WO2007055669A3 - Solution de gravure reyclable - Google Patents

Solution de gravure reyclable Download PDF

Info

Publication number
WO2007055669A3
WO2007055669A3 PCT/TN2006/000001 TN2006000001W WO2007055669A3 WO 2007055669 A3 WO2007055669 A3 WO 2007055669A3 TN 2006000001 W TN2006000001 W TN 2006000001W WO 2007055669 A3 WO2007055669 A3 WO 2007055669A3
Authority
WO
WIPO (PCT)
Prior art keywords
etching solution
copper
recyclable
ammonium
carbonate
Prior art date
Application number
PCT/TN2006/000001
Other languages
English (en)
Other versions
WO2007055669A2 (fr
Inventor
Dridi Karim Nahdi
Original Assignee
Eve Recycling Sarl
Dridi Karim Nahdi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eve Recycling Sarl, Dridi Karim Nahdi filed Critical Eve Recycling Sarl
Priority to JP2008539995A priority Critical patent/JP2009516071A/ja
Priority to EP06824664A priority patent/EP2010695A2/fr
Publication of WO2007055669A2 publication Critical patent/WO2007055669A2/fr
Publication of WO2007055669A3 publication Critical patent/WO2007055669A3/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/02—Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Catalysts (AREA)

Abstract

À une solution de gravure aqueuse recyclable par la réduction de concentration de cuivre pendant le travail, utilisée pour la gravure de cuivre en particulier pour les circuits imprimés et les industries des pièces en cuivre composée en général d'une partie d'eau, d'Ammoniac, Carbonate de cuivre et carbonate d'Ammonium, la solution de gravure doit contenir comme catalyseur supplémentaire bromacetylbiphenil et ses dérivés .
PCT/TN2006/000001 2005-11-10 2006-11-09 Solution de gravure reyclable WO2007055669A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008539995A JP2009516071A (ja) 2005-11-10 2006-11-09 再生利用可能なエッチング溶液
EP06824664A EP2010695A2 (fr) 2005-11-10 2006-11-09 Solution de gravure reyclable

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TNSN.05.283 2005-11-10
TN05283 2005-11-10

Publications (2)

Publication Number Publication Date
WO2007055669A2 WO2007055669A2 (fr) 2007-05-18
WO2007055669A3 true WO2007055669A3 (fr) 2007-11-01

Family

ID=37982804

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/TN2006/000001 WO2007055669A2 (fr) 2005-11-10 2006-11-09 Solution de gravure reyclable

Country Status (6)

Country Link
EP (1) EP2010695A2 (fr)
JP (1) JP2009516071A (fr)
KR (1) KR20080075148A (fr)
CN (1) CN101443480A (fr)
DE (1) DE102006036888A1 (fr)
WO (1) WO2007055669A2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102019430B (zh) * 2009-09-18 2012-09-05 福建师范大学福清分校 一种碱性蚀刻废液回收铜及碱性蚀刻液的回收方法
CN102154646A (zh) * 2011-03-04 2011-08-17 侯延辉 一种不产生氯气的酸性蚀刻液及其催化剂
CN106702387A (zh) * 2015-11-18 2017-05-24 陶克（苏州）机械设备有限公司 一种在线碱性硫酸铵刻蚀废液循环再生系统
CN105603434B (zh) * 2016-03-20 2018-04-13 华南理工大学 一种光催化pcb酸性蚀刻液循环回收利用的方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4311551A (en) * 1979-04-12 1982-01-19 Philip A. Hunt Chemical Corp. Composition and method for etching copper substrates
GB2163101A (en) * 1984-08-14 1986-02-19 Hoellmueller Maschbau H Etching of copper films on circuit boards
DE19800605A1 (de) * 1998-01-12 1999-07-15 Helmar Haug Ammoniakalische Ätzlösung
US6129858A (en) * 1990-07-05 2000-10-10 Elo-Chem Atztechnik Gmbh Etching solution
WO2006000364A1 (fr) * 2004-06-25 2006-01-05 Elo-Chem Csm Gmbh Solution de gravure pouvant etre regeneree par voie electrolytique

