WO2006122058A2 - Transient blocking apparatus with electrostatic discharge protection - Google Patents

Transient blocking apparatus with electrostatic discharge protection Download PDF

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Publication number
WO2006122058A2
WO2006122058A2 PCT/US2006/017776 US2006017776W WO2006122058A2 WO 2006122058 A2 WO2006122058 A2 WO 2006122058A2 US 2006017776 W US2006017776 W US 2006017776W WO 2006122058 A2 WO2006122058 A2 WO 2006122058A2
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WO
WIPO (PCT)
Prior art keywords
depletion mode
voltage
transient
channel device
core
Prior art date
Application number
PCT/US2006/017776
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French (fr)
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WO2006122058A3 (en
Inventor
Richard A. Harris
Original Assignee
Fultec Semiconductor, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/130,829 external-priority patent/US20060098363A1/en
Application filed by Fultec Semiconductor, Inc. filed Critical Fultec Semiconductor, Inc.
Publication of WO2006122058A2 publication Critical patent/WO2006122058A2/en
Publication of WO2006122058A3 publication Critical patent/WO2006122058A3/en

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Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02HEMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/02Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess current
    • H02H9/025Current limitation using field effect transistors

Definitions

  • This invention relates generally to a Transient Blocking Unit (TBU) provided with Electrostatic Discharge (ESD) protection and in particular with ESD mechanisms that protect a transient blocking core of the TBU.
  • TBU Transient Blocking Unit
  • ESD Electrostatic Discharge
  • Protection circuits are specialized depending on conditions and application. For example, in the case of protecting batteries or rechargeable elements from overcharging and over-discharging one can refer to circuit solutions described in U.S. Pat. Nos. 5,789,900; 6,313,610; 6,331,763; 6,518,731; 6,914,416; 6,948,078; 6,958,591 and U.S. Published Application 2001/0021092. Still other protection circuits, e.g., ones associated with power converters for IC circuits and devices that need to control device parameters and electric parameters simultaneously also use these elements. Examples can be found in U.S. Pat. Nos . 5,929,665; 6,768,623; 6,855,988; 6,861,828.
  • TBU transient blocking unit
  • ESD electrostatic discharge
  • Conventional ESD protection uses shunt semiconductor devices such as avalanche diodes and SCR structures to shunt the power generated by the ESD event to equipment ground.
  • a ground or earth pin be made available within the TBU.
  • the TBU is a series device that has no ground reference. Therefore, the ESD protection mechanism or component must be applied across the TBU, i.e., between TBU input pin and the TBU output pin.
  • the apparatus has a transient blocking core with an input, an output and at least one depletion mode n-channel device interconnected with at least one depletion mode p-channel device such that a transient alters a bias voltage V p of the p-channel device and a bias voltage V n of the n-channel device so that these devices mutually switch off to block the transient.
  • the apparatus has a high-voltage depletion mode device connected before the input or past the output of the transient blocking core.
  • An ESD protection unit is connected between the input and output to protect the transient blocking apparatus.
  • the apparatus can be uni-directional or bi-directional. In the uni-directional embodiment only one high-voltage depletion mode device is required and the transient blocking core is uni-directional . In a bi-directional embodiment of the apparatus the transient blocking core is bi-directional and the apparatus has an additional high-voltage depletion mode device. Here the high-voltage depletion mode device is connected before the input and the additional high-voltage depletion mode device is connected after the output of the transient blocking core.
  • h:Lgh-voltage depletion mode devices are metal-oxide-semiconductor field effect transistors
  • MOSFETs MOSFETs
  • the high-voltage MOSFETs are configured to switch off when the depletion mode devices in the transient blocking core mutually switch off.
  • the ESD protection unit is configured to reduce the voltage across the transient blocking core such that the core, and more specifically the depletion mode devices of the core switch back on and the core becomes conductive. When this happens, the core will bias the high- voltage MOSFETs to switch on as well.
  • the voltage at which this occurs is the rated voltage of the ESD protection unit dictated by its components.
  • the ESD protection unit may comprise a fold-back type semiconductor that has a diac structure to fulfill this functionality.
  • the ESD protection unit when used to operate in the fold-back mode to create a low impedance shunt it should have a rated voltage lower than the rated voltage of the transient blocking core.
  • the transient blocking core can be uni-directional to block only forward transients, or bi-directional to block both forward and reverse transients (transients of both polarities) .
  • the transient blocking core, the high- voltage depletion mode device or devices and the ESD protection unit are all integrated. In other words, they all reside on the same die.
  • ESD protection is achieved by providing the transient blocking core that has an input, an output and at least one depletion mode n-channel device interconnected with at least one depletion mode p- channel device such that the transient alters the bias voltage V p of the p-channel device and the bias voltage V n of the n-channel device, whereby said devices mutually switch off to block the transient.
