WO2006076940A1 - Infrared transceiver and method for the production thereof - Google Patents

Infrared transceiver and method for the production thereof Download PDF

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Publication number
WO2006076940A1
WO2006076940A1 PCT/EP2005/012579 EP2005012579W WO2006076940A1 WO 2006076940 A1 WO2006076940 A1 WO 2006076940A1 EP 2005012579 W EP2005012579 W EP 2005012579W WO 2006076940 A1 WO2006076940 A1 WO 2006076940A1
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WO
WIPO (PCT)
Prior art keywords
recess
cover layer
optical lens
transmitter
receiver
Prior art date
Application number
PCT/EP2005/012579
Other languages
German (de)
French (fr)
Inventor
Felix Rodriguez
Ralf Dathe
Original Assignee
Vishay Semiconductor Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vishay Semiconductor Gmbh filed Critical Vishay Semiconductor Gmbh
Publication of WO2006076940A1 publication Critical patent/WO2006076940A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Definitions

  • the invention relates to an infrared transceiver with an infrared transmitter, an infrared receiver and at least one optical lens for the transmitter and / or the receiver.
  • the invention further relates to a method for producing such a transceiver.
  • Transceivers are used for the optical transmission and reception of data according to predetermined transmission specifications and protocols, for example according to the IrDA standard. Transceivers are used, for example, in cell phones, personal digital assistants (PDAs) or computers (PCs or notebooks) to enable wireless communication between such devices.
  • PDAs personal digital assistants
  • PCs or notebooks computers
  • each transceiver has a transmitter for emitting infrared signals, a receiver for receiving infrared signals and at least one amplifier circuit.
  • Infrared transceivers are commonly manufactured and offered as packaged devices that are provided with other components for mounting on a printed circuit board (PCB).
  • PCB printed circuit board
  • Such transceiver components usually have a conductor strip formed by a stamped sheet metal part, on which transmitter, receiver and amplifier are arranged and which is enclosed by a synthetic resin housing in such a way that only conductor pads for electrical con tactation protrude from the housing.
  • an infrared transceiver having the features of claim 1, and in particular by the fact that the transmitter and the receiver are arranged on a flexible printed circuit board which has at least one flexible carrier foil, a structured conductor layer and a cover layer, that the cover layer the flexible circuit board has at least one recess in which the transmitter and / or the receiver are arranged, and that the optical lens is at least partially disposed in the recess of the cover layer.
  • Characteristic of the transceiver according to the invention is therefore initially that the transmitter, the receiver and any other circuits are arranged on a flexible circuit board.
  • the flexible printed circuit board used in the transceiver according to the invention has a flexible carrier film, which preferably consists of polyimide or of polyester or polyethylene naphthalate. This carrier film is provided by a pressing process or by means of an adhesive (eg acrylic adhesive) with a flexible conductor layer.
  • the conductor layer is preferably a copper cladding.
  • This conductor layer is structured, ie it does not extend over the entire surface along the carrier film, but is, for example, by an etching process as a structure of conductor tracks, contact formed training areas, etc.
  • the carrier film and the conductor layer formed thereon are provided with a flexible cover layer, which ultimately serves to protect the layers arranged underneath.
  • This cover layer may be formed of the same material as the said support film (for example, polyimide). Alternatively or additionally, a solder resist or a solder stop foil may be provided as cover layer.
  • the flexible circuit board may also have a multilayer structure, that is a series of multiple conductor layers and arranged therebetween cover or insulator layers.
  • the transceiver according to the invention that at least one recess is formed on the cover layer of the printed circuit board, in which the transmitter, the receiver or both are arranged together and electrically connected to an associated portion of the conductor layer, for example by solder contacts.
  • This recess also serves to receive the optical lens, which is arranged in the recess of the cover layer. In other words, at least a lower portion of the lens protrudes into the recess of the cover layer and thereby covers the transmitter or receiver likewise arranged in the recess.
  • the transceiver according to the invention is flexible.
  • the inventive transceiver is thus particularly well suited, for example, for integration into chip, identification or transponder cards made of plastic.
  • the standard size of a credit card is 0.9 mm thick.
  • This format allows due to the low height of the transceiver according to the invention easily integrates such a transceiver. Due to the flexibility of the materials used, the transceiver is also suitable for use in so-called "intelligent textiles". Even for the already known applications of transceivers, for example in mobile phones or mobile computers, the transceiver according to the invention proves to be advantageous due to its low height.
  • the optical lens is molded with respect to its circumference in a form-fitting manner in said recess of the cover layer, ie the lens adjoins the peripheral boundary of the recess.
  • the recess serves not only for receiving the lens and the transmitter and / or receiver covered thereby, but also as a lateral boundary for the casting material when the lens is produced by a casting process.
  • a particularly simple production of a flat lens is possible because only one drop of a transparent transparent casting compound in the recess must be filled. Due to the circumferential limitation of the recess, the lateral spread of the casting compound is limited.
  • the amount of casting material can be taking advantage of the surface tension a lens is formed whose upper portion has a convex curvature to thereby form a converging lens.
  • the stated object is also achieved by a method for producing an infrared transceiver having the features of claim 8, and in particular by forming a flexible printed circuit board by providing a flexible carrier foil with a structured conductor layer, the structured conductor layer having a covering layer is provided, in the cover layer at least one recess is introduced, in the recess, an infrared transmitter and / or an infrared receiver are arranged, and in the recess, an optical lens is provided.
  • Fig. 1 shows a plan view of an infrared transceiver according to a first embodiment.
  • FIGS. 2 and 3 show cross-sectional views of the transceiver according to FIG.
  • FIG. 4 shows a further embodiment of a transceiver in a schematic plan view.
  • the transceiver according to FIGS. 1 to 3 has a flexible printed circuit board which is arranged as a laminate with a flexible carrier foil 11, one of which is arranged thereon Copper layer 13 and arranged on the copper layer 13 and the carrier film 11 flexible cover layer 15 is formed.
  • the carrier film 11 and the cover layer 15 are preferably made of polyimide.
  • the copper layer 13 is structured in such a way that a plurality of conductor tracks with connection surfaces for solder contacts and surfaces for receiving electronic components are formed.
  • On the cover layer 15, a circular recess 17 is formed.
  • the integrated circuit 25 serves to control the transmission signals of the light emitting diode 21 and to amplify and evaluate the received signals of the photodiode 23.
