JP4262525B2 - Optical crystal holder, solid-state laser device, and optical crystal fixing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an optical crystal holder for holding an optical crystal such as a solid-state laser crystal or a nonlinear optical material, a solid-state laser device using the optical crystal holder, and a fixing method for fixing the optical crystal in a held state.
[0002]
[Prior art]
Currently, in laser application equipment such as a laser processing apparatus, optical amplification and wavelength conversion are performed using an optical crystal such as a solid-state laser crystal or a nonlinear optical material. For example, a laser processing apparatus using a solid laser medium, a wavelength conversion apparatus that performs wavelength conversion using a nonlinear optical crystal, and the like are used. In general, these optical crystals allow laser light to pass through both end faces, perform optical amplification and wavelength conversion, contact the side faces with a heat sink or the like to radiate and cool, and remove heat generated in the optical crystals. In these optical crystals, temperature management is important, and it is necessary to maintain a predetermined temperature by heat radiation and heating. For example, in a laser processing apparatus, since a resonator that irradiates a solid laser crystal with excitation light and resonates with intense heat generation, a mechanism for effectively cooling this is necessary. In particular, in order to perform highly accurate processing, it is necessary to control the output of the laser beam to be constant, and for that purpose, it is necessary to manage the temperature of the solid-state laser medium to be constant. As a method for fixing the solid-state laser medium, for example, the structures shown in Patent Document 1, Patent Document 2, and Patent Document 3 are known.
[0003]
[Patent Document 1]
JP 2000-22244 A
[Patent Document 2]
Japanese Patent Laid-Open No. 5-190940
[Patent Document 2]
Japanese Patent Laid-Open No. 9-293919
[0004]
[Problems to be solved by the invention]
In order to effectively cool the optical crystal, it is necessary to fix the side surface of the optical crystal so as to be held in contact with a heat radiating portion such as a heat sink in a state of low contact thermal resistance. In general, the optical crystal is fixed to the heat sink in a thermally conductive state by using an adhesive such as silver paste to reduce the contact thermal resistance between the optical crystal and the heat sink, or by using a low melting point solder such as indium. There are a method of soldering a crystal and a heat sink, a method of inserting a heat conductive sheet of indium or the like between a heat sink and an optical crystal as a buffer material, and applying pressure to both so as to reduce contact thermal resistance. .
[0005]
However, in the method using an adhesive such as silver paste, the volatility of the adhesive becomes a problem. In particular, both end faces of the optical crystal are generally coated, and adhesion of volatile substances significantly deteriorates the optical characteristics and impairs the performance of the apparatus. Also, the assembly process requires the management of the amount of adhesive and the drying process, and the adhesive that has solidified due to the heat generated by the optical crystal even after drying is subjected to stress (stress), resulting in misalignment of the optical crystal, etc. It also causes problems. There is a problem that the cooling state of the optical crystal changes depending on the thickness of the adhesive layer, which also affects the optical performance.
[0006]
Also, in the method of soldering an optical crystal and a heat sink using a low melting point solder, it is necessary to place the optical crystal once in a high temperature state in order to perform soldering. Since it is necessary to deposit metal such as Au on the surface, the cost becomes high. Moreover, since the replacement when the optical crystal is broken is impossible, it has a disadvantage that it must be handled as one piece with the heat sink. Furthermore, since bonding is performed over a wide area, it is necessary to manage the mechanical accuracy of the elements and the heat sink in order to perform uniform solder bonding, and it is also necessary to manage the pressure applied during bonding.
[0007]
Furthermore, in the method of press-contacting using a heat conductive sheet as a buffer material, the stress applied to the optical crystal becomes a problem. In general, heat sinks can be mass-produced with high accuracy, whereas the dimensional accuracy of optical crystals usually varies by about ± 100 μm. If it is attempted to suppress this variation to about ± 50 μm, the yield increases and the cost increases. On the other hand, it is extremely difficult to bring optical crystals of different thicknesses into contact with the heat sink with uniform pressure due to variations. For example, in the method of fastening the screw 78 so that the optical crystal 80 is tightly attached via the heat conductive sheet 81 from the side surface perpendicular to the optical axis, the upper and lower surfaces in the figure with two heat sinks 77A and 77B as shown in FIG. The torque management of the screw 78 is difficult, and the state in which the optical crystal 80 is in contact with the heat sinks 77A and 77B becomes non-uniform depending on the tightening state. If the contact state is not uniform, the contact thermal resistance increases and the cooling state cannot be controlled. In some cases, the optical crystal 80 may be excessively stressed to cause breakage. Another problem is that the two heat sinks are thermally separated.
[0008]
In order to prevent this, two heat sinks 79A and 79B may be brought into contact with each other as shown in FIG. 2, but the optical crystal 80 and the heat sinks 79A and 79B have different thicknesses as described above. The contact surface cannot be made uniform. In particular, since the processing accuracy of the optical crystal is remarkably poor with respect to the processing accuracy of the heat sink, considerable stress is applied to the optical crystal in order to bring the two heat sinks into thermal contact.
[0009]
The present invention has been made to solve such conventional problems. A main object of the present invention is to provide an optical crystal holder, a solid-state laser device, and an optical crystal fixing method capable of fixing the optical crystal in a state of being held with a uniform pressing force.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, an optical crystal holder according to claim 1 of the present invention comprises: Almost rectangular parallelepiped Optical crystal 80 4 surfaces of upper and lower surfaces and left and right surfaces constituting the side surface in the longitudinal direction Is an optical crystal holder that is fixed in a state where it is held at a predetermined pressing force. , Optical crystal 80 One of the upper and lower surfaces and one of the left and right surfaces Press Therefore, it is composed of two planes that intersect at substantially right angles 1st press board provided with the 1st press surface 83 When , Optical crystal 80 The other of the upper and lower surfaces and the other of the left and right surfaces Press Therefore, two planes intersecting at substantially right angles are configured. Second pressing plate having a second pressing surface 84 When , The first pressing plate 83 Between the second pressing plate 84 Holding plate 85 for tightly holding A first direction in which the first pressing plate 83 and the second pressing plate 84 are sandwiched between the first pressing surface and the second pressing surface, and the first pressing surface. And a plurality of pressing tools for setting the pressure for pressing the optical crystal 80 to a predetermined value from the second direction perpendicular to the first direction, which is a direction sandwiched by the second pressing surface. The first pressing plate 83 and the second pressing plate 84 are inserted into the temporary fixing screw 88 in the vertical and horizontal directions. A plurality of screw holes, In the pressing space constituted by the first pressing surface and the second pressing surface, the optical crystal 80 4 In a state where the surface is pressed to a predetermined pressure, the first pressing plate 83 And the second pressing plate by the holding plate 85 84 And the first pressing surface and the second pressing surface are fixed, and in this state, the first pressing plate 83 And holding plate 85, From a third direction orthogonal to the first direction and the second direction Fixing fixture 86 With fixing screw as It is characterized by that.
