WO2007034072A1 - Electronic device comprising a power support which bears a control support, and assembly method - Google Patents

Electronic device comprising a power support which bears a control support, and assembly method Download PDF

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Publication number
WO2007034072A1
WO2007034072A1 PCT/FR2006/002150 FR2006002150W WO2007034072A1 WO 2007034072 A1 WO2007034072 A1 WO 2007034072A1 FR 2006002150 W FR2006002150 W FR 2006002150W WO 2007034072 A1 WO2007034072 A1 WO 2007034072A1
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WO
WIPO (PCT)
Prior art keywords
support
control
power
components
power support
Prior art date
Application number
PCT/FR2006/002150
Other languages
French (fr)
Inventor
Philippe Bettan
Original Assignee
Valeo Systemes De Controle Moteur
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Systemes De Controle Moteur filed Critical Valeo Systemes De Controle Moteur
Publication of WO2007034072A1 publication Critical patent/WO2007034072A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Definitions

  • An electronic device comprising a power support which carries a control support, and method of assembly.
  • An electronic device includes a power carrier that carries a control medium, and an associated assembly method.
  • the power components necessary for the implementation of electric motors are carried by a power support, for example an integrated metallic substrate comprising an insulating layer carrying conductive tracks and associated with a second thicker metal layer forming a radiator.
  • the integrated metal substrate also carries control components.
  • the passage of the conductive tracks associated with the power components often prevents a compact arrangement of the control components.
  • the necessary thickness and separation of the conductive tracks prevents the use of compact fine pitch control components.
  • the most common integrated metal substrates usually have only one level of conductive tracks, which leads to separate the control components from each other, inducing a large surface area.
  • this type of integrated metal substrate is much more expensive and more difficult to implement, especially in warm environments typical of a vehicle engine compartment.
  • the invention relates to an electric device 'roni- that the arrangement of the components is more compact.
  • an electronic device comprising a power carrier carrying power components, and control components, in which, according to the invention, the control components are carried by a carrier. which is attached directly to the power support by means of securing members also forming electrical connections between the power support and the control support
  • control support is reported, in the manner of a single component, on the power support, the only links between the control support and the power support being summed up to the solenoidization members which occupy only a small area on the surface of the integrated metal substrate.
  • the control support forms an additional stage so that the available surface area for placing the control components is no longer limited to the areas on the surface of the integrated metal substrate.
  • control support having a large class of etching and allowing the use of compact control components with fine pitch.
  • a control medium having a plurality of levels of conductive tracks can be used, which allows even more compact installation of the control components, while keeping a power carrier at a level of conductive tracks.
  • the invention also relates to a method of assembling such a device.
  • FIG. 1 is a perspective view of an electronic device housing according to the invention, the housing cover has been omitted;
  • FIG. 2 is a sectional view along the line II -II of Figure 1.
  • FIG. 3 is an enlarged partial view of Figure 2, showing the device being mounted.
  • the device of the invention here comprises a housing 10 having a circular plate-shaped portion which carries collectors 11 of an electric motor (not visible), and a cavity-shaped portion which receives a support a power source, here an integrated metal substrate 20 which carries power components 21 to which the collectors 11 are connected by conductive tracks 12.
  • the housing is normally covered by a cover (not shown) and is here part of a motor group. fan for integration into a vehicle engine compartment.
  • the integrated metal substrate 20 comprises, in a manner known per se, an insulating layer 22 which is associated with a metal layer 23 (for example aluminum) forming a radiator. At the free surface of the insulating layer 22 extend conductive copper tracks 24,26, visible in Figure 3.
  • a control medium here a printed circuit board 30 carrying control components 31, is attached to the integrated metal substrate 20.
  • the printed circuit board 30 is treated as a single component, which, from the same way as a power component, is soldered to the integrated metal substrate 20.
  • the printed circuit board 30 comprises, in a manner known per se, an insulator 32 made of glass / epoxy laminate (for example of the FR4 or FR5 type) whose faces bear conductive tracks 33.
  • the conductive tracks 33 of each of the faces of the printed circuit board 30 are electrically connected by conductive vias 34 passing through the printed circuit board 30.
  • the device of the invention is manufactured as follows: the brazing paste is screen printed on the printed circuit board 30, and the control components 31 are placed on the printed circuit board 30 on it. the reflow oven assembly for soldering the control components 31 on the printed circuit board 30.
  • the assembly consisting of the printed circuit board 30 and control components is placed thereon. 31, as well as the power components 21.
  • the whole is passed to the reflow oven so that the power components 21 and the printed circuit board 30 are soldered to the integrated metal substrate 30 in a single operation.
  • the heated solder paste forms welds which are as many fasteners ensuring both mechanical connections and electrical connections between the integrated metal substrate 20 and the printed circuit board 30.
  • the assembly thus constituted is reported in the housing 10 to be fixed by the screws 27.
  • the use according to the invention of a printed circuit board 30 for carrying the control components 31 saves an appreciable surface.
  • the printed circuit board 30 may overlap power tracks on the surface of the integrated metal substrate (such as track 26 of FIG. 3), allowing the operation (on an upper floor) of a surface that would not It could be used to place control components if they had to be placed directly on the integrated metal substrate 20.
  • this type of card allows the use of compact components with fine pitch that could not be mounted. on the integrated metal substrate.
  • the printed circuit board 30 may have several levels of conductive tracks, which further enables the arrangement of the control components to be further compacted;
  • the fastening according to the invention of the printed circuit board to the integrated metal substrate by welding forming both mechanical connections and electrical connections between the power support and the control support avoids manipulating several supports during assembly of the device and thus eliminates operations for fixing the supports in the housing and electrical connection between supports, so that the assembly of the device is simplified.
  • the power support is an integrated metal substrate and the control support a printed circuit board, the invention is not limited to these types of support and any other support may be used.
  • the power support may be constituted by a copper support.
  • solder paste may also be placed under the control support.
  • the solder paste may also be disposed on the side of the control support.
  • solder balls it will also be possible to use solder balls arranged under the control support in the manner of so-called BGA components.
  • the securing members may take more generally other forms than welds, such as screwed legs, as long as the connecting members also provide an electrical connection between the power support and the control support.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention concerns an electronic device comprising a power support (20) bearing power components (21) and control components (31), wherein the control components are borne by a control support (30) which is mounted on the power support via securing members (35) forming electrical connections between the power support and the control support.

