WO2007118364A1 - Structure d'éclairage décorative à led - Google Patents

Structure d'éclairage décorative à led Download PDF

Info

Publication number
WO2007118364A1
WO2007118364A1 PCT/CN2006/000728 CN2006000728W WO2007118364A1 WO 2007118364 A1 WO2007118364 A1 WO 2007118364A1 CN 2006000728 W CN2006000728 W CN 2006000728W WO 2007118364 A1 WO2007118364 A1 WO 2007118364A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
conductive
lighting structure
wire
strip
Prior art date
Application number
PCT/CN2006/000728
Other languages
English (en)
Chinese (zh)
Inventor
Tsung-Wen Chan
Original Assignee
Topson Optoelectronics Semi Co
Tsung-Wen Chan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Topson Optoelectronics Semi Co, Tsung-Wen Chan filed Critical Topson Optoelectronics Semi Co
Priority to PCT/CN2006/000728 priority Critical patent/WO2007118364A1/fr
Publication of WO2007118364A1 publication Critical patent/WO2007118364A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the invention relates to an LED lighting structure, in particular to an LED lighting structure which is low in cost, stable in structure, and is not easy to enter water or dust, meets the international standard of IP66, and can be used in any environment. Background technique
  • the well-known lighting structure is made up of many small light bulbs in series/parallel to produce a luminous and flashing visual effect, which is useful for product display or banquet decoration, and plays an important role in various industries or activities. Character.
  • the traditional lighting structure is mainly made of light bulbs, and the volume and weight of the bulbs are of a certain scale, there is enough space for collection, and the power consumption is large, the heat is amazing, and the outdoor setting is vulnerable to wind and rain. The damage, so that the traditional lighting is not expensive, it is not affordable for the average person.
  • LEDs instead of light bulbs is the only way in the industry.
  • Traditional LEDs are not suitable as lighting fixtures due to insufficient brightness, but in recent years, due to advances in technology, high-brightness LEDs are sufficient for lighting tasks.
  • the LED is light and strong, durable, and low in power consumption, which is the best choice to replace the bulb settings.
  • the LED lighting structure is known to be inserted into a lamp holder that has been completed in series/parallel. Due to lack of integrity, the structure is complicated, except that the lamp holder itself has to consider the configuration of the positive and negative wires.
  • the LED cannot be placed directly in the lamp holder, and the device in which the LED is fixed in the lamp holder must be additionally designed. In this way, not only is the structure too complicated, the installation cost is increased, and since the conductive sheet of the LED is not directly fixed to the wire, but only the touch is combined, the problem of poor contact is easily generated; in addition, the structural sealing of the conventional LED lighting is poor. , easy to enter water or dust, especially for lighting used outdoors, it is easy to malfunction, resulting in reduced product life.
  • a primary object of the present invention is to provide an improved LED lighting structure.
  • An improved LED lighting structure that achieves the above objects, comprising a plurality of LEDs, and is formed by wire/parallel connection.
  • the LED has two conductive sheets, and the two conductive sheets are directly cut and formed on the same strip.
  • the two conductive sheets are respectively provided with a terminal head, and the terminal head includes a positioning plate and a conductive plate, and the positioning plate is used for Pressing the insulating sheath of the fixed wire, the conductive plate is used for fixing and conducting the metal core wire inside the wire, and the positioning plate and the conductive plate on the two conductive sheets have a height difference from each other, so as to avoid short circuit due to accidental contact.
  • the two conductive sheets are cut from the strip, and after being bonded and sealed by epoxy resin, the LEDs required by the invention are formed, and then the LEDs of the present invention are serially/parallelized to form a A stable, long-life LED lighting structure.
  • the configuration is simple and smooth, and the structure is stable, which ensures that the LED is electrically conductive and makes it work normally.
  • Figure 1 is a view showing an example of a tape configuration of the present invention
  • FIG. 2 is a view showing an example of a single LED structure of the present invention.
  • 3 is a view showing an example of connecting LEDs and wires of the present invention.
  • FIG. 4 is a view showing an example of setting of an LED lighting fixture of the present invention.
  • the present invention provides an improved LED lighting structure comprising a plurality of LEDs 1 and formed in series/parallel via wires 2.
  • the LED 1 has two conductive sheets 11, and the two conductive sheets 11 are directly cut and formed on the same strip 3, so that a large number of LED conductive sheets can be directly produced in the same strip 3, thereby saving production line and cost.
  • the two conductive sheets 11 are respectively provided with a terminal head 12, and the terminal head 12 includes a positioning plate 121 and a conductive plate 122 for pressing and fixing the insulating sheath 21 of the wire 2.
  • the conductive plate 122 is The metal core 22 for fixing and conducting the inside of the wire 2 is disposed, and the positioning plate 121 and the conductive plate 122 on the two conductive sheets 11 have a height difference from each other to avoid short circuit due to accidental contact.
  • the two conductive sheets 11 are cut from the tape 3, and after being bonded and sealed with epoxy resin, they become LEDs with terminal heads.
  • the insulating sheath 21 at the front end of the wire 2 is removed, and a part of the metal core 22 is exposed.
  • the LED 1 with the terminal head is obtained first, and the positioning plate 121 of the terminal head 12 is pressed against the insulating sheath 21 of the fixed wire 2, and the metal core 22 exposed at the front end is given by the conductive plate 122. Pressurization and fixing, since the positioning plate 121 and the conductive plate 122 on the two conductive sheets 11 have a height difference from each other, short circuit can be avoided due to accidental contact.
  • a slot 123 may be disposed in the middle of the positioning plate 121 or the conductive plate 122 to facilitate the bending of the positioning plate 121 or the conductive plate 122.
  • a plurality of the completed LEDs 1 are serially/parallelized by the wires 2, thereby completing the improved structure of the LED lighting of the present invention, and the LED external cover is completed.
  • the outer casing 4 is provided for packaging the LED 1 to prevent the terminal head 12 or the wire 2 from being exposed. In addition to improving the appearance, the outer casing 4 can seal the metal conductive portion of the LED 1 and the wire 2 to avoid Rain or other factors are eroded to reduce the life of the product.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