[0011]
An optical crystal holder according to claim 2 is the optical crystal holder according to claim 1, wherein the first pressing surface and the second pressing surface have thermal conductivity between the optical crystal 80. It is characterized by holding the buffer material provided.
[0012]
[0013]
[0014]
further , Claim 3 The optical crystal holder of claim 1 or 2 The optical crystal holder according to claim 1, wherein the temporary fixing screws 88 are inserted through springs 89, respectively. 83 And the second pressing plate 84 Is held in a pressed state at a predetermined pressure.
[0015]
Furthermore, the claims 4 The optical crystal holder of claim 1 3 One of one The optical crystal holder according to claim 1, wherein the fixture 86 is the first pressing plate. 83 And a plurality of fixing screws for screwing the holding plate 85 to each other.
[0016]
[0017]
Furthermore, the claims 5 The optical crystal holder of claim Any one of 1 to 4 The optical crystal holder according to claim 1, wherein one of the two intersecting surfaces is extended, and the first pressing plate 83 And the second pressing plate 84 And constitutes a joining surface 91 for direct joining.
[0018]
Furthermore, the claims 6 The optical crystal holder of claim 5 The optical crystal holder according to claim 1, wherein the first pressing plate is substantially orthogonal to the bonding surface 91. 83 And the second pressing plate 84 And a second joint surface 91B for direct joining.
[0019]
Claims 7 Solid state laser device, solid state laser crystal The A solid-state laser device that excites and emits excitation light, Almost rectangular parallelepiped Solid state laser crystal One of the upper and lower surfaces and one of the left and right surfaces among the four surfaces of the upper and lower surfaces and the left and right surfaces constituting the side surface in the longitudinal direction Press Therefore, it is composed of two planes that intersect at substantially right angles 1st press board provided with the 1st press surface 83 When, Above Solid state laser crystal The other of the upper and lower surfaces and the other of the left and right surfaces Press Therefore, it is composed of two planes that intersect at substantially right angles Second pressing plate having a second pressing surface 84 When , The first pressing plate 83 Between the second pressing plate 84 Holding plate 85 for tightly holding A first direction in which the first pressing plate 83 and the second pressing plate 84 are sandwiched between the first pressing surface and the second pressing surface, and the first pressing surface. As a pressing tool for setting the pressure for pressing the solid-state laser crystal to a predetermined value from a second direction perpendicular to the first direction, which is a direction sandwiched by the second pressing surface, A plurality of temporary fixing screws 88 are configured to be connectable, and the first pressing plate 83 and the second pressing plate 84 insert the temporary fixing screws 88 in the vertical and horizontal directions. A plurality of screw holes for each, The first pressing plate in a state where at least two surfaces of the solid laser crystal are pressed to a predetermined pressure in a pressing space constituted by the first pressing surface and the second pressing surface. 83 And the second pressing plate by the holding plate 85 84 And the first pressing surface and the second pressing surface are fixed, and in this state, the first pressing plate 83 And holding plate 85, From a third direction orthogonal to the first direction and the second direction Fixing fixture 86 As fixing screw The solid-state laser crystal is fixed while being held at a predetermined pressing force.
[0020]
And claims 8 The optical crystal fixing method of Almost rectangular parallelepiped Optical crystal 80 One of the upper and lower surfaces and one of the left and right surfaces among the four surfaces of the upper and lower surfaces and the left and right surfaces constituting the side surface in the longitudinal direction Press Therefore, it is composed of two planes that intersect at substantially right angles 1st press board provided with the 1st press surface 83 When , Optical crystal 80 The other of the upper and lower surfaces and the other of the left and right surfaces Press Therefore, it is composed of two planes that intersect at substantially right angles Second pressing plate having a second pressing surface 84 When , The first pressing plate 83 Between the second pressing plate 84 An optical crystal fixing method for fixing the optical crystal 80 to an optical crystal holder comprising a holding plate 85 for tightly holding the optical crystal 80, wherein the optical crystal 80 is fixed to the first pressing surface and the second pressing surface. The first pressing surface and the second pressing surface, the first pressing surface and the first pressing surface, and the first pressing surface and the first pressing surface. From the second direction perpendicular to the first direction. Pressing tool At a given pressure Optical crystal 80 The first pressing plate in a pressed state 83 And the second pressing plate 84 The first pressing plate from the step of holding and the third direction orthogonal to the first direction and the second direction. 83 And fixing the holding plate 85 with a fixture 86; Pressing tool Said first pressing plate by 83 And the second pressing plate 84 And a step of releasing the pressed state.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the embodiment described below exemplifies an optical crystal holder, a solid-state laser device, and an optical crystal fixing method for embodying the technical idea of the present invention. The solid laser device and the fixing method of the optical crystal are not specified as follows.
[0022]
Further, in this specification, in order to facilitate understanding of the claims, the numbers corresponding to the members shown in the embodiments are referred to as “claim column” and “means for solving the problems”. It is added to the members shown in the column. However, the members shown in the claims are not limited to the members in the embodiments. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing.
[0023]
[Optical crystal 80]
In this specification, the optical crystal 80 refers to a solid-state laser crystal that emits induced light when excited, a nonlinear optical material that performs wavelength conversion, and the like. In the following example, rod-shaped Nd: YVO is used as the optical crystal 80. ₄ The solid laser medium was used. The wavelength of the semiconductor laser for exciting the solid laser medium is Nd: YVO. ₄ The center wavelength of the absorption spectrum of 809 nm was set to 809 nm. However, the present invention is not limited to this example, and other solid-state laser media such as rare earth doped YAG, LiSrF, LiCaF, YLF, NAB, KNP, LNP, NYAB, NPP, GGG, etc. can also be used. Further, the wavelength conversion element can be converted into an arbitrary wavelength by combining a wavelength conversion element with a solid laser medium.
[0024]
Furthermore, it is also possible to use a wavelength conversion element that does not use a solid laser medium, in other words, does not constitute a resonator that oscillates laser light, and performs only wavelength conversion. In this case, wavelength conversion is performed on the output light of the semiconductor laser. As the wavelength conversion element, for example, KTP (KTiPO ₄ ), Organic nonlinear optical materials and other inorganic nonlinear optical materials such as KN (KNbO) ₃ ), KAP (KAsPO ₄ ), BBO, LBO, and bulk type polarization inversion elements (LiNbO) ₃ (Periodically Polled Lithium Niobate: PPLN), LiTaO ₃ Etc.) are available. Further, a semiconductor laser for an excitation light source of a laser by up-conversion using a fluoride fiber doped with rare earth such as Ho, Er, Tm, Sm, and Nd can be used. Thus, the present embodiment can be used for various types of optical crystals. These optical crystals are generally polished and coated at both end surfaces in the longitudinal direction, and these surfaces are used optically. On the other hand, the side surface of the optical crystal is often used as a cooling surface.