  • a high-voltage depletion mode device is connected before the input or past the output of the transient blocking core.
  • the ESD protection unit is connected between the input and the output to protect the transient blocking apparatus.
  • the high-voltage device e.g., MOSFET, is switched off as the devices in the core mutually switch off. In the bi-directional case two high-voltage devices, e.g., MOSFETs are employed before the input and after the output of the transient blocking core and they are preferably both switched off as the devices in the core mutually switch off.
  • a certain voltage is selected above which the ESD protection unit reduces the voltage across the transient blocking core such that the core switches back on. This biases the high-voltage device to switch on as well and thus render the entire transient blocking apparatus conductive.
  • the certain voltage is the rated voltage of the ESD protection unit or its components. For proper shunting operation above the rated voltage of the ESD protection unit is selected to be lower than the rated voltage of the transient blocking core.
  • Fig. 1 is a diagram illustrating the basic principle of operation of a prior art uni-directional transient blocking unit (TBU) .
  • TBU transient blocking unit
  • Fig. 2 is a diagram illustrating the basic principle of operation of a prior art bi-directional TBU.
  • Fig. 3 is a diagram of a uni-directional transient blocking apparatus with an ESD protection unit in accordance with the invention.
  • Fig. 4 is a diagram of a bi-directional transient blocking apparatus with an ESD protection unit according to the invention.
  • TBUs transient blocking units
  • FIG. 1 shows a prior art TBU 10 for protecting a load 12 from voltage and/or current transients of one polarity, i.e., positive voltage spikes or surges. For this reason, TBU 10 is called uni-directional .
  • TBU 10 uses a depletion mode n-channel device 14 and a depletion mode p-channel device 16, both of which can be implemented by field effect transistors (FETs).
  • FETs field effect transistors
  • Devices 14, 16 are interconnected to take advantage of their n-channel and p-channel biasing and resistance properties to cause mutual switch off to block the transient.
  • devices 14, 16 have corresponding n- and p-channels 15, 17 as well as gate G, source S and drain D terminals. Resistances R n , R p of devices 14, 16 are low when voltage differences or bias voltages V gsn and V gsp between their gate G and source S terminals are zero. Normally, TBU 10 is unblocked and devices 14, 16 act as small resistors that allow a load current Ii oad to pass to load 12. Application of negative bias V gsn to n-channel device 14 and positive bias V gsp to p-channel device 16 increases resistances R n , R p , as indicated by the arrows and turns devices 14, 16 off.
  • the interconnection of devices 14, 16 source-to-source and gate-to-drain reinforces the biasing off process in response to a transient.
  • load current Ii oad increases device 16 develops a larger voltage drop across it, thus increasing negative bias V gsn applied to device 14 and consequently increasing resistance R n .
  • Higher resistance R n increases positive bias V gsp on device 16 thereby increasing R p .
  • the transient alters bias voltages V gsn and V gsp in concert such that devices 14, 16 mutually increase their resistances R n , R p and switch off and thus TBU 10 blocks the transient.
  • TBU 20 has two n- channel devices 22, 24 and one p-channel device 26. Devices 22, 24, 26 are interconnected between their gate G, source S and drain D terminals as shown. Two current limiters 28, 30 are used to ensure appropriate routing of current between devices 22, 24, 26. Current limiters 28, 30 can be diodes, resistors, transistors, current sources or combinations thereof.
  • TBU 20 causes mutual switch off of devices 22, 24, 26 in response to a negative or positive spike by employing the principles of controlling resistances by biasing in response to transients as explained above.
  • TBUs that use p-channel devices at inputs, a larger number of n-channel or p-channel devices as well as TBUs that employ high-voltage depletion devices.
  • TBUs that use p-channel devices at inputs
  • TBUs that employ high-voltage depletion devices.
  • More detailed information about prior art TBUs and associated applications and methods can be found in published literature including, in particular, PCT /AU94 / 00358 , PCT /AUO 4 / 00117 ; PCT/AU03/00175; PCT/AU03/00848 and U.S. Pat. No. 5,742,463 that are herein incorporated by reference. Additional information about the use of high-voltage depletion devices in TBUs is found in U.S. patent application 11/130,829.
  • Fig. 3 illustrates a uni-directional transient blocking apparatus 100 with an electrostatic discharge (ESD) protection unit 102 in accordance with the invention.
  • ESD protection unit 102 is of the fold-back type.
  • Apparatus has a uni-directional transient blocking core 104 with an input 106 and an output 108.
  • Core 104 is analogous in construction to a prior art uni-directional TBU as described above in reference to Fig. 1.
  • core 104 has a depletion mode n-channel device 110 interconnected with a depletion mode p-channel device 112 such that a forward transient alters a bias voltage V p of p-channel device 112 and a bias voltage V n of n-channel device 110 so that these devices mutually switch off to block the forward transient.