Description

Dispositif électronique comportant un support de puissance qui porte un support de commande, et procédé d'assemblage. L'invention concerne un dispositif électronique comportant un support de puissance qui porte un support de commande, et un procédé d'assemblage associé. Electronic device comprising a power support which carries a control support, and method of assembly. An electronic device includes a power carrier that carries a control medium, and an associated assembly method.
ARRIERE-PLAN DE L'INVENTION Les composants de puissance nécessaires à la mise en œuvre de moteurs électriques (par exemple les moteurs de ventilateurs disposés dans les compartiments moteurs des véhicules) sont portés par un support de puissance, par exemple un substrat métallique intégré comportant une couche d'isolant portant des pistes conductrices et associée à une deuxième couche métallique, plus épaisse, formant radiateur.BACKGROUND OF THE INVENTION The power components necessary for the implementation of electric motors (for example the fan motors arranged in the motor compartments of the vehicles) are carried by a power support, for example an integrated metallic substrate comprising an insulating layer carrying conductive tracks and associated with a second thicker metal layer forming a radiator.
Le substrat métallique intégré porte également des composants de commande. Cependant, le passage des pistes conductrices associées aux composants de puissance empêche souvent une disposition compacte des composants de commande. De plus, l'épaisseur et la séparation nécessaire des pistes conductrices empêche l'utilisation de composants de commande compacts à pas fin. En outre, les substrats métalliques intégrés les plus courants ne comportent en général qu'un seul niveau de pistes conductrices, ce qui conduit à écarter les composants de commande les uns des autres, induisant un encombrement surfacique important . Pour augmenter la densité des composants de commande, et ainsi diminuer l'encombrement général, on peut faire appel à un substrat métallique intégré comportant plusieurs niveaux de pistes conductrices. Cependant, ce type de substrat métallique intégré est bien plus onéreux et plus délicat à mettre en œuvre, notamment dans des environnements chauds typiques d'un compartiment moteur de véhicule .The integrated metal substrate also carries control components. However, the passage of the conductive tracks associated with the power components often prevents a compact arrangement of the control components. In addition, the necessary thickness and separation of the conductive tracks prevents the use of compact fine pitch control components. In addition, the most common integrated metal substrates usually have only one level of conductive tracks, which leads to separate the control components from each other, inducing a large surface area. To increase the density of the control components, and thus reduce the overall size, it is possible to use an integrated metal substrate having several levels of conductive tracks. However, this type of integrated metal substrate is much more expensive and more difficult to implement, especially in warm environments typical of a vehicle engine compartment.
OBJET DE L'INVENTION L'invention a pour objet un dispositif élect'roni- que dont l'agencement des composants est plus compact. BREVE DESCRIPTION DE L'INVENTIONOBJECT OF THE INVENTION The invention relates to an electric device 'roni- that the arrangement of the components is more compact. BRIEF DESCRIPTION OF THE INVENTION
En vue de la réalisation de ce but, on propose un dispositif électronique comportant un support de puissance portant des composants de puissance, et des compo- sants de commande, dans lequel, selon l'invention, les composants de commande sont portés par un support de commande qui est rapporté directement sur le support de puissance au moyen d'organes de solidarisation formant également des liaisons électriques entre le support de puissance et le support de commandeIn order to achieve this object, an electronic device is provided comprising a power carrier carrying power components, and control components, in which, according to the invention, the control components are carried by a carrier. which is attached directly to the power support by means of securing members also forming electrical connections between the power support and the control support
