WO2007028201A1 - Optical mount for laser rod - Google Patents
Optical mount for laser rod Download PDFInfo
- Publication number
- WO2007028201A1 WO2007028201A1 PCT/AU2006/001300 AU2006001300W WO2007028201A1 WO 2007028201 A1 WO2007028201 A1 WO 2007028201A1 AU 2006001300 W AU2006001300 W AU 2006001300W WO 2007028201 A1 WO2007028201 A1 WO 2007028201A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- contact
- optical
- base
- optical element
- mount
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/0602—Crystal lasers or glass lasers
- H01S3/0606—Crystal lasers or glass lasers with polygonal cross-section, e.g. slab, prism
Definitions
- This invention relates to an optical mount and in particular a mount to hold a laser rod.
- Optical devices such as laser rods, operate in an environment that often has a rapidly changing and highly variable thermal environment.
- the thermal changes can induce thermo-optical and thermo-mechanical misalignment. It is important to maintain the optical element at the correct operating temperature to reduce thermal-induced misalignment and to avoid thermal stress, while maintaining stable mechanical location.
- thermal stability is a solid state laser system which is based upon optical excitation of a laser rod.
- the laser rod has a characteristic optical transition at a specific wavelength. It is well known that there are a number of factors that impact the lasing efficiency, lensing effects within the laser rod and the beam quality of the emitted radiation. For example, thermal-induced lensing and birefringence is a known problem in Nd:YAG. As the laser rod is pumped with energy from the pump source, some of the energy is converted to heat which must be removed evenly from the laser rod to avoid thermal-optical misalignment and thermal- mechanical stress. To achieve this a good and even thermal conductivity is required from the entire surface of the optical element to an efficient heat sink.
- an optical mount comprising: a base shaped to receive an optical element in close contact on two faces of the optical element; two or more contact blocks shaped to contact the base and the optical element; and one or more bias means located to urge said contact blocks into contact with said optical element and said base.
- the optical element is rectangular and the base is a V block having a corner shape adapted to receive a corner of the optical element so that two faces of the optical element are in contact with the base.
- the contact blocks preferably have matching shaped faces so that at least one face is in contact with a face of the optical element and one face is in contact with the base.
- the bias means are suitably springs which act against the contact blocks to push them towards the optical element and the base.
- the bias means are springs located between the clamping member and the contact blocks.
- the optical element is preferably a laser rod.
- Heat transfer material may be applied between the faces of the contact blocks and the optical element, and between the contact blocks and the base.
- the contact blocks and the base are suitably made from material with good thermal conductivity such as copper or aluminium.
- the springs provide sufficient force against the contact blocks to maintain good thermal contact but allow for minor movement thereby compensating for thermal effects.
- a key feature of this design is that both contact blocks can move independently and still maintain full contact, and therefore full and homogenous thermal transfer, with both the laser rod and the base.
- FIG 1 is a sketch of a prior art optical mount
- FIG 2 is a sketch of another prior art optical mount
- FIG 3 is a sketch of an optical mount with improved thermal stability
- FIG 4 is a cross-sectional view of a laser rod holder based on the optical mount of FIG 3;
- FIG 5 is an exploded view of the laser rod holder of FIG 4.
- FIG 1 A prior art holder for a laser rod is shown in FIG 1.
- the laser rod 1 is held between a lower 'V block 2 and an upper V block 3.
- the pair of 'V blocks are pushed together so as to firmly contact all sides of the laser rod.
- Heat from the laser rod is conducted into the blocks as indicated by the arrows.
- a lower heat sink 4 and an upper heat sink 5 absorb excess heat and provide temperature control.
- the heat sinks 4, 5 are Peltier chip devices or water cooling coils.
- the prior art device of FIG 1 requires two temperature control devices which adds cost. The temperature control devices must be well matched to avoid the introduction of systemic heat differentials between the blocks.
- FIG 2 Another prior art mounting block is shown in FIG 2.
- the design is similar to that of FIG 1 but only a single lower heat sink 4 is used to reduce cost.
- An indium foil ⁇ is placed between the 'V blocks to conduct heat from one block to the other. The heat flow is depicted by the arrows.
- This design reduces cost and removes the problem of possible differences between the heat sinks but a very high mechanical tolerance is required to maintain good contact between the full length of the rod on all faces and also the faces that adjoin the upper and lower blocks. The result of this is usually a thermal gradient between the top of the upper block 3 and the bottom of the lower block 2 adjacent the heat sink 4.
- FIG 1 and FIG 2 will introduce variable mechanical stress and thermal conductivity as the rod expands and contracts due to heat produced during pumping.
