WO2007024229A1 - Echangeur thermique destine a des applications thermoelectriques - Google Patents

Echangeur thermique destine a des applications thermoelectriques Download PDF

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Publication number
WO2007024229A1
WO2007024229A1 PCT/US2005/030389 US2005030389W WO2007024229A1 WO 2007024229 A1 WO2007024229 A1 WO 2007024229A1 US 2005030389 W US2005030389 W US 2005030389W WO 2007024229 A1 WO2007024229 A1 WO 2007024229A1
Authority
WO
WIPO (PCT)
Prior art keywords
array
heat exchanger
thermoelectric
foam heat
foam
Prior art date
Application number
PCT/US2005/030389
Other languages
English (en)
Inventor
Abbas A. Alahyari
Louis J. Spadaccini
Xiaomei Yu
Thomas H. Vanderspurt
Original Assignee
Carrier Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carrier Corporation filed Critical Carrier Corporation
Priority to EP05792689A priority Critical patent/EP1924809A1/fr
Priority to US11/990,964 priority patent/US20100218512A1/en
Priority to CA002620479A priority patent/CA2620479A1/fr
Priority to CNA2005800518467A priority patent/CN101292125A/zh
Priority to PCT/US2005/030389 priority patent/WO2007024229A1/fr
Publication of WO2007024229A1 publication Critical patent/WO2007024229A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0251—Removal of heat by a gas