  • p-channel device 110 is a field effect transistor (FET) such as a PJFET and n-channel device 112 is a metal-oxide-semiconductor (MOS) such as an n-channel MOSFET.
  • FET field effect transistor
  • MOS metal-oxide-semiconductor
  • apparatus 100 has a high-voltage depletion mode device 114 connected before input 106 of core 104.
  • ESD protection unit 102 is connected between input 106 and output 108 to protect apparatus 100.
  • high- voltage depletion mode device 114 be a normally on depletion mode MOSFET.
  • high-voltage device 114 is configured to also switch off when the depletion mode devices 110, 112 in core 104 mutually switch off. This is accomplished by interconnecting gate G terminal of high- voltage device 114 between source S terminals of devices 110, 112.
  • apparatus 100 During normal operation, when no forward transient or ESD current are present, apparatus 100 is in the conducting state and thus load current Ii oad is applied to load 12.
  • load current Ii oad is applied to load 12.
  • Devices 110, 112 and high-voltage device 114 are all in the on state at this time.
  • high-voltage device 114 especially when it is embodied by a MOSFET, can handle very high ESD currents
  • core 104 senses it and reacts by blocking it in accordance with the above-described principles. Specifically, p-channel device 112 and n-channel device 110 mutually switch off in response to the forward transient. Because of its interconnection with n-channel and p-channel devices 110, 112, high-voltage device 114 is also biased to switch off as devices 110, 112 mutually switch off. Therefore, apparatus 100 is in the non-conducting or off state and thus blocks the forward transient as intended. In fact, the presence of high-voltage device 114 enhances the blocking capability of apparatus 100 to between 500 and 2,000 Volts - considerably above what core 104 would be able to block by itself.
  • high- voltage device 114 could be damaged.
  • high-voltage device 114 could begin to break down and additional voltage may develop across core 104 to damage it.
  • ESD protection unit 102 connected between input 106 and output 108 of core 104 comes into play.
  • ESD protection unit 102 is configured to reduce the voltage across core 104 such that devices 110, 112 switch back on and core 104 becomes conductive.
  • the appropriate voltage for this to occur is below the rated voltage of core 104.
  • the rated voltage of ESD protection unit 102 is selected to be lower than the rated voltage of core 104.
  • core 104 will bias high-voltage device 114 to switch on as well because of the configuration of the connections between devices 110, 112 and 114. This renders entire apparatus 100 conductive once again.
  • high-voltage device 114 can handle very large ESD currents.
  • core 104 is does not take on the very large ESD current because ESD protection unit 102 is set to divert most of the current thus effectively shunting core 104. This happens above a certain voltage that is typically selected to be the rated voltage of the ESD protection unit 102. Of course, for proper shunting operation the rated voltage of ESD protection unit 102 is selected to be lower than the rated voltage of core 104.
  • n-channel devices 126, 128 are MOSFETs and p- channel device 130 be a PJFET.
  • Devices 126, 128 and 130 are interconnected to mutually switch off in response to transients of either polarity, i.e., forward and reverse transients.
  • two current limiters 132, 134 are used to ensure appropriate routing of current between devices 126, 128, 130.
  • Current limiters 132, 134 can be diodes, resistors, transistors, current sources or combinations thereof.
  • Core 124 has an input 136 and an output 138.
  • a high-voltage depletion mode device 140 is connected before input 136.
  • An additional high-voltage depletion mode device 142 is connected after output 138 of core 124.
  • High-voltage devices 140, 142 are configured or interconnected with core 124 such that they are switched off as devices 126, 128, 130 in core 124 mutually switch off.
  • high-voltage devices 136, 138 are MOSFETs.
  • high-voltage devices 140, 142 are switched off as devices 126, 128, 130 in core 124 mutually switch off in response to forward or reverse transients.
  • ESD protection unit 122 causes devices 126, 128, 130 to switch back on.
  • high-voltage devices 140, 142 are also switched on from their off state and entire apparatus 120 becomes conductive. Fold back ESD protection unit 122 shunts core 124 to thus protect it from the large over-current.
  • high-voltage devices 140, 142 are capable of handling the larger over- current since they are on.
  • transient blocking core 124, high-voltage depletion mode devices 140, 142 and ESD protection unit 122 are all integrated. In other words, they all reside on the same die.
  • Suitable fold-back protection components for unit 122 include any typical crowbar devices such as thyristor surge suppressors or any other type of fold-back type semiconductor device.
  • unit 122 has a diac structure.
  • the apparatus and method of invention can be practiced when to protect a low voltage rated transient blocking core operating on its own.
  • the ESD protection unit can be a clamp type component such as an avalanche diode or MOV.
  • the ESD protection unit can also be a crowbar device (diac, sidac, fold-back diode) .
  • the ESD protection unit simply shunts the over-voltage and thus protects the core from damage.
  • the voltage ratings of the core and the ESD protection unit are chosen in the manner described above to satisfy these requirements.
  • Still other embodiments may use additional high-voltage circuitry and/or fast response components to speed up the operation of the apparatus to rapidly rising voltage.

