WO2007071307A1

WO2007071307A1 - Projection objective with decentralized control

Info

Publication number: WO2007071307A1
Application number: PCT/EP2006/011370
Authority: WO
Inventors: Torsten Gross
Original assignee: Carl Zeiss Smt Ag
Priority date: 2005-12-22
Filing date: 2006-11-28
Publication date: 2007-06-28
Also published as: US20080288108A1; DE102005062081A1; EP1969428A1

Abstract

The invention relates to a projection objective (7') for microlithography for the production of semiconductor components, which has one or a plurality of optical elements and/or optical assemblies that are adjustable by means of manipulator units (M'1, ..., M'n) with actuators and sensors. The manipulator units (M'1, ..., M'n) are driven by a control system (12', 13') via a data bus (17). The manipulator units (M'1, ..., M'n) in each case have one or a plurality of dedicated, decentralized control subsystems (SPU1, …, SPUn) which are arranged at least approximately in the region of the manipulator units (M'1, ..., M'n) and are connected to the control system (12', 13') via the common data bus (17) formed in digital fashion.

Description

Projection objective with decentralized control

The invention relates to a projection objective for microlithography for the production of semiconductor components, which has one or a plurality of optical elements and/or optical assemblies that are adjustable by means of manipulator units with actuators and sensors, the manipulator units being driven by a control system via a data bus.

A projection objective of this type is known from DE 100 56 782 Al.

In the case of known projection objectives for microlithography, the actuators and sensors of the manipulators, which are required in particular for eliminating imaging aberrations or the like, are driven and evaluated by a central control unit. As a result, the transmission paths within the objective are generally very long, so that signal preamplifiers and signal amplifiers are necessary. Such devices corrupt the sensor signals, however, which has a direct effect on the evaluation thereof by the central control unit and on the measurement accuracy. The corruption of the measurement signals by the signal amplifiers may have diverse causes. Non-linearities of characteristic curves, temperature drifts or the like are factors in this context.

The signal transmission constitutes a further fault source. In the case of capacitive sensors, in particular, the sensor cable has to be tuned to the sensor and the signal preamplifier used. If this is not the case, interfering signal reflections can occur, by way of example. Furthermore, there is also the risk of crosstalk, that is to say that an energy source can couple interference signals into a signal cable. Although interference of this type can be minimized by appropriate laying of the signal cables and also by application of a wide variety of screening measures, this is complicated and requires structural space in addition.

The power loss rises considerably as a result of the use of signal preamplifiers and as a result of long transmission paths. This is manifested in an increased power demand and heating of the electronic apparatuses in the projection exposure apparatus. Such heating is undesirable and has to be dissipated in a complicated manner.

Taking this as a departure point, the present invention is based on the object of providing a projection objective of the type mentioned in the introduction which avoids the disadvantages of the prior art, in particular - even in the case of a high number of active manipulator units - reduces dynamic interference sources issuing from cables and simplifies integration into the projection exposure apparatus from electrical and regulation engineering standpoints.

This object is achieved according to the invention by virtue of the fact that the manipulator units in each case have one or a plurality of dedicated, decentralized control subsystems which are arranged in the region of the manipulator units and are connected to the control system via the common data bus formed in digital fashion, the control subsystems preferably being designed to independently execute the communicated control commands of the control system by means of a regulation of the actuators with the aid of the sensors. By virtue of the fact that each manipulator unit is provided with an independent control subsystem/controller, the cabling outlay can advantageously be reduced essentially to one bus line and to one power supply line. Since the signal amplifiers thereby move very close to the sensors and actuators, interference over long cable sections is avoided. The signal conditioning and signal processing are effected directly in the control subsystem of the manipulator. The communication between manipulator unit and control system or objective controller is limited to manipulator control commands of the control system and to status feedback messages of the manipulator unit to the control system. Since this communication is effected digitally, communication errors can be detected by error correction measures (e.g. CRC check sums or the like) and thus avoided. The embodiment of the control subsystems, which, on account of their regulation functionality, could of course also be referred to as regulation subsystems, is suitable for all types of projection objectives. They can be adapted to any actuator and sensor by software modification. Consequently, the projection objective can also be extended by new active manipulators. Moreover, signal amplification may be obviated in part. Signal transmission losses are significantly reduced.