Definitions

  • This invention relates generally to foam heat exchangers, and more particularly, to an apparatus and method for enhancing heat transfer in thermoelectric systems using foam heat exchangers.
  • Heat exchangers to dissipate heat in power electronics applications is well known.
  • Heat exchangers or heat sinks are frequently metal radiators designed to remove heat from power electronics components, particularly, power transistor modules, by thermal conduction, convection or radiation. Without heat exchangers power electronics component would suffer from reduced performance and reliability.
  • Heat exchangers are often structured to have a maximum number of fins per unit volume radiating in a direction perpendicular to a heated surface.
  • heat exchangers dissipate heat using forced convection to a cooling fluid over the heat exchangers to increase the heat dissipation of the exchanger.
  • An even more efficient apparatus for dissipating heat is the use of foams, and in particular metal forms, which have a more effective surface area for heat transfer. Metal foams have recently been used to dissipate heat in power electronic applications; however, they have not been used in thermoelectric systems.
  • thermoelectric elements to be used with thermoelectric elements to build systems for a variety of heating and cooling systems that reduce energy consumption and increase heat pumping capacity in such systems.
  • thermoelectric heating and cooling systems that use foam heat exchangers.
  • thermoelectric heating and cooling systems that use metal foam heat exchangers.
  • thermoelectric heating and cooling systems that use foam heat exchangers to dissipate heat.
  • thermoelectric heating and cooling systems having thermoelectric elements that use foam heat exchangers to reduce the energy consumption of the thermoelectric elements.
  • thermoelectric heating and cooling systems having thermoelectric elements that use foam heat exchangers to increase the heat pumping capacity of the thermoelectric elements.
  • thermoelectric heat pumping system including an array of thermoelectric elements having a temperature at a first surface of the array and a temperature at a second surface of the array opposite the first surface and at least one foam heat exchanger located adjacent one of the first surface and the second surface is provided.
  • the fluid flowing through the at least one foam heat exchanger reduces a difference between the temperature at a first surface of the array and the temperature at a second surface of the array thereby enhancing the efficiency of the system.
  • thermoelectric system having a thermoelectric array having a series of thermoelectric pairs arranged electrically in series.
  • the method provides for a first foam heat exchanger adjacent a first surface of the thermoelectric array and a second foam heat exchanger adjacent a second surface of the thermoelectric array opposite first surface; for generating a temperature at a first surface of the thermal array and a temperature at a second surface of the array that is different from the temperature at the first surface of the array; whereby fluid flowing through the first foam heat exchanger and the second foam heat exchanger reduces a temperature difference between the first surface and the second surface, thereby enhancing the efficiency of the thermoelectric system.
  • Fig. 1 illustrates a thermoelectric system having foam heat exchangers of the present invention
  • Fig. 2 shows a table that compares the heat transfer coefficients of different foams used in the thermoelectric system of the present invention and the weight savings compared to a conventional heat exchanger;
  • Fig. 3 illustrates a thermoelectric system functioning in a heating mode and using foam heat exchangers of the present invention
  • Fig. 4 illustrates a graph showing increased coefficient of performance of thermoelectric systems as the heat transfer coefficient of heat exchangers increase
  • Fig. 5 illustrates a foam heat exchanger of the present invention shown in Fig. 3;
  • Fig. 6 illustrates a foam heat exchanger according to a second embodiment of the heat exchanger of the present invention.
  • thermoelectric system 10 having a thermoelectric elements 15, is shown.
  • Thermoelectric elements 15 are grouped in several P and N pairs or couples 20 that are arranged electrically in series.
  • Electrical connectors 25 provide the connection between adjacent couples 20 and to a power source (not shown).
  • Substrates 30 and 35 are ceramic substrates that provide insulation to system 10. Substrates 30 and 35 hold system 10 together mechanically and insulate couples 20 electrically.
  • Substrate 30 has a surface 40 that is in contact a with foam heat exchanger 45.
  • substrate 35 has a surface 50 that is in contact with foam heat exchanger 55.
  • Fans 60 and 65 are used to force fluid through heat exchangers 45 and 55, respectively.
  • fans 60 and 65 are shown forcing air through heat exchangers 45 and 55, respectively, other types of mechanisms for removing other types of fluid could also be used.
  • Surfaces 40 and 50 may be integral to heat exchanger 45 and 55, respectively, and form a base for connecting to surface 30 and 35 of thermoelectric array.
  • foam heat exchangers 45 and 55 are located immediately adjacent to substrates 30 and 35 to maximize heat transfer from the surfaces 70 and 75 of thermoelectric elements 15. Foam heat exchangers 45 and 55 provide enhanced heat transfer area from surfaces 70 and 75, respectively.