[0025]
[Upper heat sink 84, Lower heat sink 83]
Hereinafter, an optical crystal holder, a solid-state laser device, and an optical crystal fixing method according to embodiments of the present invention will be described with reference to the drawings. FIG. 3 shows a configuration of an optical crystal holder according to an embodiment of the present invention. The optical crystal holder 82 shown in this figure includes a lower heat sink 83 as a first pressing plate, an upper heat sink 84 as a second pressing plate, and a holding plate 85. The lower heat sink 83 and the upper heat sink 84 are configured to have a shape in which the combined portions substantially match so that they are combined into a block shape. In addition, the holding surfaces 92 are formed in a substantially flat shape so that the upper heat sink 84 and the holding plate 85 can be held between the upper heat sink 84 and the lower heat sink 83 in a combined state. The lower heat sink 83 and the holding plate 85 are provided with light extraction openings through which laser light, converted light, etc. from the optical crystal holder 82 are emitted. The optical crystal holder 82 is fixed by a fixture 86 in a state where the side surface in the longitudinal direction of the substantially rectangular parallelepiped optical crystal 80 is pressed with a predetermined pressure. A fixing screw can be used as the fixture 86, and the fixing tool 86 is fastened by being inserted through a fixing screw hole provided in the lower heat sink 83 and the holding plate 85.
[0026]
[Heat conduction sheet 81]
The lower heat sink 83 and the upper heat sink 84 are in contact with the side surface of the optical crystal 80 via a buffer material. As the buffer material, a heat conductive sheet 81 having heat conductivity can be used, and it is composed of indium or the like. By inserting and pressing the heat conductive sheet 81, the stress applied to the optical crystal 80 from the pressing surface is dispersed and can be made uniform. In FIG. 3, the heat conductive sheet 81 is bent in an L shape, and is arranged between the upper heat sink 84 and the lower heat sink 83 so as to cover the optical crystal 80 with two L-shaped heat conductive sheets 81. Is done. Further, the buffer material can be interposed between the lower heat sink 83 and the holding plate 85.
[0027]
At this time, the pressing force with which the upper heat sink 84 and the lower heat sink 83 hold the optical crystal 80 is adjusted by a pressing tool that applies the pressing force in the direction indicated by the arrow from above in FIG. FIG. 4 shows a state in which the pressing force is adjusted with the pressing tool. FIG. 4 is a cross-sectional view taken along the IV-IV plane in FIG. The upper heat sink 84 and the lower heat sink 83 each include a pressing surface 87 that presses the optical crystal 80. As shown in FIG. 4, two pressing surfaces 87 are provided for both the upper heat sink 84 and the lower heat sink 83. The pressing surfaces 87 configured in the respective heat sinks intersect each other so that the two surfaces are substantially orthogonal and the cross section is L-shaped. As a result, as shown in FIG. 4, the lower heat sink 83 presses the lower surface and the left surface of the optical crystal 80, the upper heat sink 84 presses the upper surface and the right surface, and the four surrounding surfaces of the optical crystal 80 are all pressed by the pressing surface 87. The In addition, on the left and right sides of the pressing surface 87, a joining surface 91 for joining the heat sinks is configured. The joining surface 91 is configured to extend one of the L-shaped pressing surfaces 87 as it is. Therefore, for example, as shown in FIG. 5, the cross section of the heat sink itself can be formed in an L shape. However, in the example of FIG. 5, the joining surface 91 between the heat sinks is only on the same plane. Therefore, preferably, as shown in FIGS. 4 and 6, the cross-sectional shape of the heat sink is preferably a shape in which at least one of the heat sinks is further provided with a stepped step at an L-shaped intersection. FIG. 6 shows a modification in which the upper heat sink 84 has the same L-shaped cross section as in FIG. 4 and the lower heat sink 83 has an L-shaped cross section. Thus, as will be described later, the pressing surface of the optical crystal 80 can be adjusted by the orthogonal plane in addition to the second bonding surface 91B orthogonal to the bonding plane as well as the same plane.
[0028]
[Temporary fixing]
The pressing tool is used to press the pressing force on each pressing surface so that the contact thermal resistance is small without being displaced on the contact surface, and the optical crystal 80 is not excessively stressed and damaged. Use to adjust to the optimum value. The pressing tool shown in FIG. 4 is a temporary set screw 88 provided with an elastic body. The temporary fixing screw 88 temporarily fixes the upper heat sink 84 and the lower heat sink 83 through an elastic body such as a spring 89. Temporary fixing means that the upper heat sink 84 and the lower heat sink 83 are temporarily maintained at positions where the optical crystal 80 is pressed with a preferable pressure on the respective pressing surfaces of the upper heat sink 84 and the lower heat sink 83. In other words, the upper heat sink 84 and the lower heat sink 83 are not finally fixed in the temporary fixing stage. The holding plate 85 is not used at the temporary fixing stage. The temporary fixing screw 88 is screwed into a temporary fixing screw hole 90 provided in the upper heat sink 84 and the lower heat sink 83. The temporary fixing screw 88 has a spring 89 inserted between the screw head and the surface of the heat sink provided with the temporary fixing screw hole 90, whereby a predetermined pressure is applied in the direction of the screw movement, thereby managing the torque of the screw. It is easy. Therefore, the pressing force can be adjusted so as not to damage the optical crystal 80 by tightening the temporary fixing screw 88 and to hold the optical crystal 80 in the pressed state on the pressing surface.
[0029]
The temporary fixing screw 88 is provided in the upper heat sink 84 and the lower heat sink 83 so that the temporary fixing screw 88 is inserted in a position not penetrating the optical crystal 80. For this reason, the temporary fixing screw hole 90 is provided on the bonding surface 91 of the heat sinks excluding the pressing surface of the optical crystal 80. Since the temporary fixing screw 88 can adjust the pressing force in the screw traveling direction, in order to adjust the pressing force of the four surfaces of the optical crystal 80, it is necessary to provide the temporary fixing screws 88 in the two directions of the upper and lower surfaces and the left and right surfaces. There is. In the example of FIG. 4, a total of three temporary fixing screws 88 are provided, two on the upper surface and one on the right surface. The pressing force on the upper and lower surfaces of the optical crystal 80 is adjusted by adjusting the temporary fixing screw 88 on the upper surface, and the pressing force on the left and right surfaces is adjusted with the temporary fixing screw 88 on the side surface. In order to insert the temporary fixing screws 88 not only on the upper and lower surfaces, but also on the side surfaces, the heat sink of FIG. 4 is provided with the second bonding surfaces 91B not only in the horizontal direction but also in the vertical direction. By fixing the temporary fixing screw 88 so as to be substantially orthogonal, the optical crystal 80 can be maintained in a state of being pressed with an appropriate pressing force from the top, bottom, left and right in the drawing. In this way, the joint surfaces of the heat sinks are orthogonal to each other In relation 2 sides (In the example of FIG. 4, the joint surface 91 and the second joint surface 91B) By doing so, it becomes possible to adjust the pressing force of the four surfaces of the optical crystal 80. However, it is needless to say that the conditions for providing the pressing surface, the number of temporary fixing screws, the position, and the like are not limited to this example, and can be appropriately changed according to the use mode and conditions.
