WO2006132122A1

WO2006132122A1 - Led lamp module

Info

Publication number: WO2006132122A1
Application number: PCT/JP2006/310960
Authority: WO
Inventors: Hideyuki Takahashi; Mikio Onodera; Ken Shibazaki; Yasunori Sasaki; Akira Nakano
Original assignee: Alps Electric Co., Ltd.
Priority date: 2005-06-07
Filing date: 2006-06-01
Publication date: 2006-12-14
Also published as: JP2006344420A

Abstract

[PROBLEMS] To provide an LED lamp module which is used to easily and inexpensively produce various types of illuminators having different quantities of light and different irradiation ranges of illumination light. [MEANS FOR SOLVING PROBLEMS] The LED lamp module comprises a resin molding (2) having a male contact (21) and a female contact (22) molded integrally, and an LED (6) fixed to the resin molding (2) and connected electrically with the male contact (21) and the female contact (22). A plurality of connection pin insertion holes (16) constituting the female contact (22) are formed with such shape, dimension and arrangement as receiving connection pins (3a, 4a) and a ground electrode plate (5) constituting the male contact (21).

Description

Specification

LED lamp module

Technical field

The present invention relates to an LED lamp module using a light emitting diode (abbreviated as “LED” in the present specification) as a light source, and in particular, an LED lamp module in which a plurality can be combined in an arbitrary arrangement. About.

Background art

Conventionally, as a lighting device using a chip LED as a light source, a printed wiring board on which electrical components such as a chip LED, a chip resistor, a switch, and a connector are mounted is stored in a housing. It has been known. As another example, an LED lamp is incorporated in a ceramic holder with a base pin (male contact), and the other end of the lead wire connected to the LED lamp is inserted into the base pin. (For example, see Patent Document 1).

Patent Document 1: No. 3092760

Disclosure of the invention

Problems to be solved by the invention

[0003] The former of the above lighting devices is a method of manufacturing a printed wiring board on which electrical components are mounted. A printed wiring board on which electrical components are mounted is placed in a reflow furnace, and terminal portions of the electrical components and printed circuit boards are printed. Since the method of connecting the terminal portion of the wiring board with solder is generally used, it is necessary to use heat-resistant electrical components that can withstand reflow, and the lighting device is expensive. In addition, the assembly cost increases and the lighting device costs because the connector and the housing are composed of separate parts, and the printed wiring board is generally screwed to the housing. Become high. In addition, when manufacturing lighting devices with different amounts of light and illumination light, the printed wiring board must be redesigned for each lighting device, which makes it difficult to respond to changes in lighting device design. is there.

[0004] On the other hand, in the latter of the lighting devices, an LED lamp is incorporated in a holder having a base pin, so that a plurality of female contacts into which the base pin can be inserted are formed. If a printed wiring board is used, the number of LEDs can be increased or decreased within the range of the number of female contacts formed on the printed wiring board, and manufacturing of lighting devices with different light amounts and illumination light irradiation ranges is facilitated to some extent. be able to. However, the lighting device of this example cannot increase the force LED within the range of the number of female contacts formed on the printed wiring board, and for example, even when only one LED is mounted, Since printed wiring boards with female contacts must be used, there is a lot of waste.

[0005] The present invention has been made to solve the deficiencies of the conventional techniques, and the purpose of the present invention is to make it possible to easily manufacture various types of lighting devices with different light amounts and illumination light irradiation ranges. Is to provide a simple LED lamp module.

Means for solving the problem

[0006] In order to solve the above-mentioned problems, the present invention relates to an LED lamp module in which a male contact and a female contact are integrally molded, and the male contact and the male contact attached to the resin molded body. A structure having an LED electrically connected to the female contact, wherein a plurality of connection pin insertion holes constituting the female contact are formed so that a plurality of connection pins constituting the male contact can be inserted. I made it.

[0007] When a male contact and a female contact are integrally formed on a resin molded body, electrical connection with an external device or other LED lamp module without using a connector formed separately from the resin molded body. Connection becomes possible. In addition, when the shape, size and arrangement of the plurality of connection pin insertion holes constituting the female contact are formed into the shape, size and arrangement capable of inserting the plurality of connection pins constituting the male contact, connection of one LED lamp module is possible. Any number of LED lamp modules can be connected by simply inserting the connection pins of the other LED lamp module into the pin insertion holes.

