WO2007111046A1

WO2007111046A1 - Optical fiber array, semiconductor laser light collecting device, and optical fiber array manufacturing method

Info

Publication number: WO2007111046A1
Application number: PCT/JP2007/052203
Authority: WO
Inventors: Hiromichi Ota; Tomomi Nakano; Yoshinobu Katoh
Original assignee: Jtekt Corporation
Priority date: 2006-03-29
Filing date: 2007-02-08
Publication date: 2007-10-04
Also published as: JPWO2007111046A1; JP5277959B2

Abstract

It is possible to provide an optical fiber array and a semiconductor laser light collecting device capable of suppressing a loss and an optical fiber array manufacturing method. The optical fiber array is formed by a plurality of optical fibers (22a) for receiving lights emitted from an array-shaped light emission source (10) having a plurality of light emission units (12a) for emitting lights advancing while spreading into an elliptical shape, the light emission units (12a) being arranged in a shorter axis direction of an ellipsis. Each of the optical fibers is arranged so that each incident face of each optical fiber arranged at an interval of the shorter axis direction of the light emission unit so as to oppose to each light emission unit. The incident face side of each optical fiber is fixed by a fixing member to form a unitary block (21) by the fixing member and the incident face of the optical fiber. At the incident face side of each optical fiber in the unitary block, a lens unit is formed by grinding or cutting or polishing or melting and master pressing.

Description

Specification

Optical fiber array, semiconductor laser condensing device, and optical fiber array manufacturing method

Technical field

TECHNICAL FIELD [0001] The present invention relates to an optical fiber array capable of efficiently condensing emitted laser light, a semiconductor laser condensing device, and a method of manufacturing the optical fiber array.

Background art

In recent years, semiconductor lasers have a high oscillation efficiency (˜50%), and therefore there is an increasing need for using them as excitation light for solid-state lasers or as direct light sources. Semiconductor laser manufacturers also provide semiconductor laser bars in which multiple emitters (light emitting sections) are arranged one-dimensionally, and semiconductor lasers in which semiconductor laser bars are stacked and multiple emitters (light emitting sections) are arranged in two dimensions. The stack is commercialized.

For example, a typical semiconductor laser bar is a semiconductor laser chip with an external dimension of about 10 mm in length, about 0.2 mm in thickness, and about 1 mm in width, mounted on a heat sink, and about 1 m in length in the thickness direction. In the vertical direction, about 10 m of light emitting parts are integrated at a pitch of about 500 m. Then, a laser beam with an output of about 2 W is emitted from one light emitting unit. If these are condensed to increase the power density and used as excitation light or directly as a processing light source, metal welding, drilling, cutting, etc. can be performed.

In this specification, the semiconductor laser bar and the semiconductor laser stack are collectively referred to as a semiconductor laser array.

In a general semiconductor laser array, as shown in the example of FIG. 1 (example in which the light emitting part is one-dimensionally arranged), the laser light L1 emitted from the light emitting part (12a to 12g) Proceeds while spreading almost elliptically in the minor axis direction. In addition, as shown in the example of FIG. 2, the force S shear angle Θ f in the major axis direction is about several tens of degrees (for example, 30 to 40 degrees), and in the minor axis direction as shown in the example of FIG. The spread angle Θ s is about several degrees (for example, 3 to 4 degrees). In addition, as described above, the dimension of each light emitting part (12a to 12 g) is about 1 m in the major axis direction in a general semiconductor laser array. The minor axis direction is about 100 to 200 μm.

The condensing property of the laser light depends on the beam parameter product indicated by “beam diameter * divergence angle”. In the case of the semiconductor laser array as described above, the beam parameter port duct in the long axis direction is about 0.2 mm'mrad. The beam parameter product in the short axis direction is 200mm • mrad. For this reason, when condensing, it is relatively easy to collect light in the long axis direction, but it is relatively difficult to collect light in the short axis direction.

[0004] For example, in the prior art described in Patent Document 1, a lens-shaped multimode fiber having a slanted cross section provided at one end of a single mode fiber and having a wedge shape and a tip curved surface is fused. Fibers with end lenses have been proposed that are attached or bonded. Laser light emitted from the light emitting part of the semiconductor laser is bent inward by a lens-like convex curved surface in the major axis direction, and further refracted so that the diameter becomes smaller due to the internal refractive index distribution, and the minor axis direction. The light is refracted so that its diameter becomes smaller due to the refractive index distribution, and is guided to a single mode fiber.

In the prior art described in Patent Document 2, the semiconductor laser array and the lens array are mounted on a metal block, and the metal block is laser welded to the inside of the window on the side wall of the package (housing). A semiconductor laser module has been proposed in which a sleeve on which an optical fiber array is mounted is positioned and laser-welded. By fixing the metal block to the side of the package (chassis) without fixing it to the side, displacement due to distortion of the bottom or temperature rise during laser emission (positions of the semiconductor laser array, lens array, and optical fiber array) The optical coupling loss due to deviation) is suppressed.