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4311551A (en) * 1979-04-12 1982-01-19 Philip A. Hunt Chemical Corp. Composition and method for etching copper substrates
GB2163101A (en) * 1984-08-14 1986-02-19 Hoellmueller Maschbau H Etching of copper films on circuit boards
US6129858A (en) * 1990-07-05 2000-10-10 Elo-Chem Atztechnik Gmbh Etching solution
DE19800605A1 (de) * 1998-01-12 1999-07-15 Helmar Haug Ammoniakalische Ätzlösung
WO2006000364A1 (fr) * 2004-06-25 2006-01-05 Elo-Chem Csm Gmbh Solution de gravure pouvant etre regeneree par voie electrolytique

Also Published As

Publication number Publication date
EP2010695A2 (fr) 2009-01-07
WO2007055669A2 (fr) 2007-05-18
JP2009516071A (ja) 2009-04-16
CN101443480A (zh) 2009-05-27
DE102006036888A1 (de) 2007-05-16
KR20080075148A (ko) 2008-08-14

Similar Documents

Publication Publication Date Title
WO2003069025A3 (fr) Procede de dissolution de cuivre
MX291201B (es) Produccion fermentativa de compuestos quimicos finos.
WO2006100312A3 (fr) Procede pour la production d'un compose organique
WO2006110868A3 (fr) Inductance
TW200746371A (en) Surface mountable optoelectronic component and its production method
PL1651324T3 (pl) Alkaliczny wodny środek flokulujący, sposób wytwarzania alkalicznego wodnego środka flokulującego i stałego środka flokulującego oraz ich zastosowanie
EP1921675A4 (fr) Carte a circuit imprime et module a semiconducteur utilisant celle-ci, procede de fabrication pour carte a circuit imprime
WO2007002703A3 (fr) Agents moussants et compositions contenant des olefines substituees par du fluor, et procedes de moussage
EP1785507A3 (fr) Procédé de gravur de la surface d'un substrat non-conducteur
WO2005121078A3 (fr) Composes cyclopentene substitues
MX274842B (es) Procedimiento para la produccion de sales de (4,5-dihidroisoxazol- 3-il)tiocarboxamidina.
WO2007055669A3 (fr) Solution de gravure reyclable
WO2007029194A3 (fr) Procede pour fabriquer un substrat opaque imprime
EP1828398A4 (fr) Production de glucurono-3,6-lactone a faible impact sur l'environnement
MY146013A (en) Process for purifying mesotrione
WO2007012626A3 (fr) Nouveau procede de production de sels de tiotropium
WO2007014349A3 (fr) Procede de sequestration de dioxyde de carbone dans des milieux aqueux
DE60237921D1 (de) Reinigung von oniumhydroxiden durch elektrodialyse
BRPI0519696A2 (pt) composição aquosa, processo para obter metal de materiais contendo metal, e, uso de tensoativos
WO2007036319A3 (fr) Procédé pour réaliser un support de données sous forme de carte comportant une zone d'inscription
ATE450633T1 (de) Elektrolytisch regenerierbare ätzlösung
WO2011013922A3 (fr) Composition d'agent de traitement de surface, procédé permettant de préparer cette composition, feuille de cuivre pour carte de circuits imprimés, et stratifié cuivré souple
WO2007072496A3 (fr) Procede de preparation de sucralose
BRPI0416637A (pt) método para produção de uma solução aquosa de etanolamina de cobre e de uma solução de monoetanolamina de cobre
EP1790632A4 (fr) Méthode de synthèse du 4-(méthylthio)butane-1,2-diol

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200680041806.9

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 935/MUMNP/2008

Country of ref document: IN

ENP Entry into the national phase

Ref document number: 2008539995

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1020087013509

Country of ref document: KR

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 06824664

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2006824664

Country of ref document: EP