Abstract

Transient blocking with electrostatic discharge (ESD) protection to be employed with a transient blocking apparatus that has a transient blocking core with an input, an output and at least one depletion mode n-channel device interconnected with at least one depletion mode p-channel device such that a transient alters a bias voltage Vp of the p-channel device and a bias voltage Vn of the n-channel device so that these devices mutually switch off to block the transient. The apparatus uses high-voltage depletion mode devices, e.g., MOSFETs, connected before the input and/or past the output of the transient blocking core in uni-directional and bi-directional embodiments, respectively. The ESD protection unit can be of the fold-back type and is connected between the input and output of the core to protect the transient blocking apparatus by causing the core to turn the high-voltage devices back on and shunting the core when dangerously high over-current conditions are produced by ESD events.

Description

Transient Blocking Apparatus with Electrostatic Discharge
Protection
FIELD OF THE INVENTION
This invention relates generally to a Transient Blocking Unit (TBU) provided with Electrostatic Discharge (ESD) protection and in particular with ESD mechanisms that protect a transient blocking core of the TBU.
BACKGROUND ART
Many circuits, networks, electrical devices and data handling systems are operated in configurations and environments where external factors can impair their performance, cause failure or even result in permanent damage. Among the most common of these factors are over- voltage, over-current and over-temperature. Protection against these factors is important and has been addressed in the prior art in a number of ways, depending on the specific electronics and their application.
Protection circuits are specialized depending on conditions and application. For example, in the case of protecting batteries or rechargeable elements from overcharging and over-discharging one can refer to circuit solutions described in U.S. Pat. Nos. 5,789,900; 6,313,610; 6,331,763; 6,518,731; 6,914,416; 6,948,078; 6,958,591 and U.S. Published Application 2001/0021092. Still other protection circuits, e.g., ones associated with power converters for IC circuits and devices that need to control device parameters and electric parameters simultaneously also use these elements. Examples can be found in U.S. Pat. Nos . 5,929,665; 6,768,623; 6,855,988; 6,861,828.
When providing protection for very sensitive circuits, such as those encountered in telecommunications, the performance parameters of the fuses and protection circuits are frequently insufficient. A prior art solution, commonly referred to as a transient blocking unit (TBU) , satisfies a number of the constraints and is taught in international publications PCT/AU94/00358; PCT/AU04/00117 ; PCT/AU03/00175; PCT/AU03/00848 as well as U.S. Pat. Nos. 4,533,970; 5,742,463 and related literature cited in these references.
There are specific instances where a TBU of the type mentioned above requires electrostatic discharge (ESD) protection. Conventional ESD protection uses shunt semiconductor devices such as avalanche diodes and SCR structures to shunt the power generated by the ESD event to equipment ground. To apply this technique in protecting the TBU requires that a ground or earth pin be made available within the TBU. However, the TBU is a series device that has no ground reference. Therefore, the ESD protection mechanism or component must be applied across the TBU, i.e., between TBU input pin and the TBU output pin.
TBU components have high blocking voltages and thus, to work effectively, the ESD protection of the TBU needs to have a rated voltage above the TBU rated blocking voltage but below the TBU maximum voltage that causes irreparable harm to the TBU. This requirement places a large number of constraints on the rating of the TBU. ESD shunt components can be manufactured efficiently with a tolerance of 10% or greater. Therefore, the maximum protection rating that can be applied to the TBU is 100%-10%=90% of the maximum rating of the TBU. This is a significant reduction in the overall blocking rating of .the resultant TBU.
In addition, the ESD protection must be made with a high protection voltage. High protection voltages increase exponentially the die size and cost of the ESD device due to a non-linear increase in the power-handling requirement of the die. Clearly, it would be an advance in the art to overcome these limitations affecting ESD protection for the TBU.
OBJECTS AND ADVANTAGES
In view of the above prior art limitations, it is an object of the invention to provide ESD protection for the TBU that does not negatively affect thee overall blocking rating of the TBU.
It is another object of the invention to provide ESD protection that can be efficiently integrated with the TBU and does not exponentially increase the die size.
These and other objects and advantages of the invention will become apparent from the ensuing description.
SUMMARY OF THE INVENTION The objects and advantages of the invention are addressed by a transient blocking apparatus with electrostatic discharge (ESD) protection. The apparatus has a transient blocking core with an input, an output and at least one depletion mode n-channel device interconnected with at least one depletion mode p-channel device such that a transient alters a bias voltage Vp of the p-channel device and a bias voltage Vn of the n-channel device so that these devices mutually switch off to block the transient. Further, the apparatus has a high-voltage depletion mode device connected before the input or past the output of the transient blocking core. An ESD protection unit is connected between the input and output to protect the transient blocking apparatus.