[0030]
For example, in the configuration shown in FIG. 5, temporary fixing screws 88 are provided only on the upper and lower surfaces, and only the pressure on the inner and upper surfaces of the pressing surface that presses the optical crystal 80 can be adjusted to the optimum value. This configuration can be suitably used when it is not necessary to maintain the four surfaces of the optical crystal 80 at an equal pressing force and only two surfaces need to be optimally held.
[0031]
Thus, the force for pressing the upper heat sink 84 against the lower heat sink 83 and the optical crystal 80 in the assembling process is always kept constant by using the spring 89 of the temporary fixing screw 88. As a result, an excessive stress is not applied to the optical crystal 80, and a situation in which the optical crystal 80 is damaged is avoided. At the same time, by realizing appropriate contact between the optical crystal 80 and the optical crystal holder 82, temperature control such as uniform cooling and heating with low contact thermal resistance can be obtained, thereby causing laser non-uniformity due to non-uniform cooling. The problem of unstable output is solved. Furthermore, since the spring 89 is controlled so that a constant pressure is always applied to the optical crystal 80, the operator does not need to perform troublesome operations such as fine adjustment of the pressing force, and the assembly and removal operations can be simplified and manufactured. There are also advantages in terms of maintenance.
[0032]
[Holding plate 85]
As described above, with the pressing surface of the optical crystal 80 adjusted to an appropriate pressure, the upper heat sink 84 and the lower heat sink 83 and the holding plate 85 are used using the holding plate 85 and the fixture 86 as shown in FIG. Fix in a state where it is pinched. FIG. 7 shows a cross-sectional view taken along the plane VII-VII in FIG. As shown in this figure, the lower heat sink 83 and the holding plate 85 each have a holding surface 92, and the upper heat sink 84 is sandwiched and fixed by the holding surface 92. The fixing tool 86 is a fixing screw, and is fastened to a fixing screw hole provided in the lower heat sink 83 and the holding plate 85 to be firmly fixed. A plurality of fixing screws are spaced apart from each other at the upper and lower sides of the optical crystal 80 and are fixed to each other.
[0033]
Here, the length of the portion provided with the pressing surface of the lower heat sink 83 indicated by A in FIG. 7, in other words, the thickness from the holding surface 92 to the surface (contact surface with the holding plate 85) is indicated by B in the drawing. It is formed slightly smaller than the thickness of the upper heat sink 84. For example, the thickness B of the upper heat sink 84 is several tens to several hundreds of μm, and the thickness A is higher than the thickness A of the stepped portion of the lower heat sink 83. Thus, when the upper heat sink 84 is held between the lower heat sink 83 and the holding plate 85, the upper heat sink 84 protrudes from the holding surface 92, so that the upper heat sink 84 can be fixed by holding the protruding portion.
[0034]
As described above, the lower heat sink 83 and the holding plate 85 are fixed with the fixing screws while the upper heat sink 84 and the lower heat sink 83 are held in a state of pressing the optical crystal 80 through the buffer material with a predetermined pressure. . As a result, the upper heat sink 84 and the lower heat sink 83 are fixed with the positional relationship maintained, and as a result, the pressing force on the pressing surface is maintained constant.
[0035]
When the upper heat sink 84 and the lower heat sink 83 are fixed, the temporary fixing screw 88 is removed because the temporary fixing is no longer necessary. The removed temporary fixing screw 88 can be reused when another optical crystal holder 82 is fixed. However, the temporary fixing screw 88 can be left as it is.
[0036]
When a resonator is configured by setting a solid-state laser crystal as the optical crystal 80 in the optical crystal holder 82 shown in FIG. Yes. Therefore, the lower heat sink 83 in FIG. 3 is provided with a window for irradiating excitation light from the end face of the solid-state laser crystal.
[0037]
Furthermore, the optical crystal holder is not limited to the configuration shown in FIG. 3, and the configurations shown in FIGS. 8 and 9 can also be applied. As shown in FIG. 8, a side excitation (side pump) method can be applied by providing a window for irradiating excitation light from the side direction of the optical crystal 80. In FIG. 8, the heat conductive sheet 81 is a single sheet, and is disposed between the upper heat sink 84 and the lower heat sink 83 so as to cover the upper and lower surfaces of the optical crystal 80 with the two heat conductive sheets 81. . FIG. 9 shows a configuration in which the lower heat sink 83 is integrally molded with the unit.
[0038]
[Integrated]
The optical crystal holder 82 in FIG. 3 can also be composed of three or more members. Also, some members can be integrally formed in a case or the like. For example, when the optical crystal holder is applied to the oscillator unit 34 shown in FIG. 11, the lower heat sink 83 is integrally formed with the oscillator unit as shown in FIG. 12, and the upper heat sink 84 and the pressing plate are combined with this to form the optical crystal holder. Can be configured. FIG. 9 is an exploded perspective view showing in more detail an example in which the lower heat sink of FIG. As shown in this figure, an upper heat sink 84 is sandwiched and fixed by a lower heat sink 83 and a holding plate 85 integrally formed in the unit with a heat conductive sheet 81 interposed as a cushioning material. With this configuration, it is not necessary to position and fix the lower heat sink 83 to the oscillator unit 34 in advance, the problem of contact thermal resistance between the lower heat sink 83 and the oscillator unit 34 does not occur, and the number of parts can be reduced, so that the assembly can be reduced. There are advantages such as fewer man-hours. Of course, it goes without saying that the lower heat sink 83 can also be configured as a separate member in FIG.
[0039]
[Heat conduction]
FIG. 10 shows a flow in which heat is conducted in the optical crystal holder having the above configuration. The heat generated in the optical crystal 80 is conducted to the lower heat sink 83 and the upper heat sink 84, but the heat of the upper heat sink 84 moves in the longitudinal direction of the optical crystal 80, one is transferred to the lower heat sink 83, and the other is It is also transmitted to the lower heat sink 83 through the holding plate 85. Further, by inserting the heat conductive sheet 81 between the lower heat sink 83 and the upper heat sink 84, the lower heat sink 83 and the holding plate 85, and the upper heat sink 84 and the holding plate 85, respectively, the contact heat resistance is reduced, and the efficiency is improved. Heat can be conducted to promote cooling of the optical crystal 80.
