WO2007119972A1

WO2007119972A1 - Permanent anti-static polyoxymethylene resin composition

Info

Publication number: WO2007119972A1
Application number: PCT/KR2007/001800
Authority: WO
Inventors: Tak-Kyu Kim; Chung-Ryol Jeong; Sang-Eun Lee
Original assignee: Korea Engineering Plastics Co., Ltd.
Priority date: 2006-04-13
Filing date: 2007-04-13
Publication date: 2007-10-25
Also published as: TW200745252A; KR20070102052A

Abstract

There is provided a permanent anti-static polyoxymethylene resin composition including from about 50-90.0 percent by weight of polyoxymethylene; and from about 10.0 to 50.0 percent by weight of polyetheresteramide including polyether and polyamide blocks being linearly bonded with ester linkages and having a theoretical amide: ester ratio between 0.5: 1 and 25: 1 with the polyether blocks including about 10 to 75 percent by weight of the polyetheresteramide composition.

Description

PERMANENT ANTI-STATIC POLYOXYMETHYLENE RESIN

COMPOSITION

Technical Field

[1] The present invention relates to polyoxymethylene resins with a permanent antistatic function, and more particularly, to a permanent anti-static agent maintaining a peculiar abrasion resistance of polyoxymethylene and providing a permanent antistatic function and a polyoxymethylene resin including the permanent anti-static agent.

[2]

Background Art

[3] Recently, sizes of electrical and electronic engineering markets have been increased and technologies in the field of electrical and electronic engineering have been improved. Particularly, a production yield improvement of producing LCDs and semiconductors has been gradually considered as very important. In a procedure of manufacturing LCDs and semiconductors, static, electric sparks, and dust pollution cause a decrease of the production yield and an occurrence of defects of products.

[4]

[5] Generally, due to a high surface resistivity, a plastic is widely used as an insulating material for electric-electronic parts. However, the high surface resistivity is not free from static, electric sparks, and dust pollution. Accordingly, materials having an antistatic function are used for preventing malfunctions of circuits and pollution of electronic parts, caused by the static, electric sparks, and dust pollution.

[6]

[7] In general, to obtain the anti-static function, surfactants, conductive carbon blacks, and metal meshes are used for reducing the surface resistivity. However, though resin compositions with desired surface resistivities may be manufactured by adding one of conductive carbon blacks and metal meshes, secondary pollutants may be generated by an occurrence of abrasion due to usage of the resin composition.

[8]

[9] Also, a method of using surfactants, in which surfactants move to a surface of plastic and are bonded with moisture in the air, thereby providing an anti-static function, may cause deterioration of the anti-static function due to peripheral environments and a period of using surfactants. Particularly, due to continuous moving of surfactants toward the surface of the plastic, the longer the period of using surfactants, the more deteriorated the anti-static function. [11] To solve the problems, methods of giving a permanent anti- static function by using polyamide elastomers are disclosed in Korean Patent No. 0300273 and U.S. Patent No. 5986041, respectively. Therefore, several plastic resins with the permanent anti-static function are used. Due to secondary contaminations caused by abrasion of plastic, resins with an excellent abrasion resistance, such as polyacetal and polyetheretherketone (PEEK), are provided for components requiring excellent abrasion resistance. However, there is a restriction on using the PEEK, due to a high price. Since permanent anti-static agents manufactured from the Patents have low compatibility with polyacetals, formaldehydes are severely emitted at a level of weight percent of the permanent anti-static agent, for obtaining a desired anti-static function. Therefore, injection molding is impossible.

[12]

Disclosure of Invention Technical Problem

[13] An aspect of the present invention provides a polyoxymethylene resin composition including a permanent anti-static agent having compatibility with polyoxymethylene, maintaining a peculiar abrasion resistance of the polyoxymethylene, and giving a permanent anti-static function to the polyoxymethylene.