The apparatus can be uni-directional or bi-directional. In the uni-directional embodiment only one high-voltage depletion mode device is required and the transient blocking core is uni-directional . In a bi-directional embodiment of the apparatus the transient blocking core is bi-directional and the apparatus has an additional high-voltage depletion mode device. Here the high-voltage depletion mode device is connected before the input and the additional high-voltage depletion mode device is connected after the output of the transient blocking core.
It is preferred that the h:Lgh-voltage depletion mode devices are metal-oxide-semiconductor field effect transistors
(MOSFETs) . Furthermore, at least one and preferably both of the high-voltage MOSFETs are configured to switch off when the depletion mode devices in the transient blocking core mutually switch off.
Above a certain voltage the ESD protection unit is configured to reduce the voltage across the transient blocking core such that the core, and more specifically the depletion mode devices of the core switch back on and the core becomes conductive. When this happens, the core will bias the high- voltage MOSFETs to switch on as well. Typically, the voltage at which this occurs is the rated voltage of the ESD protection unit dictated by its components. Among other options, the ESD protection unit may comprise a fold-back type semiconductor that has a diac structure to fulfill this functionality. Furthermore, when the ESD protection unit is used to operate in the fold-back mode to create a low impedance shunt it should have a rated voltage lower than the rated voltage of the transient blocking core.
There are many ways in which an apparatus according to the invention can be implemented. For example, the transient blocking core can be uni-directional to block only forward transients, or bi-directional to block both forward and reverse transients (transients of both polarities) . In the preferred embodiment, the transient blocking core, the high- voltage depletion mode device or devices and the ESD protection unit are all integrated. In other words, they all reside on the same die.
According to the method of invention, ESD protection is achieved by providing the transient blocking core that has an input, an output and at least one depletion mode n-channel device interconnected with at least one depletion mode p- channel device such that the transient alters the bias voltage Vp of the p-channel device and the bias voltage Vn of the n-channel device, whereby said devices mutually switch off to block the transient. A high-voltage depletion mode device is connected before the input or past the output of the transient blocking core. The ESD protection unit is connected between the input and the output to protect the transient blocking apparatus. The high-voltage device, e.g., MOSFET, is switched off as the devices in the core mutually switch off. In the bi-directional case two high-voltage devices, e.g., MOSFETs are employed before the input and after the output of the transient blocking core and they are preferably both switched off as the devices in the core mutually switch off.
In the preferred embodiment a certain voltage is selected above which the ESD protection unit reduces the voltage across the transient blocking core such that the core switches back on. This biases the high-voltage device to switch on as well and thus render the entire transient blocking apparatus conductive. In the case of a typical ESD protection unit, the certain voltage is the rated voltage of the ESD protection unit or its components. For proper shunting operation above the rated voltage of the ESD protection unit is selected to be lower than the rated voltage of the transient blocking core.
A detailed description of the preferred embodiments of the invention is presented below in reference to the appended drawing figures.
BRIEF DESCRIPTION OF THE DRAWING FIGURES
Fig. 1 is a diagram illustrating the basic principle of operation of a prior art uni-directional transient blocking unit (TBU) .
Fig. 2 is a diagram illustrating the basic principle of operation of a prior art bi-directional TBU. Fig. 3 is a diagram of a uni-directional transient blocking apparatus with an ESD protection unit in accordance with the invention.
Fig. 4 is a diagram of a bi-directional transient blocking apparatus with an ESD protection unit according to the invention.
DETAILED DESCRIPTION
The present invention and its principles will be best understood by first reviewing prior art uni-directional and bi-directional transient blocking units (TBUs) designed for over-voltage and over-current protection. The diagram in Fig. 1 shows a prior art TBU 10 for protecting a load 12 from voltage and/or current transients of one polarity, i.e., positive voltage spikes or surges. For this reason, TBU 10 is called uni-directional . TBU 10 uses a depletion mode n-channel device 14 and a depletion mode p-channel device 16, both of which can be implemented by field effect transistors (FETs). Devices 14, 16 are interconnected to take advantage of their n-channel and p-channel biasing and resistance properties to cause mutual switch off to block the transient.