Ainsi, le support de commande est rapporté, à la manière d'un unique composant, sur le support de puissance, les seules liaisons entre le support de commande et le support de puissance se résumant aux organes de so- lidarisation qui n'occupent qu'une faible superficie à la surface du substrat métallique intégré.Thus, the control support is reported, in the manner of a single component, on the power support, the only links between the control support and the power support being summed up to the solenoidization members which occupy only a small area on the surface of the integrated metal substrate.
Le support de commande forme un étage supplémentaire de sorte que la surface disponible pour placer les composants de commande n'est plus limitée aux zones Ii- bres à la surface du substrat métallique intégré. En particulier on peut exploiter (sur le support de commande) les zones occupées par les pistes de puissance s ' étendant à la surface du support de puissance.The control support forms an additional stage so that the available surface area for placing the control components is no longer limited to the areas on the surface of the integrated metal substrate. In particular, it is possible to exploit (on the control support) the zones occupied by the power tracks extending on the surface of the power support.
On peut dès lors utiliser un support de commande ayant une classe de gravure importante et permettant l'utilisation de composants de commande compacts à pas fin. On peut en outre utiliser un support de commande comportant plusieurs niveaux de pistes conductrices, ce qui permet une installation encore plus compacte des com- posants de commande, tout en gardant un support de puissance à un niveau de pistes conductrices.It is therefore possible to use a control support having a large class of etching and allowing the use of compact control components with fine pitch. In addition, a control medium having a plurality of levels of conductive tracks can be used, which allows even more compact installation of the control components, while keeping a power carrier at a level of conductive tracks.
L'invention a également pour objet un procédé d'assemblage d'un tel dispositif.The invention also relates to a method of assembling such a device.
BREVE DESCRIPTION DES DESSINS L'invention sera mieux comprise à la lumière de la description qui suit en référence aux figures des dessins annexés parmi lesquelles :BRIEF DESCRIPTION OF THE DRAWINGS The invention will be better understood in the light of the following description with reference to the figures of the appended drawings among which:
- la figure 1 est une vue en perspective d'un boîtier de dispositif électronique selon l'invention, le couvercle du boîtier ayant été omis ;- Figure 1 is a perspective view of an electronic device housing according to the invention, the housing cover has been omitted;
- la figure 2 est une vue en coupe selon la ligne II -II de la figure 1.- Figure 2 is a sectional view along the line II -II of Figure 1.
- la figure 3 est une vue partielle agrandie de la figure 2, montrant le dispositif en cours de montage. DESCRIPTION DETAILLEE DE L'INVENTION- Figure 3 is an enlarged partial view of Figure 2, showing the device being mounted. DETAILED DESCRIPTION OF THE INVENTION
En référence aux figures, le dispositif de l'invention comporte ici un boîtier 10 ayant une partie en forme de plaque circulaire qui porte des collecteurs 11 d'un moteur électrique (non visible), et une partie en forme de cavité qui reçoit un support de puissance, ici un substrat métallique intégré 20 qui porte des composants de puissance 21 auxquels les collecteurs 11 sont reliées par des pistes conductrices 12. Le boîtier est normalement recouvert par un couvercle (non représenté) et fait ici partie d'un groupe moto-ventilateur destiné à être intégré dans un compartiment moteur de véhicule.With reference to the figures, the device of the invention here comprises a housing 10 having a circular plate-shaped portion which carries collectors 11 of an electric motor (not visible), and a cavity-shaped portion which receives a support a power source, here an integrated metal substrate 20 which carries power components 21 to which the collectors 11 are connected by conductive tracks 12. The housing is normally covered by a cover (not shown) and is here part of a motor group. fan for integration into a vehicle engine compartment.
Comme cela est plus particulièrement visible à la figure 2, le substrat métallique intégré 20 comporte de façon connue en soi une couche d'isolant 22 qui est asso- ciée à une couche métallique 23 (par exemple de l'aluminium) formant radiateur. A la surface libre de la couche d'isolant 22 s'étendent des pistes conductrices en cuivre 24,26, visibles à la figure 3.As can be seen more particularly in FIG. 2, the integrated metal substrate 20 comprises, in a manner known per se, an insulating layer 22 which is associated with a metal layer 23 (for example aluminum) forming a radiator. At the free surface of the insulating layer 22 extend conductive copper tracks 24,26, visible in Figure 3.