[14]

Technical Solution

[15] According to an aspect of the present invention, there is provided a permanent antistatic polyoxymethylene resin composition including: from about 50-90.0 percent by weight of polyoxymethylene; and from about 10.0 to 50.0 percent by weight of polyetheresteramide including polyether blocks derived from a polyalkylene glycol of the formula

[16]

[17] wherein R is one of hydrogen and an alkyl group containing from 1 to 4 carbon atoms, x is an integer from 0 to about 8 and y is a large whole number such that a molecular weight of the polyether block is between 300 and 10,000 and polyamide blocks of the molecular weight up to about 10,000 obtained by a reaction of a dimmer acid obtained by a polymerization of an ethylenically unsaturated C to C mono- carboxylic acid with a diamine selected from a group consisting of alkyl diamines containing from 2 to 54 carbon atoms, aryl diamines, alicyclic diamines wherein a ring system contains 4 to 8 carbon atoms and is substitutable with at least one alkyl groups containing 1 to 8 carbon atoms, and heterocyclic diamines selected from a group consisting of piperazine and 2,5-dimethyl piperazine, the polyamide blocks corresponding to the formula

[18]

HOOC-B- OH

[19] wherein R is one of hydrogen ad an alkyl radical containing from 1 to 18 carbon atoms, B is a radical derived from dimmer acid and containing from 30 to about 50 carbon atoms, A is a radical derived from the diamine, and z is an integer from about 1 to about 20, the polyether and polyamide blocks being linearly bonded with ester linkages and having a theoretical amide: ester ratio between 0.5: 1 and 25: 1 with the polyether blocks including about 10 to 75 percent by weight of the polyetheresteramide composition.

[20]

Brief Description of the Drawings

[21] FIG. 1 is a perspective view illustrating an injection-molded sample for measuring a nonabrasive amount in an example. [22]

Best Mode for Carrying Out the Invention

[23] According to an aspect of the present invention, there is provided a permanent antistatic polyoxymethylene resin composition including: about 50-90.0 percent by weight of polyoxymethylene; and about 10.0 to 50.0 percent by weight of polyetheresteramide including polyether blocks derived from a polyalkylene glycol of the formula

[24]

[25] [26] wherein R is one of hydrogen and an alkyl group containing from 1 to 4 carbon atoms, x is an integer from 0 to about 8 and y is a large whole number such that a molecular weight of the polyether block is between 300 and 10,000 and polyamide blocks of the molecular weight up to about 10,000 obtained by a reaction of a dimmer acid obtained by a polymerization of an ethylenically unsaturated C to C mono- carboxylic acid with a diamine selected from a group consisting of alkyl diamines containing from 2 to 54 carbon atoms, aryl diamines, alicyclic diamines wherein a ring system contains 4 to 8 carbon atoms and is substitutable with at least one alkyl groups containing 1 to 8 carbon atoms, and heterocyclic diamines selected from a group consisting of piperazine and 2,5-dimethyl piperazine, the polyamide blocks corresponding to the formula [27]

[28] wherein R is one of hydrogen ad an alkyl radical containing from 1 to 18 carbon atoms, B is a radical derived from dimmer acid and containing from 30 to about 50 carbon atoms, A is a radical derived from the diamine, and z is an integer from about 1 to about 20, the polyether and polyamide blocks being linearly bonded with ester linkages and having a theoretical amide: ester ratio between 0.5: 1 and 25: 1 with the polyether blocks including about 10 to 75 percent by weight of the polyetheresteramide composition.

[29]

Mode for the Invention

[30] Hereinafter, the present invention will be described in detail.

[31] A permanent anti-static polyoxymethylene resin composition includes a poly- oxymethylene resin and a polyetheresteramide resin.

