WO2007081827A3 - Low-profile articulated electronics enclosure with improved air coolant system - Google Patents

Low-profile articulated electronics enclosure with improved air coolant system Download PDF

Info

Publication number
WO2007081827A3
WO2007081827A3 PCT/US2007/000323 US2007000323W WO2007081827A3 WO 2007081827 A3 WO2007081827 A3 WO 2007081827A3 US 2007000323 W US2007000323 W US 2007000323W WO 2007081827 A3 WO2007081827 A3 WO 2007081827A3
Authority
WO
WIPO (PCT)
Prior art keywords
enclosure
interior
chassis
low
coolant system
Prior art date
Application number
PCT/US2007/000323
Other languages
French (fr)
Other versions
WO2007081827A2 (en
Inventor
David John Pongracz
Rodney Michael Sheman
Original Assignee
Lucent Technologies Inc
David John Pongracz
Rodney Michael Sheman
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc, David John Pongracz, Rodney Michael Sheman filed Critical Lucent Technologies Inc
Priority to JP2008550349A priority Critical patent/JP2009523323A/en
Priority to EP07716388A priority patent/EP1972186A2/en
Publication of WO2007081827A2 publication Critical patent/WO2007081827A2/en
Publication of WO2007081827A3 publication Critical patent/WO2007081827A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/03—Constructional details, e.g. casings, housings
    • H04B1/036—Cooling arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof
    • H05K5/0214—Venting apertures; Constructional details thereof with means preventing penetration of rain water or dust

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A system for housing electronic components includes an enclosure with an interior, a door for accessing the interior, and a chassis. The components are attached to the chassis, which is pivotally connected to the enclosure for movement between retracted and deployed positions. In the former, the chassis lies within the interior. In the latter, it lies rotated or swung out the front of the enclosure, allowing for the components to be accessed while minimizing the depth/size of the enclosure. The enclosure includes an air intake in the base of the enclosure, and air exhaust ports in the rear of the enclosure, both protected by baffles/louvers. Air is drawn through the intake (using a fan), up through the interior for cooling purposes, and out the rear of the enclosure through the exhaust ports. This pathway has been found to minimize the ingress of sprayed liquid, for compliance with IEC 1P44.
PCT/US2007/000323 2006-01-11 2007-01-09 Low-profile articulated electronics enclosure with improved air coolant system WO2007081827A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008550349A JP2009523323A (en) 2006-01-11 2007-01-09 Low profile anchored electronics enclosure with improved air cooling system
EP07716388A EP1972186A2 (en) 2006-01-11 2007-01-09 Low-profile articulated electronics enclosure with improved air coolant system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/330,975 2006-01-11
US11/330,975 US20070159791A1 (en) 2006-01-11 2006-01-11 Low-profile articulated electronics enclosure with improved air coolant system

Publications (2)

Publication Number Publication Date
WO2007081827A2 WO2007081827A2 (en) 2007-07-19
WO2007081827A3 true WO2007081827A3 (en) 2008-05-22

Family

ID=38134584

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/000323 WO2007081827A2 (en) 2006-01-11 2007-01-09 Low-profile articulated electronics enclosure with improved air coolant system

Country Status (5)

