WO2007115474A1

WO2007115474A1 - An electromagnetic oven

Info

Publication number: WO2007115474A1
Application number: PCT/CN2007/000982
Authority: WO
Inventors: Ming Yuan
Original assignee: Ming Yuan
Priority date: 2006-04-10
Filing date: 2007-03-27
Publication date: 2007-10-18

Abstract

An electromagnetic oven, which includes an oven body (1), a panel (2) and a temperature response detector placed on the panel (2), is provided. The temperature response detector is a telescopically elastic device which is slideably fitted a sliding cap (4) in a detector body (3), the top end of the sliding cap (4), on which a heat-conducting cap (8) formed of the good thermal conductor is placed and inside which a mounting body (9) is placed, is extended outside the detector body (3), there are a temperature response probe (5) deposed at one side of the mounting body (9) which faces the heat-conducting cap (8), and a spring (10) deposed between the sliding cap (4) and the detector body (3). The temperature response detector contacts the bottom of the cooker directly, thus it can detect the bottom's temperature of the cooker accurately and quickly.

Description

Induction cooker

Technical field

The invention relates to an induction cooker, in particular to an induction cooker which is directly manufactured by a temperature sensing probe and a bottom of a pot in a state of use, and is simple to manufacture and install.

Background technique

The widely used induction cooker basically installs the temperature sensing probe device on the lower surface of the panel. When used, the pot is placed on the panel, and the bottom of the pot directly contacts the panel, and the electromagnetic wire generated by the coil below the panel passes through. When the ferromagnetic material is used, the eddy current is generated at the bottom of the pot and the heat is generated. The temperature detected by the temperature probe device is the temperature after the heat generated at the bottom of the pot is transmitted through the panel, so the following problems exist: 1. In time Hysteresis, since the materials of the panel are mostly microcrystalline ceramics or glass, these materials are poor conductors of heat, and the heat generated at the bottom of the pot is transmitted by the poor conductor layer of the heat before being detected by the temperature sensing device, so that the detected The temperature change is delayed in time with respect to the temperature change at the bottom of the pot; 2. The detected temperature is larger than the actual temperature at the bottom of the pot, because the heat generated at the bottom of the pot is transmitted through the poor conductor panel of the heat. The temperature probe device detects that during the warming phase, the detected temperature is lower than the temperature at the bottom of the pan, plus the furnace The effect of the cooling fan, so that the lower the detected temperature, and therefore, the detected temperature as compared to the bottom of the pot large error. Because the detected temperature and the temperature error at the bottom of the pot are large and the time lags, the temperature control function of the microcomputer control circuit can not truly reflect the temperature at the bottom of the pot, which may cause the temperature at the bottom of the pot and the temperature of the upper surface of the panel. Exceeded the set or allowed temperature range, thereby burning the pot and the panel.

Summary of the invention

The technical problem to be solved by the present invention is to provide an induction cooker which can accurately and quickly detect the temperature of the bottom of the pan and realize accurate temperature control, and is simple to manufacture and install.

In order to solve the above technical problem, an induction cooker provided by the present invention includes a furnace body, a panel mounted on the furnace body, and a temperature sensing probe device mounted on the panel, wherein the temperature sensing probe device is telescopic Flexible temperature probe device.

The telescopic elastic temperature sensing probe device is provided with a sliding cap in a sliding body of the temperature sensing probe device, and the upper end of the sliding cap protrudes outside the temperature sensing probe device, and the sliding cap is provided on the sliding cap. a heat conducting cap, the heat conducting cap is made of a good heat conductor, and a temperature sensing probe mounting body is disposed in the sliding cap, and a temperature sensing probe is mounted on the temperature sensing probe mounting body One side of the heat conducting cap is provided with a spring between the sliding cap and the temperature sensing probe device body.

a metal heat conductive skin is disposed between the heat conducting cap and the temperature sensing probe mounting body, wherein the metal heat conductive skin has a central portion as a ring shape and a side wing structure on both sides of the ring. The temperature probe is stuck in the ring.