More specifically, devices 14, 16 have corresponding n- and p-channels 15, 17 as well as gate G, source S and drain D terminals. Resistances Rn, Rp of devices 14, 16 are low when voltage differences or bias voltages Vgsn and Vgsp between their gate G and source S terminals are zero. Normally, TBU 10 is unblocked and devices 14, 16 act as small resistors that allow a load current Iioad to pass to load 12. Application of negative bias Vgsn to n-channel device 14 and positive bias Vgsp to p-channel device 16 increases resistances Rn, Rp, as indicated by the arrows and turns devices 14, 16 off. The interconnection of devices 14, 16 source-to-source and gate-to-drain reinforces the biasing off process in response to a transient. Specifically, as load current Iioad increases device 16 develops a larger voltage drop across it, thus increasing negative bias Vgsn applied to device 14 and consequently increasing resistance Rn. Higher resistance Rn increases positive bias Vgsp on device 16 thereby increasing Rp. Thus, the transient alters bias voltages Vgsn and Vgsp in concert such that devices 14, 16 mutually increase their resistances Rn, Rp and switch off and thus TBU 10 blocks the transient.
The above principle of interconnection of n- and p-channel devices to achieve mutual switch off (sometimes also referred to as mutual pinch-off) is extended to bidirectional TBUs by using two uni-directional TBUs with one configured in reverse to block negative spikes. A simpler, bi-directional TBU 20 that protects load 12 from negative and positive spikes, is shown in Fig. 2. TBU 20 has two n- channel devices 22, 24 and one p-channel device 26. Devices 22, 24, 26 are interconnected between their gate G, source S and drain D terminals as shown. Two current limiters 28, 30 are used to ensure appropriate routing of current between devices 22, 24, 26. Current limiters 28, 30 can be diodes, resistors, transistors, current sources or combinations thereof. TBU 20 causes mutual switch off of devices 22, 24, 26 in response to a negative or positive spike by employing the principles of controlling resistances by biasing in response to transients as explained above.
In fact, the prior art teaches a number of variants of TBUs based on the above principles. These include, among other, TBUs that use p-channel devices at inputs, a larger number of n-channel or p-channel devices as well as TBUs that employ high-voltage depletion devices. More detailed information about prior art TBUs and associated applications and methods can be found in published literature including, in particular, PCT /AU94 / 00358 , PCT /AUO 4 / 00117 ; PCT/AU03/00175; PCT/AU03/00848 and U.S. Pat. No. 5,742,463 that are herein incorporated by reference. Additional information about the use of high-voltage depletion devices in TBUs is found in U.S. patent application 11/130,829.
Fig. 3 illustrates a uni-directional transient blocking apparatus 100 with an electrostatic discharge (ESD) protection unit 102 in accordance with the invention. ESD protection unit 102 is of the fold-back type. Apparatus has a uni-directional transient blocking core 104 with an input 106 and an output 108. Core 104 is analogous in construction to a prior art uni-directional TBU as described above in reference to Fig. 1. Accordingly, core 104 has a depletion mode n-channel device 110 interconnected with a depletion mode p-channel device 112 such that a forward transient alters a bias voltage Vp of p-channel device 112 and a bias voltage Vn of n-channel device 110 so that these devices mutually switch off to block the forward transient. Preferably, p-channel device 110 is a field effect transistor (FET) such as a PJFET and n-channel device 112 is a metal-oxide-semiconductor (MOS) such as an n-channel MOSFET.
Further, apparatus 100 has a high-voltage depletion mode device 114 connected before input 106 of core 104. ESD protection unit 102 is connected between input 106 and output 108 to protect apparatus 100. It is preferred that high- voltage depletion mode device 114 be a normally on depletion mode MOSFET. Furthermore, high-voltage device 114 is configured to also switch off when the depletion mode devices 110, 112 in core 104 mutually switch off. This is accomplished by interconnecting gate G terminal of high- voltage device 114 between source S terminals of devices 110, 112.
During normal operation, when no forward transient or ESD current are present, apparatus 100 is in the conducting state and thus load current Iioad is applied to load 12. Devices 110, 112 and high-voltage device 114 are all in the on state at this time. We note that high-voltage device 114, especially when it is embodied by a MOSFET, can handle very high ESD currents
(drain D to source S) . In the off state, however, high- voltage device 114 is quite sensitive to damage by ESD voltages .
Now, during a forward transient core 104 senses it and reacts by blocking it in accordance with the above-described principles. Specifically, p-channel device 112 and n-channel device 110 mutually switch off in response to the forward transient. Because of its interconnection with n-channel and p-channel devices 110, 112, high-voltage device 114 is also biased to switch off as devices 110, 112 mutually switch off. Therefore, apparatus 100 is in the non-conducting or off state and thus blocks the forward transient as intended. In fact, the presence of high-voltage device 114 enhances the blocking capability of apparatus 100 to between 500 and 2,000 Volts - considerably above what core 104 would be able to block by itself.