The invention may furthermore provide for the control subsystems in each case to have at least one microprocessor and at least one data memory, and for calibration data for the respective actuators and sensors of the associated manipulator units to be stored in the data memory of the control subsystems.

The control subsystem can thereby autonomously supervise the functions of the associated manipulator unit. This includes the driving of the manipulators/actuators as well as the evaluation of the corresponding sensors. In this case, the calibration data of the actuators and sensors and also the characteristic curve of the entire manipulator mount can be stored in the data memory of the control subsystems. The microprocessor is thereby enabled to compensate for or take account of drift processes during the regulation and also to monitor the thermal behaviour of the entire manipulator unit. The integration of a control subsystem into the manipulator unit leads to an additional input of energy. The latter can be compensated for in a variety of ways. Peltier elements or heating foils which are fitted on the manipulator and which keep the manipulator at a specific temperature level by means of a regulating circuit can be used for this purpose. The use of active and passive cooling systems is likewise possible for the temperature regulation. Furthermore, driving of the actuators by pulse width modulation (PWM) could also be provided. The main component part of the control subsystem is the microprocessor. The control subsystem may furthermore have a temperature control. Multiplexers and A/D converters, and demultiplexers and D/A converters are required for connection and driving of the sensors and actuators. An interface controller regulates access to the data bus.

It is advantageous if the control subsystems of the manipulator units are arranged on a housing of the projection objective, in particular on the outer side.

This means that no additional heat is introduced into the projection objective.

In one refinement of the invention, it may furthermore be provided that a separate power supply unit is provided for controlling the power supply of the control subsystems and of the manipulator units.

The power supply unit undertakes the power management of the manipulator units, which is effected independently of the control unit of the projection objective. Power supply and signal communication are thereby separate. The control subsystem can communicate directly with the power supply unit, whereby the power demand can be coordinated precisely with the functions of the manipulator. Thermal supervision of the manipulator unit by the control subsystem is likewise possible.

Advantages with regard to the projection exposure apparatus according to Claim 6 emerge analogously and with reference to the description.

An exemplary embodiment is described in principle below with reference to the drawing.

In the figures:

Figure 1 shows a basic illustration of a projection exposure apparatus for microlithography, which can be used for the exposure of structures onto wafers coated with photosensitive materials, in accordance with the prior art;

Figure 2 shows an illustration of a regulating circuit for a manipulator unit in accordance with the prior art;

Figure 3 shows an illustration of a regulating circuit of a projection objective in accordance with the prior art; Figure 4 shows an illustration of a projection objective according to the invention with manipulator control subsystems;

Figure 5 shows an illustration of a manipulator unit with a control subsystem; and

Figure 6 shows an illustration of a fundamental construction of a control subsystem of a manipulator unit.

Figure 1 illustrates a projection exposure apparatus 1 for microlithography. Said apparatus serves for the exposure of structures onto a substrate coated with photosensitive materials, which generally predominantly comprises silicon and is referred to as a wafer 2, for the production of semiconductor components, such as e.g. computer chips.

In this case, the projection exposure apparatus 1 essentially comprises an illumination device 3, a device 4 for receiving and exactly positioning a mask provided with a grating-like structure, a so-called reticle 5, which determines the later structures on the wafer 2, a device 6 for the mounting, movement and exact positioning of precisely said wafer 2, and an imaging device, namely a projection objective 7 with a plurality of optical elements, such as e.g. lenses 8, 8', which are mounted by means of mounts 9, 9' and/or manipulator units Mi, M₂ in an objective housing 10 of the projection objective 7.

In this case, the basic functional principle provides for the structures introduced into the reticle 5 to be imaged onto the wafer 2 in demagnified fashion. After an exposure has been effected, the wafer 2 is moved further in the arrow direction A or xy direction, so that a multiplicity of individual fields, each having the structure predetermined by the reticle 5, are exposed on the same wafer 2.