L'invention concerne une structure d'éclairage décorative à LED comportant une pluralité de LED. Chaque LED comporte deux lamelles conductrices réalisées directement par découpe dans une bande du même matériau. Chaque lamelle conductrice est pourvue d'un terminal comprenant une bande de fixation et une bande électroconductrice. La bande de fixation sert à la fixation d'une gaine d'isolation extérieure d'un conducteur par pression sur celle-ci, et la bande conductrice sert à la fixation et à la connexion avec les fils à noyaux toronnés métalliques du conducteur. Les bandes de fixation et les bandes électroconductrices dans les deux lamelles conductrices sont disposées à des hauteurs différentes de manière à éviter tout court-circuitage par contact accidentel. La pluralité de LED peut être montée en série/parallèle de manière à former une configuration souhaitée de la structure d'éclairage décorative à LED selon l'invention.
PCT/CN2006/000728 2006-04-19 2006-04-19 Structure d'éclairage décorative à led WO2007118364A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2006/000728 WO2007118364A1 (fr) 2006-04-19 2006-04-19 Structure d'éclairage décorative à led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2006/000728 WO2007118364A1 (fr) 2006-04-19 2006-04-19 Structure d'éclairage décorative à led

Publications (1)

Publication Number Publication Date
WO2007118364A1 true WO2007118364A1 (fr) 2007-10-25

Family

ID=38609034

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2006/000728 WO2007118364A1 (fr) 2006-04-19 2006-04-19 Structure d'éclairage décorative à led

Country Status (1)

Country Link
WO (1) WO2007118364A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4877756A (en) * 1987-03-31 1989-10-31 Mitsubishi Denki Kabushiki Kaisha Method of packaging a semiconductor laser and photosensitive semiconductor device
US6369506B1 (en) * 1998-11-27 2002-04-09 Sharp Kabushiki Kaisha Light emitting apparatus and method for mounting light emitting device
CN1464555A (zh) * 2002-06-14 2003-12-31 徐继兴 一种发光二极管装饰灯泡及其制作方法
US6717256B1 (en) * 1998-08-31 2004-04-06 Rohm Co., Ltd. Mounting structure for semiconductor device having entirely flat leads
CN1665039A (zh) * 2004-03-02 2005-09-07 安捷伦科技有限公司 发光二极管

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4877756A (en) * 1987-03-31 1989-10-31 Mitsubishi Denki Kabushiki Kaisha Method of packaging a semiconductor laser and photosensitive semiconductor device
US6717256B1 (en) * 1998-08-31 2004-04-06 Rohm Co., Ltd. Mounting structure for semiconductor device having entirely flat leads
US6369506B1 (en) * 1998-11-27 2002-04-09 Sharp Kabushiki Kaisha Light emitting apparatus and method for mounting light emitting device
CN1464555A (zh) * 2002-06-14 2003-12-31 徐继兴 一种发光二极管装饰灯泡及其制作方法
CN1665039A (zh) * 2004-03-02 2005-09-07 安捷伦科技有限公司 发光二极管

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