In the prior art described in Patent Document 3, a fiber array is formed of fibers having a material force with a cladding etching rate higher than the etching rate of the core. Each fiber tip is etched and the core end face is removed. Processed into a spherical lens.

Patent Document 1: Japanese Patent Laid-Open No. 2000-304965

Patent Document 2: JP-A-6-308358

Patent Document 3: JP-A-6-324234

Disclosure of the invention

Problems to be solved by the invention

[0005] In the prior art described in Patent Document 1, an optical fiber and a lens are integrated. It is only necessary to position the light emitting part of the semiconductor laser and the optical fiber without positioning the light emitting part of the body laser, the lens, and the optical fiber. However, when it is applied to a semiconductor laser array having a plurality of light emitting portions, it is necessary to align the optical fiber one by one with respect to each light emitting portion of the semiconductor laser array. The loss due to misalignment may increase.

In the prior art described in Patent Document 2, the metal block on which the semiconductor laser array and the lens array are mounted is separate from the optical fiber array. When the output of the semiconductor laser array is relatively large, the heat generated by the semiconductor laser array and the lens array is larger than that of the optical fiber array, and the position due to the difference between the thermal expansion of the metal block and the thermal expansion of the optical fiber array. Misalignment may occur and loss may increase.

In the prior art described in Patent Document 3, a lens is formed on the end face of the core by melting the fiber by etching, so that it cannot be formed into a substantially spherical lens shape. For example, a cylindrical lens shape, etc. It is difficult to form an appropriate lens shape that suppresses loss. In addition, since it is a method that expects to form a spherical surface by melting by etching, it is difficult to obtain desired lens characteristics such as a focal length that can further suppress loss. It is also difficult to further suppress loss by precisely matching the position of the lens formed on the core end face (position in the longitudinal direction of the core) for each fiber.

An object of the present invention is to provide an optical fiber array, a semiconductor laser condensing device, and a method for manufacturing the optical fiber array, which are conceived in view of such a point and can further suppress loss. .

Means for solving the problem

In order to solve the above-described problems, the present invention is an optical fiber array, a semiconductor laser condensing device, and a method for manufacturing the optical fiber array, each having a configuration as described in the claims. The optical fiber array according to the first aspect of the invention is configured to receive a plurality of light beams that are emitted from an array-shaped light source in which a plurality of light emitting portions that emit light that travels in an elliptical shape are arranged in the short axis direction of the ellipse. This is an optical fiber array composed of optical fibers.

Each optical fiber has each incident surface of each optical fiber aligned with the short axis direction of the light emitting part. It is arranged to face each light emitting part.

The incident surface side of each optical fiber is fixed by a fixing member to form an integral part of the fixing member and the incident surface of the optical fiber, and the incident surface side of each optical fiber in the integral part is incident. Lens part force that collects light It is formed by polishing lj, cutting lj, or polishing or melting and pressing the mold.

According to the first invention, since the incident surfaces of the plurality of optical fibers in the integral part are arranged in line with the interval of the light emitting parts of the array light source, the individual optical fibers are adapted to the positions of the light emitting parts. Since positioning is not necessary, positioning is easy and positioning accuracy is high. Thereby, loss can be suppressed more.

[0007] In the optical fiber array of the second invention, the fixing member is made of a solid material that hardens the tip portions on the incident surface side of the plurality of optical fibers.

According to the second invention, the fixing member can be easily configured with the solid material.

[0008] In the optical fiber array of the third invention, the fixing member is composed of at least two fixing plates whose surfaces orthogonal to the major axis direction of the ellipse are opposed to each other, and incident surfaces of a plurality of optical fibers The front end portion is sandwiched and fixed by a fixing plate.

According to the third aspect of the invention, the fixing member can be easily configured with at least two fixing plates that sandwich the optical fiber.

[0009] In the optical fiber array according to the fourth aspect of the invention, at least one of the fixed plates is formed with a groove for positioning the optical fiber at an interval in the short axis direction of the light emitting portion.

According to the fourth invention, the optical fiber can be easily positioned with respect to the fixed plate.

In the optical fiber array of the fifth invention, the lens portion is integrally formed in a convex shape with respect to the major axis direction so that the light incident on the integral portion is refracted in the major axis direction.

According to the fifth aspect of the invention, in the long axis direction with a large divergence angle, the lens portion reduces the divergence angle and guides it into the optical fiber, and in the short axis direction with a small divergence angle, the light is guided as it is. In addition, light can be appropriately guided into the optical fiber, and loss can be further suppressed.

Also, since the lens part is integrally formed in the integral part, it is easy to create the lens part. . Moreover, since the lens part in each optical fiber becomes the same shape (variation is very small), positioning is easy and loss can be suppressed more.