The illumination device 3 provides a projection beam 11, for example light or a similar electromagnetic radiation, required for the imaging of the reticle 5 on the wafer 2. A laser or the like may be used as a source for said radiation.

In this case, the manipulators Mi, M₂ are driven and evaluated by a central control system 12 of the projection objective 7, the so-called lens controller, which is in turn controlled by a superordinate control system 13 of the projection exposure apparatus .

In this case, the signal transmission paths are generally very long, so that, as can be seen from Figures 2 and 3, the control system 12 of the projection objective 7 has to use not only analogue/digital converters A/D and digital/analogue converters D/A but additionally signal amplifiers 14 and signal preamplifiers PA₁, ..., PA_n for driving the actuators Ai, A₂ (e.g. piezo-actuators, Lorenz actuators or the like) via an actuator interface 15 or for evaluating sensors Si, S₂ via a preamplifier 16. The driving of the manipulator unit Mi of the lens 8 by the central control system 12 of the projection objective 7 in accordance with the prior art is illustrated in principle in Figure 2.

Figure .3 illustrates in a simplified manner the regulation of a plurality of manipulator units M₁, ..., M_n by the central control system 12 of the projection objective 7 by means of preamplifiers PAi, ... , PA_n by a controller 12a in accordance with the prior art, corresponding to the detail S in Figure 1. The use of the amplifiers and the preamplifiers 14, 16, PAi, ..., PA_n corrupts the sensor signals, which has a direct influence on the measurement accuracy during the evaluation of the sensor signals by the control system 12 of the projection objective 7. Applicable causes include e.g. non-linearity of the amplifier characteristic curves and temperature drifts. In the case of capacitive sensors, the sensor cable has to be tuned to the sensor and the preamplifier used; if this tuning is inadequate, signal reflections may occur, which likewise have adverse effects on the measurement signals. Crosstalk may likewise couple interference signals into the signal cables.

The use of the preamplifiers PAi, ... , PA_n and the long transmission paths result in an increase in the power loss and thus the heat in the projection objective 7 or in the projection exposure apparatus 1. This heat has to be dissipated in a complicated manner.

In the case of previous projection objectives 7, the control system 12 of the projection objective 7 directly undertakes the regulation of the manipulator units Mi, ..., M_n. In the case of this solution, the control system 12 comprises the signal conditioning, the signal processing and also the actual controller 12a (see Figure 3) .

As can be seen from Figure 4, manipulator units M'i, ..., M'_n of a projection objective 7' according to the invention for use in the projection exposure apparatus 1 in each case have dedicated, decentralized control subsystems SPUi, • • • , SPU_n which are arranged in the region of the manipulator units M'i, ..., M'_n and which are connected to a control system 12' via a common data bus 17 formed in digital fashion. Figure 4 shows the detail S from Figure 1 in a simplified manner in the embodiment according to the invention. The control subsystems SPUi, ••-, SPU_n convert the control commands communicated by the control system 12 ' independently by means of a regulation of the actuators Ai, A₂ and with the aid of the sensors Si, S₂ (see Figures 5 and 6) . The signal conditioning and signal processing are effected directly in the manipulator control subsystems SPUi, •••, SPU_n. In the case of the projection objective 7', a respective microprocessor is integrated directly in the manipulator units M'_I, ..., M'_n as a manipulator control subsystem. The communication between manipulator unit M'i, ..., M'_n and control system 12' is thus limited to the manipulator unit M'i, ..., M'_n receiving from the control system 12' control commands for manipulation of the corresponding optical element or the optical assembly (e.g. lens 8, 8' - not specifically illustrated in Figure 4) and then reporting its status back to the control system 12'. Since this communication is effected digitally, communication errors can be reliably detected and thus precluded by means of suitable error correction measures.

