WO2006078664A1 - Systeme de connexion - Google Patents

Systeme de connexion Download PDF

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Publication number
WO2006078664A1
WO2006078664A1 PCT/US2006/001631 US2006001631W WO2006078664A1 WO 2006078664 A1 WO2006078664 A1 WO 2006078664A1 US 2006001631 W US2006001631 W US 2006001631W WO 2006078664 A1 WO2006078664 A1 WO 2006078664A1
Authority
WO
WIPO (PCT)
Prior art keywords
connector system
connector
framework
resilient contacts
contact
Prior art date
Application number
PCT/US2006/001631
Other languages
English (en)
Inventor
David T. Beatson
James L. Jaquette
Gene E. Tokraks
Steven Fahrner
Original Assignee
K & S Interconnect, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by K & S Interconnect, Inc. filed Critical K & S Interconnect, Inc.
Publication of WO2006078664A1 publication Critical patent/WO2006078664A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Definitions

  • the present invention relates to connector systems for providing electrical interconnection in the testing of packaged integrated circuits, and more particularly, to stacking connector assemblies for use in testing packaged integrated circuits.
  • connector assemblies are often used to provide electrical interconnection between the testing system (e.g., through a substrate/printed circuit board such as a load board) and the packaged integrated circuit under test (e.g., through contacts or terminals of the packaged integrated circuit).
  • the testing system e.g., through a substrate/printed circuit board such as a load board
  • the packaged integrated circuit under test e.g., through contacts or terminals of the packaged integrated circuit.
  • interposer connector assemblies housed by a socket are used to provide such electrical interconnection.
  • Such connector assemblies suffer from a number of deficiencies.
  • such connector assemblies may be configured to provide a desired deflection range in certain circuit configurations (e.g., land grid array configurations), but may not be configured to provide a desired deflection range in other circuit configurations (e.g., ball grid array configurations).
  • a connector system for providing electrical interconnection between a substrate and a packaged integrated circuit.
  • the connector system includes a first connector assembly including (a) a first framework, (b) a first plurality of resilient contacts supported by the first framework and configured to contact electrical connections of the packaged integrated circuit.
  • the connector system also includes a second connector assembly including (a) a second framework, (b) a second plurality of resilient contacts supported by the second framework and configured to contact (1) the first plurality of resilient contacts, and (2) electrical connections of the substrate.
  • a connector system for providing electrical interconnection between a substrate and a packaged integrated circuit.
  • the connector system includes a socket and a plurality of connector assemblies arranged in a stacked configuration at least partially within the socket.
  • Each of the connector assemblies includes (a) a framework, and (b) a plurality of resilient contacts supported by the framework.
  • the stacked connector assemblies provide electrical interconnection between the substrate and the packaged integrated circuit via stacked ones of the resilient contacts.
  • Fig. IA is a side view of a portion of a connector system in accordance with an exemplary embodiment of the present invention.
  • Fig. IB is a perspective view of a portion of the connector system of Fig. IA;
  • Fig. 2A is a detailed perspective view of a portion of another connector system in accordance with an exemplary embodiment of the present invention.
  • Fig. 2B is a side view of a portion of the connector system of Fig. 2A
  • Fig. 2C is a perspective view of another portion of the connector system of Fig. 2A;
  • Fig. 2D is another perspective view of Fig. 2C;
  • Fig. 3A is a perspective view of a portion of another connector system in accordance with an exemplary embodiment of the present invention.
  • Fig. 3B is a side view of the portion of the connector system of Fig. 3A;
  • Fig. 4A is a perspective view of a portion of yet another connector system in accordance with an exemplary embodiment of the present invention.
  • Fig. 4B is a side view of the portion of the connector system of Fig. 4A;
  • Fig. 5A is a block diagram of a side view of a portion of a connector system providing electrical interconnection between an packaged integrated circuit device and a substrate in a free state according to an exemplary embodiment of the present invention
  • Fig. 5B is a block diagram of a side view of the portion of the connector system of Fig. 5A in a compressed state
  • Fig. 5C is a block diagram illustrating an alignment structure for aligning the connector system of Fig. 5A.
  • United States Patent Nos. 5,629,837; 6,042,387; and 6,890,185 relate to electrical interconnection technology, and are herein incorporated by reference in their entirety.
  • the term "substrate” is intended to refer to any of a number of devices configured to be electrically connected to a packaged integrated circuit during the testing of the packaged integrated circuit.
  • an exemplary substrate is a printed circuit board which is coupled to a testing system, wherein terminals/pads/contacts of the printed circuit board are configured to be electrically connected to terminals/pads/contacts of the packaged integrated circuit device to be tested.
  • this electrical connection is provided via a connector system including stacked connector assemblies.
  • a specific example of such a printed circuit board is a conventional load board used in package testing environments.
  • arm is intended to refer to a portion of a resilient contact extending from a base portion of the resilient contact and is not limited to any particular shape or configuration.
  • a contact may extend upwardly in a first orientation of the connector assembly, and downwardly in a second orientation of the connector assembly.
  • each of the connector assemblies may include a laminated structure (e.g., a dielectric/conductor structure) including a base dielectric layer and a conductive (or semiconductive) layer (e.g., a conductive layer selectively applied to the base layer).