[32] The polyoxymethylene resin is one of a homopolymer of an oxymethylene repeat unit of Formula 1 and a oxymethylene copolymer in which the unit of Formula 1 and a unit of Formula 2 are randomly bonded with each other,

[33]

-(-CH2O-)-

... Formula (1) [34]

- [-(CXiXs)XO-]-

... Formula (2), [35] wherein each of X and X is one of hydrogen, an alkyl group, and an aryl group, the X and X corresponding to one of a case of being identical with each other and a case of being different from each other, at least one of the X and X is not the hydrogen, and x is an integer from about 2 to about 6. An average molecular weight of the polyoxymethylene resin according to an exemplary embodiment of the present invention may be from about 10,000 to about 200,000.

[36]

[37] The oxymethylene homopolymer may be manufactured by polymerizing one of formaldehyde and an annular oligomer of the formaldehyde, namely, trioxane. The oxymethylene copolymer in which the unit of Formula 1 and the unit of Formula 2 are bonded with each other may be obtained by randomly polymerizing one of formaldehyde and an annular oligomer of the formaldehyde with one of an annular ether compound of Formula 3 and an annular formal compound of Formula 4.

[38]

[39]

... Formula (4) [40] wherein X , X , X , and X are one of hydrogen and an alkyl group, the X , X , X ,

3 4 5 6 3 4 5 and X corresponding to one of a case of being identical with each other and a case of

6 being different from each other, may be bonded with one of an identical carbon atom and different carbon atom, and n and m are integers from about 2 to about 6, respectively.

[41]

[42] In comonomers used for the random copolymerization, there are ethylene oxide, propylene oxide, butylene oxide, and phenylene oxide as the annular ether compounds and 1,3-dioxolane, diethylene glycol formal, 1,3-propandiol formal, 1,4- butandiol formal, 1,3-dioxepan formal, and 1,3,6-trioxocane as the annular formal compounds. The comonomers may be at least one selected from a comonomer group consisting of ethylene oxide, 1,3-dioxolane, and 1,4 butandiol formal. Oxymethylene copolymers with a melting point more than 15O⁰C and having more than two bond carbon atoms in a main-chain may be obtained by randomly polymerizing the comonomers with one of the trioxane and the formaldehyde, which is a main comonomer, under an atmosphere of Lewis acid catalyst.

[43]

[44] The oxymethylene copolymer is provided with a molar ratio of an oxymethylene bonding structure to the oxymethylene repeat unit is from 0.05 to 50, particularly, from 0.1 to 20.

[45] There are BF 3 -H 2 , BF3 -Et 2 , BF3 -Bu 2 , BF3 -CH3 CO2 H, BF3 -F3 HF, and PF 3 -

10-hydroxyacetphenol as a polymerization catalyst used for polymerization of the oxymethylene polymer. In this case, Et indicates an ethyl group and Bu indicates a butyl group. Particularly, BF -Et and BF -Bu may be used. An amount of the polymerization catalyst may be within a range from 2x10 to 2x10 with respect to one trioxane mole.

[46]

[47] The polymerization may be performed in the form of one of bulk polymerization, suspension polymerization, and solution polymerization. A reaction temperature may be from 0 to 100⁰C, particularly, from 20 to 8O⁰C.

[48] On the other hand, there are third amines such as triethylamine, sulfur compounds such as thiophene, phosphorus compounds such as triphenylphosphine, and alkylated melamine compounds, which are Lewis bases having a Lewis electron pair having a lone electron pair and form catalysts and complex salt, as an agent forcing catalysts residual after the polymerization, to be inactive.

[49]

[50] Also, during the polymerization of the polyoxymethylene, one of alkylated phenol and ethers may be as a chain transferring agent. Particularly, alkylethers such as dimethoxymethane may be used as the chain transferring agent.

[51] One of homopolymer and copolymer of polyoxymethylene with an average molecular weight from about 10,000 to 200,000 melted at more than approximately 16O⁰C with a degree of crystallinity if from about 65 to 85% is the most desired compound according to an exemplary embodiment of the present invention.