- United States patent application 2004/0165625 describes a design which is similar to FIG 2 where springs are used to hold upper 1 V block 3 in place and to reduce the risk of damage to the optical element when thermal expansion occurs.
- the main disadvantage of this design is that if thermal expansion occurs which is sufficient to cause the holding piece to push away from the lower 'V block
- FIG. 1 An optical mount having improved thermal stability is shown in FIG. 1
- the laser rod 11 is seated in a lower 'V block 12 (base) with an adjacent heat sink 14.
- the shape of the V in the V block 12 is carefully machined to ensure good contact between the faces of the laser rod 11 and the surface of the 'V block 12.
- a pair of contact blocks in the form of wedges 13a, 13b are shaped to sit against one face of the laser rod 11 and against an adjacent face of the 'V block. Thermal conduction from the laser rod to the heat sink via the wedges and 'V block is indicated by the arrows.
- FIG 4 A cross-sectional view of a laser rod holder built according to the principle of FIG 3 is shown in FIG 4 and an exploded view is shown in FIG 5.
- the laser rod 11 is located in the corner of a relatively large 'V block base 12.
- Contact block wedges 13a, 13b are held against the laser rod and the 'V block by springs 18.
- the springs are each seated in a cup 18a formed in each wedge and a socket 18b in a clamp 19.
- the clamp 19 is attached to the V block 12 by bolt 20.
- the clamp 19, wedges 13 and 'V block 12 are made from the same material and therefore have the same thermal properties.
- the springs 18 provide sufficient force against the wedges 13 to maintain good thermal contact but allow for minor movement thereby compensating for thermal effects.
- both wedges 13a and 13b can move independently and still maintain full contact and therefore full and homogenous thermal transfer with both the laser rod 11 and the lower 'V block 12.
- the inventor has found that the laser rod holder shown in FIG 4 and FIG 5 has superior performance over those known in the prior art providing homogenous and stable thermal conduction under variable pumping conditions while providing precise mechanical location.
- the optical mount may be manufactured from any material having good thermal conductivity.
- the inventors have found that copper and aluminium are both suitable and indium foil 21 or a thermal transfer compound can be placed between the laser rod surfaces and the metal surfaces of the V block and contact blocks to improve thermal conductivity.
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Lasers (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002621629A CA2621629A1 (en) | 2005-09-07 | 2006-09-05 | Optical mount for laser rod |
AU2006289656A AU2006289656B2 (en) | 2005-09-07 | 2006-09-05 | Optical mount for laser rod |
US12/066,117 US7643230B2 (en) | 2005-09-07 | 2006-09-05 | Optical mount for laser rod |
EP06774929A EP1922788A4 (en) | 2005-09-07 | 2006-09-05 | Optical mount for laser rod |
JP2008529418A JP2009507383A (en) | 2005-09-07 | 2006-09-05 | Optical mount for laser rod |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2005904907 | 2005-09-07 | ||
AU2005904907A AU2005904907A0 (en) | 2005-09-07 | Optical mount |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007028201A1 true WO2007028201A1 (en) | 2007-03-15 |
Family
ID=37835305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/AU2006/001300 WO2007028201A1 (en) | 2005-09-07 | 2006-09-05 | Optical mount for laser rod |
Country Status (5)
Country | Link |
---|---|
US (1) | US7643230B2 (en) |
EP (1) | EP1922788A4 (en) |
JP (1) | JP2009507383A (en) |
CA (1) | CA2621629A1 (en) |
WO (1) | WO2007028201A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010228404A (en) * | 2009-03-30 | 2010-10-14 | Fuji Xerox Co Ltd | Structure for holding optical component, and optical scanning device and image forming apparatus using the same |
JP5338788B2 (en) * | 2010-11-10 | 2013-11-13 | 船井電機株式会社 | LASER HOLDER AND OPTICAL PICKUP HAVING THE SAME |
