WO2006073662A2 - Polyhedral oligomeric silsesquioxanes and polyhedral oligomeric silicates barrier materials for packaging - Google Patents
Polyhedral oligomeric silsesquioxanes and polyhedral oligomeric silicates barrier materials for packaging Download PDFInfo
- Publication number
- WO2006073662A2 WO2006073662A2 PCT/US2005/044284 US2005044284W WO2006073662A2 WO 2006073662 A2 WO2006073662 A2 WO 2006073662A2 US 2005044284 W US2005044284 W US 2005044284W WO 2006073662 A2 WO2006073662 A2 WO 2006073662A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polymer
- silicon containing
- adhesion
- physical property
- incorporation
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1262—Process of deposition of the inorganic material involving particles, e.g. carbon nanotubes [CNT], flakes
- C23C18/127—Preformed particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1212—Zeolites, glasses
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1233—Organic substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
Definitions
- FIG. 1 shows representative structural examples of nonmetallized silicon containing agents.
- FIG. 2 illustrates the ability to uniformly disperse nanostructured silicon agents at the 1 -3 nm level at the surface and the bulk of a polymer.
- FIG. 3 illustrates the ability of metallized silicon agents to selectively absorb damaging radiation.
- FIG. 4 illustrates the chemical process of oxidative conversion of a silicon containing agent into a fused nanoscopically thin glass layer.
- FIGS. 5(A) to 5(F) illustrate preferred methods of incorporating nanostructured silicon containing agents into plastic multilaminate packaging.
- the factors to effect selection of a silicon containing agent for permeability control and glassification include the nanosizes of nanostructured chemicals, distributions of nanosizes, and compatibilities and disparities between the nanostructured chemical and the polymer system, the loading level of the silica agent, the thickness of the silica layer desired, and the optical and physical properties of the polymer.
- Silica agents such as the polyhedral oligomeric silsesquioxanes illustrated in Figure 1 , are available as solids and oils and with or without metals. Both forms dissolve in molten polymers or in solvents, or can be reacted directly into polymers or can themselves be utilized as a binder material.
- Example 2 Packaged Food Improvements The following represents advantages observed through the incorporation of this invention into food packaging.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05857055A EP1838458A2 (en) | 2004-12-08 | 2005-12-07 | Polyhedral oligomeric silsequioxanes and polyhedral oligomeric silicates barrier materials for packaging |
JP2007545593A JP2008523219A (en) | 2004-12-08 | 2005-12-07 | Polyhedral oligomeric silsesquioxane and polyhedral oligomeric silicate barrier materials for containers |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US63449504P | 2004-12-08 | 2004-12-08 | |
US60/634,495 | 2004-12-08 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2006073662A2 true WO2006073662A2 (en) | 2006-07-13 |
WO2006073662A3 WO2006073662A3 (en) | 2006-09-14 |
WO2006073662A9 WO2006073662A9 (en) | 2006-10-12 |
Family
ID=36647963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/044284 WO2006073662A2 (en) | 2004-12-08 | 2005-12-07 | Polyhedral oligomeric silsesquioxanes and polyhedral oligomeric silicates barrier materials for packaging |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1838458A2 (en) |
JP (1) | JP2008523219A (en) |
KR (1) | KR20070112112A (en) |
RU (1) | RU2007125640A (en) |
TW (1) | TW200635771A (en) |
WO (1) | WO2006073662A2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150329678A1 (en) * | 2013-01-03 | 2015-11-19 | Shin-Etsu Chemical Co., Ltd. | Hydrophilized silicone particles and making method |
US9828492B2 (en) | 2013-04-23 | 2017-11-28 | Mitsubishi Gas Chemical Company, Inc. | Polyamide resin composition, and molded article |
CN114716814A (en) * | 2022-05-13 | 2022-07-08 | 安徽康采恩包装材料有限公司 | High-barrier packaging material and preparation process thereof |
CN116144284A (en) * | 2023-04-24 | 2023-05-23 | 宁波长阳科技股份有限公司 | Raw material package, integrated adhesive film backboard, preparation method of integrated adhesive film backboard and photovoltaic module |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6285118B1 (en) * | 1998-11-16 | 2001-09-04 | Matsushita Electric Works, Ltd. | Field emission-type electron source and manufacturing method thereof and display using the electron source |
US20050238967A1 (en) * | 2004-04-27 | 2005-10-27 | The Board Of Trustees Of The University Of Illinois | Composite patterning devices for soft lithography |
-
2005
- 2005-12-07 JP JP2007545593A patent/JP2008523219A/en not_active Withdrawn
- 2005-12-07 WO PCT/US2005/044284 patent/WO2006073662A2/en active Application Filing
- 2005-12-07 KR KR1020077015513A patent/KR20070112112A/en not_active Application Discontinuation
- 2005-12-07 RU RU2007125640/12A patent/RU2007125640A/en not_active Application Discontinuation
- 2005-12-07 EP EP05857055A patent/EP1838458A2/en not_active Withdrawn
- 2005-12-07 TW TW094143125A patent/TW200635771A/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6285118B1 (en) * | 1998-11-16 | 2001-09-04 | Matsushita Electric Works, Ltd. | Field emission-type electron source and manufacturing method thereof and display using the electron source |
US20050238967A1 (en) * | 2004-04-27 | 2005-10-27 | The Board Of Trustees Of The University Of Illinois | Composite patterning devices for soft lithography |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150329678A1 (en) * | 2013-01-03 | 2015-11-19 | Shin-Etsu Chemical Co., Ltd. | Hydrophilized silicone particles and making method |
US9434819B2 (en) * | 2013-01-03 | 2016-09-06 | Shin-Etsu Chemical Co., Ltd. | Hydrophilized silicone particles and making method |
US9828492B2 (en) | 2013-04-23 | 2017-11-28 | Mitsubishi Gas Chemical Company, Inc. | Polyamide resin composition, and molded article |
CN114716814A (en) * | 2022-05-13 | 2022-07-08 | 安徽康采恩包装材料有限公司 | High-barrier packaging material and preparation process thereof |
CN116144284A (en) * | 2023-04-24 | 2023-05-23 | 宁波长阳科技股份有限公司 | Raw material package, integrated adhesive film backboard, preparation method of integrated adhesive film backboard and photovoltaic module |
CN116144284B (en) * | 2023-04-24 | 2023-08-18 | 宁波长阳科技股份有限公司 | Raw material package, integrated adhesive film backboard, preparation method of integrated adhesive film backboard and photovoltaic module |
Also Published As
Publication number | Publication date |
---|---|
KR20070112112A (en) | 2007-11-22 |
JP2008523219A (en) | 2008-07-03 |
WO2006073662A3 (en) | 2006-09-14 |
EP1838458A2 (en) | 2007-10-03 |
RU2007125640A (en) | 2009-01-20 |
WO2006073662A9 (en) | 2006-10-12 |
TW200635771A (en) | 2006-10-16 |
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