  • the base dielectric layer may be a processed to form a framework/grid by removing certain portions of the base dielectric layer (e.g., by laser ablation).
  • the conductive layer may be selectively applied to form electrical contacts using, for example, electroplating, photolithography, x-ray lithography, e-beam lithography, and nano- imprint lithography.
  • a force e.g., a compressive force applied via a mechanical system such as a pneumatic chuck
  • the connector system i.e., the stacked connector assemblies
  • a larger vertical deflection range is provided.
  • Such an increased vertical deflection range facilitates interconnection of packaged integrated circuits having various configurations, for example, land grid array (i.e., LGA) and ball grid array (i.e., BGA) configurations.
  • LGA land grid array
  • BGA ball grid array
  • a connector assembly may be used to compensate for inconsistencies in the packaged integrated circuit flatness and inconsistencies in the printed circuit board flatness.
  • the connector system may also be used to compensate for inconsistencies in ball heights.
  • the connector system disclosed herein may be modular in nature in that any number of connector assemblies may be included in the connector system to provide a desired vertical deflection range.
  • a single layer connector assembly may provide the desired vertical deflection range.
  • two or more connector assemblies may be stacked to provide the desired vertical deflection range.
  • the same modular connector assembly may be used in each of the configurations. Through the use of such a modular connector assembly, cost savings are derived.
  • the framework e.g., a grid
  • the framework has a resilient property.
  • at least a portion of the framework will flex (e.g., compliantly bend) upon a predetermined force being applied to at least a portion of resilient contacts supported by the framework.
  • FIG. 1A-1B side and perspective views of a portion of a connector system are shown.
  • Fig. IA is arbitrarily rotated vertically with respect to Fig. IB.
  • the connector system includes two stacked connector assemblies, that is, connector assemblies 110 and 120.
  • Connector assembly 110 includes framework 112 and a plurality of resilient contacts 114 disposed thereon
  • connector assembly 120 includes framework 122 and a plurality of resilient contacts 124 disposed thereon.
  • Connector assembly 110 includes framework 112 (e.g., a polyimide sheet patterned to define apertures therethrough, using, for example, laser ablation).
  • Connector system also includes a plurality of resilient contacts 114 made of, for example, a nickel alloy such as NiMn.
  • a nickel alloy may desirably be plated with a noble metal (e.g., gold) to provide improved conductivity, etc.
  • Material used to define each of the contacts 114 is deposited (e.g., electroplating NiMn on a lithographically defined pattern) onto the polyimide sheet, for example, with a seed layer of copper or the like disposed therebetween (NiMn plates well to copper).
  • the remainder of the seed layer (e.g., the portion of the seed layer not provided between the polyimide sheet and a respective one of contacts 114) may be removed, for example, using an etchant.
  • each contact 114 includes (a) a base portion 114c that is substantially planar with framework 112, (b) an upwardly extending arm 114a terminating in a tip configured to contact a contact/pad/terminal/lead of a packaged integrated circuit to be tested, (c) a downwardly extending arm 114b terminating in a tip configured to contact the upwardly extending contact arm of contact 124 of connector assembly 120.
  • Upwardly extending arm 114a defines aperture 114d
  • downwardly extending arm 114b defines aperture 114e.
  • Lower extending arm 124b of contact 124 terminates in a tip configured to contact a contact/pad/terminal/lead of a substrate (e.g., a substrate such as a load board).
  • upwardly extending arm 114a defines aperture
  • aperture 114e Such an aperture favorably distributes the stresses in framework 112 caused by loads applied to contacts 114/124 (e.g., a compressive load applied during testing of a packaged integrated circuit).
  • each of contacts 114 and 124 is shaped to have a flat surface configured to provide a relatively large contact area therebetween.
  • the tip of downwardly extending arm 124b is shaped to have a flat surface to contact a contact/pad/terminal/lead of a substrate (e.g., a substrate such as a load board).
  • Figs. 1A-1B illustrate a portion of the connector system.
  • the complete connector system will typically include many contacts 114/124, and will also typically include (amongst other features) a housing (e.g., a socket) and an alignment mechanism to align the connector assemblies with one another.
  • a housing e.g., a socket
  • the connector system includes three stacked connector assemblies, that is, connector assemblies 210, 220 and 230.
  • Connector assembly 210 includes framework 212 and a plurality of resilient contacts 214 disposed thereon;
  • connector assembly 220 includes framework 222 and a plurality of resilient contacts 224 disposed thereon;
  • connector assembly 230 includes framework 232 and a plurality of resilient contacts 234 disposed thereon.
  • contact 214 (and contacts 224 and 234) includes: (a) base portion 214c substantially planar with framework 212, (b) upwardly extending arm 214a terminating in a tip configured to contact a packaged integrated circuit device to be tested, (c) downwardly extending arm 214b, (d) aperture 214d defined in upwardly extending arm 214a, and (e) aperture 214e defined in downwardly extending arm 214b.
  • Downwardly extending arm 234b of contact 234 is configured to contact a substrate (e.g., a printed circuit board such as a load board).
  • FIG. 2B a side view of contacts 214, 224, and
  • contact arm 214a (configured to contact a packaged device to be tested) and contact arm 234b (configured to contact a substrate such as a load board) has been shaped to have a substantially flat length at a tip thereof. If desired, both tips could be so shaped. In contrast, the tip portion of downwardly extending arm 214b of contact 214 and the tip portion of upwardly extending arm 224a of contact 224, have been shaped to have substantially flat lengths providing an interface region 250.
