WO2007105011A1 - Thermal diffusion barrier - Google Patents
Thermal diffusion barrier Download PDFInfo
- Publication number
- WO2007105011A1 WO2007105011A1 PCT/GB2007/050098 GB2007050098W WO2007105011A1 WO 2007105011 A1 WO2007105011 A1 WO 2007105011A1 GB 2007050098 W GB2007050098 W GB 2007050098W WO 2007105011 A1 WO2007105011 A1 WO 2007105011A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermal barrier
- thermal
- coil
- barrier
- barrier according
- Prior art date
Links
- 230000004888 barrier function Effects 0.000 title claims abstract description 48
- 238000009792 diffusion process Methods 0.000 title abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 34
- 230000008859 change Effects 0.000 claims abstract description 5
- 239000002131 composite material Substances 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims description 7
- 229910052734 helium Inorganic materials 0.000 claims description 4
- 239000001307 helium Substances 0.000 claims description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 4
- 238000002595 magnetic resonance imaging Methods 0.000 claims description 4
- 239000011148 porous material Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 229910052691 Erbium Inorganic materials 0.000 claims description 2
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 2
- 229910052689 Holmium Inorganic materials 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 claims description 2
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 claims description 2
- DQZARQCHJNPXQP-UHFFFAOYSA-N gadolinium;sulfur monoxide Chemical compound [Gd].S=O DQZARQCHJNPXQP-UHFFFAOYSA-N 0.000 claims description 2
- KJZYNXUDTRRSPN-UHFFFAOYSA-N holmium atom Chemical compound [Ho] KJZYNXUDTRRSPN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000010791 quenching Methods 0.000 abstract description 4
- 230000000171 quenching effect Effects 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract 1
- 239000000835 fiber Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 239000002887 superconductor Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L59/00—Thermal insulation in general
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L59/00—Thermal insulation in general
- F16L59/02—Shape or form of insulating materials, with or without coverings integral with the insulating materials
- F16L59/029—Shape or form of insulating materials, with or without coverings integral with the insulating materials layered
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C13/00—Details of vessels or of the filling or discharging of vessels
- F17C13/001—Thermal insulation specially adapted for cryogenic vessels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/14—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by endowing the walls of conduits with zones of different degrees of conduction of heat
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F6/00—Superconducting magnets; Superconducting coils
- H01F6/02—Quenching; Protection arrangements during quenching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F6/00—Superconducting magnets; Superconducting coils
- H01F6/04—Cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F6/00—Superconducting magnets; Superconducting coils
- H01F6/06—Coils, e.g. winding, insulating, terminating or casing arrangements therefor
Definitions
- the invention is concerned with barriers to thermal diffusion and has particular utility in superconducting coils.
- Magnetic Resonance Imaging (MRI) scanners employ superconducting coils to generate the strong magnetic fields necessary for operation of the instrument.
- the coil is maintained at a low temperature (typically about 4K) by means of a cryogenic refrigerant.
- the invention provides a thermal diffusion barrier which achieves improved thermal isolation between, for example, a coil and an interface plane without use of excessive material thickness.
- a thermal diffusion barrier comprises the features set out in claim 1 attached hereto.
- a thermal diffusion barrier comprises the features set out in claim 10 attached hereto.
- a thermal diffusion barrier comprises the features set out in claim 17 attached hereto.
- a thermal diffusion barrier 1 is located between a superconducting coil 2 and a support structure 3. Relative movement of the barrier 1 against the support structure 3 gives rise to heat Q which, to some extent, passes through the barrier and causes a local temperature rise in the coil 2.
- a porous layer loaded with fluid serves as the thermal diffusion barrier 1 between the coil 2 and the support structure 3.
- the porous layer is loaded with a fluid that has a high specific heat capacity, for example helium (volume specific heat of 3.7 x 10 '3 J/cc/K), to provide a barrier having a greater capacity to absorb heat generated at the barrier/former interface, thus protecting the coil.
- a fluid that has a high specific heat capacity for example helium (volume specific heat of 3.7 x 10 '3 J/cc/K), to provide a barrier having a greater capacity to absorb heat generated at the barrier/former interface, thus protecting the coil.
- the porous layer could be realised as multiple layers of epoxy impregnated cloth.
- An open weave cloth would be suitable for this purpose, that is a woven fibre material wherein the gaps between the material strands are of a similar size to, or greater than, the size of the strands themselves.