[52]

[53] In the present invention, contents of the polyoxymethylene resin may be from about 50.0 to 90.0 percent by weight. When more than 90.0 percent by weight, it is impossible to obtain an anti-static function of a desired level. When less than 50.0 percent by weight, not only there is no more effect of an additional increase of the antistatic function but also properties of polyoxymethylene resins are deteriorated.

[54] To obtain a permanent anti-static function of the polyoxymethylene resin, the polyoxymethylene resin composition according to an exemplary embodiment of the present invention employs polyetheresteramide resins as a permanent anti-static agent.

[55] The polyetheresteramide resins may be formed by linearly bonding polyether blocks and poly amide blocks by ester linkages.

[56] The polyether blocks may be derived from a polyalkylene glycol of the formula

[57]

[58] wherein R is one of hydrogen and an alkyl group containing from 1 to 4 carbon atoms, x is an integer from 0 to about 8 and y is a large whole number such that a molecular weight of the polyether block is between 300 and 10,000.

[59]

[60] The polyamide blocks may correspond to the formula

[61]

[62] wherein R is one of hydrogen ad an alkyl radical containing from 1 to 18 carbon atoms, B is a radical derived from dimmer acid and containing from 30 to about 50 carbon atoms, A is a radical derived from the diamine, and z is an integer from about 1 to about 20.

[63]

[64] The radical derived from the diamine may be selected from a group consisting of alkyl diamines containing from 2 to 54 carbon atoms, aryl diamines, alicyclic diamines wherein a ring system contains 4 to 8 carbon atoms and is substitutable with at least one alkyl groups containing 1 to 8 carbon atoms, and heterocyclic diamines selected from a group consisting of piperazine and 2,5-dimethyl piperazine.

[65] Terminal hydroxyl groups existing in the poly alkylene glycol is reacted with a carboxyl group of the polyamide blocks to be linearly bonded with ester linkages, thereby forming the polyetheresteramide that is a block copolymer. [66]

[67] In this case, the polyether block may be from about 10 to 75 percent by weight of the copolymer and from about 10.0 to 50.0 percent by weight of polyetheresteramide composition may be provided with a theoretical amide: ester ratio between 0.5: 1 and 25: 1.

[68] The polyetheresteramide, the permanent anti-static agent, includes from about 10.0 to 50.0 percent by weight of the polyoxymethylene resin composition. When including less than 10.0 percent, it is impossible to obtain the anti-static function of a desired level. When including more than 50.0 percent, not only there is no more effect of an additional increase of the anti- static function but also properties of polyoxymethylene resins are deteriorated.

[69]

[70] The polyoxymethylene resin composition may further include additional such as a heat-stabilizer and an antioxidant.

[71] Though there is no particular restriction on antioxidants capable of being used for the polyoxymethylene resin composition, there are hindered phenolic compounds, for instance, 2,2'-methylenebis(4-methyl-6-tert-butylphenol), hexamethylene glycol- bis(3,5-di-t-butyl-4-hydroxyhydrocinnamate), tetrakis[methylene(3,5-di-t-butyl-4-hydroxyhydrocinnamate)]methane, Methylene glycol-bis-3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionate, l,3,5-Trimethyl-2,4,6- tris(3,5-di-tert-butyl-4-hydroxybenzyl)benzene, n-octadecyl-3(4-hydroxy-3', 5'-di-t-butylphenyl)propionate, 4,4'-methylenebis(2,6-di-t-butylphenol), 4,4'-butylidene-bis(6-t-butyl-3-methyl-phenol), di-stearyl 3,5-di-t-butyl-4-hydroxybenzyl-phosphonate,

