WO2007130668A3 - Phase-separated evaporator, blade-thru condenser and heat dissipation system thereof - Google Patents

Phase-separated evaporator, blade-thru condenser and heat dissipation system thereof Download PDF

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Publication number
WO2007130668A3
WO2007130668A3 PCT/US2007/010997 US2007010997W WO2007130668A3 WO 2007130668 A3 WO2007130668 A3 WO 2007130668A3 US 2007010997 W US2007010997 W US 2007010997W WO 2007130668 A3 WO2007130668 A3 WO 2007130668A3
Authority
WO
WIPO (PCT)
Prior art keywords
phase
heat dissipation
condensate
dissipation system
boiler plate
Prior art date
Application number
PCT/US2007/010997
Other languages
French (fr)
Other versions
WO2007130668A2 (en
Inventor
Paul Silverstein
Frederick K Husher
Jee Shum
Original Assignee
Articchoke Entpr Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/494,238 external-priority patent/US7686071B2/en
Application filed by Articchoke Entpr Llc filed Critical Articchoke Entpr Llc
Publication of WO2007130668A2 publication Critical patent/WO2007130668A2/en
Publication of WO2007130668A3 publication Critical patent/WO2007130668A3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/26—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being integral with the element
    • F28F1/28—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being integral with the element the element being built-up from finned sections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2339/00—Details of evaporators; Details of condensers
    • F25B2339/02—Details of evaporators
    • F25B2339/021—Evaporators in which refrigerant is sprayed on a surface to be cooled
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2240/00—Spacing means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2270/00—Thermal insulation; Thermal decoupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)

Abstract

A phase-separated evaporator includes a boiler plate and a phase separation chamber that includes a housing, connected to the boiler plate, having a gas port and a liquid port; and a phase partitioner connected to interiors of the housing, dividing the phase-separated evaporator into a vapor directing compartment and a condensate directing compartment. The phase partitioner includes a partition panel and multiple feeding injectors extending from the partition panel, with the injector tips disposed immediately above the boiler plate. The returning condensate from a condenser enters from the liquid port into the condensate directing compartment and feeds onto the boiler plate through the feeding injectors; while the vapor generated in the vapor directing compartment exits from the gas port, without encountering the condensate. Further disclosed are a high efficiency heat dissipation system utilizing the phase-separated evaporator and a blade-thru condenser, and a computer system utilizing the heat dissipation system.
PCT/US2007/010997 2006-05-06 2007-05-06 Phase-separated evaporator, blade-thru condenser and heat dissipation system thereof WO2007130668A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US79784806P 2006-05-06 2006-05-06
US60/797,848 2006-05-06
US11/494,238 2006-07-27
US11/494,238 US7686071B2 (en) 2005-07-30 2006-07-27 Blade-thru condenser having reeds and heat dissipation system thereof

Publications (2)

Publication Number Publication Date
WO2007130668A2 WO2007130668A2 (en) 2007-11-15
WO2007130668A3 true WO2007130668A3 (en) 2009-01-29

Family

ID=38668386

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/010997 WO2007130668A2 (en) 2006-05-06 2007-05-06 Phase-separated evaporator, blade-thru condenser and heat dissipation system thereof

Country Status (1)

Country Link
WO (1) WO2007130668A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10353445B2 (en) 2016-04-11 2019-07-16 Qualcomm Incorporated Multi-phase heat dissipating device for an electronic device
US10746474B2 (en) 2016-04-11 2020-08-18 Qualcomm Incorporated Multi-phase heat dissipating device comprising piezo structures
US9999157B2 (en) * 2016-08-12 2018-06-12 Qualcomm Incorporated Multi-phase heat dissipating device embedded in an electronic device
US11181323B2 (en) 2019-02-21 2021-11-23 Qualcomm Incorporated Heat-dissipating device with interfacial enhancements

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1940804A (en) * 1930-04-09 1933-12-26 Karmazin Engineering Company Radiator
US2345204A (en) * 1942-04-02 1944-03-28 Mobile Refrigeration Inc Interior chamber insulation
US6498725B2 (en) * 2001-05-01 2002-12-24 Mainstream Engineering Corporation Method and two-phase spray cooling apparatus
US6609560B2 (en) * 2001-04-28 2003-08-26 Samsung Electronics Co., Ltd. Flat evaporator
US20030205363A1 (en) * 2001-11-09 2003-11-06 International Business Machines Corporation Enhanced air cooling of electronic devices using fluid phase change heat transfer
EP1383369A2 (en) * 2002-07-18 2004-01-21 Delphi Technologies, Inc. Thermosiphon for electronics cooling with high performance boiling and condensing surfaces
US6714413B1 (en) * 2002-10-15 2004-03-30 Delphi Technologies, Inc. Compact thermosiphon with enhanced condenser for electronics cooling
US20050217829A1 (en) * 2004-03-31 2005-10-06 Alex Belits Low-profile thermosyphon-based cooling system for computers and other electronic devices

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1940804A (en) * 1930-04-09 1933-12-26 Karmazin Engineering Company Radiator
US2345204A (en) * 1942-04-02 1944-03-28 Mobile Refrigeration Inc Interior chamber insulation
US6609560B2 (en) * 2001-04-28 2003-08-26 Samsung Electronics Co., Ltd. Flat evaporator
US6498725B2 (en) * 2001-05-01 2002-12-24 Mainstream Engineering Corporation Method and two-phase spray cooling apparatus
US20030205363A1 (en) * 2001-11-09 2003-11-06 International Business Machines Corporation Enhanced air cooling of electronic devices using fluid phase change heat transfer
EP1383369A2 (en) * 2002-07-18 2004-01-21 Delphi Technologies, Inc. Thermosiphon for electronics cooling with high performance boiling and condensing surfaces
US6714413B1 (en) * 2002-10-15 2004-03-30 Delphi Technologies, Inc. Compact thermosiphon with enhanced condenser for electronics cooling
US20050217829A1 (en) * 2004-03-31 2005-10-06 Alex Belits Low-profile thermosyphon-based cooling system for computers and other electronic devices

Also Published As

Publication number Publication date
WO2007130668A2 (en) 2007-11-15

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