[0008] Further, according to the present invention, in the LED lamp module configured as described above, a concave LED storage portion and one end are electrically connected to the male contact and the female contact on the surface of the resin molded body. A wiring pattern is formed, and the LED housed in the LED housing portion and the other end of the wiring pattern are electrically connected using solder or a conductive adhesive.

[0009] When a concave LED housing is formed on the surface of the resin molded body, the LED lamp module Since the total thickness can be the sum of the thickness of the resin molded body and the thickness of the wiring pattern, the LED lamp module can be made thin. In addition, when the LED and the other end of the wiring pattern are electrically connected using solder or conductive adhesive, it is not necessary to use a heat-resistant LED as in the case where the LED is mounted on a printed wiring board by reflow soldering.

V, so the cost of the LED lamp module can be reduced.

[0010] Further, in the LED lamp module having the above-described configuration, the present invention uses a conductive adhesive for the male contact, the wiring pattern, the female contact, and the wiring pattern.

V, electrically connected, and !!

[0011] According to the powerful configuration, since high heat does not act on the connection portion between each contact and the wiring pattern, the resin molded product that does not require the use of heat-resistant resin as a constituent material of the resin molded product. This increases the low cost of LED lamp modules and the degree of freedom in designing resin moldings.

In the LED lamp module having the above-described configuration, the present invention provides an electrical connection through a panel brush in which the male contact, the wiring pattern, and the female contact and the wiring pattern are integrally formed with the resin molded body. When connected to, it is configured as ヽぅ.

[0013] According to the powerful configuration, since the connection between each wiring pattern and each contact can be completed simultaneously with the molding of the resin molded body, a special process for connecting each wiring pattern and each contact is performed. It is not necessary to simplify the LED lamp module manufacturing process.

The low cost of the D lamp module can be achieved.

[0014] Further, according to the present invention, in the LED lamp module having the above configuration, the outer shape of the resin molded body is formed in a rectangular parallelepiped shape, and a small number of the four side surfaces excluding the mounting surface of the LED and the back surface thereof. The male contact is provided on at least one side surface, and the female contact is provided on a side surface other than the one side surface.

[0015] As described above, when male contacts and female contacts are provided on different surfaces of the resin molded body, a plurality of LED lamp modules can be connected, and thus various light amounts and illumination light irradiation ranges are different. The manufacture of the lighting device can be facilitated. In addition, by simply changing the wiring pattern in the LED lamp module, it is possible to connect the LED lamp module in series and in parallel, simplifying the circuit design and reducing power. The invention's effect

[0016] In the LED lamp module of the present invention, the male contact and the female contact are integrally formed on the resin molded body, so that it is not necessary to use a connector formed separately from the resin molded body. Low cost can be achieved. In addition, the shape, size, and arrangement of the plurality of connection pin insertion holes that make up the female contact are formed into a shape, size, and arrangement that allow insertion of the plurality of connection pins that make up the male contact, so that one LED lamp module can be connected. Any number of LED lamp modules can be connected simply by inserting the connection pins of the other LED lamp module into the pin insertion holes, making it easy to manufacture various lighting devices with different light amounts and illumination light irradiation ranges. Can be

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the best embodiment of the LED lamp module according to the present invention will be described with reference to FIGS. 1 to 6. FIG. 1 is a perspective view of an LED lamp module according to an embodiment, FIG. 2 is a side view of the LED lamp module according to the embodiment, as viewed from the protruding side of the connection pin, and FIG. 3 is an LED lamp module according to the embodiment. 4 is a side view as seen from the side where the connection pin insertion hole is opened, FIG. 4 is a cross-sectional view of FIG. 1A— FIG. 5 is an inner view of the LED lamp module according to the embodiment, and FIG. 6 is an LED according to the embodiment. It is an equivalent circuit diagram of a lamp module.

[0018] As shown in FIGS. 1 to 6, the LED lamp module 1A of this example includes a resin molded body 2 made of an insulating resin material, a positive electrode plate 3 made of a highly conductive metal material, It consists of a negative electrode plate 4 and a ground electrode plate 5, and a chip LED 6 and a chip resistor element 7 set on the surface of the resin molded body 2.