Providing a thermal pad between the heat conducting cap and the temperature sensing probe mounting body, The thermal pad is made of a flexible thermally conductive material with its underside in contact with the temperature sensing probe. a thermal pad is disposed between the heat conducting cap and the metal heat conductive skin

A water blocking ring is disposed at an exit of the wire of the temperature sensing probe at the bottom of the temperature sensing probe device body. A water conduit is provided at the bottom of the temperature sensing probe device body.

The telescopic elastic temperature sensing probe device is provided with a heat conducting cap in the body of the temperature sensing probe device, and the heat conducting cap is made of a good heat conductor, and the heat conducting cap is closed at the upper end and the peripheral wall, and the lower end is open. The upper end of the structure is extended to the outside of the temperature sensing probe device, and the temperature sensing probe is installed in the heat conducting cap and is in close contact with the inner wall of the upper end thereof, and a baffle plate is mounted on the open end thereof, and the heat conducting cap is a thermal silica gel is disposed in the inner cavity formed by the baffle plate, and a spring is disposed in the temperature sensing probe device body, and the spring is between the bottom end of the temperature sensing probe device body and the baffle plate .

The induction cooker adopting the above technical solution, because the temperature sensing probe device is mounted on the panel through the temperature sensing probe device body, sliding the large set of sliding caps in the temperature sensing probe device body, and providing a heat conducting cap on the sliding cap, the temperature sensing probe device A spring is mounted between the bottom of the body and the sliding cap, thus forming a telescopic elastic device. The heat conducting cap and the sliding cap extend outside the temperature sensing probe device under the action of the spring, and the upper side of the heat conducting cap is higher than the temperature sensing probe device. The upper end of the body. In use, the pan compresses the heat conducting cap and the sliding cap to retract the body of the temperature sensing probe device. When retracting to the lowest position, the upper side of the heat conducting cap is slightly higher than the upper end of the temperature sensing probe device body, thereby ensuring the heat conducting cap The direct contact between the side and the bottom of the pot allows the direct contact between the heat-conductive cap and the bottom of the pot even if the pot is deformed due to manufacturing or deformation after a certain period of use. Since the heat conducting cap is made of a good heat conductor, the temperature probe is stuck in the ring of the metal heat conductive skin, and a heat conducting pad is arranged between the metal heat conductive skin and the heat conducting cap, and the metal heat conductive skin and the heat conductive pad function to ensure the heat conducting cap The temperature is transmitted to the temperature probe more quickly and accurately. Therefore, the temperature probe can quickly and accurately detect the temperature and the change of the bottom of the pot, and control the operation of the microcomputer control circuit of the induction cooker, thus ensuring the temperature control accuracy of the present invention. , to achieve accurate temperature control, to avoid burning of pots and panels, and the above parts are simple to manufacture and install and low cost.

Since a water blocking ring is arranged at the outlet of the wire of the temperature sensing probe at the bottom of the temperature sensing probe device body, it is ensured that liquid such as water does not enter the electromagnetic oven through the outlet of the wire; The water pipe can guide the liquid such as water entering the bottom of the temperature sensing probe device out of the induction cooker, thereby ensuring the reliability of the operation of the induction cooker circuit.

In summary, the present invention is an electromagnetic oven in which the temperature sensing probe device is directly in contact with the bottom of the pan, and the temperature at the bottom of the pan can be accurately detected and accurately controlled, and the manufacturing and installation are simple.

DRAWINGS

The invention is further described below in conjunction with the drawings and specific embodiments.