  • the light emitting diode 21, the photodiode 23 and the integrated circuit 25 are SMD components (surface mounted devices) on corresponding surfaces of the copper layer 13 attached, with a direct attachment to the carrier film 11 is possible. By bonding wires 27, said components 21, 23, 25 are electrically connected to each other and to the conductor tracks of the copper layer 13.
  • the pads formed by the copper layer 13 serve as an input for the power supply for the light emitting diode 21 (LED), as an input for the control of the transmission signal of the light emitting diode 21 (THX), as an input for a shutdown signal (shutdown , SD), as a contact for the ground potential (GND), as a contact for the operating voltage (VCC) and as an output for the reception signal of the photodiode 23 (RHX).
  • an optical lens 31 is further arranged in the circular recess 17 of the cover layer 15.
  • the lens 31 is inserted into the recess 17 from an epoxy resin that is transparent in the infrared spectral range. Gössen, as will be explained below.
  • the lens 31 thus adjoins the circular boundary of the recess 17 in a form-fitting manner.
  • the light-emitting diode 21, the photodiode 23 and the integrated circuit 25 are positively covered by the lens 31.
  • the optical lens 31 is thus completely connected within the recess 17 with the carrier film 11, the copper layer 13 and the components 21, 23, 25; This prevents unwanted delamination of the lens 31.
  • the upper side of the lens 31 has, starting from the circumferential boundary along the recess 17, a convex curvature, so that the lens 31 is designed as a converging lens.
  • the transceiver is used in a manner known per se for transmitting and receiving data, for example according to the IrDA standard. As a result, an optical communication between two electronic devices is possible, which are equipped with such transceivers.
  • the particular advantage of the transceiver shown in FIGS. 1 to 3 is that it has a very flat construction. The transceiver can therefore be used for applications such as in credit cards, which were previously not possible due to the size of conventional transceivers.
  • the flat structure of the transceiver shown is achieved in that the light-emitting diode 21 and the photodiode 23 are arranged on the comparatively thin carrier film 11 and that the optical lens 31 is disposed within the recess 17 of the cover layer 15 ultimately on the carrier film 11 and thereby the Light emitting diode 21 and the photodiode 23 covers.
  • flexible backsheets and coverslips may be made of polyimide, each having a thickness of only 50 microns or even 25 microns.
  • the copper layer 13 has a thickness of, for example, 35 ⁇ m.
  • a height of the transceiver can thus be achieved, for example, between 100 and 300 ⁇ m.
  • Another advantage of the transceiver shown is the particularly simple and thus cost-effective production, since only one drop of a synthetic resin in the recess 17 of the cover layer 15 must be poured to form the lens 31.
  • the manufacture of the shown transceiver can take place as follows:
  • the flexible carrier film 11 (polyimide film) is provided over its entire area with the copper layer 13, for example by mutual pressing or by means of an adhesive layer therebetween.
  • the copper layer 13 is then patterned by a per se known etching process to form the printed conductors and surfaces shown in FIG.
  • the arrangement of carrier film 11 and copper layer 13 is provided with the cover layer 15, for example, again by mutual pressing or by means of an interposed adhesive layer.
  • the cover layer 15 is preferably also a polyimide film; Alternatively or additionally, a solder resist or a solder stop film may also be used as cover layer 15.
  • the recesses 17 and 29 are introduced, for example by an etching process.
  • the light emitting diode 21, the photodiode 23 and the integrated circuit 25 are fixed, for example glued.
  • the electrical contacting by means of the bonding wires 27 now takes place.
  • a casting compound, in particular the already mentioned epoxy resin is poured into the recess 17 in such a way that an optical lens 31 is formed, which is arranged in the recess 17 in a form-fitting manner along its circumference and due to the surface tension in the liquid state of the casting compound at the top has convex curvature.
  • the lens 31 is hardened, for example chemically and / or thermally.
  • transceivers are produced simultaneously on a common carrier foil 11, and after completion of the method explained, these transceivers are singulated.
  • the integrated circuit 25 with the functions explained does not necessarily have to be part of the transceiver. Instead, it is also possible to provide only one amplifier (for example an AGC amplifier, automatic gain control), which amplifies the received signals of the photodiode 23. Also, such an amplifier can be omitted if it is located externally.
  • an AGC amplifier automatic gain control
  • the optical lens 31 does not necessarily have to protrude over the top of the cover layer 15, as shown in FIGS. 2 and 3.
  • the top of the lens 31 is lower than the top of the cover layer 15 and thus protected by the cover layer 15, for example against unwanted scratching.
  • the amount of the casting compound may be selected such that the peripheral boundary of the convex upper portion of the lens 31 at the underside of the recess 17 of the cover layer 15 (and thus just adjacent to the carrier film 11), adjacent to the top of the recess 17 of the cover layer 15 or - as shown in Fig. 2 - adjacent to a point between the bottom and top of the cover layer 15.
  • the radius of curvature of the lens 31 and thus its optical properties can be adjusted by the viscosity of the casting material used.
  • a common optical lens 31 is provided for the light-emitting diode 21 and the photodiode 23. This simplifies the production since only a single lens has to be cast. Experiments have shown that in such an embodiment, sufficient optical imaging properties for both the light emitting diode 21 and the photodiode 23 are achieved.
  • the light emitting diode 21 and the photodiode 23 each have their own optical lens 31 according to the above-described manufacturing method. This is shown for a further embodiment of the transceiver according to the invention in the schematic plan view of FIG. 4.

Abstract

The invention relates to an infrared transceiver comprising an infrared transmitter, an infrared receiver and at least one optical lens for the transmitter and/or receiver. The transmitter and receiver are arranged on a flexible printed circuit board consisting of at least one flexible carrier film, a structured conductor layer and a covering layer. The covering layer of the flexible printed circuit board comprises at least one recess in which the transmitter and/or receiver are arranged. The optical lens is at least partially arranged in the recess. The invention also relates to a method for the production of said transceiver.

Description

Infrarot-Transceiver und Herstellungsverfahren Infrared transceiver and manufacturing process
Die Erfindung betrifft einen Infrarot-Transceiver mit einem Infrarot- Sender, einem Infrarot- Empfänger und wenigstens einer optischen Linse für den Sender und/ oder den Empfänger. Die Erfindung betrifft ferner ein Verfahren zur Herstellung eines solchen Transceivers.The invention relates to an infrared transceiver with an infrared transmitter, an infrared receiver and at least one optical lens for the transmitter and / or the receiver. The invention further relates to a method for producing such a transceiver.
