WO2006105346A2 - Systeme plafonnier intensif de petites dimensions - Google Patents

Systeme plafonnier intensif de petites dimensions Download PDF

Info

Publication number
WO2006105346A2
WO2006105346A2 PCT/US2006/011771 US2006011771W WO2006105346A2 WO 2006105346 A2 WO2006105346 A2 WO 2006105346A2 US 2006011771 W US2006011771 W US 2006011771W WO 2006105346 A2 WO2006105346 A2 WO 2006105346A2
Authority
WO
WIPO (PCT)
Prior art keywords
light
light emitting
lens
disposed
substrate
Prior art date
Application number
PCT/US2006/011771
Other languages
English (en)
Other versions
WO2006105346A3 (fr
Inventor
Stephen G. Johnson
Original Assignee
Integrated Lighting Solutions Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integrated Lighting Solutions Llc filed Critical Integrated Lighting Solutions Llc
Publication of WO2006105346A2 publication Critical patent/WO2006105346A2/fr
Publication of WO2006105346A3 publication Critical patent/WO2006105346A3/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • This invention is directed to a downlight system, in particular a downlight system making use of light emitting diodes (LEDs) to produce light in a smaller form factor.
  • LEDs light emitting diodes
  • Downlights 100 are luminaires and include housings 102 having sufficient height that they are recessed into ceilings 106 and project light in the downward direction of arrow A towards the floor.
  • Downlights 100 currently use a number of different lamp types 104, as is known in the art; namely incandescent, halogen, compact fluorescent and metal halide light sources. All prior downlights have a common construction utilizing a single light source, or in some cases, compact fluorescent luminaires utilize two light sources, whose emitted radiation is focused downward by a reflecting element, either within the housing 102 or within the bulb 104.
  • ceiling lights are desired to be flush with ceiling 106. Accordingly, because of the space requirement of housing 102, housing 102 projects up into ceiling 106 when luminaire 100 is flush with ceiling 106 requiring a space of many inches above the ceiling to accommodate the
  • the electrical connection is made to the luminaires made in the space above ceiling 106.
  • the efficiency of these luminaires varies, depending greatly on the reflective element.
  • the conventional sources emit light in a spherical pattern, 4pi steradians, requiring the reflector design to refocus the light emitted thereon, in the direction of Arrow A through fixture opening 108.
  • These luminaires have been satisfactory, however, they are large, cumbersome, and highly energy inefficient.
  • a downlight system includes a substrate.
  • One or more light emitting diodes are disposed on a surface of the substrate for emitting light in a single direction.
  • a respective primary optic for providing a substantially even color of light is optically coupled to a respective one of each of said one or more light emitting diodes.
  • each of the light emitting diodes is formed as a die- package, the primary optics including a lens, the lens being matched to minimize the refractive index as a function of the angle of the emissive distribution of light from the LED.
  • the primary optics includes a phosphor layer.
  • the primary optics includes a high refractive encapsulant material within the die-package.
  • the substrate may be formed of thermally conductive material to act as a heat sink.
  • a trim ring is disposed about the substrate. The trim ring provides both aesthetic attributes and function. In one embodiment, the trim ring is formed of a thermally conductive material to act as an ancillary heat sink.
  • a secondary lens is provided along the light path of the LEDs to control the beam spread of the light emitted from the downlight system.
  • the lens may be a non-imaging lens.
  • Fig. 1 is a schematic view of a downlight fixture in accordance with the prior art
  • Fig. 2 is an exploded perspective view of a downlight fixture in accordance with the invention
  • Fig. 3 is side elevation sectional view of a pair of LEDs disposed on a substrate in accordance with the invention.
  • Fig. 4 is a perspective view of a downlight fixture constructed in accordance with the invention
  • Fig. 5 is a side elevational view of a downlight fixture constructed in accordance with the invention
  • Fig. 6 is a first circuit diagram of the downlight fixture constructed in accordance with the invention.
  • Fig. 7 is a second circuit diagram of the downlight fixture constructed in accordance with the invention.
  • Fig. 8 is a schematic view of the downlight fixture mounted to the ceiling in accordance with the invention.
  • Fig. 9 is the downlight fixture mounted to the ceiling in accordance with a second embodiment of the invention.
  • Downlight system 10 includes a substrate 20.
  • Substrate 20 has a downward facing surface 25.
  • a plurality of light emitting diodes 22 are disposed on downward facing surface 25 and oriented to project light in a direction away from surface 25.
  • substrate 20 is made of a thermally conductive material to act as a heat sink to dissipate heat generated by the one or more LEDs 22.
  • Each of LEDs 22 is formed as a die as shown in Fig. 3. LEDs 22 are disposed within an optical cavity 24 formed within substrate 20. In a preferred embodiment, a high refractive encapsulant 26 is disposed within optical cavity 24 encapsulate LED 22. In a preferred embodiment, the high refractive encapsulant 26 has an index of refraction greater than about 1.5.
  • the encapsulant may be a silicon gel, by way of non-limiting example, having an index of refraction greater than 1.5.
  • lens 27 is matched to the function of the angle of the emissive distribution of light from phosphor layer 28, or in the absence of phosphor layer 28, from the reflector to minimize internal reflections.
  • lens 27 defines a volume between lens 27 and a respective LED 22.
  • a second high refractive index encapsulant 29 is disposed in the volume defined by lens 27.
  • the lens 27 is a substantially hemispherical, substantially transparent, lens in order to maximize light transmission and reduce reflection.