- the thermal barrier 1 comprises a high specific heat capacity solid state composite.
- the composite takes the form of a filled resin comprising a material with a low temperature magnetic phase change causing it to have a high specific heat capacity in the temperature range where the phase change occurs.
- a material with a low temperature magnetic phase change causing it to have a high specific heat capacity in the temperature range where the phase change occurs.
- Such materials are typically compounds based on the heavy transition elements, Holmium, Erbium or Gadolinium.
- the preferred material for this application would be Gadolinium Oxysulphide (GOS) having a phase change in the 4 - 5.5K temperature range and being of reasonable cost.
- GOS Gadolinium Oxysulphide
- the material is used in powder form dispersed within an epoxy resin (bisphenol epoxy).
- This filled resin may be further combined with a filamentary material such as glass or polymer fibres to create mechanical properties which match those of the coil.
- the anisotropic barrier necessary for one embodiment of the invention could be realised as a plurality of layers of material wherein alternate layers have high (layers 4) and low (layers 5) thermal conductivity.
- High conductivity layers would typically be metallic in nature while low conductivity layers would be polymer based.
- thermo diffusion barrier having a plurality of layers wherein alternate layers are materials of high thermal conductivity (for example metal foil) and porous material impregnated with helium.
- These structures bonded into the coil block can also include mechanisms for direct cooling of the coils and interface.
- cooling tubes, carrying liquid cryogens can also be embedded, improving their efficiency.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Magnetic Resonance Imaging Apparatus (AREA)
- Containers, Films, And Cooling For Superconductive Devices (AREA)
Abstract
Thermal diffusion barrier is described which provides improved thermal insulation between two regions. It has particular utility in the field of superconducting magnets where small localised temperature rises can lead to quenching of the magnet. A number of embodiments are described utilizing materials having anisotropic thermal conductivity; high specific heat capacity and low temperature magnetic phase change.
Description
Thermal Diffusion Barrier
The invention is concerned with barriers to thermal diffusion and has particular utility in superconducting coils.
Medical equipment such as Magnetic Resonance Imaging (MRI) scanners employ superconducting coils to generate the strong magnetic fields necessary for operation of the instrument. In order to achieve the superconducting state, the coil is maintained at a low temperature (typically about 4K) by means of a cryogenic refrigerant.
Failure to control the coil temperature can lead to quenching, where the coil enters a normal conducting state and the magnetic field collapses. This can occur as a result of localised heating in the coil which causes a localised increase in resistance. The increased resistance gives rise to further temperature rises which in turn gives rise to further increased resistance and so on. Thus, a localised temperature rise can give rise to complete quenching of the coil in a very short time. Typically a temperature increase of O.δKelvin for more than 10 ms will be sufficient to initiate the event
Electromagnetic forces generated within superconducting coils induce small discrete wire or bulk movements, particularly circumferential expansion of the coil structure. In multi-coil systems, the coils experience whole body forces which are restrained through interaction with a mechanical structure. Movement at the interface between the coil and the restraining former is a mechanism for energy release. Since materials (particularly solids) generally have low specific heat capacity at low temperature, the energy released at this interface is capable of locally raising the temperature of the superconductor above its critical temperature and inducing a quench.
Energy release at the interface has previously been limited through a number of techniques. Bonding the coil to the support structure can be employed but is often unreliable due to weaknesses in the bond, and the effect of stress transferred into the coil structure.
More generally, a low friction interface has been created through the use of flouropolymer materials to minimise energy dissipation.
In another approach, a layer of low thermal conductivity material bonded to the coil structure acts as a thermal barrier. This is normally a fibre composite. Although fibre composites offer better specific heat capacity than many homogeonous materials, their properties are still poor at low temperature and significant thicknesses must be used to achieve any benefit.
This introduces a further problem of delamination if the thermal and mechanical properties of the composite are not well matched to those of the coil.
There are examples were thermally and mechanically matched materials have also been employed with limited success (e.g. copper or aluminium rings).
The invention provides a thermal diffusion barrier which achieves improved thermal isolation between, for example, a coil and an interface plane without use of excessive material thickness.
According to a first aspect of the invention, a thermal diffusion barrier comprises the features set out in claim 1 attached hereto.
According to a second aspect of the invention, a thermal diffusion barrier comprises the features set out in claim 10 attached hereto.