As can furthermore be seen from Figure 4, a power supply unit PCDU undertakes the power management of the manipulator units M'i, ..., M'_n. This is effected independently of the control unit 12' of the projection objective 7' and constitutes an EMC separation between power supply and signal transmission.

As can be seen from Figure 5, the manipulator M'i has an autonomous control subsystem SPUi. The signal processing of the sensors Si, S₂ is effected directly in the control subsystem SPUi of the manipulator unit M'i. The actuators Ai, A₂ are likewise driven and regulated by the control subsystem SPUi. In the present exemplary embodiment, the control subsystem SPUi is formed as an autonomous controller. In further exemplary embodiments, the latter could also be dependent on the control system 12' as it were as a slave. The control subsystem SPUi communicates with the control system 12' and the power supply unit PCDU via a standardized interface. In the present case, the communication between the control subsystem SPU_x and the power supply unit PCDU takes place independently of the control system 12'. In the present exemplary embodiment, the control system 12' prescribes for the control subsystem SPUi a command sequence for manipulation of the optical element or the lens 8', which the control subsystem SPUi then processes independently and subsequently reports the status back to the control system 12'. The control subsystem SPU_x can communicate directly with the power supply unit PCDU, as a result of which the power demand can be coordinated precisely with the functions of the manipulator M'χ. In a further exemplary embodiment, the control subsystem SPUi could additionally also undertake the thermal supervision of the manipulator M'i.

Figure 6 shows the basic construction of the control subsystem SPUi of the manipulator unit M'i. The main component of the control subsystem SPUi is a microprocessor 18. The control subsystem SPUi furthermore has a data memory 19. In this case, the control subsystem SPUi is constructed in a manner similar to a PCMCIA card, an SD card or the like. The card should be readily accessible in order to ensure an exchange in the case of an upgrade or service. The card could then be inserted into a drawer compartment or the like in the mount. The control system SPUi autonomously supervises the functions of the manipulator unit M¹I. This includes the driving, i.e. the regulation of the actuators Ai, A₂ as well as the evaluation of the sensor signals of the sensors Si, S₂. The actuators Ai, A₂ are driven by means of a digital/analogue converter D/A and a demultiplexer DEMUX by means of actuator interfaces AIFi, AIF₂. The sensor signals of the sensors Si, S₂ are received from sensor interfaces SIFi, SIF₂ via a multiplexer MUX and an analogue/digital converter A/D. The calibration data of the actuators Ai, A₂ and of the sensors Si, S₂ and also the characteristic curve of the entire mount can advantageously be stored in the data memory 19 of the control subsystem SPUi. This enables the microprocessor 18 to compensate for and immediately take account of drift processes during the regulation. A further function of the control subsystem SPUi is the monitoring of the thermal behaviour of the entire manipulator M'i.

The integration of the control subsystem SPUi in the manipulator M'_I may lead to an additional input of energy. However, this can be compensated for by a plurality of countermeasures . The temperature of the manipulator M'i could be regulated by means of Peltier elements in a further exemplary embodiment. There is furthermore the possibility of fitting heating foils on the manipulator M'i, which keep the manipulator M¹ _! at a specific temperature level by means of a regulating circuit. The use of active and passive cooling systems is likewise possible for the temperature regulation.

Furthermore, the control subsystem SPUi has an interface controller 20 and, for thermal regulation, a thermal controller 21.

The data interface of the control subsystem SPUi has an electrical physical interface and a software interface. Both interfaces are dependent on the data transmission protocol to be chosen. Serial as well as parallel data transmission are conceivable. Bus systems (e.g. MIL1553, LAN, CAN) are appropriate for serial data transmission. If necessary, it is possible to realize potential isolation of the data interfaces with respect to the other bus subscribers (MIL1553) . The management of the data interface is carried out by the interface controller 20.

