WO2007025753A3 - Modulares mikroelektronisches bauteil - Google Patents

Modulares mikroelektronisches bauteil Download PDF

Info

Publication number
WO2007025753A3
WO2007025753A3 PCT/EP2006/008520 EP2006008520W WO2007025753A3 WO 2007025753 A3 WO2007025753 A3 WO 2007025753A3 EP 2006008520 W EP2006008520 W EP 2006008520W WO 2007025753 A3 WO2007025753 A3 WO 2007025753A3
Authority
WO
WIPO (PCT)
Prior art keywords
functional layers
support
microelectronic component
contact points
modular
Prior art date
Application number
PCT/EP2006/008520
Other languages
English (en)
French (fr)
Other versions
WO2007025753A2 (de
Inventor
Michael Niedermayer
Andreas Ostmann
Stephan Guttowski
Stefan Grundmann
Rolf Thomasius
Dmitry-David Polityko
Original Assignee
Fraunhofer Ges Forschung
Univ Berlin Tech
Michael Niedermayer
Andreas Ostmann
Stephan Guttowski
Stefan Grundmann
Rolf Thomasius
Dmitry-David Polityko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Ges Forschung, Univ Berlin Tech, Michael Niedermayer, Andreas Ostmann, Stephan Guttowski, Stefan Grundmann, Rolf Thomasius, Dmitry-David Polityko filed Critical Fraunhofer Ges Forschung
Publication of WO2007025753A2 publication Critical patent/WO2007025753A2/de
Publication of WO2007025753A3 publication Critical patent/WO2007025753A3/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

Die Erfindung betrifft ein modulares mikroelektronisches Bauteil und ein Verfahren zu seiner Herstellung. Erfindungsgemäß enthält das Verfahren die Schritte: a) Herstellen zumindest zweier Funktionsschichten (12, 22) , wobei jede einzelne Funktionsschicht (12, 22) einen flächigen Träger (10, 20) , auf dem Träger (10, 20) angeordnete elektronische Komponenten (1-5, 8, 9) , eine Leiterstruktur und sich am Rand (6, 23) des Trägers (10, 20) befindende elektrische erste Kontaktstellen (11, 21) aufweist, wobei die Leiterstruktur die elektronischen Komponenten zumindest teilweise kontaktiert und zumindest teilweise mit den ersten Kontaktstellen (11, 21) am Rand (6, 23) des Trägers (10, 20) verbunden ist; b) Schichtweises Aufeinanderlegen der Funkt ionsschichten (12, 22) ; c) Elektrisches Verbinden der Funktionsschichten (12, 22) über die ersten Kontaktstellen (11, 21) . Die Erfindung ermöglicht es, ein äußerst kompaktes und robustes mikroelektronisches Bauteil herzustellen. Dabei kann der Abstimmung sauf wand beim Entwurf der einzelnen Funktionsschichten gegenüber anderen modularen Ansätzen sehr gering gehalten werden. Sehr unterschiedliche Aspektverhältnisse der einzelnen Funktionsschichten gestalten sich bei der Systemintegration recht problemlos, was einen geringeren Entwicklungsaufwand erlaubt .
PCT/EP2006/008520 2005-08-29 2006-08-29 Modulares mikroelektronisches bauteil WO2007025753A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200510041640 DE102005041640A1 (de) 2005-08-29 2005-08-29 Modulares mikroelektronisches Bauteil
DE102005041640.3 2005-08-29

Publications (2)

Publication Number Publication Date
WO2007025753A2 WO2007025753A2 (de) 2007-03-08
WO2007025753A3 true WO2007025753A3 (de) 2007-05-10

Family

ID=37698165

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/008520 WO2007025753A2 (de) 2005-08-29 2006-08-29 Modulares mikroelektronisches bauteil

Country Status (2)

Country Link
DE (1) DE102005041640A1 (de)
WO (1) WO2007025753A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007021561A1 (de) 2007-05-08 2009-01-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Entwurfswerkzeug für Art und Form einer Schaltungsrealisierung

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3614541A (en) * 1969-04-08 1971-10-19 North American Rockwell Package for an electronic assembly
DE2037385A1 (de) * 1970-07-28 1972-02-03 North American Rockwell Elektronische Baugruppe
GB2095039A (en) * 1981-02-10 1982-09-22 Brown David F Circuit assembly
US20020186553A1 (en) * 2000-08-09 2002-12-12 Murata Manufacturing Co., Ltd. Converter device
FR2851406A1 (fr) * 2003-02-13 2004-08-20 Sagem Dispositif electronique a circuits imprimes tridimensionnels
DE10308642A1 (de) * 2003-02-27 2004-09-09 Siemens Ag Leiterplattenanordnung

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4764846A (en) * 1987-01-05 1988-08-16 Irvine Sensors Corporation High density electronic package comprising stacked sub-modules
WO2003005782A2 (en) * 2001-07-02 2003-01-16 Irvine Sensors Corporation Stackable microcircuit and method of making the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3614541A (en) * 1969-04-08 1971-10-19 North American Rockwell Package for an electronic assembly
DE2037385A1 (de) * 1970-07-28 1972-02-03 North American Rockwell Elektronische Baugruppe
GB2095039A (en) * 1981-02-10 1982-09-22 Brown David F Circuit assembly
US20020186553A1 (en) * 2000-08-09 2002-12-12 Murata Manufacturing Co., Ltd. Converter device
FR2851406A1 (fr) * 2003-02-13 2004-08-20 Sagem Dispositif electronique a circuits imprimes tridimensionnels
DE10308642A1 (de) * 2003-02-27 2004-09-09 Siemens Ag Leiterplattenanordnung

Also Published As

Publication number Publication date
WO2007025753A2 (de) 2007-03-08
DE102005041640A1 (de) 2007-03-15

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