According to a third aspect of the invention, a thermal diffusion barrier comprises the features set out in claim 17 attached hereto.
Referring to figure 1 , a thermal diffusion barrier 1 is located between a superconducting coil 2 and a support structure 3. Relative movement of the barrier 1 against the support structure 3 gives rise to heat Q which, to some extent, passes through the barrier and causes a local temperature rise in the coil 2.
In one embodiment, a porous layer loaded with fluid serves as the thermal diffusion barrier 1 between the coil 2 and the support structure 3.
Most solid state materials have very low specific heat capacities (for example Copper has a volume specific heat of 8.1 x 10'4 J/cc/K) which renders them unsuitable as thermal insulators for superconducting coils: only a small amount of heat is required to raise the temperature of the material and consequently that of the coil.
In this embodiment the porous layer is loaded with a fluid that has a high specific heat capacity, for example helium (volume specific heat of 3.7 x 10'3 J/cc/K), to provide a barrier having a greater capacity to absorb heat generated at the barrier/former interface, thus protecting the coil.
The porous layer could be realised as multiple layers of epoxy impregnated cloth. An open weave cloth would be suitable for this purpose, that is a woven fibre material wherein the gaps between the material strands are of a similar size to, or greater than, the size of the strands themselves.
In another embodiment of the invention, the thermal barrier 1 comprises a high specific heat capacity solid state composite.
The composite takes the form of a filled resin comprising a material with a low temperature magnetic phase change causing it to have a high specific heat capacity in the temperature range where the phase change occurs. Such materials are typically compounds based on the heavy transition elements, Holmium, Erbium or Gadolinium. The preferred material for this application would be Gadolinium Oxysulphide (GOS) having a phase change in the 4 - 5.5K temperature range and being of reasonable cost.
The material is used in powder form dispersed within an epoxy resin (bisphenol epoxy). This filled resin may be further combined with a filamentary material such as glass or polymer fibres to create mechanical properties which match those of the coil.
Referring to figure 2 another thermal diffusion barrier 1 a according to the current invention comprises a barrier having anisotropic thermal conductivity, and is arranged so that the thermal conductivity Ky in a direction substantially parallel with the interface between the barrier 1 and the coil 2 is greater than the thermal conductivity Kx in a direction substantially normal to the interface.
This arrangement provides an increased tendency for heat to dissipate along the thermal diffusion barrier 1 rather than passing through to cause localized heating of the coil.
Referring to figure 3, the anisotropic barrier necessary for one embodiment of the invention could be realised as a plurality of layers of material wherein alternate layers have high (layers 4) and low (layers 5) thermal conductivity.
Multiple layer composite comprising alternate layers of high and low thermal conductivity material produces bulk thermal conductivity which is higher in the in- layer directions than the perpendicular one, This has the effect of dispersing a transient energy pulse liberated at a point on one side of the layer resulting in a significantly lower energy density at the coil. High conductivity layers would typically be metallic in nature while low conductivity layers would be polymer based.
The presence of high conductivity material between the former and coil would increase the thermal conductivity and so for a steady state distributed heat input would produce a poorer condition than the low conductivity material alone. However the nature of the energy input is both transient and localised so that the ratio of the conductivity in the perpendicular directions reduces the energy density at the coil surface. It can be shown that the ratio of conductivities in the two directions is approximately equal to the ratio of the two material conductivities. Typically, conductivity ratios of 10 can be achieved between metallic and composite materials.
The embodiments described above may be combined to provide a thermal diffusion barrier having a plurality of layers wherein alternate layers are materials of high thermal conductivity (for example metal foil) and porous material impregnated with helium.
Use of a filled resin bonding agent for the porous layers has the additional advantage of providing the coil against mechanical damage during assembly and wiring of the magnet system.
These structures bonded into the coil block can also include mechanisms for direct cooling of the coils and interface. In this configuration, cooling tubes, carrying liquid cryogens, can also be embedded, improving their efficiency.
Claims
1. A thermal barrier between two regions, said barrier having anisotropic thermal conductivity and being arranged such that the thermal conductivity of the barrier in a direction substantially parallel with an interface between the barrier and one of the regions is greater than the thermal conductivity in a direction substantially normal to said interface.