Transceiver dienen zur optischen Übertragung und zum Empfang von Daten nach vorgegebenen Übertragungspezifikationen und -Protokollen, beispielsweise gemäß dem IrDA-Standard. Transceiver werden beispielsweise in Mobiltelefonen, Taschencomputern (personal digital assistants, PDA's) oder Computern (PC's oder Notebooks) eingesetzt, um eine drahtlose Kommunikation zwischen derartigen Geräten zu ermöglichen. Zu diesem Zweck besitzt jeder Transceiver einen Sender zum Aussenden von Infrarot-Signalen, einen Empfänger zum Empfangen von Infrarot-Signalen und zumindest eine Verstärkerschaltung. Infrarot-Transceiver werden üblicherweise als gehäuste Bauelemente gefertigt und angeboten, die zusammen mit anderen Bauelementen zur Montage an einer Leiterplatte (Printed Circuit Board, PCB) vorgesehen sind. Derartige Transceiver-Bauelemente besitzen meist einen durch ein Stanzblechteil gebildeten Leiterstreifen, auf dem Sender, Empfänger und Verstärker angeordnet sind und der durch ein Kunstharzgehäuse derart umschlossen ist, dass nur noch Leiterbein- chen zur elektrischen Kon taktierung aus dem Gehäuse herausragen.Transceivers are used for the optical transmission and reception of data according to predetermined transmission specifications and protocols, for example according to the IrDA standard. Transceivers are used, for example, in cell phones, personal digital assistants (PDAs) or computers (PCs or notebooks) to enable wireless communication between such devices. For this purpose, each transceiver has a transmitter for emitting infrared signals, a receiver for receiving infrared signals and at least one amplifier circuit. Infrared transceivers are commonly manufactured and offered as packaged devices that are provided with other components for mounting on a printed circuit board (PCB). Such transceiver components usually have a conductor strip formed by a stamped sheet metal part, on which transmitter, receiver and amplifier are arranged and which is enclosed by a synthetic resin housing in such a way that only conductor pads for electrical con tactation protrude from the housing.
Derartige Transceiver-Bauelemente besitzen zwar den Vorteil, dass sie hinsichtlich ihrer Herstellung und ihres Verwendungszwecks gut mit den gängigen Montagetechniken vereinbar sind. Allerdings besitzen die be- kannten Infrarot-Transceiver für manche Anwendungen noch eine unerwünscht große Bauform.Although such transceiver components have the advantage that they are compatible with the usual assembly techniques in terms of their production and their intended use. However, the Infrared transceivers still had an undesirably large design for some applications.
Es ist eine Aufgabe der Erfindung, einen Infrarot-Transceiver zu schaffen, der bei einfacher Herstellung eine geringe Baugröße besitzt. Ferner soll ein entsprechendes Herstellungsverfahren bereitgestellt werden.It is an object of the invention to provide an infrared transceiver which has a small size with simple manufacture. Furthermore, a corresponding production method is to be provided.
Diese Aufgabe wird durch einen Infrarot-Transceiver mit den Merkmalen des Anspruchs 1 gelöst, und insbesondere dadurch, dass der Sender und der Empfänger auf einer flexiblen Leiterplatte angeordnet sind, die zumindest eine flexible Trägerfolie, eine strukturierte Leiterschicht und eine Deckschicht aufweist, dass die Deckschicht der flexiblen Leiterplatte wenigstens eine Ausnehmung aufweist, in der der Sender und/ oder der Empfänger angeordnet sind, und dass die optische Linse zumindest teilweise in der Ausnehmung der Deckschicht angeordnet ist.This object is achieved by an infrared transceiver having the features of claim 1, and in particular by the fact that the transmitter and the receiver are arranged on a flexible printed circuit board which has at least one flexible carrier foil, a structured conductor layer and a cover layer, that the cover layer the flexible circuit board has at least one recess in which the transmitter and / or the receiver are arranged, and that the optical lens is at least partially disposed in the recess of the cover layer.
Charakteristisch für den erfindungsgemäßen Transceiver ist also zunächst, dass der Sender, der Empfänger und eventuelle weitere Schaltungen auf einer flexiblen Leiterplatte angeordnet sind. Bei Leiterplatten wird generell zwischen starren Leiterplatten (z.B. Glasfaser/ Harz-Gewebe), starr-flexiblen Leiterplatten (mit Sollbiegestellen) und flexiblen Leiterplatten (flexible printed circuit, FPC) unterschieden. Die bei dem erfindungsgemäßen Transceiver eingesetzte flexible Leiterplatte besitzt eine flexible Trägerfolie, die vorzugsweise aus Polyimid oder aus Polyester oder PoIy- ethylennaphtalat besteht. Diese Trägerfolie ist durch ein Pressverfahren oder mittels eines Klebers (z.B. Akrylkleber) mit einer flexiblen Leiterschicht versehen. Bei der Leiterschicht handelt es sich vorzugsweise um eine Kupferkaschierung. Diese Leiterschicht ist strukturiert, d.h. sie erstreckt sich nicht vollflächig entlang der Trägerfolie, sondern ist beispielsweise durch ein Ätzverfahren als eine Struktur von Leiterbahnen, Kontak- tierungsflächen etc. ausgebildet. Die Trägerfolie und die hierauf ausgebildete Leiterschicht sind mit einer flexiblen Deckschicht versehen, die letztlich zum Schutz der darunter angeordneten Schichten dient. Diese Deckschicht kann aus demselben Material wie die genannte Trägerfolie gebildet sein (beispielsweise Polyimid). Alternativ oder zusätzlich kann als Deckschicht ein Lötstopplack oder eine Lötstoppfolie vorgesehen sein.Characteristic of the transceiver according to the invention is therefore initially that the transmitter, the receiver and any other circuits are arranged on a flexible circuit board. In the case of printed circuit boards, a distinction is generally made between rigid printed circuit boards (eg glass fiber / resin fabric), rigid-flexible printed circuit boards (with predetermined bending points) and flexible printed circuit boards (FPC). The flexible printed circuit board used in the transceiver according to the invention has a flexible carrier film, which preferably consists of polyimide or of polyester or polyethylene naphthalate. This carrier film is provided by a pressing process or by means of an adhesive (eg acrylic adhesive) with a flexible conductor layer. The conductor layer is preferably a copper cladding. This conductor layer is structured, ie it does not extend over the entire surface along the carrier film, but is, for example, by an etching process as a structure of conductor tracks, contact formed training areas, etc. The carrier film and the conductor layer formed thereon are provided with a flexible cover layer, which ultimately serves to protect the layers arranged underneath. This cover layer may be formed of the same material as the said support film (for example, polyimide). Alternatively or additionally, a solder resist or a solder stop foil may be provided as cover layer.