[0040]
The lower heat sink 83, the upper heat sink 84, and the holding plate 85 constituting the optical crystal holder 82 are made of a metal such as aluminum, copper, or brass having good thermal conductivity. In addition, a temperature control mechanism for cooling or / and heating in the heat conduction state is connected to the optical crystal holder 82. The temperature control mechanism uses an electro-cooling heating element such as a Peltier element to electrically transfer heat, and an air-cooled heat radiating unit that dissipates the heat transferred by a heat sink or a fan. The heat radiating unit controls the temperature of the optical crystal holder 82 to be within a certain range. The air-cooled type eliminates the need for water-cooling equipment compared to the water-cooled type, which saves space and simplifies the equipment configuration, and also saves resources and reduces maintenance work by not consuming water. Figured. However, it goes without saying that a water-cooled type can be applied to the present invention instead of or in addition to the air-cooled type as needed, for example, when the heat radiation amount is large and the air-cooled type is insufficiently cooled.
[0041]
[Laser oscillator]
Next, FIG. 13 is a longitudinal sectional view of a laser oscillator in which a heat radiating portion is fixed to the oscillator unit of FIGS. 11 and 12, and FIG. 14 is an exploded perspective view of the laser oscillator of FIG. The laser oscillator 33 shown in these figures includes an oscillator unit 34 that is a heat source, an oscillator unit heat sink 40 as a radiator, and a Peltier element 37 that thermally transfers the amount of heat generated on the oscillator unit 34 side to the oscillator unit heat sink 40 side. Is provided. The Peltier element 37 is sandwiched between the oscillator unit 34 and the oscillator unit heat sink 40 via the heat conductive material 35.
[0042]
The oscillator unit 34 is a solid-state laser medium 38, Nd: YVO. ₄ A crystal and a Q switch 39 are incorporated. In order to efficiently dissipate these heat sources, the oscillator unit 34 is formed in a block shape with a metal such as aluminum or copper having good thermal conductivity. Furthermore, the oscillator unit 34 is fixed by screwing to an oscillator base 36 for fixing the oscillator unit 34. In order to cool the oscillator unit 34 in direct contact with the Peltier element 37, the lower surface of the oscillator unit 34 protrudes so as to expose a cooling surface in contact with the Peltier element 37 through an opening 36 a provided in the oscillator base 36. The shape is made to be. With the oscillator unit 34 fixed to the oscillator base 36, the lower surface of the oscillator unit 34 is exposed from the lower surface of the oscillator base 36. Further, an O-ring-shaped sealing material 44A is inserted into the protruding surface of the oscillator unit 34 to seal between the lower surface of the oscillator unit 34 and the upper surface of the oscillator base 36.
[0043]
Further, the heat absorption surface of the Peltier element 37 is fixed to the projecting surface of the oscillator unit 34 via the second heat conductive material 35B, and the heat dissipation surface of the Peltier element 37 is connected to the oscillator unit heat sink 40 via the first heat conductive material 35A. Is fixed. The oscillator unit heat sink 40 is provided with a plurality of heat radiation fins in an upright posture in parallel to increase the surface area and improve heat dissipation. The oscillator unit heat sink 40 of FIG. 14 is fixed with screws so that the heat sink base 40A to which the heat radiating fins are fixed is covered with a heat sink cover 40B opened in a U-shaped cross section. A fan 41 for blowing air is fixed to the opening of the heat sink cover 40B. Although one fan 41 can be provided in any one of the openings, it is preferably provided in each opening of the oscillator unit heat sink 40 and the two fans 41 forcibly blow the air on the suction side and the discharge side. This improves air flow and dissipates heat efficiently. The oscillator unit heat sink 40 is also made of a metal such as aluminum or brass having good thermal conductivity, and is preferably made of the same material as the oscillator base 36. The oscillator unit heat sink 40 is fixed to the oscillator base 36 by screws. At this time, a resin washer 45 for heat insulation is inserted between the screw head and the oscillator unit heat sink 40 so that the heat of the oscillator unit heat sink 40 is transmitted to the oscillator base 36 side through the screw and is not leaked. . Similarly, an O-ring-shaped sealing material 44B is disposed between the oscillator base 36 and the oscillator unit heat sink 40 so as to surround the three Peltier elements 37, and four spacers 42 are disposed outside the sealing material 44B. Is done. As a result, the Peltier element 37 is tightly attached to the oscillator unit heat sink 40 and the oscillator unit 34 via the heat conductive material 35.
[0044]
[Heat conduction material 35]
The thermal conductive material 35 is thermally coupled in a state where the substantial contact area between the Peltier element 37, the heat source, and the heat radiating body is increased and the thermal resistance is decreased. The heat conductive material 35 is made of thermally conductive grease, and a material having a low thermal resistance such as silicone grease is preferable. As a result, the contact thermal resistance between the Peltier element 37, the heat generation source, and the heat radiating body can be reduced. Further, by applying the heat conductive material 35 to the Peltier element 37, the gap on the contact surface is eliminated, heat conduction in the thickness direction is promoted, and the entire surface can be maintained at a uniform temperature. Further, the heat conductive material 35 may be a gel or paste having a predetermined viscosity. As a result, a pressing force is transmitted to the Peltier element 37 from the pressing surface of the heat generation source and the radiator, and an excessive pressing force is alleviated. In order to prevent a high pressure from being applied to the Peltier element 37, the viscosity of the heat conductive material 35 is lowered. The viscosity is selected according to the destruction threshold of the Peltier element 37 to be used, the gap between the heat source and the heat radiator, that is, the height of the spacer 42, and the like.
[0045]
As shown in FIG. 13, the heat conductive material 35 is applied on the oscillator unit heat sink 40 and applied to the first heat conductive material 35 </ b> A interposed between the heat dissipation surface of the Peltier element 37 and the heat absorption surface of the Peltier element 37. There is a second heat conductive material 35B interposed between the oscillator unit 34 and the oscillator unit 34. Thus, by separating the heat conducting material 35 on the heat radiating side and the heat absorbing side, it is possible to avoid the loss due to the mixture of the heat radiating energy and the heat absorbing energy and to efficiently perform the heat transfer by the Peltier element 37. However, it does not prevent the heat conduction material on the heat dissipation side and the heat absorption side from being mixed for reasons of the process of applying the heat conduction material.
