WO2007130097A3 - Multiplexed optical communication between chips on a multi-chip module - Google Patents

Multiplexed optical communication between chips on a multi-chip module Download PDF

Info

Publication number
WO2007130097A3
WO2007130097A3 PCT/US2006/023279 US2006023279W WO2007130097A3 WO 2007130097 A3 WO2007130097 A3 WO 2007130097A3 US 2006023279 W US2006023279 W US 2006023279W WO 2007130097 A3 WO2007130097 A3 WO 2007130097A3
Authority
WO
WIPO (PCT)
Prior art keywords
chips
multiplexed optical
chip module
optical communication
wavelength multiplexed
Prior art date
Application number
PCT/US2006/023279
Other languages
French (fr)
Other versions
WO2007130097A2 (en
Inventor
Jonathan Gorrell
Mark Davidson
Henry Davis
Original Assignee
Virgin Islands Microsystems
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Virgin Islands Microsystems filed Critical Virgin Islands Microsystems
Priority to EP06784917A priority Critical patent/EP2021845A2/en
Publication of WO2007130097A2 publication Critical patent/WO2007130097A2/en
Publication of WO2007130097A3 publication Critical patent/WO2007130097A3/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J25/00—Transit-time tubes, e.g. klystrons, travelling-wave tubes, magnetrons

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

A multi-chip module includes a plurality of chips; and a wavelength multiplexed optical connector, wherein at least some of the chips are optically interconnected via the wavelength multiplexed connector. Some of the chips have one or more nano-resonant structures constructed and adapted to emit electromagnetic radiation (EMR) in response to excitation by a beam of charged particles; and at least one waveguide conduit constructed and adapted to capture the EMR emitted by the at least one nano-resonant structure. The at least one waveguide conduit of a particular chip optically connects said particular chip to said wavelength multiplexed optical connector.
PCT/US2006/023279 2006-05-05 2006-06-15 Multiplexed optical communication between chips on a multi-chip module WO2007130097A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06784917A EP2021845A2 (en) 2006-05-05 2006-06-15 Multiplexed optical communication between chips on a multi-chip module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/418,126 2006-05-05
US11/418,126 US20070258675A1 (en) 2006-05-05 2006-05-05 Multiplexed optical communication between chips on a multi-chip module

Publications (2)

Publication Number Publication Date
WO2007130097A2 WO2007130097A2 (en) 2007-11-15
WO2007130097A3 true WO2007130097A3 (en) 2009-04-16

Family

ID=38661237

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/023279 WO2007130097A2 (en) 2006-05-05 2006-06-15 Multiplexed optical communication between chips on a multi-chip module

Country Status (4)

Country Link
US (1) US20070258675A1 (en)
EP (1) EP2021845A2 (en)
TW (1) TW200743205A (en)
WO (1) WO2007130097A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7586097B2 (en) 2006-01-05 2009-09-08 Virgin Islands Microsystems, Inc. Switching micro-resonant structures using at least one director
JP4277840B2 (en) * 2005-09-30 2009-06-10 ミツミ電機株式会社 Manufacturing method of optical waveguide device
US7990336B2 (en) 2007-06-19 2011-08-02 Virgin Islands Microsystems, Inc. Microwave coupled excitation of solid state resonant arrays
US7935930B1 (en) * 2009-07-04 2011-05-03 Jonathan Gorrell Coupling energy from a two dimensional array of nano-resonanting structures