Selbstverständlich kann die flexible Leiterplatte auch einen mehrlagigen Aufbau besitzen, also eine Folge von mehreren Leiterschichten und dazwischen angeordneten Deck- oder Isolatorschichten.Of course, the flexible circuit board may also have a multilayer structure, that is a series of multiple conductor layers and arranged therebetween cover or insulator layers.
Ferner ist für den erfϊndungsgemäßen Transceiver charakteristisch, dass an der genannten Deckschicht der Leiterplatte wenigstens eine Ausnehmung ausgebildet ist, in der der Sender, der Empfänger oder beide gemeinsam angeordnet und mit einem zugeordneten Abschnitt der Leiterschicht elektrisch verbunden sind, beispielsweise durch Lötkontakte. Diese Ausnehmung dient zugleich zur Aufnahme der optischen Linse, die in der Ausnehmung der Deckschicht angeordnet ist. Mit anderen Worten ragt zumindest ein unterer Abschnitt der Linse in die Ausnehmung der Deckschicht hinein und überdeckt dabei den ebenfalls in der Ausnehmung angeordneten Sender bzw. Empfänger.Furthermore, it is characteristic of the transceiver according to the invention that at least one recess is formed on the cover layer of the printed circuit board, in which the transmitter, the receiver or both are arranged together and electrically connected to an associated portion of the conductor layer, for example by solder contacts. This recess also serves to receive the optical lens, which is arranged in the recess of the cover layer. In other words, at least a lower portion of the lens protrudes into the recess of the cover layer and thereby covers the transmitter or receiver likewise arranged in the recess.
Durch diese Ausgestaltung wird ein besonders flacher Aufbau des Trans- ceivers erreicht, da entlang einer vertikalen Richtung von unten nach oben lediglich die folgenden Elemente erforderlich sind, die die Bauhöhe des Transceivers bestimmen:This refinement achieves a particularly flat structure of the transceiver, since along a vertical direction from bottom to top, only the following elements are required, which determine the overall height of the transceiver:
flexible Trägerfolie; strukturierte Leiterschicht, soweit diese im Bereich der Linse überhaupt ausgebildet ist; und optische Linse, die den Sender und/oder den Empfänger einschließt und seitlich von der Deckschicht umgeben ist.flexible carrier film; structured conductor layer, as far as it is formed in the lens at all; and optical lens which includes the transmitter and / or the receiver and is laterally surrounded by the cover layer.
Ein weiterer Vorteil des erfindungsgemäßen Transceivers besteht darin, dass er biegsam ist. Der erfmdungsgemäße Transceiver eignet sich somit beispielsweise besonders gut zur Integration in Chip-, Identifikations- oder Transponderkarten aus Kunststoff. Für das Standardformat einer Kreditkarte ist eine Dicke von 0,9 mm festgelegt. Dieses Format gestattet aufgrund der geringen Bauhöhe des erfindungsgemäßen Transceivers problemlos die Integration eines solchen Transceivers. Aufgrund der Biegsamkeit der verwendeten Materialien eignet sich der Transceiver auch für die Anwendung in so genannten "Intelligent Textiles". Auch für die bereits bekannten Anwendungen von Transceivern beispielsweise in Mobiltelefonen oder mobilen Computern erweist sich der erfindungsgemäße Transceiver aufgrund seiner geringen Bauhöhe als vorteilhaft.Another advantage of the transceiver according to the invention is that it is flexible. The inventive transceiver is thus particularly well suited, for example, for integration into chip, identification or transponder cards made of plastic. The standard size of a credit card is 0.9 mm thick. This format allows due to the low height of the transceiver according to the invention easily integrates such a transceiver. Due to the flexibility of the materials used, the transceiver is also suitable for use in so-called "intelligent textiles". Even for the already known applications of transceivers, for example in mobile phones or mobile computers, the transceiver according to the invention proves to be advantageous due to its low height.
Gemäß einer besonders vorteilhaften Ausführungsform des Transceivers ist die optische Linse hinsichtlich ihres Umfangs formschlüssig in die genannte Ausnehmung der Deckschicht eingegossen, d.h. die Linse grenzt an die umfängliche Begrenzung der Ausnehmung an. Mit anderen Worten dient die Ausnehmung nicht nur zur Aufnahme der Linse und des hiervon überdeckten Senders und/ oder Empfängers, sondern auch als seitliche Begrenzung für das Gießmaterial, wenn die Linse nach einem Gießverfahren hergestellt wird. Hierdurch ist eine besonders einfache Herstellung einer flachen Linse möglich, da lediglich ein Tropfen einer im Infraroten transparenten Gießmasse in die Ausnehmung gefüllt werden muss. Aufgrund der umfänglichen Begrenzung der Ausnehmung ist auch die seitliche Ausbreitung der Gießmasse begrenzt. Durch entsprechende Wahl der Menge der Gießmasse kann unter Ausnutzen der Oberflächenspannung eine Linse gebildet werden, deren oberer Abschnitt eine konvexe Wölbung besitzt, um hierdurch eine Sammellinse zu bilden.According to a particularly advantageous embodiment of the transceiver, the optical lens is molded with respect to its circumference in a form-fitting manner in said recess of the cover layer, ie the lens adjoins the peripheral boundary of the recess. In other words, the recess serves not only for receiving the lens and the transmitter and / or receiver covered thereby, but also as a lateral boundary for the casting material when the lens is produced by a casting process. As a result, a particularly simple production of a flat lens is possible because only one drop of a transparent transparent casting compound in the recess must be filled. Due to the circumferential limitation of the recess, the lateral spread of the casting compound is limited. By appropriate choice of the amount of casting material can be taking advantage of the surface tension a lens is formed whose upper portion has a convex curvature to thereby form a converging lens.