[0046]
[Peltier element 37]
The Peltier element 37 is a plate-like element that utilizes a phenomenon in which heat is generated or absorbed when a contact surface of a dissimilar metal or semiconductor is energized, and includes a heat absorption surface and a heat dissipation surface. Since the Peltier element 37 has no movable part and thus has advantages such as being free of vibration and being small and light, it has a large self-heating. For this reason, the heat absorbing surface is brought into contact with the heat generation source, while the heat radiating surface is brought into contact with the heat radiating body to radiate heat. The Peltier element 37 can reverse the heat transfer direction by reversing the direction in which the direct current flows, so that the heat dissipating surface and the heat absorbing surface can be reversed. Therefore, the Peltier element 37 can be used for both heating and cooling, and is suitable for highly accurate temperature control.
[0047]
A thermal conductive material 35 having a predetermined thickness is applied to the Peltier element using a mask, a squeegee, or the like. In this state, a plurality of Peltier elements 37 are arranged on the heat conductive material 35. In the example of FIG. 14, three Peltier elements 37 are adjacent on a straight line. The Peltier element 37 is opposed to the oscillator unit 34 side with the heat absorption surface as an upper surface and opposed to the oscillator unit heat sink 40 with the heat dissipation surface as a lower surface. The Peltier elements 37 are close to each other so that the heat conducting material 35 does not enter. Further, the heat conductive material 35 is similarly applied to the upper surface of the Peltier element 37 group, that is, the lower surface of the oscillator unit 34. Preferably, a heat conductive material 35 having a predetermined thickness is applied to the lower surface of the oscillator unit 34 with the oscillator unit 34 turned upside down as shown in FIG. The Peltier element 37 is sandwiched between the oscillator unit heat sink 40 and the oscillator unit 34 to which the heat conductive material 35 having a predetermined thickness is applied. Further, a spacer 42 is arranged around the Peltier element 37 group between the oscillator unit 34 and the oscillator unit heat sink 40 and fastened with screws in a state where the spacer 42 is sandwiched. In this method, since the Peltier element 37 and the heat conductive material 35 are not pressed beyond the height of the spacer 42, the height of the spacer 42 is set so that no pressure exceeding the destruction threshold of the Peltier element 37 is applied. By adjusting the thickness and viscosity of the heat conducting material 35, the Peltier element 37 is prevented from being damaged. In addition, since this method only tightens the screw, fine adjustment such as torque management is unnecessary, and the operation can be extremely simple. In this example, the oscillator unit 34 and the oscillator unit heat sink 40 are fixed by fastening screws, but the fastening tool for fixing is not limited to this, and clamps, rivets, welding, and the like can also be used.
[0048]
Further, a harness such as a lead wire for energization is connected to the Peltier element 37, which is pulled out through a notch formed in the sealing material 44B and connected to a power source terminal of a constant current source. . The cutout portion of the sealing material 44B that passes through the harness is hermetically sealed with an adhesive or the like so that no gap is formed in this portion. In addition to the rectangular shape shown in the drawing, the shape of the Peltier element can be appropriately used in the shape of a circle or a ring according to the object to be cooled and heated.
[0049]
[Spacer 42]
The spacer 42 is provided so that a pressing force exceeding the destruction threshold of the Peltier element 37 is not applied, and the gap between the oscillator unit 34 and the oscillator unit heat sink 40 is set to a constant value. Therefore, the height of the spacer 42 is determined based on the destruction threshold value and thickness of the Peltier element 37 to be used, and the thickness and viscosity of the heat conductive material 35 corresponding to the thermal resistance curve of the Peltier element 37. Further, in the example of FIGS. 13 and 14, since the lower surface of the oscillator unit 34 protrudes and penetrates the opening of the oscillator base 36, the height of the protrusion of the oscillator unit 34 protruding from the lower surface of the oscillator base 36 is also taken into consideration. It is decided. The height of the protrusion is measured with a gauge or the like. When the gap is determined according to these parameters, the spacer 42 corresponding to the gap is selected. Thus, by selecting the spacers 42 according to the Peltier elements 37 to be used, the optimum fixing of the Peltier elements 37 is realized for each apparatus.
[0050]
In this example, the spacer 42 is made of stainless steel (SUS). The number of the spacers 42 is preferably as large as possible. However, in order to prevent heat leakage of the Peltier elements 37 by conducting heat with the spacers 42, four spacers 42 are preferably arranged in the vicinity of the four corners of the Peltier element 37 group. The spacer 42 is preferably made of a heat insulating material. For example, resins having excellent heat insulation properties such as polyether ether ketone (PEEK) and polyphenylene sulfide (PSS), ceramics, and the like can be used.
[0051]
[Sealing material 44]
Further, as shown in FIG. 13, a sealing material 44 is used to seal the spaces between the oscillator unit 34 and the oscillator base 36 and between the oscillator base 36 and the oscillator unit heat sink 40, respectively. The sealing member 44 is formed in a substantially rectangular O-ring shape, and when pressed, it is elastically deformed and compressed, and the gap is hermetically closed. The sealing material 44 </ b> A is disposed around the protruding surface of the oscillator unit 34, and the sealing material 44 </ b> B is disposed between the Peltier element 37 group and the spacer 42 and sandwiched therebetween. These sealing materials 44 block the Peltier elements 37 from the outside. As a result, the air in the vicinity of the Peltier element 37 is cooled to condense and condense moisture in the air, avoiding the possibility of damaging the Peltier element 37 and other circuits, and maintaining a stable cooling capacity over a long period of time. This improves the performance and extends the circuit life. An elastic member such as butyl rubber is used for the sealing member 44. As shown in FIG. 14, the sealing material 44A is smaller than the sealing material 44B, and is sandwiched between the lower surface of the oscillator unit 34 and the upper surface of the oscillator base 36 to close a gap when these are screwed. Instead of the sealing material 44A, the gap may be sealed with a sealing material after the oscillator unit 34 and the oscillator base 36 are screwed together. The sealing member 44B has a notch for pulling out the harness of the Peltier element 37 on the lower surface and a notch on the side surface so that the side surfaces of the screws fixing the oscillator unit heat sink 40 and the oscillator base 36 are in contact with each other. ing.
[0052]
[Hygroscopic material 43]
Furthermore, a hygroscopic material 43 is arranged in the space sealed by the sealing material 44 as shown in FIG. The hygroscopic material 43 can remove moisture contained in the air that is already present when the sealed space is formed, and can reliably prevent condensation in the sealed space. Zeolite or the like can be used for the hygroscopic material 43.
[0053]
As described above, the thickness of the heat conductive material 35 is reduced to suppress the thermal resistance, the cooling capacity of the Peltier element 37 is efficiently transmitted, and the spacer 42 does not apply a pressure equal to or higher than the breakdown threshold to the Peltier element 37. To achieve both thermal efficiency and element protection. Even if there are variations in the thickness of the plurality of Peltier elements 37, the heat conduction material 35 interposed between the pressing surface and the Peltier element 37 has viscosity, so that the elements are compressed and deformed to hold each element with a uniform pressing force. can do. In addition, with this method, the Peltier element 37 can be fixed simply by fastening the screw with the spacer 42 interposed therebetween, and therefore the operation is simplified. As in the past, there is no extremely troublesome adjustment work like the method of controlling torque by tightening the screw, and the optimum state is ensured without damaging the Peltier element 37 by simply fastening the screw and with low thermal resistance. Thus, the Peltier element 37 can be fixed.