Family Cites Families (94)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2634372A (en) * 1953-04-07 Super high-frequency electromag
US1948384A (en) * 1932-01-26 1934-02-20 Research Corp Method and apparatus for the acceleration of ions
US2307086A (en) * 1941-05-07 1943-01-05 Univ Leland Stanford Junior High frequency electrical apparatus
US2397905A (en) * 1944-08-07 1946-04-09 Int Harvester Co Thrust collar construction
US2473477A (en) * 1946-07-24 1949-06-14 Raythcon Mfg Company Magnetic induction device
US2932798A (en) * 1956-01-05 1960-04-12 Research Corp Imparting energy to charged particles
US2944183A (en) * 1957-01-25 1960-07-05 Bell Telephone Labor Inc Internal cavity reflex klystron tuned by a tightly coupled external cavity
US3231779A (en) * 1962-06-25 1966-01-25 Gen Electric Elastic wave responsive apparatus
US4746201A (en) * 1967-03-06 1988-05-24 Gordon Gould Polarizing apparatus employing an optical element inclined at brewster's angle
US3571642A (en) * 1968-01-17 1971-03-23 Ca Atomic Energy Ltd Method and apparatus for interleaved charged particle acceleration
US3586899A (en) * 1968-06-12 1971-06-22 Ibm Apparatus using smith-purcell effect for frequency modulation and beam deflection
US3886399A (en) * 1973-08-20 1975-05-27 Varian Associates Electron beam electrical power transmission system
US4829527A (en) * 1984-04-23 1989-05-09 The United States Of America As Represented By The Secretary Of The Army Wideband electronic frequency tuning for orotrons
FR2564646B1 (en) * 1984-05-21 1986-09-26 Centre Nat Rech Scient IMPROVED FREE ELECTRON LASER
US4727550A (en) * 1985-09-19 1988-02-23 Chang David B Radiation source
US4806859A (en) * 1987-01-27 1989-02-21 Ford Motor Company Resonant vibrating structures with driving sensing means for noncontacting position and pick up sensing
US4838021A (en) * 1987-12-11 1989-06-13 Hughes Aircraft Company Electrostatic ion thruster with improved thrust modulation
US5185073A (en) * 1988-06-21 1993-02-09 International Business Machines Corporation Method of fabricating nendritic materials
US5023563A (en) * 1989-06-08 1991-06-11 Hughes Aircraft Company Upshifted free electron laser amplifier
US5113141A (en) * 1990-07-18 1992-05-12 Science Applications International Corporation Four-fingers RFQ linac structure
US5128729A (en) * 1990-11-13 1992-07-07 Motorola, Inc. Complex opto-isolator with improved stand-off voltage stability
US5302240A (en) * 1991-01-22 1994-04-12 Kabushiki Kaisha Toshiba Method of manufacturing semiconductor device
US5199918A (en) * 1991-11-07 1993-04-06 Microelectronics And Computer Technology Corporation Method of forming field emitter device with diamond emission tips
US5562838A (en) * 1993-03-29 1996-10-08 Martin Marietta Corporation Optical light pipe and microwave waveguide interconnects in multichip modules formed using adaptive lithography
US5608263A (en) * 1994-09-06 1997-03-04 The Regents Of The University Of Michigan Micromachined self packaged circuits for high-frequency applications
US5705443A (en) * 1995-05-30 1998-01-06 Advanced Technology Materials, Inc. Etching method for refractory materials
JP3487699B2 (en) * 1995-11-08 2004-01-19 株式会社日立製作所 Ultrasonic treatment method and apparatus
US5889449A (en) * 1995-12-07 1999-03-30 Space Systems/Loral, Inc. Electromagnetic transmission line elements having a boundary between materials of high and low dielectric constants
KR100226752B1 (en) * 1996-08-26 1999-10-15 구본준 Method for forming multi-metal interconnection layer of semiconductor device
AU4896297A (en) * 1996-10-18 1998-05-15 Microwave Technologies Inc. Rotating-wave electron beam accelerator
US5744919A (en) * 1996-12-12 1998-04-28 Mishin; Andrey V. CW particle accelerator with low particle injection velocity
US5757009A (en) * 1996-12-27 1998-05-26 Northrop Grumman Corporation Charged particle beam expander
JPH10200204A (en) * 1997-01-06 1998-07-31 Fuji Xerox Co Ltd Surface-emitting semiconductor laser, manufacturing method thereof, and surface-emitting semiconductor laser array using the same
JP4209471B2 (en) * 1997-02-20 2009-01-14 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア Plasmon resonant particles, methods, and apparatus
US7796720B1 (en) * 1997-06-19 2010-09-14 European Organization For Nuclear Research Neutron-driven element transmuter
US6040625A (en) * 1997-09-25 2000-03-21 I/O Sensors, Inc. Sensor package arrangement
JP2981543B2 (en) * 1997-10-27 1999-11-22 金沢大学長 Electron tube type one-way optical amplifier
US6143476A (en) * 1997-12-12 2000-11-07 Applied Materials Inc Method for high temperature etching of patterned layers using an organic mask stack
DE69839763D1 (en) * 1997-12-15 2008-09-04 Kazuo Sato OPTICAL WAVE SEPARATE AND THEIR MANUFACTURING PROCESS
US6338968B1 (en) * 1998-02-02 2002-01-15 Signature Bioscience, Inc. Method and apparatus for detecting molecular binding events
EP0969493A1 (en) * 1998-07-03 2000-01-05 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Apparatus and method for examining specimen with a charged particle beam
US6577040B2 (en) * 1999-01-14 2003-06-10 The Regents Of The University Of Michigan Method and apparatus for generating a signal having at least one desired output frequency utilizing a bank of vibrating micromechanical devices
ATE288630T1 (en) * 1999-05-25 2005-02-15 Nawotec Gmbh MINIATURIZED TERAHERTZ RADIATION SOURCE
TW408496B (en) * 1999-06-21 2000-10-11 United Microelectronics Corp The structure of image sensor
US6384406B1 (en) * 1999-08-05 2002-05-07 Microvision, Inc. Active tuning of a torsional resonant structure
US6870438B1 (en) * 1999-11-10 2005-03-22 Kyocera Corporation Multi-layered wiring board for slot coupling a transmission line to a waveguide
US6593539B1 (en) * 2000-02-25 2003-07-15 George Miley Apparatus and methods for controlling charged particles
US7064500B2 (en) * 2000-05-26 2006-06-20 Exaconnect Corp. Semi-conductor interconnect using free space electron switch
US6407516B1 (en) * 2000-05-26 2002-06-18 Exaconnect Inc. Free space electron switch