  • Figs. 3A-3B are perspective and side views of a portion of another connector system having a different configuration.
  • the connector system includes two stacked connector assemblies, that is, connector assembly 310 and connector assembly 320.
  • Connector assembly 310 includes a framework 312 and a plurality of resilient contacts 314.
  • Connector assembly 320 includes a framework 322 and a plurality of resilient contacts 324.
  • contacts 314 have been deposited on framework 312 such that channels 316 are defined between respect contacts 314, thereby providing electrical isolation.
  • Each contact 314 includes two upwardly extending contacts 314al and 314a2, as well as two downwardly extending contacts 314bl and 314b2.
  • each contact 324 includes two upwardly extending contacts 324al and 324a2, as well as two downwardly extending contacts 324bl and 324b2.
  • Figs. 4A-4B are perspective and side views of a portion of another connector system having a different configuration.
  • the connector system includes two stacked connector assemblies, that is, connector assembly 410 and connector assembly 420.
  • Connector assembly 410 includes framework 412 and a plurality of resilient contacts 414.
  • Connector assembly 420 includes framework 422 and a plurality of resilient contacts 424.
  • Each contact 414 includes upwardly extending contact 414a, downwardly extending contact 414b, and base portion 414c substantially planar with framework 412.
  • each contact 424 includes upwardly extending contact 424a, downwardly extending contact 424b, and base portion 424c substantially planar with framework 422.
  • contacts 414 and 424 defines slots/apertures therethrough.
  • a slot/aperture tends to distribute stress applied to the electrical contacts (e.g., from a compressive load applied during testing of a packaged integrated circuit). Additionally, such a slot or aperture may be used to divide a signal transmitted through the respective electrical contact.
  • the present invention is applicable to resilient contacts (as well as other elements of the connector system) having many different shapes and configurations.
  • Figs. 5A-5B are block diagrams of a side view of a portion of a connector system providing electrical interconnection between packaged integrated semiconductor device 500 and substrate 504 in a free state, and a compressed state, respectively, according to an exemplary embodiment of the present invention.
  • the connector system includes arrays of stacked resilient contacts 514 and 524, supported by frameworks 512 and 522 respectively. Note that Fig. 5A (and Fig. 5C) is arbitrarily rotated vertically with respect to Fig. 5B.
  • a tip portion of the upwardly extending arm of contact 514 is configured to contact terminal (or the like) 502 of packaged semiconductor device 500.
  • a tip portion of the downwardly extending arm of contact 524 is configured to contact terminal (or the like) 504 of load board 504.
  • the uncompressed height of the stacked connector system is 0.040 inches, and the spacing between frameworks 512 and 522 is a substantially constant 0.018 inches.
  • physical contact may exist between (a) terminal 502 of packaged semiconductor device 500 and an upwardly extending arm of contacts 514, (b) a downwardly extending portion of contact 514 and an upwardly extending portion of contacts 524, and/or (c) a downwardly extending portion of contact 524 and terminal 506 of load board 504 prior to a compressive force being applied to such contacts; however, such physical contact (without the compressive force) may not result in the desired electrical connection therebetween (i.e., the physical contact may result in an electrical connection of a high resistance).
  • the height of the stacked connector system is 0.030 inches, and the spacing between frameworks 512 and 522 is no longer substantially constant. More specifically, during compression, the frameworks of the connector system tend to "flex" thereby providing a portion of the force between the 514/524 contacts and packaged semiconductor device 500 and load board 504, respectively.
  • Such compression may be applied, for example, using a pneumatic device to apply a compressive force through the packaged semiconductor device in order to establish the desired electrical connections between packaged integrated circuit device 500, the first connector assembly, the second connector assembly, and load board 504.
  • Fig. 5B Also illustrated in Fig. 5B is the interface between (a) a tip portion of downwardly extending arm 514b and (b) a tip portion of upwardly extending portion 524a. As shown, during compression, relative motion between these tip portions occurs as one of the tip portions may "ride along" the other while maintaining the desired electrical contact therebetween.
  • Fig. 5C illustrates that packaged semiconductor device 500, load board
  • alignment structure 508 e.g., an alignment pin or the like
  • one or more alignment structures 508 may be provided (e.g., on a periphery of the connector system) to align respective connector assemblies of the connector system.
  • each of frameworks 512 and 522 define respective apertures to receive alignment structure 508 to ensure proper alignment.
  • the one or more alignment structures may be configured as part of a socket-type device (not shown) for housing the connector system.
  • a plurality of connector assemblies are located relative to each other (e.g., stacked) and allowed to float in the Z direction.
  • a desired electrical path between resilient contacts of the connector assemblies is provided when the connector system (including the connector assemblies) is compressed, thereby forcing adjacent resilient contacts to connect.
  • the present invention has been described primarily with respect to providing interconnection between a packaged integrated circuit and a printed circuit board such as a load board, it is not limited thereto. Likewise, the present invention is not limited to providing interconnection between components for testing packaged integrated circuits. Rather, the present invention is applicable to any of a number of applications which desire a modular and versatile electrical connector system. For example, stacking connector assemblies may also be utilized in the testing of wafer based semiconductor devices (e.g., as an interposer of a probe card assembly).