[0011] In the semiconductor laser condensing device of the sixth invention, the optical fiber array according to any one of the first to fifth inventions and a laser beam that travels in an elliptical shape as an arrayed light source. A semiconductor laser condensing device comprising: a semiconductor laser array in which a plurality of light emitting portions for emitting the light are arranged in an elliptical short axis direction, each of the light emitting portions and each of the incident surfaces on which the lens portions are formed The semiconductor laser array and the integral part are positioned so that they face each other, and the laser light emitted from each light emitting part is incident on each optical fiber and condensed.

According to the sixth aspect of the present invention, the plurality of light emitting portions and each optical fiber can be positioned together only by positioning the two of the semiconductor laser array and the integral portion. Since it is not necessary to position individual optical fibers according to the position of each light emitting section, positioning is easy and positioning accuracy is high. Thereby, loss can be suppressed more.

In the semiconductor laser condensing device of the seventh invention, the semiconductor laser array and the integral part are fixed on the same member.

According to the seventh aspect of the present invention, even if the semiconductor laser array, which is a member positioned on the path from when the laser light is emitted from the light emitting portion and collected, and the integrated portion generate heat, the fixed member is Since they are the same member and have the same coefficient of thermal expansion, the amount of misalignment due to thermal expansion can be suppressed, and loss can be further suppressed.

[0013] An optical fiber array manufacturing method according to an eighth aspect of the present invention provides each light emitted from an array light source in which a plurality of light emitting portions that emit light traveling in an elliptical shape are arranged in the minor axis direction of the ellipse. A method of manufacturing an optical fiber array composed of a plurality of optical fibers that are incident on each of the optical fibers, wherein each optical fiber is aligned with the interval in the minor axis direction of the light emitting section, and each incident surface of each optical fiber is placed on each light emitting section. It arrange | positions so that it may oppose, the incident surface side of each optical fiber is fixed with a fixing member, and the integrated part by a fixing member and the incident surface of an optical fiber is formed.

Then, the machining tool having a concave shape with respect to the major axis direction is pressed from the incident surface side of the optical fiber in the integral part to move the machining tool in the minor axis direction, and the incident light is refracted in the major axis direction. Thus, a convex lens portion is formed integrally with the entrance surface of each optical fiber with respect to the long axis direction. According to the eighth aspect of the present invention, the lens portion having a convex shape with respect to the major axis direction is integrally formed easily and in a short time on the one body portion in which the tips of the optical fibers in the optical fiber array are integrated. That's right.

[0014] The method of manufacturing the optical fiber array according to the ninth aspect of the present invention provides each light emitted from an array-shaped light source in which a plurality of light emitting sections that emit light that travels in an elliptical shape are arranged in the minor axis direction of the ellipse. A method of manufacturing an optical fiber array composed of a plurality of optical fibers that are incident on each of the optical fibers, wherein each optical fiber is aligned with the interval in the minor axis direction of the light emitting section, and each incident surface of each optical fiber is placed on each light emitting section. It arrange | positions so that it may oppose, the incident surface side of each optical fiber is fixed with a fixing member, and the integrated part by a fixing member and the incident surface of an optical fiber is formed.

Then, on the incident surface side of the optical fiber in the integral part, the integral part is arranged in the major axis direction so that incident light is refracted in the major axis direction with a cylindrical processing tool having a rotation axis parallel to the minor axis direction. In order to refract the incident light in the long axis direction, a convex lens portion with respect to the long axis direction is integrally formed on the incident surface of each optical fiber. According to the ninth aspect of the present invention, a lens portion having a convex shape with respect to the major axis direction can be integrally formed with higher accuracy in a unitary portion in which the tips of the optical fibers in the optical fiber array are integrated. .

[0015] The method for manufacturing an optical fiber array according to the tenth aspect of the invention provides each light emitted from an arrayed light source in which a plurality of light emitting portions that emit light traveling in an elliptical shape are arranged in the minor axis direction of the ellipse. A method of manufacturing an optical fiber array composed of a plurality of optical fibers that are incident on each of the optical fibers, wherein each optical fiber is aligned with the interval in the minor axis direction of the light emitting unit, and each incident surface of each optical fiber is connected to each light emitting unit. The incident surface side of each optical fiber is fixed by a fixing member, and an integral part is formed by the fixing member and the incident surface of the optical fiber.

Then, the optical fiber and the fixing member are made of the same material or a material with a close melting point, and the incident light side of the optical fiber in the unit is melted and pressed against the mold so that the incident light is in the long axis direction. A lens portion having a convex shape with respect to the major axis direction is integrally formed on the incident surface of each optical fiber so as to be refracted into the light.

According to the tenth invention, it is possible to more easily integrally form a convex lens portion with respect to the major axis direction in the integrated portion in which the tips of the optical fibers in the optical fiber array are integrated. it can.