[0054]
[Solid-state laser equipment]
Further, FIG. 15 shows a configuration of a solid-state laser device using the embodiment of the present invention. FIG. 15 shows a block diagram of the solid-state laser device. The solid-state laser device shown in this figure includes a laser control unit 1, a laser output unit 2, and an input unit 3. The solid-state laser device can be used in general laser application equipment, such as laser oscillators and various laser processing devices, laser processing such as drilling, marking, trimming, scribing, and surface treatment, and other laser application fields as a laser light source, such as DVD and the like. It can be suitably used in a light source for high-density recording / playback of an optical disc such as Blu-ray, a light source for communication, a printing device, a light source for illumination, a light source for a display device such as a display, a medical device, and the like. The following example demonstrates the example applied to a laser marker as an example of a solid-state laser apparatus. Further, in this specification, “printing” is used in a concept including various kinds of processing described above in addition to marking of characters, symbols, figures and the like.
[0055]
The input unit 3 is connected to the laser control unit 1, inputs necessary settings for operating the solid-state laser device, and transmits them to the laser control unit 1. The laser control unit 1 includes a control unit 4, a memory unit 5, a laser excitation unit 6, and a power source 7, and records setting contents input from the input unit 3 in the memory unit 5. The control unit 4 reads the setting contents from the memory when necessary, and operates the laser excitation unit 6 based on the print signal corresponding to the printing contents to excite the laser medium 8 of the laser output unit 2. Further, the control unit 4 sends a scanning signal for operating the scanning unit 9 of the laser output unit 2 to the scanner driving unit 52 in order to scan the workpiece W with the laser light oscillated by the laser medium 8 so as to perform the set printing. Output. The power source 7 applies a predetermined voltage to the laser excitation unit 6 as a constant voltage power source.
[0056]
The laser output unit 2 includes a laser oscillation unit 50. The laser oscillating unit 50 that generates laser light includes an optical mirror 80 and an output mirror and a total reflection mirror that are arranged to face each other with a predetermined distance along the optical path of the stimulated emission light emitted from the laser medium 8. And an aperture, a Q switch, and the like disposed between them. The stimulated emission light emitted from the laser medium 8 is amplified by multiple reflection between the output mirror and the total reflection mirror, and the mode is selected by the aperture while being cut off in a short period by the operation of the Q switch, and the output mirror After that, the laser beam is output. The laser oscillation unit 50 employs a so-called end pumping excitation method in which laser excitation light is input from one end surface of the rod-like shape of the laser medium 8 and is excited, and laser light is emitted from the other end surface.
[0057]
The scanning unit 9 reflects the laser beam and outputs it in a desired direction, scans the laser beam on the surface of the workpiece W, and prints it. The scanning unit 9 includes a pair of an X-axis scanner 14a and a Y-axis scanner 14b, and galvano motors 51a and 51b that rotate them. The galvano motors 51 a and 51 b are driven by the scanner driving unit 52. The scanner driving unit 52 drives the galvano motors 51a and 51b based on the scanning signal supplied from the control unit 4, thereby causing the X-axis scanner 14a and the Y-axis scanner 14b provided on the output shafts of the galvano motors 51a and 51b. The total reflection mirror is rotated to deflect and scan the laser beam oscillated from the laser medium 8. The laser beam deflected and scanned is irradiated and marked on the surface of the workpiece W through an fθ lens 15 provided in a substantially deflection direction.
[0058]
【The invention's effect】
As described above, the optical crystal holder, the solid-state laser device, and the optical crystal fixing method of the present invention can fix the optical crystal in a state where it is held with a uniform pressing force, and are sufficient between the optical crystal and the optical crystal holder. This ensures stable contact and ensures efficient cooling and heating, as well as avoiding damage to the optical crystal due to excessive pressing force on the pressing surface, so that the optical crystal can be used stably. . The optical crystal holder, the solid-state laser device, and the optical crystal fixing method according to the present invention are arranged in this posture in a state where the pressing surfaces of the first pressing plate and the second pressing plate are held at an appropriate pressure. This is because the second holding plate is sandwiched and fixed by the first pressing plate and the holding plate. Thus, the optical crystal is fixed while maintaining the positional relationship for obtaining the optimum pressure, and the optical crystal is fixed and maintained in a contact state, and the optical crystal is protected. In addition, since this method can be easily fixed, the manufacturing and maintenance work is simple, and the fixing of the optical crystal can be easily, surely and highly effective.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a conventional method for fixing an optical crystal.
FIG. 2 is a cross-sectional view showing another method for fixing a conventional optical crystal.
FIG. 3 is an exploded perspective view showing an optical crystal holder according to an embodiment of the present invention.
4 is a cross-sectional view showing a cross section of the optical crystal holder taken along line IV-IV in FIG. 3;
FIG. 5 is a cross-sectional view showing an optical crystal holder according to another embodiment of the present invention.
FIG. 6 is a cross-sectional view showing an optical crystal holder according to another embodiment of the present invention.
7 is a cross-sectional view showing a cross section of the optical crystal holder along the line VII-VII in FIG. 4;
FIG. 8 is an exploded perspective view showing an optical crystal holder according to another embodiment of the present invention.
FIG. 9 is an exploded perspective view showing an optical crystal holder according to another embodiment of the present invention.
10 is an explanatory diagram showing a flow of heat conduction in the optical crystal holder of FIG. 3. FIG.
FIG. 11 is a perspective view showing an oscillator unit in which a part of an optical crystal holder is integrally formed.
12 is an enlarged perspective view of the oscillator unit of FIG. 11. FIG.
FIG. 13 is a longitudinal sectional view showing an example in which the optical crystal holder according to one embodiment of the present invention is applied to a laser oscillator.
14 is an exploded perspective view of the laser oscillator of FIG. 13 viewed from below.
FIG. 15 is a block diagram showing a configuration of a solid-state laser apparatus according to an embodiment of the present invention.