2-t-butyl-6-(3-t-butyl-5-methyl-2-hydroxybenzyl)-4-methylphenyl acrylate, 3,9-bis-(2-(3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionyloxy)-l,l-dimethylethyl) 2,4,8, 10-tetraoxaspiro(5,5)undecane and hindered amino compounds, for instance, 4-acetoxy-2,2,6,6-tetramethylpiperidine, 4-stearoyloxy-2,2,6,6-tetramethyl piperidine, 4-acryloyloxy-2,2,6,6-tetramethyl piperidine, 4-methoxy-2,2,6,6-tetramethyl piperidine, 4-benzoyloxy-2,2,6,6-tetramethyl piperidine, 4-cyclohexyloxy-2,2,6,6-tetramethyl piperidine, 4-phenoxy-2,2,6,6-tetramethyl piperidine, 4-benzyloxy-2,2,6,6-tetramethyl piperidine, 4-(phenylcarbamoyoxy)-2,2,6,6-tetramethyl piperidine, bis(2,2,6,6-tetramethyl-4-piperidyl)oxalate, bis(2,2,6,6-tetramethyl-4-piperidyl)malonate, bis(2,2,6,6-tetramethyl-4-piperidyl)adipate, bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, bis(l,2,2,6,6-pentamethylpiperidyl)sebacate, bis(2,2,6,6-tetramethyl-4-piperidyl)terephthalate, l,2-bis(2,2,6,6-tetramethyl-4-piperidyloxy)ethane, bis(2,2,6,6-tetramethyl-4-piperidyl)hexamethylene-l,6-dicarbamate, bis(l-methyl-2,2,6,6-tetramethyl-4-piperidyl)adipate, or tris(2,2,6,6-tetramethyl-4-piperidyl)benzene-l,3,5-tricarboxylate. The antioxidant may be selected from a group consisting of triethylene glycol- bis-3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionate, l,6-hexane-diol-bis-3-(3,5-di-t-butyl-4-hydroxy-phenyl) propionate, and tetrakis [methylene (3,5-di-t-butyl-4-hydroxy-hydrocinnamate)]methane. Particularly, triethylene glycol-bis-3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionate is most suitable.

[72] Also, an antioxidant content corresponds to from about 0.01 to 1.0 percent by weight based on a sum of the polyoxymethylene resin and the polyetheresteramide resin, and more particularly, may be from about 0.1 to 0.5 percent by weight.

[73]

[74] Also, the heat stabilizer reacts with formaldehyde and increases heat stability of the polyoxymethylene polymers. Though there is no restriction on the heat stabilizer, the heat stabilizer may be selected from a group consisting of nitrogen compounds, for instance, 6-phenyl- 1 ,3,5-triazine-2,4(benzoguanamine),

2,4,6-triamino- 1 ,3,5-triazine(melamine), carbonyldiamide(urea), dicyandiamide, isophthalic dihydrazide (hydrazine) and alcohols, for instance, poly ethylenegly col, ethylene-vinylalcohol copolymer, sorbitol, sorbitan, etc. Particularly, 2,4, 6-Triamino-l,3,5-triazine and 1,12-dodecan dicarboxylic acid dihydrazide may be more suitable for the heat stabilizer.

[75]

[76] A heat stabilizer content corresponds to from about 0.01 to 1.0 percent by weight with respect to 100 percent by weight of the polyoxymethylene resin and the polyetheresteramide resin, and more particularly, may be from about 0.1 to 0.5 percent by weight.

[77] The permanent anti-static polyoxymethylene resin composition may be used in fields where the anti-static function is required, in detail, electrical-electronic fields, particularly, plastic parts used for lines for producing LCDs and semiconductors.

[78]

[79] Examples

[80] Hereinafter, though the present invention will be described in detail with reference to following examples, the present invention will not be limited the examples.

[81] In the example, polyoxymethylene resins, polyetheresteramide resins, and additional additives were fused and milled by a 2-axis extruder, and melts extruded from a die of the 2-axis extruder were cooled down by using a cooling tank and manufactured in the form of a pellet. An injection molding was manufactured by using the polyoxymethylene composition manufactured as described above by an injector.

[82]

[83] Physical properties of compositions shown in following examples and comparative examples are defined as follows.