[0016] In the manufacturing method of the optical fiber array of the eleventh aspect of the invention, the tip end portion projects into the groove array force in each groove of the groove array in which a plurality of grooves are formed at intervals in the minor axis direction of the light emitting portion. Each optical fiber is disposed on the front, and the protruding tip is fixed with a fixing member to form an integral part.

According to the eleventh invention, it is possible to easily position the optical fiber at intervals in the minor axis direction of the light emitting part, and it is easy to form a unitary part in which the tips of the optical fibers in the optical fiber array are integrated. Can be formed.

Brief Description of Drawings

[0017] FIG. 1 is a diagram (perspective view) for explaining the structure of a general semiconductor laser array and emitted laser light.

FIG. 2 is a diagram (side view) for explaining the structure of a general semiconductor laser array and emitted laser light.

FIG. 3 is a diagram (plan view) for explaining the structure of a general semiconductor laser array and emitted laser light.

FIG. 4 is a diagram illustrating the configuration of an optical fiber array 20 of the present invention.

FIG. 5 is a diagram illustrating the configuration of the optical fiber array 20 and the semiconductor laser condensing device 1 of the present invention.

FIG. 6 is a diagram for explaining the relationship between the divergence angle and radius of laser light emitted from the optical fiber array 20 and the divergence angle and radius of laser light incident on the transmission optical fiber 40.

FIG. 7 is a diagram for explaining the structure (side view) and function of the body part 21.

FIG. 8 is a diagram for explaining the structure (plan view) and function of the body part 21.

FIG. 9 is a diagram showing an example of a groove array 26.

FIG. 10 is a diagram for explaining an example of a manufacturing method of the optical fiber array 20 in which a lens portion is integrally formed.

FIG. 11 is a diagram for explaining an application example of the semiconductor laser condensing device 1.

FIG. 12 is a diagram for explaining an application example of the semiconductor laser condensing device 1.

FIG. 13 is a diagram for explaining another embodiment in the configuration of the optical fiber array 20. 14 is a diagram showing an example of a tip portion of the optical fiber array shown in FIG.

15 is a diagram for explaining a method of integrally forming a lens portion on the incident surface side of the optical fiber array shown in FIG.

FIG. 16 is a view (perspective view) for explaining another embodiment in the method of integrally forming the lens portion on the incident surface side of the optical fiber array shown in FIG.

Explanation of symbols

1 Semiconductor laser concentrator

10 Semiconductor laser array

12a 'to 12g Light emitting part

20 Optical fiber array

21 Integrated part

22a 'to 22g optical fiber

23a Clad member

24a Core material

26 Groove array

29 Pandol Club

30 Condensing means

31, 32 lenses

40 Optical fiber for transmission

50 substrates

60 heat sink

70 fins

80 Optical fiber for fiber laser

81 dichroic mirror

82 lenses

83 FBG

BEST MODE FOR CARRYING OUT THE INVENTION

The best mode for carrying out the present invention will be described below with reference to the drawings. All

Thus, the X-axis direction indicates the short-axis direction, the Y-axis direction indicates the long-axis direction, and the Z-axis direction indicates the emission direction of the laser light emitted from the light emitting unit.

4 to 6 show an example of a laser focusing device including the optical fiber array 20 of the present invention and the semiconductor laser focusing device 1 of the present invention.

參 [Configuration of optical fiber array (Figure 4)]

As shown in the example of FIG. 4, the optical fiber array 20 of the present invention is configured such that each incident surface of each optical fiber (22a, 22b) corresponds to each light emitting unit in accordance with the interval in the minor axis direction of the light emitting unit of the semiconductor laser array 10. (The center interval in the minor axis direction of the adjacent light emitting units is the same as the center interval in the minor axis direction of the incident surface of the adjacent optical fiber).

Then, an integrated part 21 is formed around the incident surface of the adjacent optical fiber, which is solidified with a solid material (for example, ultraviolet curing resin, quartz compound (polysilane, polysilazane) or epoxy adhesive). Each optical fiber (22a, 22b '·) constitutes an optical fiber array 20.

Further, a lens portion for condensing incident laser light is formed on the incident surface side of the optical fiber (22a, 22b) in the integrated portion 21, and the lens portion will be described later.

[0020] 參 [Configuration of Semiconductor Laser Concentrator 1 (Figure 5)]

As shown in the example of FIG. 5, the semiconductor laser condensing device 1 of the present invention includes a semiconductor laser array 10 and an optical fiber array 20.

Then, the semiconductor laser array 10 and the integrated portion 21 (optical fiber array 20) are arranged so that each incident surface of the integrated portion 21 faces each light emitting portion (12a to 12g, see FIG. 1) of the semiconductor laser array 10. Positioning.