Country Link
US (1) US20070159791A1 (en)
EP (1) EP1972186A2 (en)
JP (1) JP2009523323A (en)
KR (1) KR20080081962A (en)
WO (1) WO2007081827A2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070171609A1 (en) * 2006-01-24 2007-07-26 Honeywell International, Inc. Electronic equipment enclosure with passive thermal vent door control
US8328026B2 (en) * 2007-02-22 2012-12-11 Tellabs Operations, Inc. Apparatus and method for configuring a dual rack-mountable chassis
US20090036049A1 (en) * 2007-07-30 2009-02-05 Lodhia Ashwin V Chassis having bottom and rear-provided air vents to enable airflow through the chassis
JP5747633B2 (en) * 2010-08-02 2015-07-15 富士電機株式会社 Electronics
US9408330B2 (en) 2012-04-18 2016-08-02 International Business Machines Coporation Apparatus to cool a computing device
EP2934077B1 (en) * 2012-12-17 2018-08-15 Hitachi Systems, Ltd. Heat shutter device
CN106533459B (en) * 2017-01-10 2019-06-25 广东合一新材料研究院有限公司 A kind of power amplifier in transmitter unit cooling system and method
US11139718B2 (en) * 2017-07-21 2021-10-05 Siemens Industry, Inc. Electric machine with auxiliary blower mounting arrangement and/or modular exhaust assembly
CN107241894B (en) * 2017-08-04 2019-05-14 新昌县吉鑫制冷设备有限公司 A kind of use for electronic products heat-dissipating casing
CN109057306B (en) * 2018-06-22 2020-10-16 焦作大学 Computer controller of hydraulic climbing frame system
US11432426B2 (en) * 2019-04-14 2022-08-30 Aertight Systems, Inc. Computer isolation housing
WO2020214838A1 (en) 2019-04-19 2020-10-22 Markem-Imaje Corporation Purged ink removal from print head
US11186086B2 (en) 2019-04-19 2021-11-30 Markem-Imaje Corporation Systems and techniques to reduce debris buildup around print head nozzles
US10952353B1 (en) * 2019-08-21 2021-03-16 Schneider Electric It Corporation Thermal buffering module for equipment rack
CN113163635A (en) * 2020-01-23 2021-07-23 华为技术有限公司 Electronic equipment outer cover and electronic equipment assembly
US12016153B2 (en) * 2022-07-20 2024-06-18 Crestron Electronics, Inc. Enhanced thermal management in electrical boxes

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5672102A (en) * 1996-08-21 1997-09-30 Toshiba America Information Systems, Inc. Dust reduction system for electronic enclosures

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3146048A (en) * 1962-07-27 1964-08-25 Sylvania Electric Prod Cabinet for electronic equipment
US5416427A (en) * 1993-02-11 1995-05-16 Tracewell Enclosures, Inc. Test and development apparatus for bus-based circuit modules with open side and backplane access features
US6554697B1 (en) * 1998-12-30 2003-04-29 Engineering Equipment And Services, Inc. Computer cabinet design
US6164369A (en) * 1999-07-13 2000-12-26 Lucent Technologies Inc. Door mounted heat exchanger for outdoor equipment enclosure
US6400567B1 (en) * 2000-10-19 2002-06-04 Fujitsu Network Communications, Inc. Equipment enclosure having separate compartments cooled by separate cooling airflows
US6486399B1 (en) * 2001-05-08 2002-11-26 Powerware Corporation Pole mount cabinet and method for assembling the same
US6628520B2 (en) * 2002-02-06 2003-09-30 Hewlett-Packard Development Company, L.P. Method, apparatus, and system for cooling electronic components
US6927977B2 (en) * 2002-02-12 2005-08-09 Siemens Communications, Inc. Blower exhaust for a closed frame
US6704198B2 (en) * 2002-06-12 2004-03-09 Avava Technology Corp. Equipment enclosure with heat exchanger
US6643130B1 (en) * 2002-07-08 2003-11-04 Demarchis John A. Wash down filtered fan apparatus
US6889752B2 (en) * 2002-07-11 2005-05-10 Avaya Technology Corp. Systems and methods for weatherproof cabinets with multiple compartment cooling

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5672102A (en) * 1996-08-21 1997-09-30 Toshiba America Information Systems, Inc. Dust reduction system for electronic enclosures

Also Published As

Publication number Publication date
US20070159791A1 (en) 2007-07-12
WO2007081827A2 (en) 2007-07-19
EP1972186A2 (en) 2008-09-24
JP2009523323A (en) 2009-06-18
KR20080081962A (en) 2008-09-10

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