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

L'invention concerne un système de connexion destiné à assurer une interconnexion électrique entre un substrat (504) et un circuit intégré mis sous boîtier (500). Le système de connecteur comprend un premier ensemble de connexion (514) incluant (a) une première structure (512), (b) une première pluralité de contacts élastiques supportée par la première structure et conçus pour venir en contact avec les connexions électriques du circuit intégré mis sous boîtier. Le système de connexion comprend également un second ensemble de connexion (524) incluant (a) une seconde structure (522), (b) une seconde pluralité de contacts élastiques supportée par la seconde structure et conçue pour venir en contact avec (1) la première pluralité de contacts élastiques et (2) les connexions électriques du substrat.
PCT/US2006/001631 2005-01-21 2006-01-18 Systeme de connexion WO2006078664A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US64589505P 2005-01-21 2005-01-21
US60/645,895 2005-01-21

Publications (1)

Publication Number Publication Date
WO2006078664A1 true WO2006078664A1 (fr) 2006-07-27

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Family Applications (1)

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PCT/US2006/001631 WO2006078664A1 (fr) 2005-01-21 2006-01-18 Systeme de connexion

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5557501A (en) * 1994-11-18 1996-09-17 Tessera, Inc. Compliant thermal connectors and assemblies incorporating the same
US6029344A (en) * 1993-11-16 2000-02-29 Formfactor, Inc. Composite interconnection element for microelectronic components, and method of making same
US6204065B1 (en) * 1997-03-27 2001-03-20 Ngk Insulators, Ltd. Conduction assist member and manufacturing method of the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6029344A (en) * 1993-11-16 2000-02-29 Formfactor, Inc. Composite interconnection element for microelectronic components, and method of making same
US5557501A (en) * 1994-11-18 1996-09-17 Tessera, Inc. Compliant thermal connectors and assemblies incorporating the same
US6204065B1 (en) * 1997-03-27 2001-03-20 Ngk Insulators, Ltd. Conduction assist member and manufacturing method of the same

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