Figure 1 is a schematic view of the structure of the present invention;

Fig. 2 is a schematic view showing another structure of the present invention. detailed description

Referring to Fig. 1, a panel 2 is mounted on the furnace body 1, and a temperature sensing probe device body 3 is mounted on the panel 2, and a sliding cap 4 is slidably fitted in the temperature sensing probe device body 3, and the upper end of the sliding cap 4 is extended to the sense The temperature of the temperature probe device body 3 corresponds to the bottom of the pot, and the heat conducting cap 8 is arranged on the sliding cap 4. The heat conducting cap 8 is made of a good heat conductor, and the temperature sensor mounting body 9 is arranged in the sliding cap 4, in the heat conduction. A thermal pad 7 is disposed between the cap 8 and the temperature sensing probe mounting body 9. The thermal pad 7 is made of a flexible heat conductive material, and a metal heat conductive skin 6 is disposed between the thermal pad 7 and the temperature sensing probe mounting body 9, and the metal heat conductive skin is provided. 6 is a ring-shaped structure in the middle, and has a side flap on both sides of the ring. The temperature probe 5 is stuck on the side of the ring facing the heat conducting cap 8, and is in contact with the lower side of the thermal pad 7, the temperature probe 5 is a thermistor, and a temperature sensing element such as a thermocouple may be used. The temperature sensing probe 5 is connected to the microcomputer control circuit installed in the furnace body 1 through the wire 12, and is disposed between the sliding cap 4 and the temperature sensing probe device body 3. There is a spring 10, the feeling at the bottom of the temperature probe device body 3 Wire probe 12 at the outlet 5 of the water blocking ring 11 is provided, the temperature probe apparatus body 3 is provided with water conduit 13 at the bottom.

Since the telescopic elastic temperature sensing probe device of the present invention is provided with a sliding cap 4, a temperature sensing probe mounting body 9, a temperature sensing probe 5, a heat conducting cap 8, a metal heat conductive skin 6, and a thermal pad 7 in the temperature sensing probe device body, It is easy to ensure that the temperature of the heat conducting cap 8 is transmitted to the temperature sensing probe 5 relatively quickly, and the above parts are simple to manufacture and install at a low cost.

Referring to Fig. 2, a panel 2 is mounted on the furnace body 1, and a temperature sensing probe device body 3 is mounted on the panel 2, and a heat conducting cap 8 is slidably disposed in the temperature sensing probe device body 3, and the heat conducting cap 8 is provided with a good conductor of heat. The heat conducting cap 8 has a structure in which the upper end and the peripheral wall are closed and the lower end is open, and the upper end thereof extends to the outside of the temperature sensing probe device body 3 corresponding to the bottom of the pot, and the temperature sensing probe 5 is installed in the heat conducting cap 8 and closely adheres thereto. The upper end inner wall is provided with a baffle 14 at the open end thereof, and the temperature sensing probe 5 is a thermistor, and a temperature sensing element such as a thermocouple can also be used, and the temperature sensing probe 5 passes through the wire 12 and the microcomputer control circuit installed in the furnace body 1. Electrically connected, a thermal conductive silicone 15 is disposed in the inner cavity formed by the heat conducting cap 8 and the baffle 14, and a spring 10 is mounted in the temperature sensing probe device body 3, and the spring 10 is at the bottom end of the temperature sensing probe device body 3 and Between the baffles 14, a water blocking ring 11 is provided at the outlet of the wire 12 of the temperature sensing probe 5 at the bottom of the temperature sensing probe device body 3, and a water guiding pipe 13 is provided at the bottom of the temperature sensing probe device body 3.