[84] 1. Izod Impact Strength

[85] Based on ASTM D256 method, Izod impact strength was notched. A high notched value indicates that the Izod impact is excellent, and a low notched value indicates that the Izod impact is bad.

[86] 2. Tensile Strength

[87] Based on ASTM D638 method, a tensile strength was measured. A high measured value indicates that the tensile strength is excellent, and a low measured value indicates that the tensile strength is bad.

[88] 3. Surface Resistivity

[89] Based on ASTM D257 method, a surface resistivity was measured. A high measured value indicates insulating properties, and a low measured value indicates conductivity.

[90] 4. Abrasion Resistance

[91] Based on JIS K7218 method, a nonabrasive amount was measured. Referring to

FIG. 1, a sample with an outer diameter of 25.6 mm, an inner diameter of 20.0 mm, and a height of 15 mm was injection-molded, fixed, and underwent a test with a driving condition of a pressure load of 100 N and a linear velocity of 500 mm/s, for 100 minutes. In this case, the nonabrasive amount was calculated by using a following equation to estimate abrasion properties.

[92]

[93] Nonabrasive Amount =

[94] Abrasive Weight(D)/{Density(D/D)xPressure Load(N)xRun Length(D)}

[95] wherein a thrust type friction- abrasion tester was used as a test apparatus.

[96]

[97] Examples 1 to 5

[98] To polyoxymethylene copolymer resins produced by Korea Engineering Plastics

Co., Ltd, named as KEPITAL F 10-02, MI=3g/10 minutes (hereinafter, referred to as POM), polyetheresteramide resin produced by Ciber Company, named as Irgastat P20, 1,12-dodecane dicarboxylic acid dihydrazide as a heat stabilizer, and triethylene glycol-bis-3(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate as an antioxidant, produced by Ciba-Geigy Ltd., named as Irganox245, were added by weight percent shown in Table 1. A composition was fused and milled by a 2-axis extruder, and melts extruded from a die of the 2-axis extruder were cooled down by using a cooling tank and manufactured in the form of a pellet to measure physical properties.

[99] Physical properties of samples manufactured in respective examples 1 through 5 were shown in Table 1.

[100] [101] Comparative Example 1 [102] Polyetheresteramide resins were not added to POM resins, and a heat stabilizer and an antioxidant were added by weight percent shown in Table 1. A sample was manufactured by using the same method of the examples except weight percent of a composition.

[103] Physical properties of the sample manufactured in the comparative example 1 were shown in Table 1.

[104] [105] Comparative Examples 2 and 3 [106] To POM resins, polyetheresteramide resin produced by Ciber Company, named as Irgastat P20, 1,12-dodecane dicarboxylic acid dihydrazide as a heat stabilizer, and triethylene glycol-bis-3(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate as an antioxidant, produced by Ciba-Geigy Ltd., named as Irganox245, were added by weight percent shown in Table 1. A sample was manufactured by using the same method of the example except weight percent of a composition.

[107] Physical properties of the samples manufactured in the comparative examples 2 and 3 were shown in Table 1.

[108] [109] Table 1

[HO] [111] wherein Exa. is an abbreviation of example, Comp. is an abbreviation of comparative, PEEA is an abbreviation of Polyetheresteramide, DDD is an abbreviation of 1,12-dodecane dicarboxylic acid dihydrazide, and TBHMP is an abbreviation of triethylene glycol-bis-3(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate, Stren. is an abbreviation of strength, Resis. is an abbreviation of resistivity, and Nonab. is an abbreviation of nonabrasive.

[112] •;*:• Weight percents of 1,12-dodecane dicarboxylic acid dihydrazide and triethylene glycol-bis-3(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate are additional weight percent with respect to 100 percent by weight of the polyoxymethylene resins and polyetheresteramide resins.

