WO2006130811A3 - Electronic device manufacturing chamber and methods of forming the same - Google Patents

Electronic device manufacturing chamber and methods of forming the same Download PDF

Info

Publication number
WO2006130811A3
WO2006130811A3 PCT/US2006/021404 US2006021404W WO2006130811A3 WO 2006130811 A3 WO2006130811 A3 WO 2006130811A3 US 2006021404 W US2006021404 W US 2006021404W WO 2006130811 A3 WO2006130811 A3 WO 2006130811A3
Authority
WO
WIPO (PCT)
Prior art keywords
piece
methods
forming
electronic device
same
Prior art date
Application number
PCT/US2006/021404
Other languages
French (fr)
Other versions
WO2006130811A2 (en
Inventor
Shinichi Kurita
Wendell T Blonnigan
Makoto Inagawa
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/145,003 external-priority patent/US20060051507A1/en
Priority claimed from US11/214,475 external-priority patent/US7784164B2/en
Priority claimed from US11/366,831 external-priority patent/US20060201074A1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of WO2006130811A2 publication Critical patent/WO2006130811A2/en
Publication of WO2006130811A3 publication Critical patent/WO2006130811A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Structure Of Receivers (AREA)

Abstract

In a first aspect, a first multi-piece chamber is provided. The first multi-piece chamber includes (1) a central piece having a first side and a second side; (2) a first side piece adapted to couple with the first side of the central piece; and (3) a second side piece adapted to couple with the second side of the central piece. The central piece, the first side piece and the second side piece form a substantially cylindrical inner chamber region when coupled together. The pieces may each include openings in the top of the pieces and flat mounting surfaces for coupling the pieces together. Numerous other aspects are provided.
PCT/US2006/021404 2005-06-02 2006-06-02 Electronic device manufacturing chamber and methods of forming the same WO2006130811A2 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US11/145,003 2005-06-02
US11/145,003 US20060051507A1 (en) 2004-06-02 2005-06-02 Electronic device manufacturing chamber and methods of forming the same
US11/214,475 2005-08-29
US11/214,475 US7784164B2 (en) 2004-06-02 2005-08-29 Electronic device manufacturing chamber method
US11/366,831 2006-03-01
US11/366,831 US20060201074A1 (en) 2004-06-02 2006-03-01 Electronic device manufacturing chamber and methods of forming the same

Publications (2)

Publication Number Publication Date
WO2006130811A2 WO2006130811A2 (en) 2006-12-07
WO2006130811A3 true WO2006130811A3 (en) 2007-03-08

Family

ID=36991087

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/021404 WO2006130811A2 (en) 2005-06-02 2006-06-02 Electronic device manufacturing chamber and methods of forming the same

Country Status (1)

Country Link
WO (1) WO2006130811A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7784164B2 (en) 2004-06-02 2010-08-31 Applied Materials, Inc. Electronic device manufacturing chamber method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6216328B1 (en) * 1996-07-09 2001-04-17 Lam Research Corporation Transport chamber and method for making same
WO2004001817A1 (en) * 2002-06-21 2003-12-31 Applied Materials, Inc. Transfer chamber for vacuum processing system
US20040240983A1 (en) * 2003-06-02 2004-12-02 Jusung Engineering Co., Ltd. Transfer chamber for cluster system
US20060051507A1 (en) * 2004-06-02 2006-03-09 Applied Materials, Inc. Electronic device manufacturing chamber and methods of forming the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6216328B1 (en) * 1996-07-09 2001-04-17 Lam Research Corporation Transport chamber and method for making same
WO2004001817A1 (en) * 2002-06-21 2003-12-31 Applied Materials, Inc. Transfer chamber for vacuum processing system
US20040240983A1 (en) * 2003-06-02 2004-12-02 Jusung Engineering Co., Ltd. Transfer chamber for cluster system
US20060051507A1 (en) * 2004-06-02 2006-03-09 Applied Materials, Inc. Electronic device manufacturing chamber and methods of forming the same

Also Published As

Publication number Publication date
WO2006130811A2 (en) 2006-12-07

Similar Documents

Publication Publication Date Title
TW200618043A (en) Electronic device manufacturing chamber and methods of forming the same
USD559434S1 (en) Decorative shell
USD538100S1 (en) Microwave oven pedestal
USD520637S1 (en) Orthopedic plate
USD535252S1 (en) Charger for electronic device
USD544053S1 (en) Basketball
USD536714S1 (en) Abrasive article with holes
USD538312S1 (en) Abrasive article with holes
USD549244S1 (en) Endless track with pattern-covered surfaces
WO2007002529A3 (en) Multi-standard connection hub and method of manufacturing same
USD512229S1 (en) Bench
USD704149S1 (en) Circuit breaker component
USD585072S1 (en) Key for an input device
USD552607S1 (en) Enclosure for a radio frequency transceiver
WO2007136267A3 (en) Set of plastic eating and/or drinking aids
USD540614S1 (en) Electronic oven
USD512585S1 (en) Etagere
USD503125S1 (en) Two piece snowman mold
USD559433S1 (en) Decorative shell
EP1624130B8 (en) System with at least two structural components and manufacturing process of such a component
USD539432S1 (en) Vibrator
USD541233S1 (en) Front panel for a electronic housing
WO2006130811A3 (en) Electronic device manufacturing chamber and methods of forming the same
WO2007027909A3 (en) A needled belt with high thickness and elasticity
TW200710930A (en) Electronic device manufacturing chamber and methods of forming the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 06771914

Country of ref document: EP

Kind code of ref document: A2