  • the reflector and lens 27 are optimized for the emissive distribution pattern of the LEDs.
  • LED 22 is optically coupled with high refractive index encapsulants 26, 29, phosphor diffuser layer 28, and lens 27.
  • the structures are collectively and individually referred to as the primary optics for creating a substantially even color of light across LEDs 22.
  • a common lens 27, and associated gels and phosphor layers may be associated with two or more LEDs 22, and two or more LEDs may be disposed in a single optical cavity.
  • LEDs 22 may be formed as die-packages mounted to substrate 20, rather than optical cavities formed within substrate 20; both being considered disposed on the substrate.
  • Secondary lens 30 is used as an additional optical element. Secondary lens 30 may serve to further diffuse the light from the individual LEDs 22, or it may provide additional optical control to the light emitted from the assembly of LEDs 22.
  • secondary lens 30 is a non-imaging lens utilizing the principles of non-imaging optics to generate a desired light distribution.
  • nonimaging optics incorporate the calculation of free form surfaces, which redistributes light.
  • Such non-imaging optics are known in the art; provided by OEC by way of example.
  • secondary lens 30 can farther diffuse the light or enhance a uniform light color output by mixing different colored light output by the individual LEDs 22 of different color distributions as visible white light.
  • the beam spread of the light may be changed from a straight beam (spotlight) or a wide beam (Gaussian) distribution.
  • adjustable beam spread is provided by secondary lens 30.
  • secondary lens 30 can control the output from the LEDs 22 to reduce or eliminate veiling glare, improving the aesthetics of the fixtures when viewed from below.
  • Trim ring 40 is disposed about substrate 20 and hides substrate 20 improving the overall aesthetics of downlight system 10.
  • trim ring 40 is formed of a thermally conductive material and may be provided with radiating fins 42 disposed around the circumference of trim ring 40.
  • trim ring 40 acts as an ancillary or secondary heat sink to thermally manage the heat generated by the operation of LEDs 22.
  • active elements such as a fan may be used to dissipate heat by convection.
  • passive heat dissipation structure such as fins 42 may be located on the side of substrate 20 opposite side 23 to hide the heat dissipation structure from view.
  • LEDs 22 are low voltage direct current devices. As such, the power source, particularly for household use, will convert the supplied power from AC to a predetermined DC voltage potential.
  • the power supply design may be either a voltage limiting or current limiting circuit.
  • LEDs 22 are arrayed in a pattern to control the current by matching the voltage of the power source. IfLEDs 22 are in parallel with the power supply 70 (see Fig. 6), the voltage is lowered. IfLEDs 22 are in series with the power supply 70 (see Fig. 7), then the current can be lowered.
  • the power source may be independent of downlight system 10 as in conventional wiring structures for light fixtures as known in the art. However, as a result of the compact design as a result of the use of LEDs 22 and substrate 20, the power source may be incorporated directly into downlight system 10.
  • downlight system 10 As is readily seen from Fig. 5, as a result of the use of substrate 20 to support the light source, rather than the elongated housing 102 as known in the prior art, downlight system 10 has a substantially planar, thin profile relative to the prior art. Therefore, as seen in Fig. 8, downlight system 10 may be affixed directly to ceiling 106 without need for any recess therein and still provide the aesthetics of being essentially flush with ceiling 106. However, to appear even more flush with ceiling 106, downlight system 10 may be recessed within ceiling 106 as seen in Fig. 9.
  • a light fixture By providing an LED downlight system, a light fixture is provided which projects light downward from the ceiling in a fundamentally different form and manner. Because the light sources are much smaller than traditional sources, they may be assembled as an array on a flat substrate. This allows for even distribution of light across the emitting surface of the luminaire. By incorporating small optics associated with each respective LED (light source) to direct the light in the desired direction, the large luminaire conventional design is no longer needed. Therefore, the luminaire can be made to be much thinner, reducing the requirement for a large space above the ceiling. The luminaire may be so thin as to not require penetration of the ceiling at all.
  • the LED assembly may be powered at a DC voltage allowing ease of wiring both above and below the ceiling surface.
  • a decorative ring or trim ring may be incorporated that cosmetically masks the transition of the ceiling to the luminaire as well as dissipate the heat generated by the LEDs and the heat generated by the power source. If the light source is assembled on a substrate acting as a heat sink, maximum dissipation of the heat of the components is provided while facilitating a thin dimension to the system.
  • Optics may be built into the individual LEDs to provide primary optics of the source while a detachable lens may provide secondary optics providing a variety of light color, beam shape and softness utilizing a simple interchangeable structure.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention concerne un système plafonnier intensif comprenant un substrat. Au moins une diode électroluminescente, placée sur une surface du substrat, émet de la lumière dans une seule direction. Un dispositif optique principal respectif permettant de fournir une lumière de couleur sensiblement uniforme est optiquement couplé à une diode électroluminescente respective.
PCT/US2006/011771 2005-03-29 2006-03-29 Systeme plafonnier intensif de petites dimensions WO2006105346A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US66610305P 2005-03-29 2005-03-29
US60/666,103 2005-03-29