Selon l'invention, un support de commande, ici une carte à circuit imprimé 30 portant des composants de commande 31, est rapporté sur le substrat métallique intégré 20. La carte à circuit imprimé 30 est traitée comme un unique composant, qui, de la même manière qu'un composant de puissance, est soudé sur le substrat métallique intégré 20. En référence à la figure 3, la carte à circuit imprimé 30 comporte de façon connue en soi un isolant 32 en laminé de verre/epoxy (par exemple de type FR4 ou FR5) dont les faces portent des pistes conductrices 33. Les pistes conductrices 33 de chacune des faces de la carte à circuit imprimé 30 sont connectées électriquement par des vias conducteurs 34 traversant la carte à circuit imprimé 30.According to the invention, a control medium, here a printed circuit board 30 carrying control components 31, is attached to the integrated metal substrate 20. The printed circuit board 30 is treated as a single component, which, from the same way as a power component, is soldered to the integrated metal substrate 20. With reference to FIG. 3, the printed circuit board 30 comprises, in a manner known per se, an insulator 32 made of glass / epoxy laminate (for example of the FR4 or FR5 type) whose faces bear conductive tracks 33. The conductive tracks 33 of each of the faces of the printed circuit board 30 are electrically connected by conductive vias 34 passing through the printed circuit board 30.
La fabrication du dispositif de l'invention se fait comme suit : on sérigraphie de la pâte à braser sur la carte à circuit imprimé 30, puis on place sur celle-ci les composants de commande 31 sur la carte à circuit imprimé 30. On passe l'ensemble au four de refusion pour souder les composants de commande 31 sur la carte à cir- cuit imprimé 30.The device of the invention is manufactured as follows: the brazing paste is screen printed on the printed circuit board 30, and the control components 31 are placed on the printed circuit board 30 on it. the reflow oven assembly for soldering the control components 31 on the printed circuit board 30.
Ainsi que cela est illustré à la figure 3, après avoir sérigraphié de la pâte à braser 35 sur le substrat métallique intégré 20, on place sur celui-ci l'ensemble constitué de la carte à circuit imprimé 30 et des compo- sants de commande 31, ainsi que les composants de puissance 21. Le tout est passé au four de refusion de sorte que l'on soude sur le substrat métallique intégré 20 les composants de puissance 21 et la carte à circuit imprimé 30 en une seule opération. La pâte à braser 35 chauffée forme des soudures qui sont autant d'organes de solidari- sation assurant à la fois des liaisons mécaniques et liaisons électriques entre le substrat métallique intégré 20 et la carte à circuit imprimé 30. L'ensemble ainsi constitué est rapporté dans le boîtier 10 pour être fixé par les vis 27.As is illustrated in FIG. 3, after having screen printed solder paste 35 on the integrated metal substrate 20, the assembly consisting of the printed circuit board 30 and control components is placed thereon. 31, as well as the power components 21. The whole is passed to the reflow oven so that the power components 21 and the printed circuit board 30 are soldered to the integrated metal substrate 30 in a single operation. The heated solder paste forms welds which are as many fasteners ensuring both mechanical connections and electrical connections between the integrated metal substrate 20 and the printed circuit board 30. The assembly thus constituted is reported in the housing 10 to be fixed by the screws 27.
Les avantages du dispositif de l'invention sont nombreux:The advantages of the device of the invention are numerous:
- l'utilisation selon l'invention d'une carte à circuit imprimé 30 pour porter les composants de commande 31 permet d'économiser une surface appréciable. D'une part, la carte à circuit imprimé 30 peut chevaucher des pistes de puissance à la surface du substrat métallique intégré (comme la piste 26 de la figure 3) , permettant l'exploitation (à un étage supérieur) d'une surface qui n'aurait pu être utilisée pour placer des composants de commande s ' ils avaient dû être disposés directement sur le substrat métallique intégré 20. D'autre part, ce type de carte permet l'utilisation de composants de commande compacts à pas fin qui ne pourraient être montés sur le substrat métallique intégré. De plus, la carte à circuit imprimé 30 peut comporter plusieurs niveaux de pistes conductrices, ce