Outgoing surface force of optical fiber array 20 There are various forms of condensing means 30 for condensing light to optical fiber 40 for transmission. In the example of Fig. 5, NA conversion optical system using lenses 31 and 32 is used. In this example, laser light emitted from the semiconductor laser array is used as a direct processing light source. In the description of FIG. 11 and FIG. 12, which will be described later, an example of using V as a direct processing light source and an example of using it as excitation light of a solid-state laser will be described.

The emission surface of the optical fiber array 20 is bundled (bundled) as shown in FIG. 6. The radius is rl and the spread angle of the emitted laser light is 01. Also with lenses 31 and 32 If the radius of the incident surface of the transmission optical fiber 40 on which the focused laser beam is incident is r2, and the incident angle of the incident laser beam is 02, then rl * Θl = r2 * θ2.

Furthermore, if the numerical aperture of the transmission optical fiber 40 is ΝΑ, the laser light emitted from the optical fiber array 20 is used for transmission by selecting appropriate rl, r2, NA so that sin Θ2 is NA. It can efficiently enter the optical fiber 40.

[0022] 參 [Structure and function of integrated part 21 (Fig. 7, Fig. 8)]

Next, the structure and function of the integrated part 21 will be described with reference to FIGS. 7 is a view of the light emitting portion 12a, the integrated portion 21 and the optical fiber 22a of the semiconductor laser array 10 in FIG. 4 as seen from the short axis direction (X axis direction), and FIG. 8 is the long axis direction (Y axis direction). ).

As shown in FIG. 7, a lens portion for converging the incident laser beam L1 is formed on the incident surface side of the optical fiber 22a in the integrated portion 21, and the lens portion refracts the laser beam L1. It is possible to guide the light into the optical fiber 22a with a small divergence angle (refracted so as to be almost parallel light), and to properly guide the light into the core 24a covered with the cladding 23a. It is. The lens portion is integrally formed in a convex shape with respect to the major axis direction in the integral portion 21 (the forming method will be described later in the description of FIGS. 9 and 10).

In the example of Fig. 8, the lens shape is not formed in the minor axis direction, but the minor axis direction is wide and the angle is small. The laser light L 1 can be guided.

Of course, a lens portion may be formed on the incident surface of each optical fiber so as to be further convex in the minor axis direction, but the curved surface in the major axis direction and the curved surface in the minor axis direction have different curvatures.

[0023] 方法 [Production Method of Optical Fiber Array 20 with Lens Part Integrated (FIGS. 9 and 10)] Next, using FIG. 9 and FIG. An example of a manufacturing method (a method for forming the integral part 21 and a method for integrally forming the lens part) will be described. First, a groove array 26 is prepared in which V-grooves are formed at the center interval (interval in the short axis direction) of the light emitting portions 12x of the semiconductor laser array 10 (FIG. 9). The number of V-grooves is the same as or more than the number of light emitting parts. The shape of the groove is not limited to the V-groove, and various shapes of grooves can be used. Then, as shown in the example of FIG. 10, the same number of optical fibers 22η as the number of light emitting portions are arranged in the V-groove so that the tip portion protrudes from the groove array 26. Then, the projecting tip is solidified with a solid material such as an ultraviolet curable resin, a quartz compound (polysilane, polysilazane), or an adhesive such as epoxy to form an integral part 21. In the next step, the lens portion is integrally formed by grinding from the tip of the integral portion 21 with a processing tool Τ (in this example, a rotating grindstone). Therefore, when the integral portion 21 is formed (before the lens portion is formed). ), The incident surface of the optical fiber may be covered with the adhesive or the like, or the protruding length from the groove array 26 may not be uniform.

Then, the inner wall Ta of the machining tool is integrated with the machining tool 有する whose inner wall Ta has a concave shape with respect to the major axis direction (in this example, the rotating grindstone T (the rotation axis is parallel to the major axis direction)). While pressing against part 21, it moves in the short axis direction (X-axis direction) to adjust the shape and expose the incident surface of each optical fiber to the surface. The lens part) is integrally formed. Since it is integrally formed, it can be formed easily in a short time. The machining tool T is not limited to a rotating grindstone as long as it can transfer the shape of the inner wall Ta, and may be a machining tool that reciprocally vibrates in the short axis direction, for example.

The groove array 26 may be removed after the lens portion is formed, or may be attached as the condensing optical fiber portion 20 as it is.

In the integrated portion 21 in which the lens portions are formed as described above, the lens portions having the same shape are formed on the incident surfaces of the optical fibers, and the intervals between the incident surfaces of the optical fibers are the same as the intervals between the light emitting portions.

Therefore, the laser beam emitted from the plurality of light emitting portions can be appropriately incident on each of the plurality of optical fibers only by positioning the semiconductor laser array 10 and the integrated portion 21, which is very convenient, Loss due to misalignment can be suppressed.

In addition, since each lens part is integrally formed and the variation in the shape of each lens part is very small (the variation in the focal length is very small), the loss due to the positional deviation can be further suppressed.