Die genannte Aufgabe wird auch durch ein Verfahren zur Herstellung eines Infrarot-Transceivers mit den Merkmalen des Anspruchs 8 gelöst, und insbesondere dadurch, dass eine flexible Leiterplatte gebildet wird, indem eine flexible Trägerfolie mit einer strukturierten Leiterschicht versehen wird, die strukturierte Leiterschicht mit einer Deckschicht versehen wird, in die Deckschicht wenigstens eine Ausnehmung eingebracht wird, in der Ausnehmung ein Infrarot-Sender und/ oder ein Infrarot- Empfänger angeordnet werden, und in der Ausnehmung eine optische Linse vorgesehen wird.The stated object is also achieved by a method for producing an infrared transceiver having the features of claim 8, and in particular by forming a flexible printed circuit board by providing a flexible carrier foil with a structured conductor layer, the structured conductor layer having a covering layer is provided, in the cover layer at least one recess is introduced, in the recess, an infrared transmitter and / or an infrared receiver are arranged, and in the recess, an optical lens is provided.
Weitere Ausführungsformen der Erfindung sind in den Unteransprüchen genannt.Further embodiments of the invention are mentioned in the subclaims.
Die Erfindung wird nachfolgend lediglich beispielhaft unter Bezugnahme auf die Zeichnungen erläutert.The invention will now be described by way of example only with reference to the drawings.
Fig. 1 zeigt eine Draufsicht auf einen Infrarot-Transceiver gemäß einer ersten Ausführungsform.Fig. 1 shows a plan view of an infrared transceiver according to a first embodiment.
Fig. 2 und 3 zeigen Querschnittsansichten des Transceivers gemäßFIGS. 2 and 3 show cross-sectional views of the transceiver according to FIG
Fig. 1 entlang der Ebene II-II bzw. IH-III.Fig. 1 along the plane II-II or IH-III.
Fig. 4 zeigt eine weitere Ausführungsform eines Transceivers in einer schematischen Draufsicht.4 shows a further embodiment of a transceiver in a schematic plan view.
Der Transceiver gemäß Fig. 1 bis 3 besitzt eine flexible Leiterplatte, die als Laminat mit einer flexiblen Trägerfolie 11 , einer hierauf angeordneten Kupferschicht 13 und einer auf der Kupferschicht 13 und der Trägerfolie 11 angeordneten flexiblen Deckschicht 15 ausgebildet ist. Die Trägerfolie 11 und die Deckschicht 15 bestehen vorzugsweise aus Polyimid. Die Kupferschicht 13 ist derart strukturiert, dass mehrere Leiterbahnen mit Anschlussflächen für Lötkontakte und Flächen zur Aufnahme von elektronischen Bauelementen ausgebildet sind. An der Deckschicht 15 ist eine kreisrunde Ausnehmung 17 ausgebildet.The transceiver according to FIGS. 1 to 3 has a flexible printed circuit board which is arranged as a laminate with a flexible carrier foil 11, one of which is arranged thereon Copper layer 13 and arranged on the copper layer 13 and the carrier film 11 flexible cover layer 15 is formed. The carrier film 11 and the cover layer 15 are preferably made of polyimide. The copper layer 13 is structured in such a way that a plurality of conductor tracks with connection surfaces for solder contacts and surfaces for receiving electronic components are formed. On the cover layer 15, a circular recess 17 is formed.
Innerhalb der Ausnehmung 17 sind eine als Infrarot- Sender dienende Leuchtdiode 21 , eine als Infrarot-Empfänger dienende Photodiode 23 und ein integrierter Schaltkreis 25 angeordnet. Der integrierte Schaltkreis 25 dient zur Steuerung der Sendesignale der Leuchtdiode 21 und zur Verstärkung und Auswertung der Empfangssignale der Photodiode 23. Die Leuchtdiode 21, die Photodiode 23 und der integrierte Schaltkreis 25 sind als SMD-Bauelemente (surface mounted devices) an entsprechenden Flächen der Kupferschicht 13 befestigt, wobei auch eine direkte Befestigung an der Trägerfolie 11 möglich ist. Durch Bond-Drähte 27 sind die genannten Bauelemente 21, 23, 25 miteinander sowie mit den Leiterbahnen der Kupferschicht 13 elektrisch verbunden. An einer weiteren Ausnehmung 29 der Deckschicht 15 dienen die durch die Kupferschicht 13 gebildeten Anschlussflächen als Eingang für die Stromversorgung für die Leuchtdiode 21 (LED), als Eingang für die Steuerung des Sendesignals der Leuchtdiode 21 (THX), als Eingang für ein Abschaltsignal (Shutdown, SD), als Kontakt für das Massepotential (GND), als Kontakt für die Betriebsspannung (VCC) und als Ausgang für das Empfangs signal der Photodiode 23 (RHX).Within the recess 17 serving as an infrared transmitter LED 21, serving as an infrared receiver photodiode 23 and an integrated circuit 25 are arranged. The integrated circuit 25 serves to control the transmission signals of the light emitting diode 21 and to amplify and evaluate the received signals of the photodiode 23. The light emitting diode 21, the photodiode 23 and the integrated circuit 25 are SMD components (surface mounted devices) on corresponding surfaces of the copper layer 13 attached, with a direct attachment to the carrier film 11 is possible. By bonding wires 27, said components 21, 23, 25 are electrically connected to each other and to the conductor tracks of the copper layer 13. At a further recess 29 of the cover layer 15, the pads formed by the copper layer 13 serve as an input for the power supply for the light emitting diode 21 (LED), as an input for the control of the transmission signal of the light emitting diode 21 (THX), as an input for a shutdown signal (shutdown , SD), as a contact for the ground potential (GND), as a contact for the operating voltage (VCC) and as an output for the reception signal of the photodiode 23 (RHX).
In der kreisrunden Ausnehmung 17 der Deckschicht 15 ist ferner eine optische Linse 31 angeordnet. Die Linse 31 ist aus einem im infraroten Spektralbereich transparenten Epoxidharz in die Ausnehmung 17 einge- gössen, wie nachfolgend noch erläutert wird. Entlang ihres Außenumfangs grenzt die Linse 31 somit formschlüssig an die kreisrunde Begrenzung der Ausnehmung 17 an. Die Leuchtdiode 21, die Photodiode 23 und der integrierte Schaltkreis 25 sind von der Linse 31 formschlüssig überdeckt. An ihrer Unterseite ist die optische Linse 31 innerhalb der Ausnehmung 17 somit vollflächig mit der Trägerfolie 11, der Kupferschicht 13 und den Bauelementen 21, 23, 25 verbunden; hierdurch wird eine unerwünschte Delamination der Linse 31 verhindert. Die Oberseite der Linse 31 besitzt ausgehend von der umfänglichen Begrenzung entlang der Ausnehmung 17 eine konvexe Wölbung, so dass die Linse 31 als Sammellinse ausgebildet ist.In the circular recess 17 of the cover layer 15, an optical lens 31 is further arranged. The lens 31 is inserted into the recess 17 from an epoxy resin that is transparent in the infrared spectral range. Gössen, as will be explained below. Along its outer circumference, the lens 31 thus adjoins the circular boundary of the recess 17 in a form-fitting manner. The light-emitting diode 21, the photodiode 23 and the integrated circuit 25 are positively covered by the lens 31. On its underside, the optical lens 31 is thus completely connected within the recess 17 with the carrier film 11, the copper layer 13 and the components 21, 23, 25; This prevents unwanted delamination of the lens 31. The upper side of the lens 31 has, starting from the circumferential boundary along the recess 17, a convex curvature, so that the lens 31 is designed as a converging lens.