qui permet de compacter encore plus l'agencement des composants de commande ;- The use according to the invention of a printed circuit board 30 for carrying the control components 31 saves an appreciable surface. On the one on the other hand, the printed circuit board 30 may overlap power tracks on the surface of the integrated metal substrate (such as track 26 of FIG. 3), allowing the operation (on an upper floor) of a surface that would not It could be used to place control components if they had to be placed directly on the integrated metal substrate 20. On the other hand, this type of card allows the use of compact components with fine pitch that could not be mounted. on the integrated metal substrate. In addition, the printed circuit board 30 may have several levels of conductive tracks, which further enables the arrangement of the control components to be further compacted;
- En outre, par rapport aux dispositifs connus comportant plusieurs cartes à circuit imprimé fixées individuellement dans le boîtier et entre lesquelles s'étendent des connexions électriques, la solidarisation selon l'invention de la carte à circuit imprimé au substrat métallique intégré par des soudures formant à la fois des liaisons mécaniques et des liaisons électriques entre le support puissance et le support de commande évite de manipuler plusieurs supports lors de l'assemblage du dispositif et élimine donc des opérations de fixation des supports dans le boîtier et de connexion électrique entre supports, de sorte que l'assemblage du dispositif s'en trouve simplifié.- In addition, compared to known devices comprising a plurality of printed circuit boards individually fixed in the housing and between which extend electrical connections, the fastening according to the invention of the printed circuit board to the integrated metal substrate by welding forming both mechanical connections and electrical connections between the power support and the control support avoids manipulating several supports during assembly of the device and thus eliminates operations for fixing the supports in the housing and electrical connection between supports, so that the assembly of the device is simplified.
L'invention n'est pas limitée à ce qui vient d'être décrit, mais bien au contraire englobe toute variante entrant dans le cadre défini par les revendica- tions.The invention is not limited to what has just been described, but on the contrary encompasses any variant within the scope defined by the claims.
En particulier, bien que dans l'exemple illustré, le support de puissance soit un substrat métallique intégré et le support de commande une carte à circuit imprimé, l'invention n'est pas limitée à ces types de support et tout autre support pourra être utilisé. En particu- lier, le support de puissance pourra être constitué par un support cuivré .In particular, although in the example illustrated, the power support is an integrated metal substrate and the control support a printed circuit board, the invention is not limited to these types of support and any other support may be used. In particular bind, the power support may be constituted by a copper support.
Bien que l'on ait indiqué que les organes de so- lidarisation entre le support de puissance et le support de commande sont des soudures faites au moyen de pâte à braser disposée sur le support de puissance, la pâte à braser pourra être également placée sous le support de commande. La pâte à braser pourra également être disposée sur le côté du support de commande. En remplacement de la pâte à braser, on pourra également utiliser des billes de soudure disposées sous le support de commande à la manière des composants dits BGA.Although it has been pointed out that the means of solubilization between the power support and the control support are welds made by means of solder paste placed on the power support, the solder paste may also be placed under the control support. The solder paste may also be disposed on the side of the control support. In lieu of the solder paste, it will also be possible to use solder balls arranged under the control support in the manner of so-called BGA components.
Par ailleurs, les organes de solidarisation pourront prendre plus généralement d'autre formes que des soudures, comme par exemple des pattes vissées, du moment que les organes de liaison assurent également une liaison électrique entre le support de puissance et le support de commande . Moreover, the securing members may take more generally other forms than welds, such as screwed legs, as long as the connecting members also provide an electrical connection between the power support and the control support.