US6545425B2 (en) * 2000-05-26 2003-04-08 Exaconnect Corp. Use of a free space electron switch in a telecommunications network
US6373194B1 (en) * 2000-06-01 2002-04-16 Raytheon Company Optical magnetron for high efficiency production of optical radiation
US7257327B2 (en) * 2000-06-01 2007-08-14 Raytheon Company Wireless communication system with high efficiency/high power optical source
US6972421B2 (en) * 2000-06-09 2005-12-06 Cymer, Inc. Extreme ultraviolet light source
WO2001096936A1 (en) * 2000-06-15 2001-12-20 California Institute Of Technology Direct electrical-to-optical conversion and light modulation in micro whispering-gallery-mode resonators
US7049585B2 (en) * 2000-07-27 2006-05-23 Ebara Corporation Sheet beam-type testing apparatus
WO2002020390A2 (en) * 2000-09-08 2002-03-14 Ball Ronald H Illumination system for escalator handrails
JP3762208B2 (en) * 2000-09-29 2006-04-05 株式会社東芝 Optical wiring board manufacturing method
US6777244B2 (en) * 2000-12-06 2004-08-17 Hrl Laboratories, Llc Compact sensor using microcavity structures
US20020071457A1 (en) * 2000-12-08 2002-06-13 Hogan Josh N. Pulsed non-linear resonant cavity
US7022988B2 (en) * 2001-02-28 2006-04-04 Hitachi, Ltd. Method and apparatus for measuring physical properties of micro region
US7010183B2 (en) * 2002-03-20 2006-03-07 The Regents Of The University Of Colorado Surface plasmon devices
US7177515B2 (en) * 2002-03-20 2007-02-13 The Regents Of The University Of Colorado Surface plasmon devices
US6525477B2 (en) * 2001-05-29 2003-02-25 Raytheon Company Optical magnetron generator
US20030012925A1 (en) * 2001-07-16 2003-01-16 Motorola, Inc. Process for fabricating semiconductor structures and devices utilizing the formation of a compliant substrate for materials used to form the same and including an etch stop layer used for back side processing
DE50111853D1 (en) * 2001-07-17 2007-02-22 Cit Alcatel Monitoring unit for optical burst signals
US20030034535A1 (en) * 2001-08-15 2003-02-20 Motorola, Inc. Mems devices suitable for integration with chip having integrated silicon and compound semiconductor devices, and methods for fabricating such devices
US7248297B2 (en) * 2001-11-30 2007-07-24 The Board Of Trustees Of The Leland Stanford Junior University Integrated color pixel (ICP)
US20050023145A1 (en) * 2003-05-07 2005-02-03 Microfabrica Inc. Methods and apparatus for forming multi-layer structures using adhered masks
US6635949B2 (en) * 2002-01-04 2003-10-21 Intersil Americas Inc. Symmetric inducting device for an integrated circuit having a ground shield
US6738176B2 (en) * 2002-04-30 2004-05-18 Mario Rabinowitz Dynamic multi-wavelength switching ensemble
JP2003331774A (en) * 2002-05-16 2003-11-21 Toshiba Corp Electron beam equipment and device manufacturing method using the equipment
JP2004014943A (en) * 2002-06-10 2004-01-15 Sony Corp Multibeam semiconductor laser, semiconductor light emitting device, and semiconductor device
US6841795B2 (en) * 2002-10-25 2005-01-11 The University Of Connecticut Semiconductor devices employing at least one modulation doped quantum well structure and one or more etch stop layers for accurate contact formation
US6922118B2 (en) * 2002-11-01 2005-07-26 Hrl Laboratories, Llc Micro electrical mechanical system (MEMS) tuning using focused ion beams
JP2004158970A (en) * 2002-11-05 2004-06-03 Ube Ind Ltd Band filter employing thin film piezoelectric resonator
CN101114694A (en) * 2002-11-26 2008-01-30 株式会社东芝 Magnetic cell and magnetic memory
JP2004191392A (en) * 2002-12-06 2004-07-08 Seiko Epson Corp Wavelength multiple intra-chip optical interconnection circuit, electro-optical device and electronic appliance
US7138629B2 (en) * 2003-04-22 2006-11-21 Ebara Corporation Testing apparatus using charged particles and device manufacturing method using the testing apparatus
US7279686B2 (en) * 2003-07-08 2007-10-09 Biomed Solutions, Llc Integrated sub-nanometer-scale electron beam systems
US7141800B2 (en) * 2003-07-11 2006-11-28 Charles E. Bryson, III Non-dispersive charged particle energy analyzer
US20050067286A1 (en) * 2003-09-26 2005-03-31 The University Of Cincinnati Microfabricated structures and processes for manufacturing same
US7042982B2 (en) * 2003-11-19 2006-05-09 Lucent Technologies Inc. Focusable and steerable micro-miniature x-ray apparatus
US7294834B2 (en) * 2004-06-16 2007-11-13 National University Of Singapore Scanning electron microscope
US7155107B2 (en) * 2004-06-18 2006-12-26 Southwest Research Institute System and method for detection of fiber optic cable using static and induced charge
US20060062258A1 (en) * 2004-07-02 2006-03-23 Vanderbilt University Smith-Purcell free electron laser and method of operating same
US20060020667A1 (en) * 2004-07-22 2006-01-26 Taiwan Semiconductor Manufacturing Company, Ltd. Electronic mail system and method for multi-geographical domains
US7375631B2 (en) * 2004-07-26 2008-05-20 Lenovo (Singapore) Pte. Ltd. Enabling and disabling a wireless RFID portable transponder
US20060035173A1 (en) * 2004-08-13 2006-02-16 Mark Davidson Patterning thin metal films by dry reactive ion etching
US7626179B2 (en) * 2005-09-30 2009-12-01 Virgin Island Microsystems, Inc. Electron beam induced resonance
KR100623477B1 (en) * 2004-08-25 2006-09-19 한국정보통신대학교 산학협력단 Optical printed circuit boards and optical interconnection blocks using optical fiber bundles
US7508576B2 (en) * 2005-01-20 2009-03-24 Intel Corporation Digital signal regeneration, reshaping and wavelength conversion using an optical bistable silicon raman laser
EP1964159A4 (en) * 2005-06-30 2017-09-27 L. Pierre De Rochemont Electrical components and method of manufacture
US20070013765A1 (en) * 2005-07-18 2007-01-18 Eastman Kodak Company Flexible organic laser printer
US8425858B2 (en) * 2005-10-14 2013-04-23 Morpho Detection, Inc. Detection apparatus and associated method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
No relevant documents disclosed *