Der Transceiver dient auf an sich bekannte Weise zum Aussenden und Empfangen von Daten, beispielsweise nach dem IrDA-Standard. Hierdurch ist eine optische Kommunikation zwischen zwei elektronischen Geräten möglich, die mit derartigen Transceivern ausgestattet sind. Der besondere Vorteil des in den Fig. 1 bis 3 gezeigten Transceivers besteht darin, dass er einen sehr flachen Aufbau besitzt. Der Transceiver kann deshalb für Anwendungen - beispielsweise in Kreditkarten - verwendet werden, die bislang aufgrund der Baugröße der herkömmlichen Transceiver nicht möglich waren. Der flache Aufbau des gezeigten Transceivers wird dadurch erreicht, dass die Leuchtdiode 21 und die Photodiode 23 auf der vergleichsweise dünnen Trägerfolie 11 angeordnet sind und dass auch die optische Linse 31 innerhalb der Ausnehmung 17 der Deckschicht 15 letztlich auf der Trägerfolie 11 angeordnet ist und dabei die Leuchtdiode 21 und die Photodiode 23 überdeckt. Beispielsweise können flexible Trägerund Deckfolien aus Polyimid gefertigt werden, die jeweils eine Dicke von lediglich 50 μm oder sogar 25 μm besitzen. Die Kupferschicht 13 besitzt eine Dicke von beispielsweise 35 μm. Insgesamt lässt sich somit eine Bauhöhe des Transceivers beispielsweise zwischen 100 und 300 μm erreichen. Ein weiterer Vorteil des gezeigten Transceivers besteht in der besonders einfachen und somit kostengünstigen Herstellung, da zur Bildung der Linse 31 lediglich ein Tropfen eines Kunstharzes in die Ausnehmung 17 der Deckschicht 15 gegossen werden muss.The transceiver is used in a manner known per se for transmitting and receiving data, for example according to the IrDA standard. As a result, an optical communication between two electronic devices is possible, which are equipped with such transceivers. The particular advantage of the transceiver shown in FIGS. 1 to 3 is that it has a very flat construction. The transceiver can therefore be used for applications such as in credit cards, which were previously not possible due to the size of conventional transceivers. The flat structure of the transceiver shown is achieved in that the light-emitting diode 21 and the photodiode 23 are arranged on the comparatively thin carrier film 11 and that the optical lens 31 is disposed within the recess 17 of the cover layer 15 ultimately on the carrier film 11 and thereby the Light emitting diode 21 and the photodiode 23 covers. For example, flexible backsheets and coverslips may be made of polyimide, each having a thickness of only 50 microns or even 25 microns. The copper layer 13 has a thickness of, for example, 35 μm. Overall, a height of the transceiver can thus be achieved, for example, between 100 and 300 μm. Another advantage of the transceiver shown is the particularly simple and thus cost-effective production, since only one drop of a synthetic resin in the recess 17 of the cover layer 15 must be poured to form the lens 31.
Im Einzelnen kann die Fertigung des gezeigten Transceivers wie folgt ablaufen:In detail, the manufacture of the shown transceiver can take place as follows:
Zunächst wird die flexible Trägerfolie 11 (Polyimidfolie) vollflächig mit der Kupferschicht 13 versehen, beispielsweise durch gegenseitiges Verpressen oder mittels einer dazwischen liegenden Kleberschicht. Die Kupferschicht 13 wird sodann durch ein an sich bekanntes Ätzverfahren strukturiert, um die in Fig. 1 gezeigten Leiterbahnen und -flächen zu bilden.First, the flexible carrier film 11 (polyimide film) is provided over its entire area with the copper layer 13, for example by mutual pressing or by means of an adhesive layer therebetween. The copper layer 13 is then patterned by a per se known etching process to form the printed conductors and surfaces shown in FIG.
Anschließend wird die Anordnung aus Trägerfolie 11 und Kupferschicht 13 mit der Deckschicht 15 versehen, beispielsweise wieder durch gegenseitiges Verpressen oder mittels einer dazwischen angeordneten Kleberschicht. Bei der Deckschicht 15 handelt es sich vorzugsweise ebenfalls um eine Polyimidfolie; alternativ oder zusätzlich kann auch ein Lötstopplack oder eine Lötstoppfolie als Deckschicht 15 zum Einsatz gelangen. In die Deckschicht 15 werden die Ausnehmungen 17 und 29 eingebracht, beispielsweise durch ein Ätzverfahren.Subsequently, the arrangement of carrier film 11 and copper layer 13 is provided with the cover layer 15, for example, again by mutual pressing or by means of an interposed adhesive layer. The cover layer 15 is preferably also a polyimide film; Alternatively or additionally, a solder resist or a solder stop film may also be used as cover layer 15. In the cover layer 15, the recesses 17 and 29 are introduced, for example by an etching process.
Auf den somit freiliegenden Flächen der Kupferschicht 13 innerhalb der Aufnehmung 17 werden die Leuchtdiode 21, die Photodiode 23 und der integrierte Schaltkreis 25 befestigt, beispielsweise verklebt. Außerdem erfolgt nun die elektrische Kontaktierung mittels der Bond-Drähte 27. Schließlich wird eine Gießmasse, insbesondere das bereits genannte Epoxidharz, derart in die Ausnehmung 17 gegossen, dass eine optische Linse 31 gebildet wird, die entlang ihres Umfangs formschlüssig in der Ausnehmung 17 angeordnet ist und aufgrund der Oberflächenspannung im flüssigen Zustand der Gießmasse an der Oberseite eine konvexe Wölbung besitzt. Nach diesem Gießvorgang wird die Linse 31 gehärtet, beispielsweise chemisch und/ oder thermisch.On the thus exposed surfaces of the copper layer 13 within the Aufnehmung 17, the light emitting diode 21, the photodiode 23 and the integrated circuit 25 are fixed, for example glued. In addition, the electrical contacting by means of the bonding wires 27 now takes place. Finally, a casting compound, in particular the already mentioned epoxy resin, is poured into the recess 17 in such a way that an optical lens 31 is formed, which is arranged in the recess 17 in a form-fitting manner along its circumference and due to the surface tension in the liquid state of the casting compound at the top has convex curvature. After this casting process, the lens 31 is hardened, for example chemically and / or thermally.
