WO2007061509A3 - Modular diode laser assembly - Google Patents

Modular diode laser assembly Download PDF

Info

Publication number
WO2007061509A3
WO2007061509A3 PCT/US2006/038430 US2006038430W WO2007061509A3 WO 2007061509 A3 WO2007061509 A3 WO 2007061509A3 US 2006038430 W US2006038430 W US 2006038430W WO 2007061509 A3 WO2007061509 A3 WO 2007061509A3
Authority
WO
WIPO (PCT)
Prior art keywords
diode laser
laser assembly
assembly
cooling block
modular diode
Prior art date
Application number
PCT/US2006/038430
Other languages
French (fr)
Other versions
WO2007061509A2 (en
Inventor
Derek E Schulte
Yu Yan
Robert J Martinsen
Aaron L Hodges
Scott R Karlsen
Original Assignee
Nlight Photonics Corp
Derek E Schulte
Yu Yan
Robert J Martinsen
Aaron L Hodges
Scott R Karlsen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/313,068 external-priority patent/US7436868B2/en
Priority claimed from US11/378,697 external-priority patent/US7586963B2/en
Priority claimed from US11/378,696 external-priority patent/US7420996B2/en
Priority claimed from US11/378,570 external-priority patent/US20070116071A1/en
Priority claimed from US11/378,667 external-priority patent/US7443895B2/en
Application filed by Nlight Photonics Corp, Derek E Schulte, Yu Yan, Robert J Martinsen, Aaron L Hodges, Scott R Karlsen filed Critical Nlight Photonics Corp
Publication of WO2007061509A2 publication Critical patent/WO2007061509A2/en
Publication of WO2007061509A3 publication Critical patent/WO2007061509A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Lasers (AREA)

Abstract

An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies (100) mounted to a stepped cooling block (700, 900, 1100, 1400, 1700 and 1800). The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.
PCT/US2006/038430 2005-11-22 2006-09-29 Modular diode laser assembly WO2007061509A2 (en)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
US73918505P 2005-11-22 2005-11-22
US60/739,185 2005-11-22
US11/313,068 2005-12-20
US11/313,068 US7436868B2 (en) 2005-11-22 2005-12-20 Modular diode laser assembly
US11/378,570 2006-03-17
US11/378,667 2006-03-17
US11/378,697 2006-03-17
US11/378,697 US7586963B2 (en) 2005-11-22 2006-03-17 Modular diode laser assembly
US11/378,696 US7420996B2 (en) 2005-11-22 2006-03-17 Modular diode laser assembly
US11/378,570 US20070116071A1 (en) 2005-11-22 2006-03-17 Modular diode laser assembly
US11/378,696 2006-03-17
US11/378,667 US7443895B2 (en) 2005-11-22 2006-03-17 Modular diode laser assembly

Publications (2)

Publication Number Publication Date
WO2007061509A2 WO2007061509A2 (en) 2007-05-31
WO2007061509A3 true WO2007061509A3 (en) 2009-04-16

Family

ID=38067691

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/038430 WO2007061509A2 (en) 2005-11-22 2006-09-29 Modular diode laser assembly

Country Status (1)

Country Link
WO (1) WO2007061509A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009016953B4 (en) 2009-04-08 2017-03-09 Dirk Lorenzen Conversion unit with several conversion modules, commissioning method of the conversion unit and such a conversion unit having optical arrangement

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5610930A (en) * 1995-03-02 1997-03-11 Hughes Aircraft Company Voltage adding diode laser array
US6057871A (en) * 1998-07-10 2000-05-02 Litton Systems, Inc. Laser marking system and associated microlaser apparatus
US6240116B1 (en) * 1997-08-14 2001-05-29 Sdl, Inc. Laser diode array assemblies with optimized brightness conservation
US20040114684A1 (en) * 2001-01-03 2004-06-17 Marta Karczewicz Switching between bit-streams in video transmission
US20050063433A1 (en) * 2003-09-20 2005-03-24 Hans-Georg Treusch Stepped manifold array of microchannel heat sinks
US6898222B2 (en) * 2000-12-06 2005-05-24 Jenoptik Laserdiode Gmbh Diode laser arrangement with a plurality of diode laser arrays

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5610930A (en) * 1995-03-02 1997-03-11 Hughes Aircraft Company Voltage adding diode laser array
US6240116B1 (en) * 1997-08-14 2001-05-29 Sdl, Inc. Laser diode array assemblies with optimized brightness conservation
US6057871A (en) * 1998-07-10 2000-05-02 Litton Systems, Inc. Laser marking system and associated microlaser apparatus
US6898222B2 (en) * 2000-12-06 2005-05-24 Jenoptik Laserdiode Gmbh Diode laser arrangement with a plurality of diode laser arrays
US20040114684A1 (en) * 2001-01-03 2004-06-17 Marta Karczewicz Switching between bit-streams in video transmission
US20050063433A1 (en) * 2003-09-20 2005-03-24 Hans-Georg Treusch Stepped manifold array of microchannel heat sinks

Also Published As

Publication number Publication date
WO2007061509A2 (en) 2007-05-31

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