WO2006114228A3 - Verfahren und vorrichtung zum beschichten von substraten - Google Patents

Verfahren und vorrichtung zum beschichten von substraten Download PDF

Info

Publication number
WO2006114228A3
WO2006114228A3 PCT/EP2006/003593 EP2006003593W WO2006114228A3 WO 2006114228 A3 WO2006114228 A3 WO 2006114228A3 EP 2006003593 W EP2006003593 W EP 2006003593W WO 2006114228 A3 WO2006114228 A3 WO 2006114228A3
Authority
WO
WIPO (PCT)
Prior art keywords
target
coating substrates
determined
magnet system
spraying
Prior art date
Application number
PCT/EP2006/003593
Other languages
English (en)
French (fr)
Other versions
WO2006114228A2 (de
Inventor
Christian Weindel
Waldemar Lukhaub
Larisa Pacearescu
Siegmar Rudakowski
Original Assignee
Steag Hamatech Ag
Christian Weindel
Waldemar Lukhaub
Larisa Pacearescu
Siegmar Rudakowski
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Hamatech Ag, Christian Weindel, Waldemar Lukhaub, Larisa Pacearescu, Siegmar Rudakowski filed Critical Steag Hamatech Ag
Priority to AT06742611T priority Critical patent/ATE437251T1/de
Priority to DE502006004307T priority patent/DE502006004307D1/de
Priority to EP06742611A priority patent/EP1874977B8/de
Publication of WO2006114228A2 publication Critical patent/WO2006114228A2/de
Publication of WO2006114228A3 publication Critical patent/WO2006114228A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3476—Testing and control
    • H01J37/3482—Detecting or avoiding eroding through

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Catalysts (AREA)
  • Spray Control Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

Verfahren zum Beschichten von Substraten, bei dem das Substrat durch eine Magnetron-Zerstaubungsprozess mit einem zu zerstaubenden Target und einem rotierenden Magnetsystem beschichtet wird, dadurch gekennzeichnet, dass ein Zerstaubungszustand des Targets ermittelt wird, und die Rotationsgeschwindigkeit des Magnetsystems in Abhangigkeit von dem ermittelten Zersaubungszustand des Targets gesteuert wird.
PCT/EP2006/003593 2005-04-25 2006-04-20 Verfahren und vorrichtung zum beschichten von substraten WO2006114228A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AT06742611T ATE437251T1 (de) 2005-04-25 2006-04-20 Verfahren und vorrichtung zum beschichten von substraten
DE502006004307T DE502006004307D1 (de) 2005-04-25 2006-04-20 Verfahren und vorrichtung zum beschichten von substraten
EP06742611A EP1874977B8 (de) 2005-04-25 2006-04-20 Verfahren und vorrichtung zum beschichten von substraten

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005019101.0 2005-04-25
DE102005019101A DE102005019101A1 (de) 2005-04-25 2005-04-25 Verfahren und Vorrichtung zum Beschichten von Substraten

Publications (2)

Publication Number Publication Date
WO2006114228A2 WO2006114228A2 (de) 2006-11-02
WO2006114228A3 true WO2006114228A3 (de) 2007-04-19

Family

ID=37057157

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/003593 WO2006114228A2 (de) 2005-04-25 2006-04-20 Verfahren und vorrichtung zum beschichten von substraten

Country Status (5)

Country Link
EP (1) EP1874977B8 (de)
AT (1) ATE437251T1 (de)
DE (2) DE102005019101A1 (de)
TW (1) TW200726852A (de)
WO (1) WO2006114228A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013100382B4 (de) * 2013-01-15 2019-12-05 VON ARDENNE Asset GmbH & Co. KG Magnetronanordnung
US9328410B2 (en) 2013-10-25 2016-05-03 First Solar, Inc. Physical vapor deposition tile arrangement and physical vapor deposition arrangement
US10168459B2 (en) * 2016-11-30 2019-01-01 Viavi Solutions Inc. Silicon-germanium based optical filter
KR102420329B1 (ko) * 2018-02-13 2022-07-14 한국알박(주) 마그네트론 스퍼터링 장치의 자석 집합체

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10130833A (ja) * 1996-11-01 1998-05-19 Anelva Corp スパッタリング装置
WO1999027758A1 (en) * 1997-11-20 1999-06-03 Barankova Hana Plasma processing apparatus having rotating magnets
WO2005121392A1 (ja) * 2004-06-14 2005-12-22 Shibaura Mechatronics Corporation スパッタリング装置及び方法並びにスパッタリング制御用プログラム
WO2006019981A2 (en) * 2004-07-16 2006-02-23 Dexter Magnetic Technologies, Inc. Sputtering magnetron control devices

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4995958A (en) * 1989-05-22 1991-02-26 Varian Associates, Inc. Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile
DE4107505A1 (de) * 1991-03-08 1992-09-10 Leybold Ag Verfahren zum betrieb einer sputteranlage und vorrichtung zur durchfuehrung des verfahrens
US5194131A (en) * 1991-08-16 1993-03-16 Varian Associates, Inc. Apparatus and method for multiple ring sputtering from a single target
US5248402A (en) * 1992-07-29 1993-09-28 Cvc Products, Inc. Apple-shaped magnetron for sputtering system
EP1215302A4 (de) * 1999-07-06 2007-11-07 Applied Materials Inc Zerstäubungsvorrichtung und filmherstellungsverfahren
US6440282B1 (en) * 1999-07-06 2002-08-27 Applied Materials, Inc. Sputtering reactor and method of using an unbalanced magnetron

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10130833A (ja) * 1996-11-01 1998-05-19 Anelva Corp スパッタリング装置
WO1999027758A1 (en) * 1997-11-20 1999-06-03 Barankova Hana Plasma processing apparatus having rotating magnets
WO2005121392A1 (ja) * 2004-06-14 2005-12-22 Shibaura Mechatronics Corporation スパッタリング装置及び方法並びにスパッタリング制御用プログラム
JP2005350751A (ja) * 2004-06-14 2005-12-22 Shibaura Mechatronics Corp スパッタリング装置及び方法並びにスパッタリング制御用プログラム
WO2006019981A2 (en) * 2004-07-16 2006-02-23 Dexter Magnetic Technologies, Inc. Sputtering magnetron control devices

Also Published As

Publication number Publication date
EP1874977B8 (de) 2009-10-07
EP1874977B1 (de) 2009-07-22
DE502006004307D1 (de) 2009-09-03
WO2006114228A2 (de) 2006-11-02
DE102005019101A1 (de) 2006-10-26
EP1874977A2 (de) 2008-01-09
ATE437251T1 (de) 2009-08-15
TW200726852A (en) 2007-07-16

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