[0019] The resin molded body 2 is composed of an upper half 2a and a lower half 2b each formed in a square having the same planar shape, and is assembled into a hollow rectangular parallelepiped by joining these halves. It is done. As the resin material for forming the resin molding 2, it is also possible to use a general plastic such as ABS resin, an engineering plastic such as PBT resin, or a super engineering plastic such as LCP.

[0020] On the surface of the upper half 2a formed in a square shape, as shown in FIG. 4, a concave LED storage portion 11 and a resistance storage portion 12 for storing the chip LED 6 and the chip resistance element 7 are formed. Wiring pattern 13 for connecting each chip LED 6 and chip resistor element 7 in series, and a plus-side wiring pattern for connecting a set of each chip LED 6 and chip resistor element 7 connected in series in parallel 14 and a negative wiring pattern 15 are formed. As shown in FIG. 2, the plus-side wiring pattern 14 extends to the side surface portion of the upper half 2a and is electrically connected to the plus electrode plate 3. Further, as shown in FIG. 3, the minus-side wiring pattern 15 extends to the side surface portion of the upper half 2a and is electrically connected to the minus electrode plate 4. The wiring patterns 13, 14, and 15 are formed on the upper half 2a by a transfer method or a plating method. The transfer method will be described in detail later with reference to the drawings. In addition, the connection between the plus side wiring pattern 14 and the plus electrode plate 3 and the connection between the minus side wiring pattern 15 and the minus electrode plate 4 can be performed by a conductive adhesive.

[0021] As shown in FIGS. 4 and 5, a plus electrode plate 3, a minus electrode plate 4, and a ground electrode plate 5 are integrally formed on the lower half 2b by an insert mold. The positive electrode plate 3 has two male connection pins 3a for forming the male contact 21 and two female connection pins 3b for forming the female contact 22, and the male connection pin 3a Protrudes outward from the two adjacent side surfaces (male contact setting surface) of the resin molded body 2, and the female connection pin 3b is connected to the other two side surfaces (female contact setting surface) of the resin molded body 2. It is placed inside the connection pin insertion hole 16 established in On the other hand, the negative electrode plate 4 has two male side connection pins 4a for constituting the male contact 21 and two female side connection pins 4b for constituting the female contact 22. The connection pin 4a protrudes outward from the male contact setting surface of the resin molding 2, and the female connection pin 4b is located inside the connection pin insertion hole 16 provided on the female contour setting surface of the resin molding 2. Be placed. The ground electrode plate 5 is formed in a substantially bar shape, one end is fixed to the lower half 2b, and the tip is projected outward from the male contact setting surface of the resin molded body 2. As shown in FIG. 5, the connection pins 3a, 3b, 4a, 4b and the ground electrode plate 5 are set in the same arrangement on each male contact setting surface and each female contact setting surface. Further, each connection pin insertion hole 16 constituting the female contact 22 is formed in a shape, size and arrangement in which each connection pin 3a, 4a constituting the male contact 21 and the ground electrode plate 5 can be inserted.

[0022] Chip LED6 is an arbitrary LED power belonging to the publicly known power A white LED that emits white light is particularly suitable as a light source of an LED lamp module provided in a car room lamp or a map lamp. The chip LED 6 is housed in the LED housing 11 with the light emitting surface facing outward. Further, as the chip resistor element 7, an element having a resistance value necessary for driving the chip LED 6 is used, and is housed in the resistor housing portion 12. The connection between the chip LED 6 and the wiring patterns 13 and 14 and the connection between the chip resistor element 7 and the wiring patterns 13 and 15 can be made with solder or a conductive adhesive. By making such a connection, the LED driving circuit shown in FIG. 6 is configured in the LED lamp module 1A according to the embodiment.

Hereinafter, a method for manufacturing the upper half 2a to which a required wiring pattern is transferred will be described with reference to FIG. FIG. 7 is a flowchart showing a manufacturing procedure of the upper half 2a constituting the LED lamp module 1A according to the embodiment.

