WO2006115410A3 - Die assembly and/or stamper - Google Patents
Die assembly and/or stamper Download PDFInfo
- Publication number
- WO2006115410A3 WO2006115410A3 PCT/NL2006/050080 NL2006050080W WO2006115410A3 WO 2006115410 A3 WO2006115410 A3 WO 2006115410A3 NL 2006050080 W NL2006050080 W NL 2006050080W WO 2006115410 A3 WO2006115410 A3 WO 2006115410A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- parts
- stamper
- disc
- die assembly
- way
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
- B29C45/2632—Stampers; Mountings thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
- B29C2045/2661—The thickness of the mould cavity being changeable in radial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Die assembly and stamper possibly in combination. This is used in particular for the manufacture of disc-shaped data carriers. To prevent the end edge of a data carrier manufactured in this way from having a greater thickness than the central part, it is proposed either to make one of the die parts of the die assembly facing the mould cavity thicker or to make the stamper used near the edge boundary which is of annular design thicker. Compensation will then automatically be made for differences in thickness. Injection-moulded parts obtained in this way are particularly suitable for producing optical data carriers made up of two disc parts or disc parts that are provided with a thin spin-coated layer or disc parts to which a thin foil has been bonded.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1028737A NL1028737C2 (en) | 2005-04-11 | 2005-04-11 | Mold assembly and / or stamper. |
NL1028737 | 2005-04-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006115410A2 WO2006115410A2 (en) | 2006-11-02 |
WO2006115410A3 true WO2006115410A3 (en) | 2007-05-10 |
Family
ID=35432006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/NL2006/050080 WO2006115410A2 (en) | 2005-04-11 | 2006-04-11 | Die assembly and/or stamper |
Country Status (2)
Country | Link |
---|---|
NL (1) | NL1028737C2 (en) |
WO (1) | WO2006115410A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3831589B1 (en) * | 2018-07-31 | 2024-03-27 | Kobayashi Industry Co., Ltd. | Powder molding apparatus, powder molding die, and method for preparing powder molded body |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01285321A (en) * | 1988-05-12 | 1989-11-16 | Nec Corp | Injection mold |
JPH02134219A (en) * | 1988-11-15 | 1990-05-23 | Sekisui Chem Co Ltd | Molding die of substrate for data recording medium |
JPH0438635A (en) * | 1990-05-31 | 1992-02-07 | Sony Corp | Disk substrate for optical disk and stamper for molding disk substrate |
EP0803339A1 (en) * | 1996-04-26 | 1997-10-29 | Sony Corporation | Optical disc moulding device and moulding method for optical disc |
JPH09295319A (en) * | 1996-05-01 | 1997-11-18 | Sony Corp | Mold for molding disk substrate |
JP2000263615A (en) * | 1999-03-12 | 2000-09-26 | Ricoh Co Ltd | Mold for optical information recording medium substrate |
JP2000268410A (en) * | 1999-03-15 | 2000-09-29 | Sony Disc Technology:Kk | Disk substrate and metal mold for molding the same and molding device therefor |
JP2000311397A (en) * | 1999-04-28 | 2000-11-07 | Sony Corp | Metal mold for molding substrate and production of substrate |
WO2000074919A1 (en) * | 1999-06-07 | 2000-12-14 | Imation Corp. | Optical disk mold tooling for reduced edge wedge |
US20030043731A1 (en) * | 2001-09-04 | 2003-03-06 | Imation Corp. | Variable thickness stamper for creation of flat molded substrates |
-
2005
- 2005-04-11 NL NL1028737A patent/NL1028737C2/en not_active IP Right Cessation
-
2006
- 2006-04-11 WO PCT/NL2006/050080 patent/WO2006115410A2/en active Application Filing
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01285321A (en) * | 1988-05-12 | 1989-11-16 | Nec Corp | Injection mold |
JPH02134219A (en) * | 1988-11-15 | 1990-05-23 | Sekisui Chem Co Ltd | Molding die of substrate for data recording medium |
JPH0438635A (en) * | 1990-05-31 | 1992-02-07 | Sony Corp | Disk substrate for optical disk and stamper for molding disk substrate |
EP0803339A1 (en) * | 1996-04-26 | 1997-10-29 | Sony Corporation | Optical disc moulding device and moulding method for optical disc |
JPH09295319A (en) * | 1996-05-01 | 1997-11-18 | Sony Corp | Mold for molding disk substrate |
JP2000263615A (en) * | 1999-03-12 | 2000-09-26 | Ricoh Co Ltd | Mold for optical information recording medium substrate |
JP2000268410A (en) * | 1999-03-15 | 2000-09-29 | Sony Disc Technology:Kk | Disk substrate and metal mold for molding the same and molding device therefor |
JP2000311397A (en) * | 1999-04-28 | 2000-11-07 | Sony Corp | Metal mold for molding substrate and production of substrate |
WO2000074919A1 (en) * | 1999-06-07 | 2000-12-14 | Imation Corp. | Optical disk mold tooling for reduced edge wedge |
US20030043731A1 (en) * | 2001-09-04 | 2003-03-06 | Imation Corp. | Variable thickness stamper for creation of flat molded substrates |
Non-Patent Citations (9)
Title |
---|
DATABASE WPI Section Ch Week 199027, Derwent World Patents Index; Class A32, AN 1990-204405, XP002360852 * |
DATABASE WPI Section Ch Week 199805, Derwent World Patents Index; Class A32, AN 1998-046340, XP002146219 * |
DATABASE WPI Section Ch Week 200108, Derwent World Patents Index; Class A32, AN 2001-064996, XP002360851 * |
PATENT ABSTRACTS OF JAPAN vol. 014, no. 058 (M - 0930) 2 February 1990 (1990-02-02) * |
PATENT ABSTRACTS OF JAPAN vol. 014, no. 373 (M - 1009) 13 August 1990 (1990-08-13) * |
PATENT ABSTRACTS OF JAPAN vol. 016, no. 211 (P - 1355) 19 May 1992 (1992-05-19) * |
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 03 27 February 1998 (1998-02-27) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 12 3 January 2001 (2001-01-03) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 14 5 March 2001 (2001-03-05) * |
Also Published As
Publication number | Publication date |
---|---|
NL1028737C2 (en) | 2006-10-12 |
WO2006115410A2 (en) | 2006-11-02 |
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