Üblicherweise wird nach dem erläuterten Verfahren eine Vielzahl von Transceivern gleichzeitig auf einer gemeinsamen Trägerfolie 11 hergestellt, und nach Abschluss des erläuterten Verfahrens werden diese Transceiver vereinzelt.Usually, according to the method explained, a multiplicity of transceivers are produced simultaneously on a common carrier foil 11, and after completion of the method explained, these transceivers are singulated.
Zu dem Transceiver gemäß Fig. 1 bis 3 ist noch Folgendes anzumerken:For the transceiver according to FIGS. 1 to 3, the following should also be noted:
Der integrierte Schaltkreis 25 mit den erläuterten Funktionen muss nicht unbedingt Bestandteil des Transceivers sein. Es ist stattdessen auch möglich, lediglich einen Verstärker (beispielsweise einen AGC-Verstärker, au- tomatic gain control) vorzusehen, der die Empfangssignale der Photodiode 23 verstärkt. Auch auf einen solchen Verstärker kann verzichtet werden, wenn dieser extern angeordnet wird.The integrated circuit 25 with the functions explained does not necessarily have to be part of the transceiver. Instead, it is also possible to provide only one amplifier (for example an AGC amplifier, automatic gain control), which amplifies the received signals of the photodiode 23. Also, such an amplifier can be omitted if it is located externally.
Die optische Linse 31 muss nicht unbedingt - wie in den Fig. 2 und 3 gezeigt - über die Oberseite der Deckschicht 15 überstehen. Je nach Wahl der Dicke der Deckschicht 15 und der Menge der in die Ausnehmung 17 eingefüllten Gießmasse kann auch vorgesehen sein, dass die Oberseite der Linse 31 niedriger ist als die Oberseite der Deckschicht 15 und somit durch die Deckschicht 15 beispielsweise gegen unerwünschtes Verkratzen geschützt ist. Die Menge der Gießmasse kann so gewählt werden, dass die umfängliche Begrenzung des konvexen oberen Abschnitts der Linse 31 an die Unterseite der Ausnehmung 17 der Deckschicht 15 (und somit gerade an die Trägerfolie 11) angrenzt, an die Oberseite der Ausnehmung 17 der Deckschicht 15 angrenzt oder - wie in Fig. 2 gezeigt - an eine Stelle zwischen Unterseite und Oberseite der Deckschicht 15 angrenzt. Der Krümmungsradius der Linse 31 und somit deren optische Eigenschaften können über die Viskosität des verwendeten Gießmaterials eingestellt werden.The optical lens 31 does not necessarily have to protrude over the top of the cover layer 15, as shown in FIGS. 2 and 3. Depending on the choice of the thickness of the cover layer 15 and the amount of poured into the recess 17 molding compound can also be provided that the top of the lens 31 is lower than the top of the cover layer 15 and thus protected by the cover layer 15, for example against unwanted scratching. The amount of the casting compound may be selected such that the peripheral boundary of the convex upper portion of the lens 31 at the underside of the recess 17 of the cover layer 15 (and thus just adjacent to the carrier film 11), adjacent to the top of the recess 17 of the cover layer 15 or - as shown in Fig. 2 - adjacent to a point between the bottom and top of the cover layer 15. The radius of curvature of the lens 31 and thus its optical properties can be adjusted by the viscosity of the casting material used.
Bei der Ausführungsform gemäß den Fig. 1 bis 3 ist für die Leuchtdiode 21 und die Photodiode 23 eine gemeinsame optische Linse 31 vorgesehen. Dies vereinfacht die Herstellung, da lediglich eine einzige Linse gegossen werden muss. Versuche haben ergeben, dass bei einer derartigen Ausgestaltung noch hinreichende optische Abbildungseigenschaften sowohl für die Leuchtdiode 21 als auch für die Photodiode 23 erzielt werden.In the embodiment according to FIGS. 1 to 3, a common optical lens 31 is provided for the light-emitting diode 21 and the photodiode 23. This simplifies the production since only a single lens has to be cast. Experiments have shown that in such an embodiment, sufficient optical imaging properties for both the light emitting diode 21 and the photodiode 23 are achieved.
Alternativ hierzu ist es jedoch auch möglich, für die Leuchtdiode 21 und die Photodiode 23 jeweils eine eigene optische Linse 31 nach dem vorstehend erläuterten Herstellungsverfahren vorzusehen. Dies ist für eine weitere Ausführungsform des erfindungsgemäßen Transceivers in der schematischen Draufsicht gemäß Fig. 4 gezeigt.Alternatively, however, it is also possible to provide for the light emitting diode 21 and the photodiode 23 each have their own optical lens 31 according to the above-described manufacturing method. This is shown for a further embodiment of the transceiver according to the invention in the schematic plan view of FIG. 4.
