WO2007009510A1 - Procede pour appliquer des structures conductrices electriques sur un composant cible en matiere plastique - Google Patents

Procede pour appliquer des structures conductrices electriques sur un composant cible en matiere plastique Download PDF

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Publication number
WO2007009510A1
WO2007009510A1 PCT/EP2006/003241 EP2006003241W WO2007009510A1 WO 2007009510 A1 WO2007009510 A1 WO 2007009510A1 EP 2006003241 W EP2006003241 W EP 2006003241W WO 2007009510 A1 WO2007009510 A1 WO 2007009510A1
Authority
WO
WIPO (PCT)
Prior art keywords
target component
transfer medium
conductor structures
molded part
plastic
Prior art date
Application number
PCT/EP2006/003241
Other languages
German (de)
English (en)
Inventor
Ingmar Petersen
Markus Pfletschinger
Bernd Schwarz
Martin Flues
Jan Krüger
Original Assignee
Hirschmann Car Communication Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirschmann Car Communication Gmbh filed Critical Hirschmann Car Communication Gmbh
Publication of WO2007009510A1 publication Critical patent/WO2007009510A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Definitions

  • the invention relates to a method for applying electrical conductor structures to a target component made of plastic according to the features of the preamble of patent claim 1.
  • target components made of plastic.
  • plastic in the case of vehicles, it is known to manufacture flat components, such as hoods, roofs, trunk lids and the like, for reasons of weight reduction.
  • attachments such as fenders, doors, bumpers and the like can be made of plastic vehicles.
  • these plastic components have the advantage that they can not rust against steel components.
  • the invention is therefore based on the object to provide a method for applying electrical conductor structures on a target component made of plastic, which is easy to implement and which avoids the disadvantages described above.
  • a manufactured by the process target component with electrical conductor structures to be available.
  • a transfer medium on which the conductor structures are detachably arranged, are inserted into a molded part and the molded part is filled with a PUR layer (PUR foam), the finished target component being removed from the molded part after the foaming process.
  • PUR layer PUR foam
  • This method has the advantage that first the conductor structures are placed on a transfer medium, wherein in a particular embodiment of the invention, the transfer medium is a plastic film.
  • the transfer medium is a plastic film.
  • the use of a transfer medium moreover has the advantage that it only has to have dimensions in the region of which the conductor structures are present. This makes it much easier to handle.
  • the material of the transfer medium and the material of the conductor structures can be matched to one another so that they adhere to one another, at least during the production of the target component, but also after removal of the transfer medium, if appropriate.
  • the transfer medium with the conductor structures arranged thereon does not yet have to have the final shape of the target component, since this form can be done only after insertion into the molding and the subsequent filling of the molded part with plastic material.
  • the freedom of design for the target component and its rational production are supported in an advantageous manner.
  • the inventive method has the advantage that then the conductor structures are surrounded on their surfaces facing away from the transfer medium of the plastic material and thus permanently and firmly on the target component, so that they can no longer detach from this during later operation of the target component.
  • the filling of the foamable plastic material offers great freedom on the one hand with respect to the design and the manufacturing costs of the target component, on the other hand, the plastic material can also be selected after application of the target component.
  • foamable plastic materials are preferred when it comes to weight savings at the installation of the target component.
  • the transfer medium is formed before or during the filling process. Since prior to insertion of the transfer medium in the molded part whose shapes may differ from each other, but it is not necessary, it is advantageous to transform the transfer medium before or during the filling process, that is, the negative mold of the molded part, which corresponds to the outer shape of the finished target component, adapt. This can be done, for example, mechanically, with vacuum, with the help of electrostatic charge in the Molded part or the like.
  • the entire target component is deformed during or after filling.
  • the target component is already given its final shape by the shape of the molded part or else initially receives a first shape by filling the molded part with the plastic material, the target member.
  • After removing the finished target component from the mold it is then plastically deformed by means of suitable methods, in particular brought by the action of heat and pressure in its final form. It is important to ensure that during this subsequent transformation, the conductor structures are not damaged, in particular that interruptions are avoided.
  • the transfer medium is a film which has the particular advantage that the conductor structures can be applied to it simply, quickly and cost-effectively and which offers sufficient flexibility when being inserted into the molded part.
  • the transfer medium after the completion of the target component either as a protective layer remains on this is partially removed (the remaining part provides a protective layer, while in the remote region of the transfer medium, the conductor structures for further processing, in particular contacting exposed) or completely removed.
  • the partial or complete removal of the transfer medium offers the possibility that the conductor structures are then exposed and available for further processing.
  • Further processing may be an electrical contacting with electrical or electronic components that are on the target component to be there to form an electronic device, such as an antenna amplifier of a vehicle.
  • the conductor structures may also be pure electrical connections for power supply or signal transmission and have a connector in their end regions.