If you want to process (form) the lens so that it is convex in the minor axis direction, Each of the optical fibers using a processing tool rotated at a predetermined angle (rotated so that the concave shape of the inner wall Ta becomes concave in the minor axis direction, but the curvature of the concave shape of the inner wall Ta is different from that of the above processing tool T). The lens part may be processed by moving in the long axis direction (Y-axis direction) while pressing against the incident surface.

[0025] [Application example of semiconductor laser condensing device 1 (Fig. 11, Fig. 12)]

The example shown in FIG. 11 uses six sets of the semiconductor laser array 10 and the optical fiber array 20 constituting the semiconductor laser condensing device 1 of the present invention. The emission surface of each optical fiber array 20 is bundled by a bundle unit 29, and is composed of a lens 31 (a collimating lens that converts the light into parallel light) and a lens 32 (a condensing lens that reduces the diameter of the laser light of the parallel light). The laser beam L1 emitted from the bundle unit 29 is collected using the condensing means and incident on the transmission optical fiber 40, and the laser beam is extracted from the emission surface of the transmission optical fiber 40. In this example, laser light emitted from the semiconductor laser array 10 is directly used as a processing light source.

The semiconductor laser array 10 and the integrated portion 21 of the optical fiber array 20 are fixed to the same member (a substrate 50 for heat release, which is made of a metal having a high thermal conductivity). Even if the substrate 50 expands according to the coefficient of thermal expansion due to the heat generated by the semiconductor laser array 10 or the integrated part 21, the thermal expansion coefficient is different between the position where the semiconductor laser array 10 is fixed and the position where the integrated part 21 is fixed. Since there is no difference (because they are the same member) and they are fixed in the same direction, even if thermal expansion occurs, the same amount acts in the same direction, and displacement due to temperature changes can be suppressed. The loss can be further suppressed.

In FIG. 11, a heat sink 60 and a fan 70 are further provided on the substrate 50 to dissipate heat. It is also possible to make a pass hole in the substrate 50 and cool it with a fluid such as water or oil.

The example shown in FIG. 12 uses six sets of the semiconductor laser array 10 and the optical fiber array 20 that constitute the semiconductor laser condensing device 1 of the present invention, as in FIG. 11 differs from the configuration shown in FIG. 11 from the bundle portion 29 of the optical fiber array 20.

In FIG. 12, reference numeral 80 denotes an optical fiber for a fiber laser having a core portion doped with a rare earth element (the periphery of the core portion is composed of a cladding portion for confining incident excitation light). Excitation light (in this case, emitted from the semiconductor laser array) When the laser beam is incident, the core part is excited and (oscillation) laser light is generated in the core part. The (oscillation) laser light is emitted from both ends of the optical fiber 80 for fiber laser. The FBG (fiber Bragg grating) is provided on the end surface opposite to the end surface on the incident surface side of the excitation light. The light is reflected back to the incident surface side, and (oscillation) laser light is extracted from the incident surface side of the excitation light.

[0027] In the fiber laser optical fino 80, the laser beam generated in the direction facing the FBG side but reflected by the FBG and generated in the direction facing the incident surface side (oscillation) ) Laser light is superimposed and the core force on the incident surface is emitted. The emitted (oscillation) laser light is converted into parallel light by the lens 32, and the traveling direction is further converted by the dichroic mirror 81. The lens 32 functions as a condensing lens for reducing the diameter of the laser light (excitation light) emitted from the semiconductor laser array 10 so as to guide the laser light to the optical fiber 80 for fiber laser. For the (oscillation) laser light emitted from the laser optical fiber 80, it functions as a collimating lens that converts the (oscillation) laser light into parallel light. The dichroic mirror 81 transmits light having the wavelength of the excitation light (in this case, the laser light emitted from the semiconductor laser array 10), and is emitted from the (oscillation) laser light (fiber optical fiber 80). Laser light) is reflected.

The (oscillation) laser light reflected by the dichroic mirror 81 is reduced in diameter by the condenser lens 82 and is incident on the incident surface of the transmission optical fiber 40. The exit surface force of the transmission optical fiber 40 also extracts the laser beam. In this example, laser light emitted from the semiconductor laser array 10 is used as excitation light.

The integrated part 21 of the semiconductor laser array 10 and the optical fiber array 20 is fixed to the same member (such as the heat-dissipating substrate 50), and the loss power and the points are the same as in FIG. Omitted.

[0028] [Other Embodiments of Optical Fiber Array Configuration and Manufacturing Method (FIGS. 13 to 16)]

Next, another embodiment in the configuration of the optical fiber array 20 will be described with reference to FIG. 13, and another embodiment in the method for manufacturing the optical fiber array 20 will be described with reference to FIGS.