Schließlich ist es auch möglich, dass lediglich für den Empfänger, also die Photodiode 23, eine derartige Linse 31 gegossen wird, während für den Sender, also die Leuchtdiode 21 , ein Bauelement mit integrierter Sendeoptik verwendet wird. BezugszeichenlisteFinally, it is also possible that only for the receiver, so the photodiode 23, such a lens 31 is poured, while for the transmitter, so the light emitting diode 21, a device with integrated transmission optics is used. LIST OF REFERENCE NUMBERS
11 Trägerfolie11 carrier film
13 Kupferschicht13 copper layer
15 Deckschicht15 topcoat
17 Ausnehmung17 recess
21 Leuchtdiode21 LED
23 Photodiode23 photodiode
25 integrierter Schaltkreis25 integrated circuit
27 Bond-Draht27 bond wire
29 Ausnehmung29 recess
31 optische Linse 31 optical lens

Claims

13Ansprüche 13Ansprüche
1. Infrarot-Transceiver mit einem Infrarot-Sender (21), einem Infrarot- Empfänger (23) und wenigstens einer optischen Linse (31) für den Sender und/ oder den Empfänger, dadurch gekennzeichnet, dass der Sender (21) und der Empfänger (23) auf einer flexiblen Leiterplatte angeordnet sind, die zumindest eine flexible Trägerfolie (11), eine strukturierte Leiterschicht (13) und eine Deckschicht (15) aufweist, dass die Deckschicht (15) der flexiblen Leiterplatte wenigstens eine Ausnehmung (17) aufweist, in der der Sender und/ oder der Empfänger angeordnet sind, und dass die optische Linse (31) zumindest teilweise in der Ausnehmung (17) der Deckschicht angeordnet ist.Infrared transceiver with an infrared transmitter (21), an infrared receiver (23) and at least one optical lens (31) for the transmitter and / or the receiver, characterized in that the transmitter (21) and the receiver (23) are arranged on a flexible printed circuit board which has at least one flexible carrier film (11), a structured conductor layer (13) and a cover layer (15), that the cover layer (15) of the flexible printed circuit board has at least one recess (17), in which the transmitter and / or the receiver are arranged, and that the optical lens (31) is at least partially disposed in the recess (17) of the cover layer.
2. Transceiver nach Anspruch 1 , dadurch gekennzeichnet, dass die optische Linse (31) entlang ihres Umfangs formschlüssig in die Ausnehmung (17) der Deckschicht (15) eingegossen ist.2. Transceiver according to claim 1, characterized in that the optical lens (31) is molded integrally along its circumference in the recess (17) of the cover layer (15).
3. Transceiver nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die optische Linse (31) einen unteren Abschnitt, der formschlüssig in die Ausnehmung (17) der Deckschicht (15) eingegossen ist, und einen oberen Abschnitt aufweist, der eine konvexe Wölbung besitzt und vorzugsweise über die Oberseite der Deckschicht übersteht. 143. Transceiver according to one of the preceding claims, characterized in that the optical lens (31) has a lower portion which is integrally molded into the recess (17) of the cover layer (15), and having an upper portion which has a convex curvature and preferably protrudes over the top of the cover layer. 14
4. Transceiver nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die optische Linse (31) aus einem Kunstharz gegossen ist.4. Transceiver according to one of the preceding claims, characterized in that the optical lens (31) is molded from a synthetic resin.
5. Transceiver nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der Sender (21) und/oder der Empfänger (23) in der Ausnehmung (17) der Deckschicht (15) von der optischen Linse (31) überdeckt sind.5. Transceiver according to one of the preceding claims, characterized in that the transmitter (21) and / or the receiver (23) in the recess (17) of the cover layer (15) of the optical lens (31) are covered.
6. Transceiver nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Ausnehmung (17) der Deckschicht (15) kreisrund ist.6. Transceiver according to one of the preceding claims, characterized in that the recess (17) of the cover layer (15) is circular.
7. Transceiver nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass für den Sender (21) und den Empfänger (23) eine gemeinsame optische Linse (31) vorgesehen ist.7. Transceiver according to one of the preceding claims, characterized in that for the transmitter (21) and the receiver (23) has a common optical lens (31) is provided.
8. Verfahren zur Herstellung eines Infrarot-Transceivers, bei dem: eine flexible Leiterplatte gebildet wird, indem eine flexible Trägerfolie (11) mit einer strukturierten Leiterschicht (13) versehen wird, die strukturierte Leiterschicht (13) mit einer Deckschicht (15) versehen wird, in die Deckschicht (15) wenigstens eine Ausnehmung (17) eingebracht wird, in der Ausnehmung (17) ein Infrarot-Sender (21) und/oder ein Infrarot-Empfänger (23) angeordnet werden, und 158. A method for producing an infrared transceiver, in which: a flexible printed circuit board is formed by providing a flexible carrier film (11) with a structured conductor layer (13), the structured conductor layer (13) is provided with a cover layer (15) , in the cover layer (15) at least one recess (17) is introduced, in the recess (17) an infrared transmitter (21) and / or an infrared receiver (23) are arranged, and 15
in der Ausnehmung (17) eine optische Linse (31) vorgesehen wird.in the recess (17) an optical lens (31) is provided.
9. Verfahren nach Anspruch 8, dadurch gekennzeichnet, dass eine Gießmasse derart in die Ausnehmung (17) der Deckschicht (15) gegossen wird, dass eine optische Linse (31) gebildet wird, die entlang ihres Umfangs formschlüssig in der Ausnehmung (17) angeordnet ist.9. The method according to claim 8, characterized in that a casting material is poured into the recess (17) of the cover layer (15) such that an optical lens (31) is formed, which arranged in a form-fitting manner in the recess (17) along its circumference is.
10. Verfahren nach Anspruch 9, dadurch gekennzeichnet, dass die Gießmasse derart in die Ausnehmung (17) gegossen wird, dass die gebildete optische Linse (31) an ihrer Oberseite eine konvexe Wölbung besitzt, um hierdurch eine Sammellinse zu bilden. 10. The method according to claim 9, characterized in that the casting material is poured into the recess (17) such that the formed optical lens (31) has on its upper side a convex curvature, thereby forming a converging lens.
PCT/EP2005/012579 2005-01-18 2005-11-24 Infrared transceiver and method for the production thereof WO2006076940A1 (en)

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EP1187227A2 (en) * 1989-05-31 2002-03-13 Osram Opto Semiconductors GmbH & Co. OHG Surface-mountable optical element and method of fabrication
EP1107321A1 (en) * 1999-06-23 2001-06-13 Citizen Electronics Co., Ltd. Light emitting diode
US20020021871A1 (en) * 2000-07-18 2002-02-21 Albert Auburger Optoelectronic surface-mountable module and optoelectronic coupling unit
US20020088987A1 (en) * 2000-12-26 2002-07-11 Kazunori Sakurai Optical device and method for manufacturing the same, and electronic apparatus
DE10122002A1 (en) * 2001-05-07 2002-11-21 Osram Opto Semiconductors Gmbh Housing for an optoelectronic component and optoelectronic component
DE10150986A1 (en) * 2001-10-10 2003-04-30 Infineon Technologies Ag Transmitter and or receiver for optical fibre communication of signals
US20040156639A1 (en) * 2002-08-12 2004-08-12 Nikolaus Schunk Optoelectronic transmitting and/or receiving module, circuit carrier, module housing, and optical plug

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