  • the transfer medium is a fiber composite, in particular the transfer medium is a paper.
  • Paper is extremely cheap and will be delivered on roll. It is also easy to print. Waxed paper can be particularly favorable for the transfer.
  • Fabric is another, very tear-resistant fiber composite.
  • other fiber composites are conceivable
  • the transfer medium is a component of the molded part.
  • the conductor structures are applied by suitable methods on the inner surface of the molded part, wherein the connection between the conductor structures and the molded part is to be chosen so that after filling the molded part with the plastic material and the removal of the molded part, the conductor structures on the finished Target component remain and thus detach from the molding.
  • the target component is produced by the method according to the invention, wherein the target component is characterized by its application as a component of a vehicle, in particular a vehicle roof.
  • the target component is characterized by its application as a component of a vehicle, in particular a vehicle roof.
  • a plastic material for the production of the target component is translucent or opaque.
  • the plastic material according to the location already colored ready to be colored or subsequently provided with a coat of paint is translucent or opaque.
  • FIG. 1 electrical conductor structures which are applied to a transfer medium
  • FIG. 2 a molding tool for receiving the transfer medium
  • FIG. 3 shows the closed mold after introduction of the foamable PUR material
  • FIG. 4 a fragmentary view of the finished target component
  • Figure 5 the target component before and after the removal of the transfer medium.
  • FIG. 1 shows conductor structures 1 which are applied to a transfer medium, in particular a thin film 2.
  • Suitable conductor structures are pastes, for example silver polymer pastes, Cu pastes (copper) or the like.
  • the films used are PET, PMMA and generally plastic films which do not completely bond with the PUR foam. Applying the conductor structures on the film can be done by screen printing, pad printing and all common printing methods, which are also applied to paint (spraying or sputtering).
  • the above lists are only exemplary and not exhaustive.
  • Such a film 2 shown in FIG. 1 with conductor structures 1 mounted thereon either already has the final geometric design of the later one finished target components or can be brought before or during the production of the target component in the final form.
  • Figure 2 shows a mold for receiving the transfer medium.
  • the molding tool consists of two or more parts so that it is possible to insert the transfer medium into the molding tool.
  • a first molded part 3 is present, in which a lacquer layer, in particular a lacquer film 4, is introduced.
  • This lacquer layer may, but need not, be present.
  • a foamable plastic in particular a PUR layer, is introduced into the first molded part 3 by means of an application tool 6.
  • the foamable plastic material for. B. by means of a nozzle 7 of the application tool 6 in the first mold part 3 or introduced in a different manner.
  • the foamable plastic material is to adapt the paint film 4 in terms of compatibility and expansion coefficient.
  • the expansion coefficients of paint film 4 and foam should be exactly matched, so that no bimetal effect occurs.
  • FIG. 3 shows the closed mold after introduction of the foamable PU plastic material.
  • the mold is closed, here by means of at least one further molded part 8.
  • the transfer medium film 2 with applied conductor structures 1 according to FIG. 1 is introduced into the mold, for which purpose For example, it is placed on the PUR layer 5 or adheres to the inside of the further molded part 8.
  • the transfer medium can also be formed by the further molded part 8, which then carries the conductor structures 1.
  • the PU foam 5 begins to swell, creating heat and pressure, thereby foaming either the conductor pattern 1 on the film 2 or the conductor pattern 1 on the molded part 8.
  • the amount of filled plastic material is selected so that the entire interior of the mold, including the inserted conductor structures, (and possibly the inserted foil 2) is completely filled during foaming. In the event that a larger amount is selected, it may be necessary to provide an outlet opening in the mold.
  • the conductor structures 1 permanently adhering to the PUR layer are removed from the transfer medium (here the foil 2, alternatively, for example, the molded part 8).
  • the conductor structures 1 are at least partially free and can be subjected to further processing, in particular painting or attachment of electrical, electronic and the like components.
  • FIG. 5 shows the target component before and after removal of the transfer medium.
  • a finished target component 9 has been provided with the conductor structures 1 in a partial region, as described above.
  • the film 2 is used as the transfer medium, it will still adhere to it after removal of the target component 9 from the mold. This is advantageous if z.
  • the target component 9 is manufactured by a supplier of a vehicle manufacturer and delivered to a vehicle manufacturer for final assembly.
  • the film 2 provides the conductor structures 1 protection, especially against corrosion or oxidation and mechanical protection.
  • the target component 9 has been manufactured, but must first be stored before its further processing, in particular the contacting of the conductor structures 1 with further electronic components.
  • the temporary whereabouts of the film 2 on the target component 9 provides protection for the conductor structures 1 present there.
  • the conductor structures 1 are open on the surface of the target component 9, wherein it should be pointed out that the surface of the target component 9 and the surfaces of the existing conductor structures 1 are arranged in the same plane, so that the conductor structures 1 not from the surface of the target component 9 lift off or lie underneath.
  • this has the final shape or can still be made to measure. It is advantageous that it is processed so that at the end of the individual conductor structures 1 results in a contact area 10.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