Publications (2)

Publication Number Publication Date
WO2006105346A2 true WO2006105346A2 (fr) 2006-10-05
WO2006105346A3 WO2006105346A3 (fr) 2006-12-07

Family

ID=37054154

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/011771 WO2006105346A2 (fr) 2005-03-29 2006-03-29 Systeme plafonnier intensif de petites dimensions

Country Status (1)

Country Link
WO (1) WO2006105346A2 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8602601B2 (en) 2009-02-11 2013-12-10 Koninklijke Philips N.V. LED downlight retaining ring
US9151457B2 (en) 2012-02-03 2015-10-06 Cree, Inc. Lighting device and method of installing light emitter
US9151477B2 (en) 2012-02-03 2015-10-06 Cree, Inc. Lighting device and method of installing light emitter
US9709253B2 (en) 2007-09-21 2017-07-18 Cooper Lighting, Llc Light emitting diode recessed light fixture
US9810417B2 (en) 2009-07-21 2017-11-07 Cooper Technologies Company Quick-release mechanism for a modular LED light engine
US9810407B2 (en) 2009-07-21 2017-11-07 Cooper Technologies Company Interfacing a light emitting diode (LED) module to a heat sink
US10012354B2 (en) 2015-06-26 2018-07-03 Cree, Inc. Adjustable retrofit LED troffer
US10054274B2 (en) 2012-03-23 2018-08-21 Cree, Inc. Direct attach ceiling-mounted solid state downlights
US10514139B2 (en) 2012-03-23 2019-12-24 Ideal Industries, Llc LED fixture with integrated driver circuitry