Claims

REVENDICATIONS
1. Dispositif électronique comportant un support de puissance (20) portant des composants de puissance (21) et des composants de commande (31) , caractérisé en ce que les composants de commande sont portés par un support de commande (30) qui est rapporté sur le support de puissance au moyen d'organes de solidarisation (35) formant également des liaisons électriques entre le support de puissance et le support de commande.An electronic device comprising a power carrier (20) carrying power components (21) and control components (31), characterized in that the control components are carried by a control bracket (30) which is attached on the power support by means of securing members (35) also forming electrical connections between the power support and the control support.
2. Dispositif selon la revendication 1, caractérisé en ce que le support de puissance est un substrat métallique intégré (20) , tandis que le support de commande est une carte à circuit imprimé (30) . 2. Device according to claim 1, characterized in that the power carrier is an integrated metal substrate (20), while the control medium is a printed circuit board (30).
3. Dispositif selon la revendication 1, caractérisé en ce que les organes de solidarisation comprennent des apports de soudure (35) s 'étendant entre le support de puissance (20) et le support de commande (30) .3. Device according to claim 1, characterized in that the securing members comprise solder inputs (35) extending between the power support (20) and the control support (30).
4. Procédé d'assemblage d'un dispositif électro- nique comportant un support de puissance (20) adapté à porter des composants de puissance (21) et un support de commande (30) adapté à porter des composants de commande (31), comportant les étapes de:4. A method of assembling an electronic device comprising a power carrier (20) adapted to carry power components (21) and a control support (30) adapted to carry control components (31), comprising the steps of:
- placer les composants de puissance (21) sur le support de puissance (20) et placer le support de commande (30) sur le support de puissance (20) en interposant des organes de solidarisation adaptés à former des liaisons électriques entre le support de commande et le support de puissance ; - chauffer l'ensemble pour souder les composants de puissance (21) et le support de commande (30) au support de puissance (20) .placing the power components (21) on the power support (20) and placing the control support (30) on the power support (20) by interposing fastening members adapted to form electrical connections between the power support (20) and control and power support; - Heat the assembly for soldering the power components (21) and the control support (30) to the power support (20).
5. Procédé d'assemblage selon la revendication 4, dans lequel les composants de commande (31) sont assem- blés au support de commande (30) avant que le support de commande ne soit placé sur le support de puissance (20) . 5. The assembly method according to claim 4, wherein the control components (31) are connected to the control support (30) before the support of control is placed on the power support (20).
PCT/FR2006/002150 2005-09-20 2006-09-20 Electronic device comprising a power support which bears a control support, and assembly method WO2007034072A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0509567 2005-09-20
FR0509567A FR2891107B1 (en) 2005-09-20 2005-09-20 ELECTRONIC DEVICE COMPRISING A POWER SUPPORT THAT HAS A CONTROL SUPPORT, AND A METHOD OF ASSEMBLY

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WO2007034072A1 true WO2007034072A1 (en) 2007-03-29

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WO (1) WO2007034072A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0289439A1 (en) * 1987-04-22 1988-11-02 POWER COMPACT, Société Anonyme: Process for assembling power circuits and control circuits at several levels on the same module, and module so obtained
FR2768292A1 (en) * 1997-09-06 1999-03-12 Telefunken Microelectron ELECTRONIC ASSEMBLY WITH OPTIMIZED COMPONENT SUPPORTS
US20040105243A1 (en) * 2002-10-03 2004-06-03 Kuang-Hua Lee Electronic device having a plurality of metallic balls for transmitting signals between two circuit boards

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0289439A1 (en) * 1987-04-22 1988-11-02 POWER COMPACT, Société Anonyme: Process for assembling power circuits and control circuits at several levels on the same module, and module so obtained
FR2768292A1 (en) * 1997-09-06 1999-03-12 Telefunken Microelectron ELECTRONIC ASSEMBLY WITH OPTIMIZED COMPONENT SUPPORTS
US20040105243A1 (en) * 2002-10-03 2004-06-03 Kuang-Hua Lee Electronic device having a plurality of metallic balls for transmitting signals between two circuit boards

Also Published As

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FR2891107B1 (en) 2008-10-24
FR2891107A1 (en) 2007-03-23

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