The manipulator units M'i, ..., M'_n are integrated into the control of the projection exposure apparatus 1 by means of the control system 12' of the projection objective 7', which is controlled by means of the control system 13' of the projection exposure apparatus 1. In this case, the control system 12' of the projection objective 7' may also be omitted (indicated by dashed lines in Figures 5 and 6) . The task of the control system 12' of the projection objective is to coordinate the control subsystems SPUi, •••, SPU_n and could also be undertaken by the control system 13'. Furthermore, the characteristic curve of the projection objective 7' may be stored in the control system 12'. The communication between the control system 12 ' of the projection objective 7' and the control system 13' of the projection exposure apparatus 1 consists in exchanging control commands and status messages. The projection objective 7' thus forms an autonomous subsystem of the projection exposure apparatus 1. As a result of storing the projection objective characteristic curve, thermal and drift effects can also be compensated for during the regulation. The same can be achieved with regard to the manipulator units by storing the manipulator characteristic curve in the corresponding control subsystems. Overall, an advantageous overall system is created by the decentralized arrangement of the control subsystems SPUi, ■•-, SPU_n. Signal transmission losses are minimized in this case. Signal amplification can for the most part be omitted. The interfaces to the control device 13' of the projection exposure apparatus 1 are reduced. By compensating for drift effects, it is possible to achieve a lengthening of the service life of the projection objective 7'. The manipulator characteristic curves can be included fully automatically for each mount in the respective control subsystem SPUi, ••-, SPU_n. The embodiments of the control subsystems SPUi, • • ■ , SPU_n can be used for a plurality of different types of projection objectives. The control subsystems SPU_x, ... , SPU_n can be adapted to any actuator Ai, A₂ and sensor Si, S₂ by modifications of the computer software that is executed. As a result, mechanical tolerances can be chosen to be coarser in a simple and advantageous manner. When a serial data bus 17 is used, only a single cable is required for the data exchange between all the manipulator units M'i, ..., M'_n and the control system 12'. For redundancy reasons, the control subsystems SPUi, • • • _t SPU_n should therefore have at least two data interfaces to the data bus 17. New functions can be implemented at any time by means of software changes. The thermal supervision is now possible directly at the manipulator. Power supply line and signal line are separate. Overall, the structural space requirement in the projection exposure apparatus 1 is reduced.

Claims

Patent Claims

1. Projection objective for microlithography for the production of semiconductor components, which has one or a plurality of optical elements and/or optical assemblies that are adjustable by means of manipulator units with actuators and sensors, the manipulator units being driven by a control system via a data bus, characterized in that the manipulator units (M'_l, ..., M'_n) in each case have one or a plurality of dedicated, decentralized control subsystems (SPUi, ..., SPU_n) which are arranged in the region of the manipulator units

(M¹ _I, ..., M'n) and are connected to the control system (12', 13') via the common data bus (17) formed in digital fashion.

2. Projection objective according to Claim 1, wherein the control subsystems (SPUi, •••_? SPU_n) are designed to independently execute the communicated control commands of the control system (12', 13') by means of a regulation of the actuators (A_x, A₂) with the aid of the sensors (Si, S₂).

3. Projection objective according to Claim 1 or 2, wherein the control subsystems (SPUi, •••/ SPU_n) in each case have at least one microprocessor (18) and at least one data memory (19) .

4. Projection objective according to Claim 3, wherein calibration data for the respective actuators (Ai, A₂) and sensors

(Si, S₂) of the associated manipulator units (M¹ ₁, ..., M'_n) are stored in the data memory (19) of the control subsystems

(SPUi, -.., SPU_n) .

5. Projection objective according to one of Claims 1 to 4, wherein the control subsystems (SPUi, ••-, SPU_n) of the manipulator units (M' i, ..., M'_n) are arranged on a housing (18) of the projection objective (7 ' ) , in particular on the outer side.

6. Projection objective according to one of Claims 1 to 5, wherein that a separate power supply unit (PCDU) is provided for controlling the power supply of the control subsystems (SPU₁, ..., SPU_n) and of the manipulator units (M' i, ..., M'_n).

7. Projection exposure apparatus (1) for microlithography for the production of semiconductor components comprising an illumination device (3) and comprising a projection objective (7¹) according to one of Claims 1 to 6.