2. A thermal barrier according to claim 1 , comprising at least one layer of a first material and one layer of a second material, the first material having a higher thermal conductivity than the second material.
3. The thermal barrier of claim 2, comprising a plurality of layers of the first material arranged alternately with a plurality of layers of the second material.
4. The thermal barrier of claim 3 where first material comprises a metal.
5. The thermal barrier of claim 4 where the second material comprises a polymer.
6. The thermal barrier of claim 4 wherein the second material comprises a porous material impregnated with fluid.
7. The thermal barrier of claim 6 wherein the fluid is helium.
8 A thermal barrier according to claim 7, arranged between a superconducting coil and a support structure for the coil.
9. A thermal barrier according to claim 8, incorporated in a Magnetic Resonance Imaging (MRI) scanner.
10. A thermal barrier comprising a porous material impregnated with a fluid.
1 1. A thermal barrier according to claim 10, arranged between a superconducting coil and a support structure for the coil.
12. A thermal barrier according to claim 1 1 , wherein the porous material comprises an open weave, epoxy resin impregnated cloth.
13. A thermal barrier according to claim 12 wherein the epoxy resin serves to bond the barrier to the superconducting coil and to the support structure.
14. A thermal barrier according to claim 13, where the fluid is helium.
15. A thermal barrier according to claim 14, further including at least one conduit, suitable for carrying fluid throughout the barrier.
16. A thermal barrier according to claim 15, incorporated in a Magnetic Resonance Imaging (MRI) scanner.
17. A thermal barrier comprising a solid state composite, which composite includes a material that undergoes a magnetic phase change at temperatures below 10K.
18. The thermal barrier of claim 17, wherein the material comprises a compound of holmium, erbium or gadolinium.
19. The thermal barrier of claim 18 where the material comprises gadolinium oxysulphide.
20. A thermal barrier according to claim 17, 18 or 19 arranged between a superconducting coil and a support structure for the coil.
21. A thermal barrier according to claim 20, incorporated in a Magnetic Resonance Imaging (MRI) scanner.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0604836A GB2435918B (en) | 2006-03-10 | 2006-03-10 | Thermal diffusion barrier |
| GB0604836.7 | 2006-03-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2007105011A1 true WO2007105011A1 (en) | 2007-09-20 |
Family
ID=36241352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/GB2007/050098 WO2007105011A1 (en) | 2006-03-10 | 2007-03-02 | Thermal diffusion barrier |
Country Status (2)
| Country | Link |
|---|---|
| GB (1) | GB2435918B (en) |
| WO (1) | WO2007105011A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130255506A1 (en) * | 2012-03-28 | 2013-10-03 | Gary S. Selwyn | Hollow-Cavity, Gas-Filled Cookware |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2454475A (en) * | 2007-11-07 | 2009-05-13 | Siemens Magnet Technology Ltd | A Heat Shield for an MRI scanner |
| US8415952B2 (en) * | 2009-12-23 | 2013-04-09 | General Electric Company | Superconducting magnet coil interface and method providing coil stability |
| EP2375545B1 (en) | 2010-04-06 | 2013-02-20 | Converteam Technology Ltd | Electrical machines |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3668880A (en) * | 1970-10-16 | 1972-06-13 | Martin Marietta Corp | Capillary insulation |
| GB1482182A (en) * | 1973-06-15 | 1977-08-10 | Matsushita Electric Ind Co Ltd | Electrical insulator comprising a synthetic polymer |
| US4756976A (en) * | 1983-09-30 | 1988-07-12 | Kabushiki Kaisha Toshiba | Ceramic with anisotropic heat conduction |
| EP0487352A2 (en) * | 1990-11-21 | 1992-05-27 | Kabushiki Kaisha Toshiba | Superconducting coil apparatus and method of manufacturing the same |
| US20030164749A1 (en) * | 1998-11-25 | 2003-09-04 | Gregory L. Snitchler | Superconducting conductors and their method of manufacture |
