (18) hineinragt und mit dem wär¬ meleitenden Medium (16) in wärmeleitendem Kontakt ist.- arranged one in the recess (18) thermally conductive medium (16), which communicates with the base body (14) in heat-conducting contact, wherein the thermally conductive medium (16) is constructed and attached ¬ arranged that the electronic assembly (12,28 ) at be ¬-intended coupling (with the heat sink 30) at least partially into the recess (18) protrudes and with the would ¬ meleitenden medium (16) in heat-conducting contact.
2. Kühlkörper (30) nach Anspruch 1, wobei das wärmeleitende Medium (16) viskoelastisches Material aufweist.2. Heatsink (30) according to claim 1, wherein the heat-conducting medium (16) comprises viscoelastic material.
3. Kühlkörper (30) nach Anspruch 1, wobei das wärmeleitende Medium (16) spontanelastisches Material aufweist.3. The heat sink (30) of claim 1, wherein the heat-conducting medium (16) comprises spontaneously elastic material.
4. Kühlkörper (30) nach einem der vorhergehenden Ansprüche, wobei die Ausnehmung (18) als Vertiefung im Grundkörper (14) ausgebildet ist.4. Heatsink (30) according to one of the preceding claims, wherein the recess (18) is formed as a recess in the base body (14).
5. Schaltungsträgeranordnung (10) mit einem Kühlkörper (30) nach einem der vorhergehenden Ansprüche und mindestens einem elektronischen Bauteil (28).5. circuit carrier assembly (10) having a heat sink (30) according to any one of the preceding claims and at least one electronic component (28).
6. Schaltungsträgeranordnung (10) nach Anspruch 5, mit einer Trägerplatte (20), die mit dem Kühlkörper (30) mechanisch gekoppelt ist und auf der das elektronische Bauteil (28) an¬ geordnet ist. 6. circuit carrier assembly (10) according to claim 5, comprising a carrier plate (20) which is mechanically coupled to the heat sink (30) and on which the electronic component (28) is arranged on ¬ .
PCT/EP2007/054881 2006-06-27 2007-05-21 Cooling member WO2008000551A2 (en)

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