[0024] First, as shown in FIG. 7 (a), there is also a resin film strength such as polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyetherimide, polyimide, and the like. A film substrate 31 having a required through hole 3 la corresponding to the storage portion 12 is prepared. Next, as shown in FIG. 7 (b), required wiring patterns 13, 14, 15 are formed on one side of the film base 31 by screen printing or the like. Next, as shown in FIG. 7 (c), the surface of the film base 31 on which the wiring patterns 13, 14, 15 are not formed is brought into close contact with the cavity surface 32a of the mold 32 and formed on the mold 32. The required grease is injected into the mold cavity 13 with the protrusions 32b for forming the LED storage part 11 and the resistance storage part 12 being inserted into the through holes 31a provided in the film base 31. . After cooling, if the molded product is taken out from the mold 32, the upper half 2a having the film base 31 in close contact with the surface can be obtained. The plating method for forming the wiring patterns 13, 14, and 15 is that after forming the upper half 2a without the wiring patterns 13, 14, and 15, the wiring patterns 13, 14, and 15 are formed by sputtering or vacuum evaporation. In this method, a conductive film corresponding to the above is formed, and then the conductive film is used as one electrode to perform electroplating. For the manufacturing method of the lower half 2b, a general insert mold can be applied.

Hereinafter, a method of using the LED lamp module 1A according to the embodiment will be described with reference to FIG. Fig. 8 is a plan view of the LED lamp module 1A in use according to the embodiment. It is.

[0026] The LED lamp module 1A of this example has a male contact 21 and a female contact 22 formed on different surfaces, and the arrangement of the connection pins 3a, 4a and the ground electrode plate 5 in the male contact 21 and the pin in the female contact 22 Since the arrangement of 3b, 4b and the ground electrode plate 5 is the same, the required number of LED lamp modules can be obtained by inserting the male contact 21 of the other LED lamp module 1A into the female contact 22 of one LED lamp module 1A. 1A can be connected vertically and Z or horizontally. Fig. 8 (a) is characterized in that two LED lamp modules 1A are connected vertically, a switch module SW is connected to one end, and an end module EM is connected to the other end. Fig. 8 (b) is characterized in that three LED lamp modules 1A are connected horizontally, a switch module SW is connected to one end, and a termination module EM is connected to the other end. Further, FIG. 8 (c) is characterized in that four LED lamp modules 1A are connected vertically and horizontally via a dummy module DM, and a switch module SW is connected to one end thereof. The switch module SW is a switch with a switch 41 such as a push switch in place of the chip LED 6 of the LED lamp module 1A. The terminal module EM is a male contact only on one surface of the resin molded body 2. Is formed. The dummy module DM is obtained by omitting the chip LED 6 and the chip resistor element 7 of the LED lamp module 1A.

Thus, in the LED lamp module 1A of this example, the male contact 21 and the female contact 22 were formed integrally with the resin molded body 2, so that the LED lamp module 1A was formed separately from the resin molded body 2. It is possible to make an electrical connection with an external device or another LED lamp module without using a connector, and the LED lamp module can be reduced in cost. In addition, the shape, size and arrangement of the plurality of connection pin insertion holes 16 constituting the female contact 22 are changed to the shape, size and arrangement capable of inserting the connection pins 3a, 4a and the ground electrode plate 5 constituting the male contact 21. As a result, any number of LED lamp modules 1A can be obtained simply by inserting the connection pins 3a, 4a of the other LED lamp module 1A and the ground electrode plate 5 into the connection pin insertion hole 16 of one LED lamp module 1A. Thus, it is possible to facilitate manufacture of various types of lighting devices having different light amounts and illumination light irradiation ranges. Further, the LED lamp module 1 A of this example has a concave LED storage portion 11 and a resistance storage portion 12 on the surface of the resin molded body 2. As a result, the total thickness of the LED lamp module 1A can be made the sum of the thickness of the resin molded body 2 and the thickness of the film substrate 31, and the LED lamp module can be made thin. . In addition, since each connection is electrically connected using solder or conductive adhesive, there is no need to use a heat-resistant LED as in the case of mounting an LED on a printed wiring board by reflow soldering. Low cost. Furthermore, since the LED lamp module 1A of this example has two male contacts 21 and two female contacts 22 on different surfaces of the resin molded body 2, the vertical connection and the horizontal connection of the LED lamp module are provided. It becomes possible, and various illumination devices with different light amounts and illumination light irradiation ranges can be manufactured arbitrarily. In addition, by simply changing the wiring pattern of the upper half 2a in the LED lamp module, it is possible to connect the LED lamp module in series and in parallel, simplifying the circuit design and reducing power.