Referring to FIG. 1 and FIG. 2, since the temperature sensing probe device is mounted on the panel 2, a spring 10 is mounted between the bottom of the temperature sensing probe device body 3 and the heat conducting cap 8, and the heat conducting cap 8 extends under the action of the spring 10 to sense the temperature probe. The upper side of the heat conducting cap 8 is higher than the upper end of the temperature sensing probe device body 3. When the cooker compression heat conducting cap 8 is retracted to the lowest position, the upper side of the heat conducting cap 8 and the upper end of the temperature sensing probe device body 3 It is flush or slightly higher than its upper end, thus ensuring direct contact between the upper side of the heat conducting cap 8 and the bottom of the pot. Since the heat conducting cap 8 is made of a good heat conductor, the temperature probe 5 can quickly detect the pot. It has the temperature and its change at the bottom, and controls the operation of the microcomputer control circuit of the induction cooker, thus ensuring the temperature control accuracy of the invention, realizing accurate temperature control, and avoiding burning of the pot and the panel 2 . The temperature sensing probe 5 at the bottom of the temperature sensing probe device body 3 A water blocking ring 11 is arranged at the outlet of the wire 12 to ensure that the water does not immerse on the wire 12, thereby ensuring the reliability of the working of the temperature sensing probe 5, and a water guiding pipe 13 is provided at the bottom of the temperature sensing probe device body 3, which will enter The water at the bottom of the temperature sensing probe device body 3 is guided out to ensure the reliability of the temperature sensing probe 5 operation.

Claims

Rights request

An induction cooker comprising a furnace body (1), a panel (2) mounted on the furnace body (1), and a temperature sensing probe device mounted on the panel (2), characterized in that: The temperature sensing probe device is a telescopic elastic temperature sensing device.

2. The induction cooker according to claim 1, wherein: the telescopic elastic temperature sensing probe device is slidably provided with a sliding cap (4) in the temperature sensing probe device body (3), and the sliding cap is (4) The upper end protrudes outside the temperature sensing probe device body (3), and the sliding cap (4) is provided with a heat conducting cap (8), and the heat conducting cap (8) is heated a conductor, a temperature sensing probe mounting body (9) is disposed in the sliding cap (4), and a temperature sensing probe (5) is mounted on the temperature sensing probe mounting body (9) On one side of the heat conducting cap (8), a spring (10) is disposed between the sliding cap (4) and the temperature sensing probe device body (3).

3. The induction cooker according to claim 2, wherein: a metal heat conductive skin (6) is disposed between the heat conducting cap (8) and the temperature sensing probe mounting body (9), The metal heat conductive skin (6) has a structure in which a central portion is a ring and flanked on both sides of the ring, and the temperature sensing probe (5) is caught in the ring.

4. The induction cooker according to claim 2, wherein: a heat conducting pad (7) is disposed between the heat conducting cap (8) and the temperature sensing probe mounting body (9), and the heat conduction The pad (7) is made of a flexible thermally conductive material with its underside in contact with the temperature sensing probe (5).

5. The induction cooker according to claim 3, characterized in that: a thermal pad (7) is arranged between the heat conducting cap (8) and the metal heat conducting skin (6).

The induction cooker according to claim 1, wherein: the telescopic elastic temperature sensing probe device is slidably provided with a heat conducting cap (8) in the temperature sensing probe device body (3), and the heat conducting cap is (8) It is made of a good heat conductor (8) having a structure in which the upper end and the peripheral wall are closed and the lower end is open, and the upper end thereof protrudes outside the temperature sensing probe device body (3), and the sense The temperature probe (5) is mounted in the heat conducting cap (8) and is in close contact with the inner wall of the upper end thereof, and a baffle is installed at the open end thereof.

(14), in the inner cavity of the heat conducting cap (8) and the baffle (14) is equipped with a thermal silica gel

(15), a spring (10) is mounted in the temperature sensing probe device body (3), and the spring (10) is at a bottom end of the temperature sensing probe device body (3) and the baffle plate ( 14) Between.

7. The induction cooker according to claim 2, 3, 4, 5 or 6, characterized in that: the wire of the temperature sensing probe (5) at the bottom of the temperature sensing probe device body (3) (12) There is a water blocking ring (11) at the exit.

8. The induction cooker according to claim 2, 3, 4, 5 or 6, characterized in that: a water conduit (13) is provided at the bottom of the temperature sensing probe device body (3).

The induction cooker according to claim 7, characterized in that: a water conduit (13) is provided at the bottom of the temperature sensing probe device body (3).