As shown in Fig. 13, two planes that face each other perpendicular to the long axis direction (Y-axis direction) A fixing member is formed by the fixing plates 21a and 21b, and the tip portions on the incident surface side of the plurality of optical fibers 22a to 22e are sandwiched and fixed by the fixing plates 21a and 21b to form an integrated portion. In the example of FIG. 13, the force fixing plate 21a or 21b in which the fixing member is configured by one fixing plate 21a and one fixing plate 21b may be configured by two or more fixing plates.

In the example of FIG. 13, in order to position the optical fibers 22a to 22e more stably, the front ends of the optical fibers 22a to 22e are fixed to the fixing plate 21b that sandwiches the front ends of the optical fibers 22a to 22e. The force fixing plate 27 provided with the fixing plate 27 that sandwiches the rear a little may be omitted. The fixing plates 21b and 27 are fixed to the fixing plate 21a with screws 21η.

In at least one fixing plate (fixing plate 21a in the example of FIG. 13), grooves 21m (for example, V grooves) are formed at intervals in the minor axis direction of the light emitting portions of the semiconductor laser array 10. The optical fibers 22a to 22e are positioned in the minor axis direction at intervals of the grooves 21m, and are positioned on the surface of the fixing plate 21a that is orthogonal to the major axis direction. Of course, a groove 21m may be provided on both the fixing plates 21a and 21b.

Further, as the material of the fixing plates 21a and 21b, for example, metal or glass that is relatively heat resistant (melting point is higher than that of the optical fiber) can be used. As a result, compared with the case where the fixing member is formed of a relatively heat-sensitive material such as adhesive or resin, the leaked laser light (generally shown in FIG. 1) when the laser light is incident on the incident surface of the optical fiber. The laser beam included in the range indicated by L1 in Fig. 3 is approximately 86%, and the remaining 14% of the laser beam leaks outside the range indicated by L1. can do. The fixing plate 21a and the fixing plate 21b may be made of different materials!

Next, a method for manufacturing the optical fiber array 20 will be described with reference to FIGS.

The manufacturing method shown in FIG. 14 and FIG. 15 uses the same processing tool T (the processing tool whose inner wall Ta is concave in the long axis direction) as the manufacturing method described in FIG. By pressing the incident surface side force of the optical fiber at, the machining tool T is moved in the minor axis direction (X axis direction), and grinding, cutting or polishing is performed, so that the convex lens part is formed with respect to the major axis direction. These are formed integrally on the incident surface of each optical fiber. The optical fiber array in this case may have the configuration shown in FIG. 10 or the configuration shown in FIG.

[0031] In addition, the manufacturing method shown in FIG. A substantially cylindrical rotating grindstone is used. Then, by moving the processing tool T along the shape of the lens portion that is formed in a convex shape with respect to the major axis direction, the incident light is refracted in the major axis direction so as to be refracted in the major axis direction. A convex lens part is integrally formed on the incident surface of each optical fiber. In this case, the optical fiber array may have the configuration shown in FIG. 10 or the configuration shown in FIG.

[0032] As still another manufacturing method, the optical fiber and the fixing member are made of the same material or a material having a close melting point. The optical fiber array in this case may have the configuration shown in FIG. 10 or the configuration shown in FIG.

Then, the incident surface side of the optical fiber in the integrated part is melted by heating or the like, and a mold (metal or cemented carbide mold) for forming (transferring) the lens part is pressed against the long axis direction. A convex lens portion is integrally formed on the incident surface of each optical fiber (not shown).

[0033] As described above, a spherical lens (or an aspheric surface (curvature of curvature) is integrally formed on the incident surface of each optical fiber by simultaneously processing the integrated portion integrated with the optical fiber and the fixing member. Non-constant spherical lens), or cylindrical lens (or non-cylindrical (cylindrical cylinder) lens). Since a lens part of an arbitrary shape can be formed by processing, each optical fiber has an appropriate shape that can further suppress loss and an appropriate position (position aligned with each optical fiber). A lens portion can be formed on the incident surface. In addition, in the configuration of the optical fiber array shown in FIG. 13, an optical fiber array that can prevent burning can be configured by appropriately selecting the material of the fixing plates 21a and 21b.

In addition, if the fixing member is made of the same or similar material as the optical fiber, the processing accuracy can be further improved, the uneven wear of the processing tool T is suppressed, and the shape of the lens part after processing is lost. Is less likely to occur.

[0034] The optical fiber array 20 and the semiconductor laser condensing device 1 of the present invention are not limited to the appearance, configuration, structure, and the like described in the present embodiment, and various modifications can be made without departing from the scope of the present invention. Can be added and deleted.

In addition, the numerical values used in the description of the present embodiment are examples, and are not limited to these numerical values.

Further, the optical fiber array 20 described in the present embodiment is a semiconductor laser array. It is not limited to the condensing of the laser beam, but is emitted from an array-shaped light source in which a plurality of light emitting sections emitting light that travels in an elliptical shape in the major axis direction and the minor axis direction are arranged in the minor axis direction. It can be used for the purpose of collecting each light.