  • Foam heat exchangers 45 and 55 are made from highly conductive materials such as aluminum, copper or graphite. Exchangers made from such materials are not only highly conductive, but because they are formed as a foam, they have a very high porosity and surface area to further enhance their heat transfer capacity.
  • Traditional heat exchangers used in thermoelectric applications have fins to dissipate heat. In comparison to foam heat exchanges, finned heat exchangers have a very limited surface area.
  • thermoelectric refrigeration or heating system is which these exchangers would be used.
  • the coefficient of performance (COP) of thermoelectric systems is defined as the heating or cooling capacity divided by the power consumed. The COP is inversely proportional to the maximum temperature difference across the array.
  • thermoelectric system 90 having a thermoelectric system 90 using foam heat exchangers 95 and 100 configured in a heating mode
  • a DC voltage from a power source 105 is applied across thermoelectric elements 120 and a current 110 flows in the direction shown.
  • Pairs 115 (P and N pairs) of thermoelectric elements 120 absorb heat from a surface 125 and release heat to a surface 130 at the opposite side of device 120. Surface 125 where the heat energy is absorbed becomes cold and the opposite surface 130 where the heat energy is released becomes hot.
  • This "heat pumping" phenomenon known as the Peltier effect, is commonly used in thermoelectric refrigeration or heating.
  • fan 135 forces air through heat exchanger 100 which absorbs heat and is cooled.
  • Fan 140 forces air through heat exchanger 95 to transport heat away from surface 130 to be heated.
  • Power source 105 used in this configuration can be a battery, a fuel cell or any other similar device used to supply current.
  • Thermoelectric system 90 can be converted from a heating mode to a cooling by reversing the polarity of DC poser supply 105.
  • Foam heat exchangers 95 and 100 provide substantial heat transfer capacity across surfaces 130 and 125, respectively, compared to traditional heat sinks to increase the efficiency of system 90.
  • a high heat transfer coefficient foam heat exchangers 95 and 100 By having a high heat transfer coefficient foam heat exchangers 95 and 100, a lower the temperature difference between the opposing surfaces of thermoelectric elements 120, is achieved. This low temperature difference increases the performance of the overall system 90 by consuming less energy.
  • the overall system whether it is configured as a heating or a cooling system, has a very high performance.
  • Fig. 4 shows the relationship between performance of the system and the coefficient of heat transfer using the foam heat exchangers of a typical thermoelectric system. Coefficient of performance is defined as heating or cooling capacity divided by the power consumed by the system.
  • Foam heat exchanger system 150 has a thermoelectric array 155 having a series of thermoelectric pairs 160 arranged in series.
  • Thermoelectric device array 155 has surfaces 165 and 170.
  • System 150 is arranged to have a single foam heat exchanger 175 to dissipate heat from surface 170.
  • a second foam heat exchanger may not be required.
  • a traditional heat exchanger may be used in place of a foam heat exchanger depending upon the application and placed adjacent surface 165. Different configurations of placing foam heat exchangers can be used to maximize heat transfer and depending upon the application.
  • a single system can include several thermoelectric array, each having one or more foam heat exchangers.
  • a third embodiment of a foam heat exchanger system 180 is shown.
  • System 180 is arranged similar to the system of Fig. 5, except that the heat exchanger is a combination foam and fin heat exchanger 185.
  • System 80 has an array 190 of thermoelectric elements 195.
  • Elements 195 have surfaces 200 and 205.
  • a second foam heat exchanger may not be required.
  • a traditional heat exchanger may be used in place of a foam heat exchanger depending upon the application.
  • different configurations of placing foam heat exchangers can be used to maximize heat transfer and depending upon the application.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un système thermoélectrique (10) permettant de pomper de la chaleur, comprenant au moins un échangeur thermique à mousse (45) et permettant d'améliorer le transfert de chaleur à distance du système (10), de manière à améliorer le rendement et les performances globaux du système.
PCT/US2005/030389 2005-08-25 2005-08-25 Echangeur thermique destine a des applications thermoelectriques WO2007024229A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP05792689A EP1924809A1 (fr) 2005-08-25 2005-08-25 Echangeur thermique destine a des applications thermoelectriques
US11/990,964 US20100218512A1 (en) 2005-08-25 2005-08-25 Heat exchanger for thermoelectric applications
CA002620479A CA2620479A1 (fr) 2005-08-25 2005-08-25 Echangeur thermique destine a des applications thermoelectriques
CNA2005800518467A CN101292125A (zh) 2005-08-25 2005-08-25 用于热电应用的换热器
PCT/US2005/030389 WO2007024229A1 (fr) 2005-08-25 2005-08-25 Echangeur thermique destine a des applications thermoelectriques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2005/030389 WO2007024229A1 (fr) 2005-08-25 2005-08-25 Echangeur thermique destine a des applications thermoelectriques