| US20040058188A1 (en) * | 2002-06-28 | 2004-03-25 | Groll William A. | Bonded metal components having uniform thermal conductivity characteristics and method of making same |
| WO2005008687A1 (en) * | 2003-07-17 | 2005-01-27 | Fuji Electric Systems Co., Ltd. | Superconducting wire and superconducting coil employing it |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CA981803A (en) * | 1964-05-15 | 1976-01-13 | Arthur R. Kantrowitz | Superconducting device |
| FR1486299A (en) * | 1965-07-14 | 1967-10-05 | ||
| GB1291939A (en) * | 1970-11-30 | 1972-10-04 | Rolls Royce | Flame shield for a gas turbine engine |
| DE2129071C3 (en) * | 1971-06-11 | 1974-11-21 | Linde Ag, 6200 Wiesbaden | Process for the production of a multi-layer vacuum insulation for pipes |
| US3948295A (en) * | 1972-07-17 | 1976-04-06 | Summa Corporation | Insulation system |
| SU804990A1 (en) * | 1978-12-12 | 1981-02-15 | Волгоградский Инженерно-Строительныйинститут | Heat-insulating element |
| DE2917844A1 (en) * | 1979-05-03 | 1980-11-06 | Kabel Metallwerke Ghh | Tube system for carrying cold liquid or gas - has gas absorber in thermal insulation vacuum, esp. for superconducting cable in liq. gas line |
| US5374476A (en) * | 1990-10-22 | 1994-12-20 | Ball Corporation | Thermal insulating system and method |
| US5737927A (en) * | 1996-03-18 | 1998-04-14 | Kabushiki Kaisha Toshiba | Cryogenic cooling apparatus and cryogenic cooling method for cooling object to very low temperatures |
| CN1239861C (en) * | 2001-06-18 | 2006-02-01 | 神岛化学工业株式会社 | Rare earth oxysulfide cold storage medium and cold storing machine |
| JP4104004B2 (en) * | 2002-03-22 | 2008-06-18 | 住友重機械工業株式会社 | Cold storage type cryogenic refrigerator |
| US20040076810A1 (en) * | 2002-10-17 | 2004-04-22 | Ucar Carbon Company Inc. | Composite high temperature insulator |
| US20040126597A1 (en) * | 2002-12-27 | 2004-07-01 | Cohen Lewis S. | Facing for insulation and other applications |
| SE527024E (en) * | 2004-04-23 | 2014-09-30 | Saint Gobain Isover Ab | Surface laminate material and insulation system including such a surface coating material |
| JP2006075756A (en) * | 2004-09-10 | 2006-03-23 | Matsushita Electric Ind Co Ltd | Gas adsorbent and heat insulator |
-
2006
- 2006-03-10 GB GB0604836A patent/GB2435918B/en not_active Expired - Fee Related
-
2007
- 2007-03-02 WO PCT/GB2007/050098 patent/WO2007105011A1/en active Application Filing
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3668880A (en) * | 1970-10-16 | 1972-06-13 | Martin Marietta Corp | Capillary insulation |
| GB1482182A (en) * | 1973-06-15 | 1977-08-10 | Matsushita Electric Ind Co Ltd | Electrical insulator comprising a synthetic polymer |
| US4756976A (en) * | 1983-09-30 | 1988-07-12 | Kabushiki Kaisha Toshiba | Ceramic with anisotropic heat conduction |
| EP0487352A2 (en) * | 1990-11-21 | 1992-05-27 | Kabushiki Kaisha Toshiba | Superconducting coil apparatus and method of manufacturing the same |
| US20030164749A1 (en) * | 1998-11-25 | 2003-09-04 | Gregory L. Snitchler | Superconducting conductors and their method of manufacture |
| US20040058188A1 (en) * | 2002-06-28 | 2004-03-25 | Groll William A. | Bonded metal components having uniform thermal conductivity characteristics and method of making same |
| WO2005008687A1 (en) * | 2003-07-17 | 2005-01-27 | Fuji Electric Systems Co., Ltd. | Superconducting wire and superconducting coil employing it |
| EP1653485A1 (en) * | 2003-07-17 | 2006-05-03 | Fuji Electric Systems Co., Ltd. | Superconducting wire and superconducting coil employing it |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130255506A1 (en) * | 2012-03-28 | 2013-10-03 | Gary S. Selwyn | Hollow-Cavity, Gas-Filled Cookware |
| US9125512B2 (en) * | 2012-03-28 | 2015-09-08 | Gary S. Selwyn | Hollow-cavity, gas-filled cookware |
Also Published As
| Publication number | Publication date |
|---|---|
| GB0604836D0 (en) | 2006-04-19 |
| GB2435918A (en) | 2007-09-12 |
| GB2435918B (en) | 2008-05-14 |
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