WO2007062247A3 - Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields and related structures - Google Patents

Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields and related structures Download PDF

Info

Publication number
WO2007062247A3
WO2007062247A3 PCT/US2006/045535 US2006045535W WO2007062247A3 WO 2007062247 A3 WO2007062247 A3 WO 2007062247A3 US 2006045535 W US2006045535 W US 2006045535W WO 2007062247 A3 WO2007062247 A3 WO 2007062247A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermally conductive
methods
related structures
thermoelectric coolers
forming embedded
Prior art date
Application number
PCT/US2006/045535
Other languages
French (fr)
Other versions
WO2007062247A2 (en
Inventor
David A Koester
Randall G Alley
Original Assignee
Nextreme Thermal Solutions
David A Koester
Randall G Alley
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nextreme Thermal Solutions, David A Koester, Randall G Alley filed Critical Nextreme Thermal Solutions
Publication of WO2007062247A2 publication Critical patent/WO2007062247A2/en
Publication of WO2007062247A3 publication Critical patent/WO2007062247A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

A method of forming a thermoelectric device may include providing a substrate having a surface, and thermally coupling a thermoelectric p-n couple to a first portion of the surface of a substrate. Moreover, the thermoelectric p-n couple may include a p-type thermoelectric element and an n-type thermoelectric element. In addition, a thermally conductive field layer may be formed on a second portion of the surface of the substrate adjacent the first portion of the surface of the substrate. Related structures are also discussed.
PCT/US2006/045535 2005-11-28 2006-11-28 Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields and related structures WO2007062247A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US74015305P 2005-11-28 2005-11-28
US60/740,153 2005-11-28
US77921006P 2006-03-03 2006-03-03
US60/779,210 2006-03-03

Publications (2)

Publication Number Publication Date
WO2007062247A2 WO2007062247A2 (en) 2007-05-31
WO2007062247A3 true WO2007062247A3 (en) 2008-02-28

Family

ID=38067975

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/045535 WO2007062247A2 (en) 2005-11-28 2006-11-28 Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields and related structures

Country Status (1)

Country Link
WO (1) WO2007062247A2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0915515A2 (en) * 1997-10-30 1999-05-12 Siemens Aktiengesellschaft Electrical signal transmitting arrangement between a thermally isolated module on carrier plate and adjacent neighbouring modules
US6347521B1 (en) * 1999-10-13 2002-02-19 Komatsu Ltd Temperature control device and method for manufacturing the same
US20020033189A1 (en) * 2000-09-18 2002-03-21 Chris Macris Heat dissipating silicon-on-insulator structures
US6424533B1 (en) * 2000-06-29 2002-07-23 International Business Machines Corporation Thermoelectric-enhanced heat spreader for heat generating component of an electronic device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0915515A2 (en) * 1997-10-30 1999-05-12 Siemens Aktiengesellschaft Electrical signal transmitting arrangement between a thermally isolated module on carrier plate and adjacent neighbouring modules
US6347521B1 (en) * 1999-10-13 2002-02-19 Komatsu Ltd Temperature control device and method for manufacturing the same
US6424533B1 (en) * 2000-06-29 2002-07-23 International Business Machines Corporation Thermoelectric-enhanced heat spreader for heat generating component of an electronic device
US20020033189A1 (en) * 2000-09-18 2002-03-21 Chris Macris Heat dissipating silicon-on-insulator structures

Also Published As

Publication number Publication date
WO2007062247A2 (en) 2007-05-31

Similar Documents

Publication Publication Date Title
WO2007076056A3 (en) Ultrafast recovery diode
WO2006110858A3 (en) Methods of forming thermoelectric devices including superlattice structures and related devices
WO2004059706A3 (en) Electronic devices including semiconductor mesa structures and conductivity junctions and methods of forming said devices
WO2008112064A3 (en) Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures
EP1840981A3 (en) Thermoelectric module
ATE415705T1 (en) IMAGE SENSOR WITH DEEP TRENCH ISOLATION
WO2008135905A3 (en) A photosensitive device and a method of manufacturing a photosensitive device
WO2010065334A3 (en) Semiconductor devices with current shifting regions and related methods
TWI266438B (en) Semiconductor light emitting device with protective element, and its manufacturing method
WO2008156516A3 (en) Methods of fabricating silicon carbide power devices by at least partially removing an n-type silicon carbide substrate, and silicon carbide power devices so fabricated
TW200717843A (en) Light-emitting element with high-light-extracting-efficiency
WO2007124209A3 (en) Stressor integration and method thereof
WO2008129963A1 (en) Semiconductor light-emitting device and method for manufacturing the same
WO2006073613A3 (en) Thermoelectric heat exchange element
WO2007094516A8 (en) GaN-BASED SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR THE FABRICATION THEREOF
TW200633022A (en) Method of manufacturing an epitaxial semiconductor substrate and method of manufacturing a semiconductor device
WO2005036664A3 (en) Organic electronic devices with low thermal resistance and processes for forming and using the same
WO2009023148A3 (en) Nanowire electronic devices and method for producing the same
TW200731537A (en) Semiconductor device and manufacturing method thereof
WO2008021973A3 (en) Method of manufacturing a photodiode array with through-wafer vias
WO2010015310A3 (en) Solar cell and method for producing a solar cell
WO2007050754A3 (en) Stackable wafer or die packaging with enhanced thermal and device performance
WO2008063704A3 (en) Nanostructured quantum dots or dashes in photovoltaic devices and methods thereof
WO2008152945A1 (en) Semiconductor light-emitting device and method for manufacturing the same
WO2010114766A3 (en) Thermoelectric devices including thermoelectric elements having off-set metal pads and related structures, methods, and systems

Legal Events

Date Code Title Description
DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 06844586

Country of ref document: EP

Kind code of ref document: A2