However, if the forward transient is due to an ESD event that takes on the form of a fast rising over-voltage then high- voltage device 114 could be damaged. In particular, as the ESD voltage goes over the maximum blocking level of apparatus 100, high-voltage device 114 could begin to break down and additional voltage may develop across core 104 to damage it. An artisan skilled in the art will be able to ensure that this outcome (where the additional voltage develops across core 104) will only occur during fast rising ESD events and not during the more manageable slow rising transient events of lightning or power faults. At this point, ESD protection unit 102 connected between input 106 and output 108 of core 104 comes into play. That is because above a certain voltage, ESD protection unit 102 is configured to reduce the voltage across core 104 such that devices 110, 112 switch back on and core 104 becomes conductive. The appropriate voltage for this to occur is below the rated voltage of core 104. In other words, the rated voltage of ESD protection unit 102 is selected to be lower than the rated voltage of core 104.
Once devices 110 and 112 become unblocked and core 104 switches back on, then core 104 will bias high-voltage device 114 to switch on as well because of the configuration of the connections between devices 110, 112 and 114. This renders entire apparatus 100 conductive once again. Of course, in the on state high-voltage device 114 can handle very large ESD currents.
Meanwhile, core 104 is does not take on the very large ESD current because ESD protection unit 102 is set to divert most of the current thus effectively shunting core 104. This happens above a certain voltage that is typically selected to be the rated voltage of the ESD protection unit 102. Of course, for proper shunting operation the rated voltage of ESD protection unit 102 is selected to be lower than the rated voltage of core 104.
In most applications the transients or ESD events can produce large forward or reverse currents. Therefore, it is preferable that the invention be implemented in a bidirectional apparatus. An exemplary bi-directional transient blocking apparatus 120 with a fold-back type ESD protection unit 122 is shown in Fig. 4. Apparatus 120 has a transient blocking core 124 that is bi-directional. For this reason, core 124 has two depletion mode n-channel devices 126, 128 and a depletion mode p-channel device 130. Again, it is preferable that n-channel devices 126, 128 be MOSFETs and p- channel device 130 be a PJFET. Devices 126, 128 and 130 are interconnected to mutually switch off in response to transients of either polarity, i.e., forward and reverse transients. In addition, two current limiters 132, 134 are used to ensure appropriate routing of current between devices 126, 128, 130. Current limiters 132, 134 can be diodes, resistors, transistors, current sources or combinations thereof.
Core 124 has an input 136 and an output 138. A high-voltage depletion mode device 140 is connected before input 136. An additional high-voltage depletion mode device 142 is connected after output 138 of core 124. High-voltage devices 140, 142 are configured or interconnected with core 124 such that they are switched off as devices 126, 128, 130 in core 124 mutually switch off. Preferably, high-voltage devices 136, 138 are MOSFETs.
During operation, high-voltage devices 140, 142 are switched off as devices 126, 128, 130 in core 124 mutually switch off in response to forward or reverse transients. In the event of an ESD event that produces a large over-current of either polarity, ESD protection unit 122 causes devices 126, 128, 130 to switch back on. As a result of the interconnections, high-voltage devices 140, 142 are also switched on from their off state and entire apparatus 120 becomes conductive. Fold back ESD protection unit 122 shunts core 124 to thus protect it from the large over-current. Meanwhile, high-voltage devices 140, 142 are capable of handling the larger over- current since they are on.
In the preferred embodiment, transient blocking core 124, high-voltage depletion mode devices 140, 142 and ESD protection unit 122 are all integrated. In other words, they all reside on the same die. Suitable fold-back protection components for unit 122 include any typical crowbar devices such as thyristor surge suppressors or any other type of fold-back type semiconductor device. In a preferred embodiment unit 122 has a diac structure.
Many other embodiments of the apparatus and method are possible. For example, although in the preferred embodiment described above the apparatus uses on or more high-voltage devices before the input or after the output to its core, the apparatus and method of invention can be practiced when to protect a low voltage rated transient blocking core operating on its own. In such case fold-back of the device is not need and the ESD protection unit can be a clamp type component such as an avalanche diode or MOV. Of course, the ESD protection unit can also be a crowbar device (diac, sidac, fold-back diode) . In those embodiments the ESD protection unit simply shunts the over-voltage and thus protects the core from damage. The voltage ratings of the core and the ESD protection unit are chosen in the manner described above to satisfy these requirements.
Still other embodiments may use additional high-voltage circuitry and/or fast response components to speed up the operation of the apparatus to rapidly rising voltage. Given all these additional possibilities, the scope of the invention should be judged by the appended claims and their legal equivalents.

