WO2007078767A3 - Method and apparatus of using an atomizer in a two-phase liquid vapor enclosure - Google Patents

Method and apparatus of using an atomizer in a two-phase liquid vapor enclosure Download PDF

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Publication number
WO2007078767A3
WO2007078767A3 PCT/US2006/047542 US2006047542W WO2007078767A3 WO 2007078767 A3 WO2007078767 A3 WO 2007078767A3 US 2006047542 W US2006047542 W US 2006047542W WO 2007078767 A3 WO2007078767 A3 WO 2007078767A3
Authority
WO
WIPO (PCT)
Prior art keywords
atomizer
enclosure
phase liquid
liquid vapor
liquid
Prior art date
Application number
PCT/US2006/047542
Other languages
French (fr)
Other versions
WO2007078767A2 (en
Inventor
Brian A Scott
Original Assignee
Intel Corp
Brian A Scott
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp, Brian A Scott filed Critical Intel Corp
Publication of WO2007078767A2 publication Critical patent/WO2007078767A2/en
Publication of WO2007078767A3 publication Critical patent/WO2007078767A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)

Abstract

A two-phase liquid vapor enclosure is described. The enclosure includes an atomizer to spray fluid onto a heat evaporator surface. Fluid flows through a nozzle which atomizes the fluid into very small droplets. These small droplets vaporize upon reaching the heated evaporator surface. Once the vapor condenses to liquid, the liquid travels within the enclosure to recirculate to the atomizer.
PCT/US2006/047542 2005-12-28 2006-12-12 Method and apparatus of using an atomizer in a two-phase liquid vapor enclosure WO2007078767A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/321,245 2005-12-28
US11/321,245 US20070144199A1 (en) 2005-12-28 2005-12-28 Method and apparatus of using an atomizer in a two-phase liquid vapor enclosure

Publications (2)

Publication Number Publication Date
WO2007078767A2 WO2007078767A2 (en) 2007-07-12
WO2007078767A3 true WO2007078767A3 (en) 2007-12-21

Family

ID=37950217

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/047542 WO2007078767A2 (en) 2005-12-28 2006-12-12 Method and apparatus of using an atomizer in a two-phase liquid vapor enclosure

Country Status (3)

Country Link
US (1) US20070144199A1 (en)
TW (1) TWI326405B (en)
WO (1) WO2007078767A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201226828A (en) * 2010-12-24 2012-07-01 Transworld University Vaporization method
US8863821B2 (en) * 2011-04-18 2014-10-21 Empire Technology Development Llc Dissipation utilizing flow of refrigerant
US10010811B2 (en) 2013-05-28 2018-07-03 Empire Technology Development Llc Evaporation-condensation systems and methods for their manufacture and use
CN105324161B (en) 2013-05-28 2017-04-26 英派尔科技开发有限公司 Thin film systems and methods for using and making same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220804A (en) * 1991-12-09 1993-06-22 Isothermal Systems Research, Inc High heat flux evaporative spray cooling
WO1997043887A1 (en) * 1996-05-16 1997-11-20 Raytheon E-Systems, Inc. Heat spreader system and method for cooling heat generating components
WO1999022192A1 (en) * 1997-10-29 1999-05-06 Motorola Inc. Multi-mode, two-phase cooling module
US20030205054A1 (en) * 2000-12-04 2003-11-06 Fujitsu Limited High efficiency cooling system and heat absorbing unit

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE343217B (en) * 1970-07-23 1972-03-06 Lkb Medical Ab
US4790370A (en) * 1987-08-19 1988-12-13 Sundstrand Corporation Heat exchanger apparatus for electrical components
GB9312984D0 (en) * 1993-06-23 1993-08-04 Bespak Plc Atomising dispenser
US6349760B1 (en) * 1999-10-22 2002-02-26 Intel Corporation Method and apparatus for improving the thermal performance of heat sinks
US6498725B2 (en) * 2001-05-01 2002-12-24 Mainstream Engineering Corporation Method and two-phase spray cooling apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220804A (en) * 1991-12-09 1993-06-22 Isothermal Systems Research, Inc High heat flux evaporative spray cooling
WO1997043887A1 (en) * 1996-05-16 1997-11-20 Raytheon E-Systems, Inc. Heat spreader system and method for cooling heat generating components
WO1999022192A1 (en) * 1997-10-29 1999-05-06 Motorola Inc. Multi-mode, two-phase cooling module
US20030205054A1 (en) * 2000-12-04 2003-11-06 Fujitsu Limited High efficiency cooling system and heat absorbing unit

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
AVVARU ET AL: "Ultrasonic atomization: Effect of liquid phase properties", ULTRASONICS, IPC SCIENCE AND TECHNOLOGY PRESS LTD. GUILDFORD, GB, vol. 44, no. 2, February 2006 (2006-02-01), pages 146 - 158, XP005281866, ISSN: 0041-624X *
RAJAN R ET AL: "Correlations to predict droplet size in ultrasonic atomisation", ULTRASONICS, IPC SCIENCE AND TECHNOLOGY PRESS LTD. GUILDFORD, GB, vol. 39, no. 4, June 2001 (2001-06-01), pages 235 - 255, XP004239424, ISSN: 0041-624X *

Also Published As

Publication number Publication date
US20070144199A1 (en) 2007-06-28
TWI326405B (en) 2010-06-21
TW200732900A (en) 2007-09-01
WO2007078767A2 (en) 2007-07-12

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