JP5729869B2 (en) * | 2011-07-05 | 2015-06-03 | 株式会社日本自動車部品総合研究所 | Solid laser fixing method and laser ignition device using the same |
US9362716B2 (en) * | 2014-09-19 | 2016-06-07 | Ipg Photonics Corporation | Crystal mount for laser application |
KR20180095881A (en) | 2015-12-14 | 2018-08-28 | 엘렉스 메디컬 피티와이 엘티디 | Pattern laser |
CN105428969B (en) * | 2015-12-30 | 2018-07-31 | 北京国科世纪激光技术有限公司 | A kind of crystal cup group device of fine-tuning two dimension angular |
CN108594395B (en) * | 2018-06-07 | 2024-01-19 | 国家电网公司 | Carbon dioxide laser zoom aiming system |
CN109217082A (en) * | 2018-09-21 | 2019-01-15 | 中国科学院长春光学精密机械与物理研究所 | A kind of laser crystal is heat sink |
KR102124077B1 (en) * | 2019-01-07 | 2020-06-17 | 주식회사 한화 | Assembling method of laser gain medium assembly solid-state solid lasers |
JP7461159B2 (en) | 2020-02-21 | 2024-04-03 | 浜松ホトニクス株式会社 | Prism rod holder, laser module, laser processing equipment and holding structure |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07307507A (en) * | 1994-05-13 | 1995-11-21 | Oyo Koden Kenkiyuushitsu:Kk | Solid laser |
EP0847114A1 (en) * | 1996-12-03 | 1998-06-10 | Miyachi Technos Corporation | Solid-state laser apparatus |
US6754418B1 (en) * | 1999-04-23 | 2004-06-22 | Cobolt Ab | Optical arrangement |
US20040165625A1 (en) * | 2003-02-21 | 2004-08-26 | Masayuki Momiuchi | Semiconductor laser device and method for holding laser crystal in semiconductor laser device |
US20040258123A1 (en) * | 2003-06-23 | 2004-12-23 | Zamel James Michael | Diode-pumped solid-state laser gain module |
WO2006070548A1 (en) * | 2004-12-28 | 2006-07-06 | Osaka University | Solid laser module, optical amplifier, and laser oscillator |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63158578A (en) * | 1986-12-23 | 1988-07-01 | Ricoh Co Ltd | Misregistration preventing device for optical element |
US5166943A (en) * | 1991-06-14 | 1992-11-24 | Amoco Corporation | Single domain stabilization in ferroelectric crystals |
US6361177B2 (en) * | 1999-11-02 | 2002-03-26 | Fujitsu Denso Ltd. | Optical device fixing device |
US6366596B1 (en) * | 2000-01-21 | 2002-04-02 | Photonics Industries International, Inc. | High power laser |
US6603614B2 (en) * | 2001-01-26 | 2003-08-05 | Corning Precision Lens, Inc. | Lens assembly having automatic thermal focus adjustment |
JP2002341220A (en) * | 2001-05-14 | 2002-11-27 | Olympus Optical Co Ltd | Optical instrument |
JP3928545B2 (en) * | 2002-11-08 | 2007-06-13 | ブラザー工業株式会社 | Optical member holding means, and optical scanning device and image forming apparatus including the same |
JP4262525B2 (en) * | 2003-05-30 | 2009-05-13 | 株式会社キーエンス | Optical crystal holder, solid-state laser device, and optical crystal fixing method |
-
2006
- 2006-09-05 EP EP06774929A patent/EP1922788A4/en not_active Withdrawn
- 2006-09-05 JP JP2008529418A patent/JP2009507383A/en not_active Withdrawn
- 2006-09-05 US US12/066,117 patent/US7643230B2/en not_active Expired - Fee Related
- 2006-09-05 WO PCT/AU2006/001300 patent/WO2007028201A1/en active Application Filing
- 2006-09-05 CA CA002621629A patent/CA2621629A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07307507A (en) * | 1994-05-13 | 1995-11-21 | Oyo Koden Kenkiyuushitsu:Kk | Solid laser |
EP0847114A1 (en) * | 1996-12-03 | 1998-06-10 | Miyachi Technos Corporation | Solid-state laser apparatus |
US6754418B1 (en) * | 1999-04-23 | 2004-06-22 | Cobolt Ab | Optical arrangement |
US20040165625A1 (en) * | 2003-02-21 | 2004-08-26 | Masayuki Momiuchi | Semiconductor laser device and method for holding laser crystal in semiconductor laser device |
US20040258123A1 (en) * | 2003-06-23 | 2004-12-23 | Zamel James Michael | Diode-pumped solid-state laser gain module |
WO2006070548A1 (en) * | 2004-12-28 | 2006-07-06 | Osaka University | Solid laser module, optical amplifier, and laser oscillator |
Also Published As
Publication number | Publication date |
---|---|
CA2621629A1 (en) | 2007-03-15 |
US20080247431A1 (en) | 2008-10-09 |
JP2009507383A (en) | 2009-02-19 |
EP1922788A1 (en) | 2008-05-21 |
US7643230B2 (en) | 2010-01-05 |
EP1922788A4 (en) | 2011-04-13 |
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