La présente invention concerne un procédé pour appliquer des structures conductrices électriques (1) sur un composant cible (9) en matière plastique. Selon cette invention, un milieu de transfert sur lequel les structures conductrices (1) sont placées de manière amovible est inséré dans une pièce moulée (3, 8) et la pièce moulée (3, 8) est remplie avec une couche de polyuréthane (5). Après le processus de moussage, le composant cible produit (9) est retiré de la pièce moulée (3, 8).
PCT/EP2006/003241 2005-07-21 2006-04-10 Procede pour appliquer des structures conductrices electriques sur un composant cible en matiere plastique WO2007009510A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200510034083 DE102005034083A1 (de) 2005-07-21 2005-07-21 Verfahren zum Aufbringen von elektrischen Leiterstrukturen auf ein Zielbauteil von Kunststoff
DE102005034083.0 2005-07-21

Publications (1)

Publication Number Publication Date
WO2007009510A1 true WO2007009510A1 (fr) 2007-01-25

Family

ID=36581413

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/003241 WO2007009510A1 (fr) 2005-07-21 2006-04-10 Procede pour appliquer des structures conductrices electriques sur un composant cible en matiere plastique

Country Status (2)

Country Link
DE (1) DE102005034083A1 (fr)
WO (1) WO2007009510A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009010411A1 (de) 2008-02-29 2009-09-10 Hirschmann Car Communication Gmbh Anwendung von Folienantennen

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4811482A (en) * 1987-08-05 1989-03-14 Moll Kenneth W Method for producing molded circuit boards
WO1990012668A1 (fr) * 1989-04-27 1990-11-01 Amoco Corporation Appareil et procede de fabrication de plaquettes a circuits imprimes
US5090122A (en) * 1990-07-24 1992-02-25 Kitagawa Industries Co., Ltd. Method for manufacturing a three-dimensional circuit substrate
DE4141775A1 (de) * 1991-12-18 1993-06-24 Manfred Band Verfahren zur herstellung einer elektronischen schaltung
US20030070747A1 (en) * 1998-09-30 2003-04-17 Kydd Paul H. Adhesiveless transfer lamination method and materials for producing electronic circuits
DE10242526A1 (de) * 2002-09-12 2004-04-01 Daimlerchrysler Ag Fahrzeugteile aus Kunststoff mit integrierten Antennenelementen sowie Verfahren zu deren Herstellung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3991179T1 (de) * 1989-09-26 1990-10-11 Rogers Corp Gekruemmter plastikkoerper mit schaltungsmuster, und herstellungsverfahren dafuer
DE19829248A1 (de) * 1998-06-30 2000-01-05 Thomson Brandt Gmbh Verfahren zur Herstellung eines elektrotechnischen Bauteiles
DE10203455A1 (de) * 2002-01-24 2003-07-31 Jenoptik Automatisierungstech Geformtes Montagebauelement und Verfahren zu dessen Herstellung

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4811482A (en) * 1987-08-05 1989-03-14 Moll Kenneth W Method for producing molded circuit boards
WO1990012668A1 (fr) * 1989-04-27 1990-11-01 Amoco Corporation Appareil et procede de fabrication de plaquettes a circuits imprimes
US5090122A (en) * 1990-07-24 1992-02-25 Kitagawa Industries Co., Ltd. Method for manufacturing a three-dimensional circuit substrate
DE4141775A1 (de) * 1991-12-18 1993-06-24 Manfred Band Verfahren zur herstellung einer elektronischen schaltung
US20030070747A1 (en) * 1998-09-30 2003-04-17 Kydd Paul H. Adhesiveless transfer lamination method and materials for producing electronic circuits
DE10242526A1 (de) * 2002-09-12 2004-04-01 Daimlerchrysler Ag Fahrzeugteile aus Kunststoff mit integrierten Antennenelementen sowie Verfahren zu deren Herstellung

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Publication number Publication date
DE102005034083A1 (de) 2007-02-22

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