[113] [114] As shown in Table 1, when the polyetheresteramide was used as a permanent antistatic agent for the polyoxymethylene copolymer resins, abrasion resistance was kept with a permanent anti-static function and an excellent impact resistance. On the other hand, when the polyetheresteramide was not used as the case of comparative example 1, a tensile strength was excellent but an anti-static function and impact resistance were deteriorated. Also, when the polyetheresteramide includes less than about 10.0 percent by weight, it is impossible to obtain a desired anti-static function. When the polyetheresteramide includes more than about 50.0 percent by weight, not only there is no more effect of an additional increase of the anti-static function but also properties of polyoxymethylene resins are deteriorated.

[115]

Industrial Applicability [116] According to an exemplary embodiment of the present invention, there is provided a thermoplastic resin composition in which polyetheresteramide resins are added to polyoxymethylene resins as a permanent anti-static agent, thereby obtaining a permanent anti-static function, maintaining an abrasion resistance, and having an excellent impact strength to be easily applied to all kinds of electrical-electronic parts.

Claims

[1] A permanent anti-static polyoxymethylene resin composition comprising: about 50.0-90.0 percent by weight of polyoxymethylene; and about 10.0 to 50.0 percent by weight of polyetheresteramide comprising polyether blocks derived from a polyalkylene glycol of the formula

wherein R is one of hydrogen and an alkyl group containing from 1 to 4 carbon atoms, x is an integer from 0 to about 8 and y is a large whole number such that a molecular weight of the polyether block is between 300 and 10,000 and poly amide blocks of the molecular weight up to about 10,000 obtained by a reaction of a dimmer acid obtained by a polymerization of an ethylenically unsaturated C 16 to C 26 monocarboxy ^J lic acid with a diamine selected from a g orourp consisting of alkyl diamines containing from 2 to 54 carbon atoms, aryl diamines, alicyclic diamines wherein a ring system contains 4 to 8 carbon atoms and is substitutable with at least one alkyl groups containing 1 to 8 carbon atoms, and heterocyclic diamines selected from a group consisting of piperazine and 2,5-dimethyl piperazine, the polyamide blocks corresponding to the formula

HOOC-B- OH

wherein R is one of hydrogen ad an alkyl radical containing from 1 to 18 carbon atoms, B is a radical derived from dimmer acid and containing from 30 to about 50 carbon atoms, A is a radical derived from the diamine, and z is an integer from about 1 to about 20, the polyether and polyamide blocks being linearly bonded with ester linkages and having a theoretical amide: ester ratio between 0.5: 1 and 25: 1 with the polyether blocks comprising about 10 to 75 percent by weight of the polyetheresteramide composition.

[2] The resin composition of claim 1, further comprising: about 0.01 to 1.0 percent by weight of an antioxidant; and about 0.01 to 1.0 percent by weight of a heat stabilizer.

[3] The resin composition of claim 1, wherein the polyoxymethylene resin with an average molecular weight from about 10,000 to about 200,000 is one of a ho- mopolymer of an oxymethylene repeat unit of Formula (1) and a oxymethylene copolymer in which the repeat unit of Formula (1) and a unit of Formula (2) are randomly bonded with each other,

-(-CH2O-)-

. Formula (1)

- [-(CXiXz)XO-] -

... Formula (2), wherein each of X 1 and X is one of hydrogen, an alkyl group, and an aryl group, the X and X corresponding to one of a case of being identical with each other and a case of being different from each other, at least one of the X and X is not the hydrogen, and x is an integer from about 2 to about 6.

[4] The resin composition of claim 2, wherein the antioxidant is at least one selected from a group consisting of Methylene glycol- bis-3(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate, 1 ,6-hexane-diol-bis-3-(3,5-di-t-butyl-4-hydroxy-phenyl)propionate, and tetrakis [methylene(3,5-di-t-butyl-4-hydroxy-hydrocinnamate)] methane.

[5] The resin composition of claim 2, wherein the heat stabilizer is at least one selected from a group consisting of 2,4,6-triamino-l,3,5-triazine and 1,12-dodecan dicarboxylic acid dihydrazide.