Claims

We claim:
1. A transient blocking apparatus with electrostatic discharge protection, said transient blocking apparatus comprising: a) a transient blocking core having an input, an output and at least one depletion mode n-channel device interconnected with at least one depletion mode p- channel device such that a transient alters a bias voltage Vp of said depletion mode p-channel device and a bias voltage Vn of said depletion mode n- channel device, whereby said depletion mode p-channel device and said depletion mode n-channel device mutually switch off to block said transient; b) a high-voltage depletion mode device connected before said input or past said output; c) an electrostatic discharge protection unit connected between said input and said output to protect said transient blocking apparatus.
2. The apparatus of claim 1, wherein said high-voltage depletion mode device comprises a normally on depletion mode MOSFET.
3. The apparatus of claim 1, wherein said high-voltage depletion mode device is interconnected to switch off when said depletion mode p-channel device and said depletion mode n-channel device mutually switch off.
4. The apparatus of claim 3, wherein above a predetermined voltage said electrostatic discharge protection unit reduces a voltage across said transient blocking core such that said transient blocking core switches on and biases said high-voltage depletion mode device to switch on.
5. The apparatus of claim 4, wherein said predetermined voltage corresponds to a rated voltage of said electrostatic discharge protection unit.
6. The apparatus of claim 1, wherein said electrostatic discharge protection unit comprises a fold-back type semiconductor.
7. The apparatus of claim 6, wherein said fold-back type semiconductor comprises a diac structure.
8. The apparatus of claim 1, wherein said electrostatic discharge protection unit has a rated voltage lower than the rated voltage of said transient blocking core .
9. The apparatus of claim 1, wherein said transient blocking core, said high-voltage depletion mode • device and said electrostatic discharge protection unit are integrated.
10. The apparatus of claim 1, wherein said transient blocking core is bi-directional, said high-voltage depletion mode device is connected before said input and an additional high-voltage depletion mode device is connected after said output.
11. The apparatus of claim 1, wherein said transient blocking core is uni-directional .
12. A method for electrostatic discharge protection comprising: a) providing a transient blocking core having an input, an output and at least one depletion mode n-channel device interconnected with at least one depletion mode p-channel device such that a transient alters a bias voltage Vp of said depletion mode p-channel device and a bias voltage Vn of said depletion mode n-channel device, whereby said depletion mode p- channel device and said depletion mode n-channel device mutually switch off to block said transient; b) connecting a high-voltage depletion mode device before said input or after said output; c) connecting an electrostatic discharge protection unit between said input and said output to protect said transient blocking apparatus.
13. The method of claim 12, further comprising biasing said high-voltage depletion mode device to be switched off by said transient blocking core as said depletion mode p-channel device and said depletion mode n-channel device mutually switch off.
14. The method of claim 13, further comprising selecting a predetermined voltage above which said electrostatic discharge protection unit reduces a voltage across said transient blocking core such that said transient blocking core switches on and biases said high-voltage depletion mode device to switch on.
15. The method of claim 14, wherein said predetermined voltage corresponds to a rated voltage of said electrostatic discharge protection unit.
16. The method of claim 12, further comprising selecting a rated voltage of said electrostatic discharge protection unit to be lower than the rated voltage of said transient blocking core.
17. A transient blocking apparatus with electrostatic discharge protection, said transient blocking apparatus comprising: a) a transient blocking core having an input, an output and at least one depletion mode n-channel device interconnected with at least one depletion mode p- channel device such that a transient alters a bias voltage Vp of said depletion mode p-channel device and a bias voltage Vn of said depletion mode n- channel device, whereby said depletion mode p-channel device and said depletion mode n-channel device mutually switch off to block said transient; and b) an electrostatic discharge protection unit connected between said input and said output to protect said transient blocking apparatus.
18. The apparatus of claim 17, wherein said electrostatic discharge protection unit comprises a clamp type component .
19. The apparatus of claim 1, wherein said electrostatic discharge protection unit has a rated voltage lower than the rated voltage of said transient blocking core.
PCT/US2006/017776 2005-05-06 2006-05-05 Transient blocking apparatus with electrostatic discharge protection WO2006122058A2 (en)

Applications Claiming Priority (4)

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US67863205P 2005-05-06 2005-05-06
US60/678,632 2005-05-06
US11/130,829 US20060098363A1 (en) 2004-11-09 2005-05-17 Integrated transient blocking unit compatible with very high voltages
US11/130,829 2005-05-17

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WO2017213841A1 (en) * 2016-06-10 2017-12-14 Littelfuse, Inc. Transient suppressing circuit arrangements

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US6714393B2 (en) * 2002-01-07 2004-03-30 Simmonds Precision Products, Inc. Transient suppression apparatus for potentially explosive environments
US20050128669A1 (en) * 2002-02-12 2005-06-16 Harris Richard A. Protection device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017213841A1 (en) * 2016-06-10 2017-12-14 Littelfuse, Inc. Transient suppressing circuit arrangements

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