Also Published As

Publication number Publication date
TW200743205A (en) 2007-11-16
WO2007130097A2 (en) 2007-11-15
US20070258675A1 (en) 2007-11-08
EP2021845A2 (en) 2009-02-11

Similar Documents

Publication Publication Date Title
WO2007130094A3 (en) Inter-chip optical communication
CN206920661U (en) High Speeding Optical Transmitter-receiver Circuit
TWI511477B (en) Optical transceiver apparatus
WO2010008218A3 (en) Optical communication module for optical wavelength division multiplexing
WO2008000244A3 (en) Optoelectronic component and illumination device
EP1215783A3 (en) Semiconductor laser module, manufacturing method thereof and optical amplifier
WO2006091741A3 (en) Edge viewing photodetector
TW200746571A (en) Opto-electronic semiconductor device
WO2005072224A3 (en) Integrated photonic devices
WO2009063986A1 (en) Optical circuit and optical signal processing device using the same
WO2007130097A3 (en) Multiplexed optical communication between chips on a multi-chip module
WO2006107490A3 (en) Optical systems utilizing optical fibers transmitting high power signal and a method of operating such systems
EP1601070A3 (en) Wavelength stabilized laser
WO2020135163A1 (en) Communication terminal, communication device and communication system based on free-space optical communication
CN106054329A (en) Optical transceiver
CN104049323B (en) Optical module
CN202794614U (en) Multi-channel optical component and parallel optical module provided with light emission power monitoring function
WO2012017319A3 (en) Optical coupling system
WO2012005012A3 (en) Optical interconnection system
WO2004051327A3 (en) Optical via for three dimensional interconnection
US20240302605A1 (en) Systems using microled-based interconnects
CN100485512C (en) High-performance free space fibre-optical amplifier module
TW200741246A (en) Illumination system and projection apparatus
WO2008011383A3 (en) Compact multicolor light beam source
WO2008124313A3 (en) Optical systems for external cavity frequency upconverting laser arrays

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 06784917

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2006784917

Country of ref document: EP