[Explanation of symbols]
1 ... Laser controller
2 ... Laser output section
3 ... Input section
4. Control unit
5 ... Memory part
6 ... Laser excitation part
7 ... Power supply
8 ... Laser medium
9 ... Scanning part
14a, 14b ... XY scanner
15 ... fθ lens
33 ... Laser oscillator
34 ... Oscillator unit
35 ... Heat conduction material
35A: first heat conductive material
35B: second heat conductive material
36 ... Oscillator base
36a ... opening
37 ... Peltier element
38... Solid laser medium
39 ... Q switch
40 ... Oscillator unit heat sink
40A ... heat sink base
40B ... heat sink cover
41 ... Fan
42 ... Spacer
43 ... Hygroscopic material
44, 44A, 44B ... Sealing material
45 ... Resin washer
47a ... opening
50 ... Laser oscillator
51, 51a, 51b ... Galvano motor
52 ... Scanner drive unit
77A, 77B ... heat sink
78 ... Screw
79A, 79B ... heat sink
80: Optical crystal
81 ... Thermal conductive sheet
82. Optical crystal holder
83 ... Lower heat sink
84 ... Upper heat sink
85 ... Holding plate
86 ... Fixing tool
87 ... Pressing surface
88 ... Temporary set screw
89 ... Spring
90 ... Temporary set screw hole
91 ... Joining surface
91B ... Second joint surface
92 ... holding surface
W ... Work

Claims (8)

An optical crystal holder for fixing the upper and lower surfaces and the left and right surfaces constituting the side surface in the longitudinal direction of the substantially rectangular parallelepiped optical crystal (80) in a state of being held at a predetermined pressing force,
A first pressing plate (83) having a first pressing surface composed of two surfaces intersecting at substantially right angles in order to press one of the upper and lower surfaces and one of the left and right surfaces of the optical crystal (80);
A second pressing plate (84) having a second pressing surface constituted by two surfaces intersecting at substantially right angles to press the other of the upper and lower surfaces of the optical crystal (80) and the other of the left and right surfaces ;
A holding plate (85) for tightly holding the second pressing plate (84) with the first pressing plate (83) ;
With
A first direction in which the first pressing plate (83) and the second pressing plate (84) sandwich between the first pressing surface and the second pressing surface, and the first pressing A pressing tool for setting a pressure for pressing the optical crystal (80) to a predetermined value from a second direction perpendicular to the first direction, which is a direction sandwiched between the surface and the second pressing surface As a plurality of temporary set screws (88) can be connected,
The first pressing plate (83) and the second pressing plate (84 ) are provided with a plurality of screw holes for inserting the temporary fixing screws (88) in the vertical direction and the horizontal direction, respectively. And
In a state where the four surfaces of the optical crystal (80) are pressed to a predetermined pressure in a pressing space constituted by the first pressing surface and the second pressing surface, the first pressing plate (83) and the The holding plate (85) sandwiches the second pressing plate (84) to fix the first pressing surface and the second pressing surface. In this state, the first pressing plate (83) An optical crystal holder, comprising: a fixing screw as a fixture (86) for fixing the holding plate (85) from a third direction orthogonal to the first direction and the second direction .   2. The optical crystal holder according to claim 1, wherein the first pressing surface and the second pressing surface sandwich a buffer material having thermal conductivity between the optical crystal (80). A featured optical crystal holder. 3. The optical crystal holder according to claim 1 , wherein the temporary fixing screw (88) is inserted through a spring (89), and the first pressing plate (83) and the second pressing plate ( 84) is held in a pressed state at a predetermined pressure. The optical crystal holder according to any one of claims 1 to 3 , wherein the fixture (86) includes a plurality of screws that screw the first pressing plate (83) and the holding plate (85). An optical crystal holder, which is a fixing screw. The optical crystal holder according to any one of claims 1 to 4 , wherein one of the two intersecting surfaces is extended so that the first pressing plate (83) and the second pressing An optical crystal holder comprising a joining surface (91) for direct joining with a plate (84) . The optical crystal holder according to claim 5 , wherein the second pressing plate (83) and the second pressing plate (84) are directly bonded to each other substantially perpendicular to the bonding surface (91). An optical crystal holder comprising a bonding surface (91B). A solid-state laser device that emits excitation light by exciting a solid-state laser crystal,
In order to press one of the upper and lower surfaces and one of the left and right surfaces of the four surfaces of the upper and lower surfaces and the left and right surfaces constituting the side surface in the longitudinal direction of the solid laser crystal having a substantially rectangular parallelepiped shape, first pressing plate having a first pressing surface that will be the (83),
A second pressing plate (84) comprising a second pressing surface composed of two surfaces intersecting at substantially right angles to press the other of the upper and lower surfaces of the solid-state laser crystal and the other of the left and right surfaces ;
A holding plate (85) for tightly holding the second pressing plate (84) with the first pressing plate (83) ;
With
A first direction in which the first pressing plate (83) and the second pressing plate (84) sandwich between the first pressing surface and the second pressing surface, and the first pressing As a pressing tool for setting the pressure for pressing the solid laser crystal to a predetermined value from a second direction perpendicular to the first direction, which is a direction sandwiched between a surface and the second pressing surface A plurality of temporary set screws (88) can be connected,
The first pressing plate (83) and the second pressing plate (84 ) are provided with a plurality of screw holes for inserting the temporary fixing screws (88) in the vertical direction and the horizontal direction, respectively. And
In a state where at least two surfaces of the solid laser crystal are pressed to a predetermined pressure in a pressing space constituted by the first pressing surface and the second pressing surface, the first pressing plate (83) and the holding The second pressing plate (84) is clamped by the plate (85), and the first pressing surface and the second pressing surface are fixed. In this state, the first pressing plate (83) is held. A fixing screw as a fixture (86) for fixing the plate (85) from a third direction orthogonal to the first direction and the second direction ;
A solid-state laser device, wherein the solid-state laser crystal is fixed while being held at a predetermined pressing force. Two surfaces intersecting substantially at right angles to press one of the upper and lower surfaces and one of the left and right surfaces of the four surfaces of the upper and lower surfaces and the left and right surfaces constituting the longitudinal side surface of the substantially rectangular optical crystal (80). In order to press the first pressing plate (83) having the first pressing surface composed of the upper and lower surfaces of the optical crystal (80) and the other of the left and right surfaces, the two surfaces intersecting at substantially right angles retention and second pressing plate comprising a second pressing surface configured (84), and holds the Semagi the second pressing plate (84) between said first press plate (83) An optical crystal fixing method for fixing an optical crystal (80) to an optical crystal holder comprising a plate (85),
Sandwiching the optical crystal (80) between the first pressing surface and the second pressing surface via a cushioning material having thermal conductivity;
A first direction sandwiched between the first pressing surface and the second pressing surface, and a direction sandwiched between the first pressing surface and the second pressing surface, wherein the first direction The first pressing plate (83) and the second pressing plate (84) are held in a state in which the optical crystal (80) is pressed with a predetermined pressure by a pressing tool from a second direction orthogonal to the first direction. Process,
Fixing the first pressing plate (83) and the holding plate (85) with a fixture (86) from a third direction orthogonal to the first direction and the second direction;
Releasing the pressing state of the first pressing plate (83) and the second pressing plate (84) by the pressing tool ;
An optical crystal fixing method comprising the steps of:

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