Claims

The scope of the claims

[1] A light-emitting portion that emits light that travels while spreading in an elliptical shape is configured by a plurality of optical fibers that receive light emitted from an array-shaped light source that is arranged in a plurality in the short axis direction of the ellipse. An optical fiber array,

Each optical fiber is arranged so that each incident surface of each optical fiber faces each light emitting part according to the interval in the minor axis direction of the light emitting part,

The incident surface side of each optical fiber is fixed by a fixing member to form an integral part of the fixing member and the incident surface of the optical fiber.

On the incident surface side of each optical fiber in the integrated part, a lens part that collects the incident light is pressed against the mold by polishing iJ, cutting iJ, or polishing or melting. Therefore, the optical fiber array formed.

[2] The optical fiber array according to claim 1,

The fixing member is an optical fiber array made of a solid material that hardens the tip portions on the incident surface side of the plurality of optical fibers.

[3] The optical fiber array according to claim 1,

The fixing member is composed of at least two fixing plates in which planes orthogonal to the major axis direction of the ellipse are opposed to each other, and the tip portions on the incident surface side of the plurality of optical fibers are the above-mentioned An optical fiber array that is sandwiched and fixed by a fixed plate.

[4] The optical fiber array according to claim 3,

An optical fiber array in which a groove for positioning the optical fiber is formed in at least one of the fixing plates at an interval in the minor axis direction of the light emitting unit.

[5] The optical fiber array according to any one of Claims 1 to 4!

The optical fiber array, wherein the lens portion is integrally formed in a convex shape with respect to the major axis direction so that light incident on the integral portion is refracted in the major axis direction.

[6] The optical fiber array according to any one of claims 1 to 5,

A semiconductor laser condensing device provided with a semiconductor laser array in which a plurality of light emitting portions for emitting laser light traveling while spreading in an elliptical shape are arranged in the short axis direction of the ellipse as the arrayed light source. And The semiconductor laser array and the integrated part are positioned so that each of the light emitting parts and each of the incident surfaces on which the lens parts are formed face each other, and laser light emitted from each light emitting part is sent to each of the light emitting parts. A semiconductor laser condensing device that collects light by entering an optical fiber.

[7] The semiconductor laser condensing device according to claim 6,

A semiconductor laser condensing device in which the semiconductor laser array and the integral part are fixed on the same member.

[8] A light emitting portion that emits light that travels while spreading in an elliptical shape is configured by a plurality of optical fibers that receive light emitted from an array-shaped light source that is arranged in a plurality in the minor axis direction of the ellipse. An optical fiber array manufacturing method comprising:

Each optical fiber is arranged so that each incident surface of each optical fiber faces each light emitting part in accordance with the interval in the minor axis direction of the light emitting part,

The incident surface side of each optical fiber is fixed with a fixing member, and an integral part is formed by the fixing member and the incident surface of the optical fiber,

The machining tool having a concave shape with respect to the major axis direction is pressed from the incident surface side of the optical fiber in the integrated portion to move the machining tool in the minor axis direction, and the incident light is incident on the major axis. A method of manufacturing an optical fiber array, in which a lens portion having a convex shape with respect to the major axis direction is integrally formed on an incident surface of each optical fiber so as to be refracted in a direction.

[9] A light emitting portion that emits light that travels while spreading in an elliptical shape is configured by a plurality of optical fibers that receive light emitted from an array-shaped light source that is arranged in a plurality in the minor axis direction of the ellipse. An optical fiber array manufacturing method comprising:

On the incident surface side of the optical fiber in the integrated part, a cylindrical processing tool having a rotation axis parallel to the short axis direction is applied to the integrated part so that incident light is refracted in the long axis direction. Is moved so as to be convex in the major axis direction, and the convex lens portion with respect to the major axis direction is moved to each optical fiber so that incident light is refracted in the major axis direction. A method of manufacturing an optical fiber array integrally formed on the incident surface of the bar.

[10] A light-emitting portion that emits light that travels while spreading in an elliptical shape is configured by a plurality of optical fibers that receive light emitted from an array-shaped light source that is arranged in a plurality in the minor axis direction of the ellipse. An optical fiber array manufacturing method comprising:

The optical fiber and the fixing member are made of the same material or a material having a melting point close to each other, and the incident light side of the optical fiber in the integrated portion is melted and pressed against the mold so that the incident light is A method of manufacturing an optical fiber array, wherein a lens portion convex to the major axis direction is integrally formed on an incident surface of each optical fiber so as to be refracted in the axial direction.

[11] A method of manufacturing an optical fiber array according to any one of claims 8 to 10,

In each groove of the groove array in which a plurality of grooves are formed at intervals in the minor axis direction of the light emitting portion, each optical fiber is arranged so that the tip portion protrudes from the groove array force,

A method of manufacturing an optical fiber array, wherein the protruding tip portion is fixed by the fixing member to form the integrated portion.