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030160256A1 (en) * 2000-09-01 2003-08-28 General Electric Company Plastic packaging of LED arrays
US20060049475A1 (en) * 2004-09-07 2006-03-09 Opto Tech Corporation High power LED array

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030160256A1 (en) * 2000-09-01 2003-08-28 General Electric Company Plastic packaging of LED arrays
US20060049475A1 (en) * 2004-09-07 2006-03-09 Opto Tech Corporation High power LED array

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9709253B2 (en) 2007-09-21 2017-07-18 Cooper Lighting, Llc Light emitting diode recessed light fixture
US10634321B2 (en) 2007-09-21 2020-04-28 Eaton Intelligent Power Limited Light emitting diode recessed light fixture
US11570875B2 (en) 2007-09-21 2023-01-31 Signify Holding B.V. Light emitting diode recessed light fixture
US11859796B2 (en) 2007-09-21 2024-01-02 Signify Holding B.V. Light emitting diode recessed light fixture
US8602601B2 (en) 2009-02-11 2013-12-10 Koninklijke Philips N.V. LED downlight retaining ring
US9810417B2 (en) 2009-07-21 2017-11-07 Cooper Technologies Company Quick-release mechanism for a modular LED light engine
US9810407B2 (en) 2009-07-21 2017-11-07 Cooper Technologies Company Interfacing a light emitting diode (LED) module to a heat sink
US9151457B2 (en) 2012-02-03 2015-10-06 Cree, Inc. Lighting device and method of installing light emitter
US9151477B2 (en) 2012-02-03 2015-10-06 Cree, Inc. Lighting device and method of installing light emitter
US10054274B2 (en) 2012-03-23 2018-08-21 Cree, Inc. Direct attach ceiling-mounted solid state downlights
US10514139B2 (en) 2012-03-23 2019-12-24 Ideal Industries, Llc LED fixture with integrated driver circuitry
US10012354B2 (en) 2015-06-26 2018-07-03 Cree, Inc. Adjustable retrofit LED troffer

Also Published As

Publication number Publication date
WO2006105346A3 (fr) 2006-12-07

Similar Documents

Publication Publication Date Title
US20090086484A1 (en) Small form factor downlight system
US9366410B2 (en) Reverse total internal reflection features in linear profile for lighting applications
US10323824B1 (en) LED light fixture with light shaping features
JP6204194B2 (ja) トロファ型光学アセンブリ
US8905575B2 (en) Troffer-style lighting fixture with specular reflector
JP5647274B2 (ja) 光混合モジュール及び斯かる光混合モジュールを有する照明器具
JP5026968B2 (ja) Ｌｅｄランプシステム
EP2529421B1 (fr) Dispositif à diode électroluminescente à large distribution angulaire
JP5711147B2 (ja) Ｌｅｄ、光ガイド及びリフレクタを備える光源
US8529102B2 (en) Reflector system for lighting device
US9360185B2 (en) Variable beam angle directional lighting fixture assembly
WO2006105346A2 (fr) Systeme plafonnier intensif de petites dimensions
US9057503B2 (en) Light-emitting diode light bulb generating direct and decorative illumination
US9488330B2 (en) Direct aisle lighter
US20120039073A1 (en) Luminaire with distributed led sources
US8277085B2 (en) Compact LED downlight with cuspated flux-redistribution lens
JP2012513083A (ja) 照明器具において装飾的照明効果を生成する発光装置
US8833981B2 (en) Multiple-tier omnidirectional solid-state emission source
TW201233947A (en) LED light bulb with light scattering optics structure
KR100991890B1 (ko) 엘이디를 이용한 조명 모듈
JP2013531357A (ja) 単一チャンバーの照明デバイス
JP2008016314A (ja) Ｌｅｄを用いた光源及びこれを用いた照明装置
CN217714590U (zh) 一种Par灯
Chaves et al. Virtual filaments that mimic conventional light bulb filaments

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase in:

Ref country code: DE

NENP Non-entry into the national phase in:

Ref country code: RU

122 Ep: pct application non-entry in european phase

Ref document number: 06748971

Country of ref document: EP

Kind code of ref document: A2