[0028] Although the chip resistor element 7 is disposed on the surface of the resin molded body 2 in the above-described embodiment, it is replaced with a required portion of the film base 31 in place of a forceful configuration. Resistor patterns can also be printed. Note that when a resistor is not required for driving the LED 6, the chip resistor element 7 or the resistor pattern can be omitted.

[0029] Although the male electrode 21 is provided with the ground electrode plate 5 in the above embodiment, it can be omitted.

[0030] Further, in the above embodiment, a conductive adhesive is used for connecting the plus side wiring pattern 14 and the plus electrode plate 3 and connecting the minus side wiring pattern 15 and the minus electrode plate 4 together. However, instead of using a powerful configuration, as shown in FIG. 9, these connections can be made via a panel brush 42 integrally formed with the resin molded body 2. According to this configuration, since the connection between each wiring pattern and each electrode plate can be completed simultaneously with the molding of the resin molding 2, a special connection between each wiring pattern and each electrode plate is possible. Therefore, the manufacturing process of the LED lamp module can be simplified and the cost of the LED lamp module can be reduced.

[0031] Power! In addition, in the above embodiment example, the force in which two male contacts 21 and two female contacts 22 are provided on different surfaces of the resin molded body 2 respectively. Non-restricted resin molded body formed in a rectangular parallelepiped shape 2 Mounting of LED6 It is sufficient if the male contact 21 is provided on at least one of the four side surfaces excluding the surface and the back surface, and the female contact 22 is provided on a side other than the one side.

Brief Description of Drawings

FIG. 1 is a perspective view of an LED lamp module according to an embodiment.

FIG. 2 is a side view of the surface force on the protruding side of the connection pin of the LED lamp module according to the embodiment.

FIG. 3 is a side view of the LED lamp module according to the embodiment as viewed from the surface force on the connection pin insertion hole opening side.

FIG. 4 is a cross-sectional view taken along the line AA ′ of FIG.

FIG. 5 is an inner view of the LED lamp module according to the embodiment.

FIG. 6 is an equivalent circuit diagram of the LED lamp module according to the embodiment.

FIG. 7 is a flowchart showing a manufacturing procedure of an upper half constituting the LED lamp module according to the embodiment.

FIG. 8 is a plan view of the LED lamp module in use according to an embodiment.

FIG. 9 is a cross-sectional view of an LED lamp module according to another embodiment.

Explanation of symbols

[0033] 1A LED lamp module

2 Molded resin

3 Positive electrode plate

4 Negative electrode plate

5 Ground electrode plate

6-chip LED

7 Chip resistor

11 LED compartment

12 Resistance storage

13, 14, 15 Wiring pattern

16 Connection pin insertion hole

21 Male contact Female contact switch panel brush

Claims

The scope of the claims

[1] A resin molded body in which a male contact and a female contact are integrally molded, and an LED attached to the resin molded body and electrically connected to the male contact and the female contact. The LED lamp module is characterized in that a plurality of connection pin insertion holes constituting the plurality of connection pins are formed so that a plurality of connection pins constituting the male contact can be inserted.

[2] A LED housing part having a concave shape and a wiring pattern with one end electrically connected to the male contact and the female contact are formed on the surface of the resin molded body, and the LED housed in the LED housing part 2. The LED lamp module according to claim 1, wherein the wiring pattern and the other end of the wiring pattern are electrically connected using solder or a conductive adhesive.

3. The LED lamp module according to claim 2, wherein the male contact and the wiring pattern, and the female contact and the wiring pattern are electrically connected using a conductive adhesive. .

4. The male contact and the wiring pattern, and the female contact and the wiring pattern are electrically connected via a panel brush integrally formed with the resin molded body. LED lamp module as described.

[5] The outer shape of the resin molded body is formed in a rectangular parallelepiped shape, the male contact is provided on at least one of the four side surfaces excluding the mounting surface of the LED and the back surface thereof, and the side surface other than the one side surface is provided. The LED lamp module according to claim 1, wherein the female contact is provided.