Publications (1)

Publication Number Publication Date
WO2007024229A1 true WO2007024229A1 (fr) 2007-03-01

Family

ID=37771889

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/030389 WO2007024229A1 (fr) 2005-08-25 2005-08-25 Echangeur thermique destine a des applications thermoelectriques

Country Status (5)

Country Link
US (1) US20100218512A1 (fr)
EP (1) EP1924809A1 (fr)
CN (1) CN101292125A (fr)
CA (1) CA2620479A1 (fr)
WO (1) WO2007024229A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013004532A1 (fr) * 2011-07-05 2013-01-10 Siemens Aktiengesellschaft Élément de refroidissement
WO2013041841A3 (fr) * 2011-09-21 2013-10-03 Bae Systems Plc Ensemble de couches pour échangeur de chaleur
WO2014085181A1 (fr) * 2012-11-28 2014-06-05 Massachusetts Institute Of Technology Échangeurs de chaleur utilisant des mousses métalliques sur des ailettes
EP3018412A1 (fr) * 2014-11-05 2016-05-11 NOXMAT GmbH Récupérateur et brûleur à récupération

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9179579B2 (en) * 2006-06-08 2015-11-03 International Business Machines Corporation Sheet having high thermal conductivity and flexibility
US20110303197A1 (en) 2010-06-09 2011-12-15 Honda Motor Co., Ltd. Microcondenser device
DE102016012795A1 (de) * 2016-10-26 2018-04-26 Peter Marchl Struktur zur Temperierung von Festkörpern und Behältnissen und seine Verwendung
JP6477800B2 (ja) * 2017-08-02 2019-03-06 三菱マテリアル株式会社 ヒートシンク
KR102474817B1 (ko) * 2018-12-04 2022-12-06 현대자동차주식회사 열전 모듈 및 그를 포함하는 온도조절장치
CN112179976A (zh) * 2019-07-04 2021-01-05 霍尼韦尔国际公司 气体湿度降低设备以及其使用方法

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US5092129A (en) * 1989-03-20 1992-03-03 United Technologies Corporation Space suit cooling apparatus
US5180293A (en) * 1992-03-20 1993-01-19 Hewlett-Packard Company Thermoelectrically cooled pumping system
US5737923A (en) * 1995-10-17 1998-04-14 Marlow Industries, Inc. Thermoelectric device with evaporating/condensing heat exchanger
US6018616A (en) * 1998-02-23 2000-01-25 Applied Materials, Inc. Thermal cycling module and process using radiant heat

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US3302704A (en) * 1965-05-14 1967-02-07 Olin Mathieson Compound metal structure
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US5228923A (en) * 1991-12-13 1993-07-20 Implemed, Inc. Cylindrical thermoelectric cells
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KR20010076991A (ko) * 2000-01-29 2001-08-17 박호군 발포금속 방열기
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US6530231B1 (en) * 2000-09-22 2003-03-11 Te Technology, Inc. Thermoelectric assembly sealing member and thermoelectric assembly incorporating same
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Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US5092129A (en) * 1989-03-20 1992-03-03 United Technologies Corporation Space suit cooling apparatus
US5180293A (en) * 1992-03-20 1993-01-19 Hewlett-Packard Company Thermoelectrically cooled pumping system
US5737923A (en) * 1995-10-17 1998-04-14 Marlow Industries, Inc. Thermoelectric device with evaporating/condensing heat exchanger
US6018616A (en) * 1998-02-23 2000-01-25 Applied Materials, Inc. Thermal cycling module and process using radiant heat

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013004532A1 (fr) * 2011-07-05 2013-01-10 Siemens Aktiengesellschaft Élément de refroidissement
WO2013041841A3 (fr) * 2011-09-21 2013-10-03 Bae Systems Plc Ensemble de couches pour échangeur de chaleur
AU2012311283B2 (en) * 2011-09-21 2016-02-11 Bae Systems Plc Layer assembly for heat exchanger
US9631844B2 (en) 2011-09-21 2017-04-25 Bae Systems Plc Layer assembly for heat exchanger
WO2014085181A1 (fr) * 2012-11-28 2014-06-05 Massachusetts Institute Of Technology Échangeurs de chaleur utilisant des mousses métalliques sur des ailettes
EP3018412A1 (fr) * 2014-11-05 2016-05-11 NOXMAT GmbH Récupérateur et brûleur à récupération

Also Published As

Publication number Publication date
EP1924809A1 (fr) 2008-05-28
US20100218512A1 (en) 2010-09-02
CA2620479A1 (fr) 2007-03-01
CN101292125A (zh) 2008-10-22

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